# Power MOSFET, P Channel, 60 V, 23.6 A, 0.05 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:3943837/)

**URL**: https://novapart.co/products/DMPH6050SK3Q-13/power-mosfet-p-channel-60-v-236-a-005-ohm-to-252
**SKU**: DMPH6050SK3Q-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2870
**Stock**: 10+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 1.9W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 23.6A |
| Drain Source On State Resistance | 0.05ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943837/)

**Green DMPH6050SK3Q** ~~@~~ [7 **60V +175°C P-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
|**BVDSS**<br>**RDS(ON) max**<br>**ID max**<br>**TC = +25°C**<br>-60V<br>50mΩ@VGS= -10V<br>-23.6A<br>70mΩ@VGS= -4.5V<br>-20A|||
|**BVDSS**|**RDS(ON) max**|**ID max**<br>**TC = +25°C**|
|-60V|50mΩ@VGS= -10V|-23.6A|
||70mΩ@VGS= -4.5V|-20A|



## **Features** 

- Rated to +175°C – Ideal for High Ambient Temperature Environments 

- 100% Unclamped Inductive Switching  – Ensures More Reliable and Robust End Application 

- Low Qg – Minimizes Switching Loss 

- Low RDS(ON) – Minimizes On State Loss 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

- **PPAP Capable (Note 4)** 

## **Description and Applications** 

This MOSFET is designed to meet the stringent requirements of automotive applications. It is qualified to AEC-Q101, supported by a PPAP and is ideal for use in: 

## **Mechanical Data** 

   - Case: TO252 (DPAK) 

   - Case Material: Molded Plastic, ―Green‖ Molding Compound; UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

- Engine Management Systems 

- Body Control Electronics 

- DC-DC Converters 

- Terminal Finish - Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 

- Weight: 0.315 grams (Approximate) 

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TO252 (DPAK)<br>D<br>G<br>S<br>Top View  Pin Out Top View  Equivalent Circuit<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 5) 

|**Ordering Informationg Information Information** (Note 5)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|DMPH6050SK3Q-13|TO252(DPAK)|2,500/Tape & Reel|



- Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html. 

   5. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

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TO252 (DPAK)<br>H6050S<br>YYWW<br>**----- End of picture text -----**<br>


= Manufacturer’s Marking H6050S = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 15 = 2015) WW = Week Code (01 to 53) 

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## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|||||||
|---|---|---|---|---|---|
|**Characteristic**|||**Symbol**|**Value**|**Units**|
|Drain-Source Voltage|||VDSS|-60|V|
|Gate-Source Voltage|||VGSS|±20|V|
|Continuous Drain Current (Note 7) VGS= -10V|Steady<br>State|TC= +25°C<br>TC= +70°C|ID|-23.6<br>-19|A|
||Steady<br>State|TA= +25°C<br>TA= +70°C|ID|-7.2<br>-6.0|A|
|Pulsed Drain Current(10μspulse,dutycycle = 1%)|||IDM|-40|A|
|Maximum Continuous BodyDiode Forward Current(Note 7)|||IS|-3.8|A|
|Avalanche Current(Note 8)L = 0.1mH|||IAS|-25|A|
|Avalanche Energy (Note 8)L = 0.1mH|||EAS|31|mJ|



## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Thermal Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)||||
|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Value**|**Units**|
|Total Power Dissipation(Note 6)||PD|1.9|W|
|Thermal Resistance, Junction to Ambient(Note 6)|Steady State|RJA|80|°C/W|
|Total Power Dissipation(Note 7)||PD|3.8|W|
|Thermal Resistance,Junction to Ambient(Note 7)|Steady State|RJA|39|°C/W|
|Thermal Resistance,Junction to Case(Note 7)||RJC|3||
|Operatingand Storage Temperature Range||TJ,TSTG|-55 to +175|°C|



