# Power MOSFET, N Channel, 60 V, 74.5 A, 8000 µohm, TO-251, Through Hole

![Product image](https://novapart.co/image/farnell:3943874/)

**URL**: https://novapart.co/products/DMT6009LJ3/power-mosfet-n-channel-60-v-745-a-8000-ohm-to-251
**SKU**: DMT6009LJ3
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.7190
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 83.3W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-251 |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 74.5A |
| Drain Source On State Resistance | 8000µohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943874/)

© **Green** 

**DMT6009LJ3** 7 

## **60V N-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|~~O~~|~~O~~|~~O~~|
|---|---|---|
|**BVDSS**|**RDS(ON)Max**|**ID**<br>**TC = +25°C**|
|60V|10mΩ @ VGS= 10V|74.5A|
||12.8mΩ @ VGS= 4.5V|65.8A|



## **Features and Benefits** 

- 100% Unclamped Inductive Switching – Ensures More Reliable and Robust End Application 

- Low RDS(ON)—Ensures On State Losses Are Minimized 

- Excellent Qgd x RDS(ON) Product (FOM) 

- Advanced Technology for DC-DC Converters 

- Small Form Factor Thermally Efficient Package Enables Higher Density End Products 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

## **Description and Applications** 

This new generation MOSFET is designed to minimize the on-state resistance (RDS(ON)) yet maintain superior switching performance, making it ideal for high-efficiency power-management applications. 

## **Mechanical Data** 

   - Case: TO251 (Type TH) 

   - Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

- Power Management Functions 

- DC-DC Converters 

- Backlighting 

- Terminal Connections: See Diagram 

- Terminals: Finish – Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 **e3** 

- Weight: 0.33 grams (Approximate) 

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TO251 (Type TH)<br>**----- End of picture text -----**<br>


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Top View  Bottom View<br>**----- End of picture text -----**<br>


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G  D  S<br>Internal Schematic<br>Top View<br>Pin Configuration<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Part Number**|**Case**|**Packaging**|
|---|---|---|
|DMT6009LJ3|TO251(TypeTH)|75Pieces /Tube|



Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3).compliant. All applicable RoHS exemptions applied. 

2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. 

## **Marking Information** 

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**----- Start of picture text -----**<br>
T6009L<br>YYWW<br>**----- End of picture text -----**<br>


= Manufacturer’s Marking T6009L = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 18 = 2018) WW or WW = Week Code (01 to 53) 

1 of 6 **www.diodes.com** 

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**DMT6009LJ3** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

||||||
|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Drain-Source Voltage||VDSS|60|V|
|Gate-Source Voltage||VGSS|±16|V|
|Continuous Drain Current (Note 7)|TC= +25°C<br>TC= +70°C|ID|74.5<br>59.6|A|
|Maximum Body Diode Forward Current (Note 7)||IS|50|A|
|Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)||IDM|280|A|
|Pulsed Body Diode Forward Current (10μs Pulse, Duty Cycle = 1%)||ISM|280|A|
|Avalanche Current, L=0.1mH||IAS|28.2|A|
|Avalanche Energy, L=0.1mH||EAS|39.8|mJ|



## **Thermal Characteristics** 

|**Thermal Characteristics**|**Thermal Characteristics**||||
|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Total Power Dissipation (Note 6)|TA= +25°C|PD|2.9|W|
|Thermal Resistance, Junction to Ambient (Note 6)||RϴJA|43|°C/W|
|Thermal Resistance, Junction to Ambient (Note 5)||RϴJA|80|°C/W|
|Total Power Dissipation(Note 7)|TC= +25°C|PD|83.3|W|
|Thermal Resistance, Junction to Case (Note 7)||RϴJC|1.5|°C/W|
|Operatingand Storage Temperature Range||TJ, TSTG|-55 to +150|°C|



## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|---|
||||||||
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|**Test Condition**|
|**OFF CHARACTERISTICS(Note 8)**<br>~~———~~|||||||
|Drain-Source Breakdown Voltage<br>~~———~~|BVDSS|60|||V|VGS= 0V, ID= 1mA|
|Zero Gate Voltage Drain Current<br>~~———~~|IDSS|||1|µA|VDS= 48V, VGS= 0V|
|Gate-Source Leakage<br>~~———~~|IGSS|||±100|nA|VGS= ±16V, VDS= 0V|
|**ON CHARACTERISTICS(Note 8)**<br>~~———~~<br>~~GOGO OO~~<br>~~a~~|||||||
|Gate Threshold Voltage<br>~~DO~~<br>~~a~~|VGS(TH)<br>~~DO~~|0.7<br>~~DO~~|<br>~~DO~~<br>~~GO~~|2<br>~~DO~~<br>~~GO~~|V<br>~~DO~~<br>~~GO OO~~|VDS= VGS, ID= 250µA<br>~~DO~~<br>~~OO~~|
|Static Drain-Source On-Resistance<br>~~a~~<br>~~———~~|RDS(ON)||8<br>~~GO~~|10<br>~~GO~~|mΩ<br>~~GO OO~~|VGS= 10V,ID= 13.5A<br>~~OO~~|
||||9.8<br>~~GO ~~|12.8<br> ~~GO~~||VGS= 4.5V,ID= 11.5A<br>~~OO~~|
|Diode Forward Voltage<br>~~———~~|VSD||0.8|1.2|V|VGS= 0V, IS= 5A|
|**DYNAMIC CHARACTERISTICS(Note 9)**<br>~~———~~<br>~~ee ee~~|||||||
|Input Capacitance<br>~~———~~<br>~~es~~|Ciss<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee ee~~|1925<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee~~|pF<br>~~es~~<br>~~ee~~|VDS= 30V, VGS= 0V,<br>f = 1MHz<br>~~es~~|
|Output Capacitance<br>~~es~~|Coss<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee ee~~|438<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee~~|||
|Reverse Transfer Capacitance<br>~~es~~|Crss<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee ee~~|41<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee~~|||
|Gate Resistance<br>~~rrr~~<br>~~————~~|Rg<br>~~ee~~<br>~~rrr~~|<br>~~ee ee~~<br>~~rrr~~|1.7<br>~~ee~~<br>~~rrr~~|<br>~~ee~~<br>~~rrr~~<br>~~e~~|Ω<br>~~ee~~<br>~~rrr~~<br>~~e~~|VDS= 0V,VGS= 0V,f = 1MHz<br>~~rrr~~<br>~~ee~~|
|Total Gate Charge(VGS= 4.5V)<br>~~rrr~~<br>~~————~~|Qg<br>~~rrr~~|<br>~~rrr~~|15.6<br>~~rrr~~|<br>~~rrr~~<br>~~e~~|nC<br>~~rrr~~<br>~~e~~|VDS= 30V, ID= 13.5A<br>~~rrr~~<br>~~ee~~|
|Total Gate Charge(VGS= 10V)<br>~~rrr~~<br>~~————~~|Qg<br>~~rrr~~|<br>~~rrr~~|33.5<br>~~rrr~~|<br>~~rrr~~<br>~~e~~|||
|Gate-Source Charge<br>~~————~~|Qgs||4.7|<br>~~e~~|||
|Gate-Drain Charge<br>~~————~~|Qgd||5.3|<br>~~e~~|||
|Turn-On Delay Time<br>~~————~~|tD(ON)||4.5|<br>~~e~~|ns<br>~~e~~|VDD= 30V, VGS= 10V,<br>Rg= 6Ω, ID= 13.5A<br>~~ee~~|
|Turn-On Rise Time<br>~~————~~|tR||8.6|<br>~~e~~|||
|Turn-Off Delay Time|tD(OFF)||35.9||||
|Turn-Off Fall Time|tF||15.7||||
|Body Diode Reverse Recovery Time<br>~~ee~~|tRR<br>~~ee~~|<br>~~ee~~|18.2<br>~~ee~~|<br>~~ee~~|ns<br>~~ee~~|IF= 13.5A, di/dt = 400A/μs<br>~~ee~~|
|BodyDiode Reverse RecoveryCharge<br>~~ee~~|QRR<br>~~ee~~|<br>~~ee~~|33.1<br>~~ee~~|<br>~~ee~~|nC<br>~~ee~~||



Notes: 

5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 

6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate. 

