# Power MOSFET, N Channel, 60 V, 100 A, 2500 µohm, PowerDI 5060, Surface Mount

![Product image](https://novapart.co/image/farnell:3518398/)

**URL**: https://novapart.co/products/DMT6004LPS-13/power-mosfet-n-channel-60-v-100-a-2500-ohm-powerdi
**SKU**: DMT6004LPS-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5430
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PowerDI 5060 |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 2500µohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3518398/)

**DMT6004LPS** 

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## **60V N-CHANNEL ENHANCEMENT MODE MOSFET PowerDI5060-8** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**BVDSS**|**RDS(ON) Max**|**ID** **MAX**<br>**TC = +25°C**|
|60V|3.1mΩ @ VGS= 10V|100A|
||4.5mΩ @ VGS= 4.5V|100A|



## **Features** 

- 100% Unclamped Inductive Switching – Ensures More Reliable and Robust End Application 

- Low RDS(ON) – Minimizes Power Losses 

- Low QG – Minimizes Switching Losses 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Description and Applications** 

This MOSFET is designed to minimize the on-state resistance (RDS(ON)), yet maintain superior switching performance, making it ideal for high-efficiency power management applications. 

## **Mechanical Data** 

   - Case: PowerDI[®] 5060-8 

   - Case Material: Molded Plastic, ―Green‖ Molding Compound. UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

- Primary Switch in Isolated DC-DC 

- Synchronous Rectifier 

- Loadswitch 

- Terminal Finish – Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 

- Weight: 0.097 grams (Approximate) 

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PowerDI5060-8<br>Top View  Bottom View<br>**----- End of picture text -----**<br>


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Internal Schematic<br>**----- End of picture text -----**<br>


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S D<br>S D<br>S D<br>G D<br>Top View<br>Pin Configuration<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|DMT6004LPS-13|PowerDI5060-8|2,500/Tape &Reel|



Notes: 

1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 

2. See http://www.diodes.com/quality/lead_free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. 

## **Marking Information** 

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D D D D<br>      = Manufacturer’s Marking<br>T6004LS = Product Type Marking Code<br>YYWW = Date Code Marking<br>T6004LS<br>YY = Year (ex: 18 = 2018)<br>YY WW WW = Week (01 to 53)<br>S S S G<br>**----- End of picture text -----**<br>


_PowerDI is a registered trademark of Diodes Incorporated._ 

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**DMT6004LPS** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

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||||||
|---|---|---|---|---|
|Characteristic|Symbol|Value|Unit|
|Drain-Source Voltage|VDSS|60|V|
|Gate-Source Voltage|VGSS|±20|V|
|Continuous Drain Current (Note 5)|TA = +25°C|ID|22|A|
|TA = +70°C|16|
|TC = +25°C|100|
|Continuous Drain Current (Note 6)|TC = +70°C|ID|100|A|
|(Note 8)|
|Maximum Continuous Body Diode Forward Current (Note 6)|IS|100|A|
|Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)|IDM|200|A|
|Pulsed Body Diode Forward Current (10µs Pulse, Duty Cycle = 1%)|ISM|200|A|
|Avalanche Current, L = 0.2mH|IAS|40|A|
|Avalanche Energy, L = 0.2mH|EAS|160|mJ|

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**Thermal Characteristic** 

**Characteristic Symbol Value Unit** Total Power Dissipation (Note 5) TA = +25°C PD 2.5 W Thermal Resistance, Junction to Ambient (Note 5) RθJA 47 °C/W Total Power Dissipation (Note 6) TC = +25°C PD 139 W Thermal Resistance, Junction to Case (Note 6) RθJC 0.9 °C/W ~~===~~ Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C ~~——~~ 

## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

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|||||||||
|---|---|---|---|---|---|---|---|
|Characteristic|Symbol|Min|Typ|Max|Unit|Test Condition|
|OFF CHARACTERISTICS|(Note 7)|
|Drain-Source Breakdown Voltage|BVDSS|60|—|—|V|VGS = 0V, ID = 1mA|
|Zero Gate Voltage Drain Current|IDSS|—|—|1|μA|VDS = 48V, VGS = 0V|
|Gate-Source Leakage|IGSS|—|—|±100|nA|VGS = ±20V, VDS = 0V|
|———|
|ON CHARACTERISTICS|(Note 7)|
|ee|Gate Threshold Voltage|VGS(TH)|1|—|3|V|VDS = VGS, ID = 250μA|
|Static Drain-Source On-Resistance|RDS(ON)|— —|2.5 3.3|3.1 4.5|mΩ mΩ|VVGSGS = 10V = 4.5V, I, IDD = 25A   = 20A|
|———————————|Diode Forward Voltage|VSD|—|—|1.3|V|VGS = 0V, IS = 25A|
|DYNAMIC CHARACTERISTICS|(Note 8)|
|Input Capacitance|Ciss|—|4,515|—|
|Output Capacitance|Coss|—|1,477|—|pF|VDS = 30V, VGS = 0V,|
|f = 1MHz|
|Reverse Transfer Capacitance|Crss|—|135.3|—|
|Gate Resistance|Rg|—|0.64|—|Ω|VDS = 0V, VGS = 0V, f = 1MHz|
|———|Total Gate Charge (VGS = 10V)|ee|Qg|—|96.3|—|
|Total Gate Charge (VGS = 4.5V)|Qg|—|47.4|—|nC|VDD = 30V, ID = 25A|
|Gate-Source Charge|Qgs|—|14.1|—|
|Gate-Drain Charge|QGD|—|21.4|—|
|Turn-On Delay Time|tD(ON)|—|9.9|—|
|Turn-On Rise Time|tR|—|17.7|—|VDD = 30V, VGS = 10V,|
|ns|
|Turn-Off Delay Time|tD(OFF)|—|53.5|—|ID = 25A, Rg = 3.5Ω|
|Turn-Off Fall Time|tF|—|32.9|—|
|—————|ee|
|Body Diode Reverse Recovery Time|tRR|—|49.7|—|ns|
|IF = 25A, di/dt = 100A/μs|
|Body Diode Reverse Recovery Charge|QRR|—|78.9|—|nC|
|——|a ee|