**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Characteristic**<br>~~——~~|**Symbol**<br>~~——~~|**Min**<br>~~——~~|**Typ **<br>~~——~~|**Max**<br>~~——~~|**Unit**<br>~~——~~|**Test Condition**<br>~~——~~|
|---|---|---|---|---|---|---|
|**OFF CHARACTERISTICS(Note 9) **<br>~~——~~|||||||
|Drain-Source Breakdown Voltage<br>~~——~~|BVDSS<br>~~——~~|-60<br>~~——~~|—<br>~~——~~|—<br>~~——~~|V<br>~~——~~|VGS= 0V,ID= -250μA<br>~~——~~|
|Zero Gate Voltage Drain Current TJ= +25°C<br>~~——~~|IDSS<br>~~——~~<br>~~fe~~|—<br>~~——~~<br>~~fe~~|—<br>~~——~~<br>~~fe~~|-1<br>~~——~~|µA<br>~~——~~|VDS= -60V,VGS= 0V<br>~~——~~|
|Gate-Source Leakage<br>~~Ce~~|IGSS<br>~~Ce~~<br>~~fe~~|—<br>~~Ce~~<br>~~fe~~|—<br>~~Ce~~<br>~~fe~~|±100<br>~~Ce~~|nA<br>~~Ce~~|VGS= ±20V,VDS= 0V<br>~~Ce~~|
|**ON CHARACTERISTICS(Note 9) **<br>~~fe~~<br>~~i~~<br>~~—~~|||||||
|Gate Threshold Voltage<br>~~ef~~<br>~~i~~<br>~~—~~|VGS(TH)<br>~~ef~~<br>~~—~~|-1<br>~~ef~~<br>~~—~~|—<br>~~ef~~<br>~~—~~|-3<br>~~ef~~<br>~~—~~|V<br>~~ef~~|VDS= VGS,ID= -250μA<br>~~ef~~|
|Static Drain-Source On-Resistance<br>~~i~~<br>~~—~~|RDS(ON)<br>~~—~~<br>~~ff~~|—<br>~~—~~|—<br>~~—~~|50<br>~~—~~|mΩ|VGS= -10V,ID= -7A|
|||—<br>~~—~~<br>~~ff~~|—<br>~~—~~<br>~~ff~~|70<br>~~—~~||VGS= -4.5V,ID= -7A|
|Diode Forward Voltage<br>~~i~~<br>~~—~~<br>~~ef~~|VSD<br>~~—~~<br>~~ef~~<br>~~ff~~|—<br>~~—~~<br>~~ef~~<br>~~ff~~|-0.7<br>~~—~~<br>~~ef~~<br>~~ff~~|-1.2<br>~~—~~<br>~~ef~~|V<br>~~ef~~|VGS= 0V,IS= -1A<br>~~ef~~|
|**DYNAMIC CHARACTERISTICS(Note 10)**<br>~~ff~~<br>~~oe~~|||||||
|Input Capacitance<br>~~Cn~~<br>~~———~~|Ciss<br>~~———~~<br>~~oe~~|—<br>~~———~~|1,377<br>~~———~~|—<br>~~———~~|pF<br>~~———~~|VDS= -30V, VGS= 0V,<br>f = 1MHz<br>~~———~~|
|Output Capacitance<br>~~———~~|Coss<br>~~———~~<br>~~oe~~|—<br>~~———~~|87<br>~~———~~|—<br>~~———~~|pF<br>~~———~~||
|Reverse Transfer Capacitance<br>~~———~~|Crss<br>~~———~~<br>~~oe~~|—<br>~~———~~|68<br>~~———~~|—<br>~~———~~|pF<br>~~———~~||
|Gate Resistance<br>~~———~~<br>~~Cn~~|Rg<br>~~———~~<br>~~oe~~<br>~~ED~~|—<br>~~———~~|12<br>~~———~~|—<br>~~———~~|Ω<br>~~———~~|VDS= 0V,VGS= 0V,f = 1MHz<br>~~———~~|
|Total Gate Charge(VGS= -4.5V)<br>~~I~~<br>~~Cn~~|Qg<br>~~oe~~<br>~~I~~<br>~~ED~~|—<br>~~I~~|12<br>~~I~~|—<br>~~I~~|nC<br>~~I~~|VDS= -30V, ID= -5A<br>|
|Total Gate Charge(VGS= -10V)<br>~~Cn~~|Qg<br>~~ED~~|—|25|—|nC||
|Gate-Source Charge|Qgs|—|3.8|—|nC||
|Gate-Drain Charge<br>~~_——~~|Qgd<br>|—<br>|4.9<br>|—<br>|nC<br>||
|Turn-On DelayTime<br>~~_——~~|tD(ON)<br>|—<br>|5.3<br>|—<br>|ns<br>|VDS= -30V, VGS= -10V,<br>RG= 3Ω, ID= -5A<br>|
|Turn-On Rise Time<br>~~_——~~|tR<br>|—<br>|8.6<br>|—<br>|ns<br>||
|Turn-Off DelayTime<br>~~_——~~|tD(OFF)<br>|—<br>|49.4<br>|—<br>|ns<br>||
|Turn-Off Fall Time<br>~~_——~~|tF<br>|—<br>|29.7<br>|—<br>|ns<br>||
|Body Diode Reverse Recovery Time<br>~~_——ee~~|tRR<br>~~ee~~|—<br>~~ee~~|14.2<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|IF= -5A, di/dt = 100A/μs<br>~~ee~~|
|Body Diode Reverse Recovery Charge<br>~~ee~~|QRR<br>~~ee~~|—<br>~~ee~~|7.9<br>~~ee~~|—<br>~~ee~~|nC<br>~~ee~~||



7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate. 