7. Thermal resistance from junction to soldering point (on the exposed drain pad). 

8. Short duration pulse test used to minimize self-heating effect. 

9. Guaranteed by design. Not subject to production testing. 

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DMT6009LJ3 Document number: DS39077  Rev. 3 - 2 

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**DMT6009LJ3** 

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30.0   30<br> VGS = 3.0V  VDS = 5V<br>25.0   RO  VGS=3.5V  ) 25<br> VGS = 6.0V<br> VGS = 10.0V<br>20.0   20<br>fe<br>15.0    VGS = 2.5V  15<br>foo<br>10.0   f p 10  TJ=125 ℃  f-<br> VGS = 2.3V  TJ=85 ℃<br>5.0   5<br>0.0   |——— A  VGS = 2.0V  0  i TJ=150 ℃ L K TTJ=-55J=25 ℃℃<br>0  0.5  1  1.5  2  0.5  1  1.5  2  2.5  3<br>VDS, DRAIN-SOURCE VOLTAGE (V)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1. Typical Output Characteristic<br>Figure 2. Typical Transfer Characteristic<br>0.012  0.1<br>0.011<br>0.08<br> VGS = 4.5V<br>0.01<br>0.06  ID = 11.5A<br>0.009<br>0.04<br>0.008<br> VGS = 10V<br>0.007  0.02  ID = 13.5A<br>0.006  0<br>0  5  10  15  20  25  30  0  2  4  6  8  10  12<br>ID, DRAIN-SOURCE CURRENT (A)   VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current and  Figure 4. Typical Transfer Characteristic<br>Gate Voltage<br>0.014  1.8<br>VGS = 10V  150 ℃<br>0.012  1.6  coors<br>125 ℃  VGS = 4.5V, ID = 11.5A<br>1.4  caer<br>0.01  85 ℃<br>1.2  coor<br>0.008<br>25 ℃<br>1<br>0.006<br>-55 ℃ 0.8   VGS = 10V, ID = 13.5A<br>0.004  0.6  aafiies<br>0  5  10  15  20  25  30  -50  -25  0  25  50  75  100  125  150<br>ID, DRAIN CURRENT (A)  TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 5. Typical On-Resistance vs. Drain Current and<br>Figure 6. On-Resistance Variation with Junction<br>Junction Temperature<br>Temperature<br>, DRAIN CURRENT (A)  , DRAIN CURRENT (A)<br>ID ID<br>)<br>W<br>)<br>(W<br>, DRAIN-SOURCE ON-<br>RESISTANCE (<br>DS(ON)<br>R , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON)<br>R<br>)<br>(W<br>(NORMALIZED)<br>, DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN-SOURCE ON-RESISTANCE<br>DS(ON)<br>DS(ON) R<br>R<br>**----- End of picture text -----**<br>


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**DMT6009LJ3** 

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0.02  2.4<br>2.2  ne<br>2  Te<br>0.016  1.8  a<br>1.6  — ID = 1mA<br>1.4  a e eeee<br>0.012   VGS = 4.5V, ID = 11.5A  1.2  ID = 250μA<br>1  ee _ —>K<br>0.8  en,<br>0.008   VGS = 10V, ID = 13.5A  0.6 0.4  eereeX<br>0.2  en<br>a<br>0.004  0<br>-50  -25  0  25  50  75  100  125  150  -50  -25  0  25  50  75  100  125  150<br>TJ, JUNCTION TEMPERATURE ( ℃ )  TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 7. On-Resistance Variation with Junction  Figure 8. Gate Threshold Variation vs. Junction<br>Temperature  Temperature<br>)<br>W , GATE THRESHOLD VOLTAGE (V)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>GS(TH)<br>V<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