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- Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 6. Thermal resistance from junction to soldering point (on the exposed drain pad). 7 .Short duration pulse test used to minimize self-heating effect. 

   8. Guaranteed by design. Not subject to production testing. 

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50.0  30<br>45.0  VGS=3.5V VDS= 5.0V<br>40.0  AO —f SS VGS=3.0V 25 e ee| eee<br>35.0<br>VGS=4.0V 20<br>30.0  D ane eee ||<br>25.0  KY VGS=4.5V 15 ee||<br>125 ℃<br>20.0  VGS=10.0V 85 ℃<br>10<br>15.0  la ——— e e SINAN | |<br>150 ℃<br>25 ℃<br>10.0<br>fo VGS=2.5V 5 e e | e<br>5.0  po | -55 ℃<br>0.0  | 0 —i<br>0 0.5 1 1.5 2 2.5 3 0 1 2 3 4 5 6<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1. Typical Output Characteristic Figure 2. Typical Transfer Characteristic<br>5.00  10<br>9 TCC<br>4.00  8 TEE EEE<br>VGS=4.5V 7 te<br>3.00  6 St<br>5<br>2.00  VGS=10.0V 4 ID=25A<br>3 besseessi a<br>1.00  21 CSeeSEE<br>0.00  = 0 FEE Se  EEE<br>0 10 20 30 40 50 2 4 6 8 10 12 14 16 18 20<br>ID, DRAIN-SOURCE CURRENT (A)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current and  Figure 4. Typical Transfer Characteristic<br>Gate Voltage<br>6 2.2<br>VGS=10V 2 Pf | ff ft fy<br>5<br>1.8 Pf | | | ft tf<br>125 ℃ 150 ℃<br>4 1.6 Pf | [| | ft ft ft<br>85 ℃ 1.4 aes<br>3<br>25 ℃ 1.2 | | | | |bef<br>VGS=4.5V, ID=20A<br>2 -55 ℃ 1 er eee<br>0.8<br>1<br>0.6 VGS=10V, ID=25A<br>0 0.4 aiicecoe | | | ff |<br>10 20 30 40 50 -50 -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT (A) TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 5. Typical On-Resistance  vs. Drain Current and<br>Figure 6. On-Resistance Variation with Temperature<br>Temperature<br>, DRAIN CURRENT (A)<br>, DRAIN CURRENT (A)ID ID<br>(mΩ)<br>(mΩ)<br>, DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN-SOURCE ON-RESISTANCE<br>DS(ON)<br>R<br>DS(ON)<br>R<br>(NORMALIZED)<br>,  DRAIN-SOURCE ON-RESISTANCE (mΩ) , DRAIN-SOURCE ON-RESISTANCE DS(ON)<br>DS(ON) R<br>R<br>**----- End of picture text -----**<br>