8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C. 

9. Short duration pulse test used to minimize self-heating effect. 

10. Guaranteed by design. Not subject to product testing. 

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30.0 30<br>VGS = -10V<br>VGS = -5.0V VDS = -5.0V<br>25.0 VGS = -4.5V 25<br>VGS = -4.0V<br>LY. ee<br>20.0 20<br>a RERREEE<br>15.0 ean 15 Oe<br>10.0 VGS = -3.5V 10 TA = 175C<br>Wo pf TA = 150C TA = 85C<br>5.0 — 5 ee TA = 125C T aoe A = 25C<br>VGS = -2.5V VGS = -3.0V TA = -55C<br>0.0 0 Zameen_———= 0.5 1 1.5 2 2.5 3 0 0 aaaeB 0.5 1 1.5 2 2.5 fe 3 3.5 4 4.5 5<br>VDS, DRAIN -SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1 Typical Output Characteristics Figure 2 Typical Transfer Characteristics<br>0.100 0.3<br>0.090<br>0.25<br>0.080<br>0.070<br>SSE 0.2 tt<br>0.060 a al ID = -7A<br>0.050 VGS = -4.5V 0.15<br>ID = -5A<br>er GLEE<br>0.040<br>0.030 — VGS = -10V 0.1 TE<br>0.020<br>0.05<br>0.010 PEERS eee<br>0.000 a 0 | EPrerr<br>0 5 10 15 20 25 30 0 2 4 6 8 10 12 14 16 18 20<br>ID, DRAIN SOURCE CURRENT (A) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3 Typical On-Resistance vs.  Figure 4 Typical Transfer Characteristic<br>Drain Current and Gate Voltage<br>0.12 2.4<br>VGS = -4.5V<br>2.2<br>0.1<br>Too TA = 175C 2 eee VGS = -10V<br>0.08 T A  = 150C 1.8 I D  = -10A<br>——— TA = 125C  oo 1.6 Pe<br>0.06 a T A  = 85C 1.4 Pit Wa<br>root rT | Sanna<br>TA = 25C 1.2 VGS = -4.5V<br>0.04 eer eT ID = -5A<br>1<br>TA = -55C 0.8<br>0.02<br>eo eee<br>0.6<br>0 | ttt 0.4 SPCC Eee<br>0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150 175<br>ID, DRAIN SOURCE CURRENT (A) TJ, JUNCTION TEMPERATURE (C)<br>Figure 5 Typical On-Resistance vs.  Figure 6 On-Resistance Variation with Temperature<br>Drain Current and Temperature<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON)<br>R<br>, DRAIN-SOURCE<br>DS(ON)<br>R<br>ON-RESISTANCE (NORMALIZED)<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON)<br>R<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON)<br>R<br>, DRAIN CURRENT (A)<br>ID<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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0.1 3<br>0.09 [V)]<br>Pt; | tt tt yf Sea<br>2.5<br>0.08<br>0.07 po V ID GS   -5=   -4.= A 5V 7 [GE(] A -I   = 250µAD<br>[OLT] V 2<br>0.06 Bann ee BST<br>[LD] O -I   =1mAD<br>0.05 «nze 1.5 SS<br>VGS = -10V [SH] RE<br>0.04 HEE ID  -10= A HT mS<br>E 1<br>0.03<br>SO [AT] G itt tty ys<br>0.02 , 0.5<br>( [TH)]<br>0.01 eo G [S]<br>V<br>0 0<br>CEE ETT LETTE ELE<br>-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175<br>TJ, JUNCTION TEMPERATURE (C) T  , AMBIENT TEMPERATURE (°C)A<br>Figure 7 On-Resistance Variation with Temperature Figure 8 Gate Threshold Variation vs. Ambient Temperature<br>30 100000<br>25 10000 T   = 175°CA<br>) T   = 150°CA<br>20 TA= 175C N [T(nA] 1000 T   = 125°CA<br>15 TA= 150C C [URRE] 100 T   = 85°CA<br>TA= 125C G [E] A<br>10 T A = 85C KA 10<br>a TA= 25C , [LE] Sesesses=see T   = 25°CA<br>5 TA= -55C I D [SS] 1<br>0 0.1<br>0 0.3 0.6 0.9 1.2 1.5 0 5 10 15 20 25 30 35 40 45 50 55 60<br>Figure 9 Diode Forward Voltage vs. Current-VSD, SOURCE-DRAIN VOLTAGE (V) V    , DRAIN-SOURCE VOLTAGE (V)DS<br>Figure 10 Typical Drain-Source Leakage Current vs. Voltage<br>10000 10<br>f = 1MHz<br>===><br>a ee 8<br>Ciss<br>1000<br>Seeee ooo VDS = -30V<br>6 I D = -5A<br>100 Coss 4<br>Crss<br>———<br>ee ee 2<br>10 Pt tT tT ft | Tt<br>0 5 10 15 20 25 30 35 40 0<br>= VDS, DRAIN-SOURCE VOLTAGE (V) 0 aati 5 10 15 20 25<br>Figure 11 Typical Junction Capacitance Qg, TOTAL GATE CHARGE (nC)<br>Figure 12 Gate-Charge Characteristics<br>, GATE-SOURCE VOLTAGE (V)<br>V<br>GS<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br>, GATE THRESHOLD VOLTAGE (V)<br>GS(TH)<br>V<br>, LEAKAGE CURRENT (nA)<br>IDSS<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>DS(on)<br>R<br>, SOURCE CURRENT (A)<br>-I<br>S<br>**----- End of picture text -----**<br>