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30<br>10000<br>VGS = 0V  f=1MHz<br>25  Ciss<br>T E = —<br>20  ee || 1000   a<br>15  ee | — Coss  —<br>[| S O S<br>TJ = 85 [o] C<br>10  WTRHa 100   O O<br>TJ = 125 [o] C  TJ = 25 [o] C  Crss<br>5  TJ = 150 [o] C  Hi} | | e e<br>TJ = -55 [o] C<br>0  VLy im 10   aeeee ee ee<br>0  0.3  0.6  0.9  1.2  1.5  0  5  10  15  20  25  30<br>VSD, SOURCE-DRAIN VOLTAGE (V)  VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current  Figure 10. Typical Junction Capacitance<br>10  1000<br>RDS(ON) Limited  PW =1µs<br>AeeBE<br>8<br>100  N N Hl<br>6<br>PW =10µs<br>10  et, TSN<br>PW =100µs<br>4  PW =1ms<br>TJ(Max) = 150 ℃<br>VDS = 30V, ID = 13.5A  1  TC = 25 ℃ PW =10ms<br>2  Single Pulse DUT on infinite heatsink  PW =100ms<br>VGS= 10V  DC<br>Poi, Nl<br>0  0.1<br>0  7  14  21  28  35  0.1  1  10  100<br>Qg (nC)  VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11. Gate Charge  Figure 12. SOA, Safe Operation Area<br>, SOURCE CURRENT (A)<br>IS , JUNCTION CAPACITANCE (pF) T<br>C<br> (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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**DMT6009LJ3** 

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1<br>D=0.7<br>RC D=0.5  NE<br>D=0.3<br>D=0.9<br>0.1  T OMES CTT TTI CTT<br>D=0.1<br>D=0.05<br>ee n D=0.02  COT<br>0.01<br>D=0.01<br>D=0.005<br>RθJC(t) = r(t) * RθJC<br>a 0 Hi<br>D=Single Pulse  RθJC = 1.5 ℃ /W<br>Duty Cycle, D = t1 / t2<br>a TN AVIeTTI TE ii<br>0.001<br>1E-06  1E-05  0.0001  0.001  0.01  0.1  1  10<br>t1, PULSE DURATION TIME (sec)<br>Figure 13. Transient Thermal Resistance<br>ge Outline Dimensionse Outline Dimensions<br>Please see http://www.diodes.com/package-outlines.html for the latest version.<br>TO251 (Type TH)<br>E<br>L4<br>L3 b3 c TO251 (Type TH)<br>ooo TTS<br>0 Dim  Min  Max  Typ<br>A  2.20 2.40 2.30<br>es ee<br>A2  0.97  1.17  1.07<br>E1 ee ee<br>b  0.68 0.90 0.78<br>L5 es ee<br>b3  5.20  5.50  5.33<br>P D ee c  0.43  ee 0.63  0.53<br>D1 D  5.98  6.22  6.10<br>0 D1  5.30 REF<br>0 H e  2.286 BSC<br>E  6.40  6.80  6.60<br>A2 es es<br>E1  4.63  5.03  4.83<br>es a<br>H  16.22  16.82  16.52<br>L —f_ k  rr 0.40REF<br>b > L  9.15 9.65 9.40<br>L3  0.88 1.28 1.02<br>L4  0.75 REF<br>Gf ; oAii1] es ee —— PØ L5   a 1.65  ee 1.95 1.20  1.80<br>0 1 e θ  5°  9°  7°<br>k θ1  5°  9°  7°<br>—-— — 1— ee<br>A All Dimensions in mm<br>Tt”™~‘“CSCS™*™*~*~*™~*~CCCCS<br>ee — ee<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


## **Package Outline Dimensionse Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

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**DMT6009LJ3** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2018, Diodes Incorporated 

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