# Power MOSFET, P Channel, 450 V, 250 mA, 40 ohm, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:3943805RL/)

**URL**: https://novapart.co/products/DMP45H150DHE-13/power-mosfet-p-channel-450-v-250-ma-40-ohm-sot-223
**SKU**: DMP45H150DHE-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1490
**Stock**: 10+
**Lead Time**: 106 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 13.9W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-223 |
| Drain Source Voltage Vds | 450V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 250mA |
| Drain Source On State Resistance | 40ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943805RL/)

**DMP45H150DHE 450V P-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**BVDSS**|**RDS(ON)**|**ID**<br>**TA = +25°C**|
|-450V|150Ω @ VGS= -10V|-0.25A|



## **Features and Benefits** 

- Low Gate Drive 

- Low Input Capacitance 

- Fast Switching Speed 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

## **Mechanical Data** 

## **Description** 

- Case: SOT223 

This 450V enhancement mode P-channel MOSFET provides users with a competitive specification offering efficient power handling capability, high impedance and is free from thermal runaway and thermally induced secondary breakdown. Applications benefiting from this device include a variety of Telecom and general high voltage switching circuits. 

- Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminals Connections: See Diagram Below 

- Terminals: Finish – Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 **e3** 

## **Applications** 

|**Applicationspplicationslications**||||||Weight: 0.112 grams (Approximate)|Weight: 0.112 grams (Approximate)|Weight: 0.112 grams (Approximate)|Weight: 0.112 grams (Approximate)|
|---|---|---|---|---|---|---|---|---|---|
|Load Switching||||||||||
|Uninterrupted Power Supply||||||||||
|SOT223<br>*||i:||||||**D**<br>**S**<br>**G**<br> &||
|Top View|||Pin Out - Top View|||||Equivalent Circuit||
|**Ordering Information** (Note 4)||||||||||
|||||||||||
|**Part Number**||**Qualification**||||||**Case**|**Packaging**|
|DMP45H150DHE-13||Standard|||||SOT223||2,500/Tape & Reel|



- Load Switching 

- Uninterrupted Power Supply 

## **Ordering Information** (Note 4) 

- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

**==> picture [56 x 24] intentionally omitted <==**

**----- Start of picture text -----**<br>
YWW<br>P450H2<br>**----- End of picture text -----**<br>


= Manufacturer’s Marking P450H2 = Marking Code YWW = Date Code Marking Y or Y= Year (ex: 7 = 2017) WW = Week (01 to 53) 

1 of 6 **www.diodes.com** 

DMP45H150DHE Document Number DS39212 Rev. 3 - 2 

October 2017 © Diodes Incorporated 

**DMP45H150DHE** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|
||||||
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Drain-Source Voltage||VDSS|-450|V|
|Gate-Source Voltage||VGSS|±30|V|
|Continuous Drain Current (Note 5) VGS=- 10V|TC= +25°C<br>TC= +70°C|ID|-0.25<br>-0.20|A|
|Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)||IDM|-0.45|A|
|Maximum Body Diode Continuous Current||IS|-0.45|A|
|Avalanche Energy (Note 6) L=60mH||EAS|4|mJ|
|Avalanche Current (Note 6) L=60mH||IAS|0.25|A|
|Peak Diode Recoverydv/dt(ISD ≤1.0A, di/dt≤100A/μs)||dv/dt|4.5|V/ns|



## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Thermal Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|
||||||
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Total Power Dissipation (Note 6)|TC= +25°C|PD|13.9|W|
||TC= +70°C||8.9|°C/W|
|Thermal Resistance,Junction to Ambient|(Note 6)|RθJA|59.4|W|
|Thermal Resistance,Junction to Case|(Note 6)|RθJC|8.9|°C/W|
|Operatingand Storage Temperature Range||TJ,TSTG|-55 to +150|°C|