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1<br>D = 0.9<br>PE D = 0.7 Eee<br>D = 0.5<br>TegEE ee<br>D = 0.3<br>0.1 aaLS D = 0.1 wert P 20See?Aco)AD)|  a| |<br>HH<br>D = 0.05 oe A TT<br>by tt<br>SA<br>D = 0.02<br>ATHLETE T HOTT<br>0.01 PAN D = 0.01<br>aSfSc) AAer eraOO ccemLIMeccrineSGTAINOO UIIOOLECT<br>SH<br>ey D = 0.005 ieee tH|tt<br>et Rthjc (t) = r(t)  *  Rthjc |<br>Single Pulse R  = 2.8°C/W<br>thjc<br>Duty Cycle, D = t1/ t2<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10<br>t1, PULSE DURATION TIME (sec)<br>Figure 13  Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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100<br>RDS(ON) PW = 1µs<br>Limited a ee<br>=. oH<br>ee aR YS nail<br>10 IN<br>ESSapT PW = 1s PICIAAN KATEEY AE<br>|e?gt PW = 100ms PT VISRAATA NEAT<br>| 1 NSX/\) nail<br>1 a PW = 10ms USAXN<br>————a eens PW = 1ms /—J— AWPF WW<br>eee [WAGE<br>ee PW = 100µs \ nail<br>0.1 TJ(Max) = 175 ℃ PW = 10µs<br>TC = 25 ℃<br>Single Pulse ee<br>DUT on Infinite Heatsink<br>VGS = -10V<br>cc CC<br>0.01<br>0.1 1 10 100<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 14 SOA, Safe Operation Area<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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**DMPH6050SK3Q** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

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TO252 (DPAK)<br>**----- End of picture text -----**<br>


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E<br>A<br>b3<br>7°± 1° TO252 (DPAK)<br>L3 c Dim Min  Max  Typ<br>oo = —— A  2.19 2.39 2.29<br>A1  0.00 0.13 0.08<br>A2  0.97  1.17  1.07<br>D b  0.64  0.88 0.783<br>A2<br>L4 H b2  0.76  1.14  0.95<br>b3  5.21  5.46  5.33<br>c  0.45  0.58 0.531<br>D  6.00  6.20  6.10<br>D1  5.21  -  -<br>e  -  -  2.286<br>e E  6.45 6.70 6.58<br>b(3x)<br>E1  4.32  -  -<br>b2(2x)<br>H  9.40 10.41  9.91<br>0.508 L  1.40  1.78  1.59<br>Gauge Plane L3  0.88  1.27  1.08<br>L4  0.64  1.02  0.83<br>E1 D1 Seating Plane a  0°  10°  -<br>L All Dimensions in mm<br>A1<br>2.74REF<br>Ht 4 ot<br>ie Sa li ne S55<br>a<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**TO252 (DPAK)** 

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e e X1 7<br>Y1<br>Y2<br>= C<br>ne<br>Y<br>ot X<br>**----- End of picture text -----**<br>


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Dimensions  Value (in mm)<br>C  4.572<br>X  1.060<br>X1  5.632<br>Y  2.600<br>Y1  5.700<br>Y2  10.700<br>**----- End of picture text -----**<br>


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## **IMPORTANT NOTICE** 

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Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

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- A.   Life support devices or systems are devices or systems which: 

   1.  are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2016, Diodes Incorporated 

**www.diodes.com** 

7 of 7 **www.diodes.com** 

DMPH6050SK3Q Document number: DS37293  Rev. 5 - 2 

June 2016 © Diodes Incorporated 



## Links

- [View this product on Novapart](https://novapart.co/products/DMPH6050SK3Q-13/power-mosfet-p-channel-60-v-236-a-005-ohm-to-252)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmph6050sk3q-13/mosfet-p-ch-60v-23-6a-to-252/dp/3943837)
---

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