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0.008 2.5<br>0.007<br>2<br>0.006<br>0.005 SEE VGS=4.5V, ID=20A R 1.5 RET ID=1mA<br>0.004<br>0.003 eT 1 oEo L<br>ID=250μA<br>0.002 oe oN<br>VGS=10V, ID=25A 0.5<br>0.001<br>—— — ~<br>0 Pee eee SO 0 EEE<br>-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE ( ℃ ) TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 7. On-Resistance Variation with Temperature Figure 8. Gate Threshold Variation vs. Temperature<br>50 10000<br>45 TT VGS=0V, TA=125 ℃ P === Ciss f=1MHz<br>40 Coss<br>een ae<br>35<br>VGS=0V, TA=150 ℃ 1000<br>30 | HP =CO ——<br>25 IN G ——————S S Crss S<br>20 ee [|e] VGS=0V, TA=85 ℃ a =<br>100<br>15<br>VGS=0V, TA=25 ℃<br>10<br>=====—<br>eee HER [Te)] a<br>5<br>VGS=0V, TA=-55 ℃<br>Oa<br>0 DTD 10  ==<br>0 0.3 0.6 0.9 1.2 1.5 0 5 10 15 20 25 30 35 40<br>VSD, SOURCE-DRAIN VOLTAGE (V) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current Figure 10. Typical Junction Capacitance<br>10 1000<br>R Limited PW = 10µs PW = 1µs<br>8 / a DS(ON)  ee<br>100<br>6 7 VDS=30V, ID=25A aa" bee NAR Hall<br>oN Hil<br>10 PW = 100µs<br>4 PW = 1ms<br>T = 150 ℃<br>1 J(Max)  PW = 10ms<br>2 Pandan TC = 25 ℃ |<br>Single Pulse PW = 100ms<br>DUT on Infinite Heatsink<br>VGS= 10V PW = 1s<br>0 0.1 Po TP<br>0.1 1 10 100<br>0 10 20 30 40 50 60 70 80 90 100<br>Qg (nC) VDS , DRAIN-SOURCE VOLTAGE (V)<br>Figure 12 SOA, Safe Operation Area<br>Figure 11. Gate Charge<br>, DRAIN CURRENT (A)<br>ID<br>(Ω)<br>, DRAIN-SOURCE ON-RESISTANCE<br>, GATE THRESHOLD  VOLTAGE (V)<br>DS(ON)<br>R VGS(TH)<br>, SOURCE CURRENT (A)<br>IS<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br> (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


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**DMT6004LPS** -—— 

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1<br>CESt<br>D=0.5<br>TH CELL rT TS LCT<br>D=0.9<br>D=0.3 ee Hl<br>D=0.7<br>V TA , tM ETAT El<br>0.1<br>D=0.1<br>SSH EHREH<br>er<br>D=0.05<br>FT | [AIT] | Am | iii | VTi hTUTCh<br>a Cc aooo<br>D=0.02 Emm AST ALIA MRRaTL RAL AMATO<br>0.01 uy OZ UML EI TIME ATCT TTI<br>D=0.01<br>al SEE HEHE EEErE<br>Leer | | Al | Titi 6| hvPr S T h<br>D=0.005<br>FATT alll<br>Ob [20am] RθJC(t)=r(t) * RθJC<br>RθJC=1.06 ℃ /W<br>D=Single Pulse Duty Cycle, D=t1 /  t2<br>0.001<br>1E-06 1E-05 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, PULSE DURATION TIME (sec)<br>Figure 12. Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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**DMT6004LPS** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**PowerDI5060-8** 

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D PowerDI5060-8<br>D1 Detail A Dim  Min  Max  Typ<br>0 (4X) A  0.90 1.10 1.00<br>A1  0.00  0.05  <br>c b 0.33 0.51  0.41<br>A1 b2  0.200 0.350 0.273<br>b3  0.40 0.80 0.60<br>E1 E<br>c  0.230 0.330 0.277<br>e D  5.15 BSC<br>D1  4.70 5.10 4.90<br>aie ====<br>1 0 1 (4X) D2  3.70 4.10 3.90<br>et D3  3.90 4.30 4.10<br>E  6.15 BSC<br>b (8X) e/2 E1  5.60 6.00 5.80<br>1 E2  3.28 3.68 3.48<br>L b2 (4X) E3 3.99 4.39 4.19<br>D3 K e 1.27 BSC<br>G  0.51  0.71  0.61<br>aa! A E3 [ete E2 UP D2 g M e b3 (4X) E K L  0.510 ee .51  S 0.71  0.61<br>L1  0.100 0.200 0.175<br>Detail A M1 M  3.235 4.035 3.635<br>M1  1.00 1.40 1.21<br>me G et L1 Θ  10º  12º  11º<br>3 Nese Θ1  6º  8º  7º<br>All Dimensions in mm<br>Suggested Pad Layout<br>Please see http://www.diodes.com/package-outlines.html for the latest version.<br>PowerDI5060-8<br>X4<br>Y2<br>X3<br>Dimensions  Value (in mm)<br>Y3 Y1 C  1.270<br>G  0.660<br>1 erie<br>G1  0.820<br>X  0.610<br>X1  4.100<br>X2<br>Y5 X2  0.755<br>y Y4 X1 ¥<br>X3  4.420<br>Y7<br>X4  5.610<br>Y  1.270<br>Y1  0.600<br>C G1 Y2  1.020<br>Y6 Y3  0.295<br>Y4  1.825<br>aoe: Y5  3.810<br>Y6  0.180<br>Y(4x)<br>fy X G Y7  6.610<br>**----- End of picture text -----**<br>


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DMT6004LPS Document number: DS37686  Rev. 4 - 2 

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**DMT6004LPS** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A.   Life support devices or systems are devices or systems which: 

1. are intended to implant into the body, or 

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2018, Diodes Incorporated 

**www.diodes.com** 

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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmt6004lps-13/mosfet-n-ch-60v-100a-powerdi-5060/dp/3518398)
---

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