**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

||||||||
|---|---|---|---|---|---|---|
|**Characteristic**<br>~~ee~~|**Symbol**<br>~~ee~~|**Min**<br>~~ee~~|**Typ**<br>~~ee~~|**Max**<br>~~ee~~|**Unit**<br>~~ee~~|**Test Condition**<br>~~ee~~|
|**OFF CHARACTERISTICS**(Note 5)<br>~~ee~~<br>~~—————~~|||||||
|Drain-Source Breakdown Voltage<br>~~ee~~<br>~~—————~~|BVDSS<br>~~ee~~|-450<br>~~ee~~|<br>~~ee~~|<br>~~ee~~|V<br>~~ee~~|VGS= 0V,ID= -250µA<br>~~ee~~|
|Zero Gate Voltage Drain Current<br>~~—————~~|IDSS|||-1|µA|VDS= -450V,VGS= 0V|
|Gate-Source Leakage<br>~~—————~~|IGSS|||±100|nA|VGS= ±30V,VDS= 0V|
|**ON CHARACTERISTICS**(Note 5)<br>~~—————~~|||||||
|Gate Threshold Voltage<br>~~Ce~~|VGS(TH)<br>~~Ce~~|-2.0<br>~~Ce~~|-3.0<br>~~Ce~~|-4.0<br>~~Ce~~|V<br>~~Ce~~|VDS= VGS,ID= -250µA<br>~~Ce~~|
|Static Drain-Source On-Resistance<br>~~ee~~|RDS(ON)<br>~~ee~~|<br>~~ee~~|<br>~~ee~~|150<br>~~ee~~|Ω<br>~~ee~~|VGS= -10V,ID= -50mA<br>~~ee~~|
|Diode Forward Voltage<br>~~ee~~|VSD<br>~~ee~~|<br>~~ee~~|-0.8<br>~~ee~~|-1.2<br>~~ee~~|V<br>~~ee~~|VGS= 0V,IS= -50mA<br>~~ee~~|
|**DYNAMIC CHARACTERISTICS**(Note 6)|||||||
|Input Capacitance|CISS||59.2||pF|VDS= -25V, VGS= 0V, f = 1.0MHz|
|Output Capacitance<br>~~————~~|COSS||11||||
|Reverse Transfer Capacitance<br>~~————~~|CRSS||1||||
|Forward Transconductance<br>~~————~~<br>~~ee~~|gFS|40|||ms|VDS=-25V,ID=-50mA|
|Gate Resistance<br>~~————~~<br>~~ee~~|RG||50||Ω|VDS= 0V,VGS= 0V,f = 1.0MHz|
|Total Gate Charge<br>~~————~~<br>~~ee~~|QG||1.8||nC<br>~~ee~~|VDS= -225V, ID= -100mA, VGS= -<br>10V<br>~~ee~~|
|Gate-Source Charge<br>~~ee~~|QGS||0.3||||
|Gate-Drain Charge<br>~~ee~~<br>~~———~~<br>~~———~~|QGD<br>~~———~~|<br>~~———~~|0.9<br>~~———~~|<br>~~———~~<br>~~ee~~|||
|Turn-On DelayTime<br>~~ee~~<br>~~———~~<br>~~———~~|tD(ON)<br>~~———~~|<br>~~———~~|12<br>~~———~~|<br>~~———~~<br>~~ee~~|ns<br>~~ee~~|VDD= -225V, RG= 3.0Ω, ID= -100mA<br>~~ee~~|
|Turn-On Rise Time<br>~~———~~|tR||9|<br>~~ee~~|||
|Turn-Off DelayTime<br>~~———~~|tD(OFF)||19<br>~~A~~|<br>~~ee~~|||
|Turn-Off Fall Time<br>~~———~~|tF||87<br>~~A~~|<br>~~ee~~|||
|Body Diode Reverse Recovery Time<br>~~———~~<br>~~eG~~|tRR<br>~~eG~~|<br>~~eG~~|108<br>~~eG~~<br>~~A~~|<br>~~ee~~<br>~~eG~~|ns<br>~~ee~~<br>~~eG~~|VGS= 0V, IS= -100mA,VDD=-100V,<br>di/dt = 100A/μs<br>~~ee~~<br>~~eG~~|
|Body Diode Reverse Recovery Charge<br>~~OO~~|QRR<br>~~OO~~|<br>~~OO~~|391<br>~~A~~<br>~~OO~~|<br>~~OO~~|nC<br>~~OO~~|VGS= 0V, IS=-100mA,<br>VDD=-100V,di/dt = 100A/μs<br>~~OO~~|



Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1 inch square copper pad layout. 6. Guaranteed by design. Not subject to production testing. 

2 of 6 **www.diodes.com** 

DMP45H150DHE Document Number DS39212 Rev. 3 - 2 

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**DMP45H150DHE** 

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0.2 0.1<br>0.2  VGS = -6.0V  VDS = -10V<br>0.2 S  VGS = -8.0V  K 0.08<br>0.1<br>0.1  VGS = -10.0V   VGS = -4.5V  0.06<br>fe<br> VGS=-5.0V<br>0.1<br>0.1 0.04<br>125 ℃<br>0.1<br> VGS = -4.0V  85 ℃<br>0.0 fi 0.02 e e<br>150 ℃ 25 ℃<br>0.0 LO  VGS = -3.5V<br>-55 ℃<br>0.0 Zo 0<br>0 2 4 6 8 10 0 1 2 3 4 5 6 7 8<br>VDS, DRAIN-SOURCE VOLTAGE (V)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1.Typical Output Characteristic  Figure 2. Typical Transfer Characteristic<br>50 200<br>180<br>160<br>45 =<br>140<br>120<br>40 100<br>eS<br> VGS = -10V  80<br>60<br>35 tn 40 ID = -50mA<br>20<br>30 TET) 0 =<br>0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 0 5 10 15 20 25 30<br>ID, DRAIN-SOURCE CURRENT (A)   VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current and  Figure 4. Typical Transfer Characteristic<br>Gate Voltage<br>120 3<br>VGS = -10V<br>2.5<br>pt [tT] TT<br>90<br>150 ℃<br>2 pti<br>60 125 ℃ 1.5<br>P| tt te<br>85 ℃<br>1 |eet tt |et<br>30 25 ℃<br>0.5  VGS = 10V, ID = 0.6A<br>-55 ℃<br>0 0 sZ afe is<br>0 0.04 0.08 0.12 0.16 0.2 -50 -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT (A)  TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 5. Typical On-Resistance vs. Drain Current and  Figure 6. On-Resistance Variation with Temperature<br>Temperature<br>, DRAIN CURRENT (A)  , DRAIN CURRENT (A)<br>ID ID<br>) (W ) (W<br>, DRAIN-SOURCE ON-RESISTANCE  , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON) DS(ON)<br>R R<br>)<br>(W<br>(NORMALIZED)<br>, DRAIN-SOURCE ON-RESISTANCE  , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON) DS(ON)<br>R R<br>**----- End of picture text -----**<br>


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DMP45H150DHE Document Number DS39212 Rev. 3 - 2 

October 2017 © Diodes Incorporated 

**DMP45H150DHE** 

**==> picture [236 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>80<br>60<br>40<br>20  VGS = -10V, ID = -50mA<br>0<br>-50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 7. On-Resistance Variation with Temperature<br>)<br>(W<br>, DRAIN-SOURCE ON-RESISTANCE<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


**==> picture [231 x 204] intentionally omitted <==**

**----- Start of picture text -----**<br>
5<br>4<br>ID = -1mA<br>3 SeeRee<br>ID = -250μA<br>2 PR S<br>1<br>-50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 8. Gate Threshold Variation vs. Junction<br>Temperature<br>, GATE THRESHOLD VOLTAGE (V)<br>GS(TH)<br>V<br>**----- End of picture text -----**<br>


**==> picture [521 x 445] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.2<br>1000<br>0.18 VGS = 0V  f=1MHz<br>0.16 A a<br>0.14 ee ee eee 100 pf tf f Ciss  f<br>0.12<br>0.1 pA fp 10 St _t<br>Coss<br>0.08 ==<br>eee [2s] \<br>TA = 85 [o] C<br>0.06<br>0.04 HE TA = 125 [o] C  R a TA = 25 [o] C  1 ER a ———_—— Crss<br>0.02 TA = 150 [o] C  TA = -55 [o] C  _—— ——— ——— ——— ——— ——<br>Se<br>0 DY 0 a<br>0 0.3 0.6 0.9 1.2 1.5 0 5 10 15 20 25 30 35 40<br>VSD, SOURCE-DRAIN VOLTAGE (V)  VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current  Figure 10. Typical Junction Capacitance<br>10 1<br>RDS(ON) Limited  PW =100µs<br>PATS<br>8 eS<br>0.1<br>6<br>|; _| Jb” PW =1ms  *K NAN NEN anna<br>4 r— VDS = -225V, ID = -100mA  ae PW =10ms  SOS<br>0.01 PW =100ms<br>2 TJ(Max) = 150 ℃  TC = 25 ℃ PW =1s<br>Single Pulse DUT on 1*MRP Board  PW =10s                                  DC  tit<br>VGS= -10V<br>0 JIU 0.001 nil SOE1Mi<br>0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 1 10 100 1000<br>Qg (nC)  VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11. Gate Charge  Figure 12. SOA, Safe Operation Area<br>, SOURCE CURRENT (A)<br>IS<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br> (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


4 of 6 **www.diodes.com** 

DMP45H150DHE Document Number DS39212 Rev. 3 - 2 

October 2017 © Diodes Incorporated 

**DMP45H150DHE** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**==> picture [31 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
SOT223<br>**----- End of picture text -----**<br>


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D<br>ae b1 Q<br>C<br>SOT223<br>Dim  Min  Max  Typ<br>A 1.55 1.65 1.60<br>A1 0.010 0.15 0.05<br>E E1<br>b 0.60 0.80 0.70<br>b1 2.90 3.10 3.00<br>Gauge<br>Plane C 0.20  0.30  0.25<br>0.25 D 6.45  6.55  6.50<br>Seating L E 3.45  3.55  3.50<br>Plane Woe EEE<br>E1 6.90  7.10  7.00<br>e1 b e -  -  4.60<br>=e e | | 7 aa e1 -  -  2.30<br>L 0.85  1.05  0.95<br>Q 0.84  0.94  0.89<br>A A1 All Dimensions in mm<br>al —<br>yout out<br>Please see http://www.diodes.com/package-outlines.html for the latest version.<br>SOT223<br>X1<br>Y1<br>Dimensions Value (in mm)<br>C  2.30<br>C1  6.40<br>X  1.20<br>X1  3.30<br>C1 Y2<br>Y  1.60<br>Y1  1.60<br>Y2  8.00<br>Y<br>agg. X C ==<br>7°<br>0°-10°<br>7°<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout out** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

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DMP45H150DHE Document Number DS39212 Rev. 3 - 2 

October 2017 © Diodes Incorporated 

**DMP45H150DHE** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

- B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2017, Diodes Incorporated 

**www.diodes.com** 

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DMP45H150DHE Document Number DS39212 Rev. 3 - 2 

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## Links

- [View this product on Novapart](https://novapart.co/products/DMP45H150DHE-13/power-mosfet-p-channel-450-v-250-ma-40-ohm-sot-223)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmp45h150dhe-13/mosfet-p-ch-450v-0-25a-sot-223/dp/3943805RL)
---

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