# Power MOSFET, P Channel, 40 V, 20 A, 0.033 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:3943803/)

**URL**: https://novapart.co/products/DMP4047SK3-13/power-mosfet-p-channel-40-v-20-a-0033-ohm-to-252
**SKU**: DMP4047SK3-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1860
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.6W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 20A |
| Drain Source On State Resistance | 0.033ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943803/)

**DMP4047SK3** 

## **40V P-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**BVDSS**|**RDS(ON)**|**ID**<br>**TC = +25°C**|
|-40V|45mΩ @ VGS= -10V|-20A|
||55mΩ @ VGS = -4.5V|-18A|



## **Features** 

- 100% Unclamped Inductive Switch (UIS) Test in Production 

- Low On-Resistance 

- Fast Switching Speed 

- **Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

## **Description** 

This MOSFET has been designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. 

## **Applications** 

- Backlighting 

## **Mechanical Data** 

   - Case: TO252 (DPAK) 

   - Case Material: Molded Plastic, “Green” Molding Compound.  UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

   - Terminals: Matte Tin Finish Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 **e3** 

   - Weight: 0.33 grams (Approximate) 

- DC-DC Converters 

- Power Management Functions 

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D<br>TO252 (DPAK)<br>D<br>G S<br>Top View  Top View<br>Pin-Out<br>**----- End of picture text -----**<br>


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D<br>G<br>S<br>Equivalent Circuit<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|||
|---|---|---|
|**Product**|**Case**|**Packaging**|
|DMP4047SK3-13|TO252(DPAK)|2,500/Tape &Reel|



- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. 

## **Marking Information** 

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P4047S<br>YYWW<br>**----- End of picture text -----**<br>


= Manufacturer’s Marking P4047S = Product Type Marking Code YYWW = Date Code Marking . YY = Year (ex: 17= 2017) WW = Week (01 to 53) 

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**DMP4047SK3** 

**Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|---|---|---|
|**Characteristic**<br>**Symbol**<br>**Value**<br>**Unit**<br>Drain-Source Voltage<br>VDSS<br>-40<br>V<br>Gate-Source Voltage<br>VGSS<br>±20<br>V<br>~~————_——~~|||||||||
||Continuous Drain Current (Note 6) VGS= -10V<br>~~a~~|Steady<br>State<br>TC= +25°C<br>TC= +100°C|ID||-20<br>-12.7||A||
||Maximum BodyDiode Continuous Current<br>IS<br>-2.5<br>A<br>Pulsed Drain Current(10µs Pulse,DutyCycle = 1%)<br>IDM<br>-40<br>A<br>Avalanche Current (Note 7) L = 0.1mH<br>IAS<br>-18<br>A<br>Avalanche Energy(Note 7) L = 0.1mH<br>EAS<br>16<br>mJ<br>**Thermal Characteristics**(@TA= +25°C, unless otherwise specified.)<br>**Characteristic**<br>**Symbol**<br>**Value**<br>**Unit**<br>Total Power Dissipation (Note 5)<br>TA= +25°C<br>PD<br>1.6<br>W<br>TA= +70°C<br>1.0<br>Thermal Resistance, Junction to Ambient (Note 5)<br>Steadystate<br>RθJA<br>77<br>°C/W<br>t<10s<br>34<br>Total Power Dissipation (Note 6)<br>TA= +25°C<br>PD<br>2.7<br>W<br>TA= +70°C<br>1.7<br>~~———————————~~||||||||
||Thermal Resistance, Junction to Ambient (Note 6)|Steadystate<br>RθJA<br>t<10s|||47<br>30||°C/W||
||Thermal Resistance,Junction to Case(Note 6)||RθJC||4.8||||
||Operatingand Storage Temperature Range||TJ,TSTG||-55 to +150|-55 to +150|°C||



## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|---|
||||||||
|**Characteristic**|**Symbol**|**Min**|**Typ **|**Max**|**Unit**|**Test Condition**|
|**OFF CHARACTERISTICS**(Note 8)|||||||
|Drain-Source Breakdown Voltage<br>~~———~~|BVDSS<br>~~———~~|-40|||V|VGS= 0V,ID= -250μA|
|Zero Gate Voltage Drain Current TJ= +25°C<br>~~———~~|IDSS<br>~~———~~|||-1|µA|VDS= -40V,VGS= 0V|
|Gate-Source Leakage<br>~~———~~|IGSS<br>~~———~~|||±100|nA|VGS= ±20V,VDS= 0V|
|**ON CHARACTERISTICS**(Note 8) <br>~~———~~|||||||
|Gate Threshold Voltage<br>~~———~~|VGS(TH)<br>~~———~~|-1.0||-3.0|V|VDS= VGS,ID= -250μA|
|Static Drain-Source On-Resistance<br>~~———~~|RDS(ON)<br>~~———~~||33|45|mΩ|VGS= -10V,ID= -4.4A|
||||40|55||VGS= -4.5V,ID= -3.7A|
|Diode Forward Voltage<br>~~———~~|VSD<br>~~———~~||-0.75|-1.2|V|VGS= 0V,IS= -3.9A|
|**DYNAMIC CHARACTERISTICS**(Note 9)<br>~~———~~|||||||
|Input Capacitance<br>~~——_—~~|Ciss<br>~~——_—~~|<br>~~——_—~~|1328<br>~~——_—~~|<br>~~——_—~~|pF<br>~~——_—~~|VDS= -20V, VGS= 0V,<br>f = 1.0MHz<br>~~——_—~~|
|Output Capacitance<br>~~——_—~~|Coss<br>~~——_—~~|<br>~~——_—~~|103<br>~~——_—~~|<br>~~——_—~~|pF<br>~~——_—~~||
|Reverse Transfer Capacitance<br>~~——_—~~|Crss<br>~~——_—~~|<br>~~——_—~~|81<br>~~——_—~~|<br>~~——_—~~|pF<br>~~——_—~~||
|Gate Resistance<br>~~——_—~~|RG<br>~~——_—~~|<br>~~——_—~~|7.7<br>~~——_—~~|<br>~~——_—~~|Ω<br>~~——_—~~|VDS= 0V,VGS= 0V,f = 1MHz<br>~~——_—~~|
|Total Gate Charge(VGS= -4.5V)|Qg||11.2||nC|VDS= -20V, ID= -4.9A<br>~~ee~~|
|Total Gate Charge(VGS= -10V)|Qg||23.2||nC||
|Gate-Source Charge|Qgs||3.3||nC||
|Gate-Drain Charge<br>~~——_———~~|Qgd||3.9|<br>~~ee~~|nC<br>~~ee~~||
|Turn-On DelayTime<br>~~——_———~~|tD(ON)||18.5|<br>~~ee~~|ns<br>~~ee~~|VDS= -20V, ID = -3.9A<br>VGS= -4.5V, RG= 1Ω<br>~~ee~~|
|Turn-On Rise Time<br>~~——_———~~|tR||28.2|<br>~~ee~~|ns<br>~~ee~~||
|Turn-Off DelayTime<br>~~——_———~~|tD(OFF)||38.8|<br>~~ee~~|ns<br>~~ee~~||
|Turn-Off Fall Time<br>~~——_———~~|tF||28.6|<br>~~ee~~|ns<br>~~ee~~||
|BodyDiode Reverse RecoveryTime<br>~~——_———~~<br>~~eee~~|tRR<br>~~eee~~|<br>~~eee~~|15.4<br>~~eee~~|<br>~~ee~~<br>~~eee~~|ns<br>~~ee~~<br>~~eee~~|IF= -3.9A, di/dt = 100A/μs<br>~~ee~~<br>~~eee~~|
|BodyDiode Reverse RecoveryCharge<br>~~eee~~|QRR<br>~~eee~~|<br>~~eee~~|5.4<br>~~eee~~|<br>~~eee~~|nC<br>~~eee~~||



Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 

7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C. 

8. Short duration pulse test used to minimize self-heating effect. 

9. Guaranteed by design. Not subject to product testing. 

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30.0  30<br>-55 ℃<br>25.0  VGS=-4.0V VGS=-3.5V 25 VDS= -5.0V 85 ℃<br>20.0  eS Y A VGS=-4.5V 20 eeeOT FAe<br>15.0  VGS=-5.0V VGS=-3.0V 15<br>10.0  l/ 7 VGS=-10.0V 10 f<br>VGS=-2.5V 125 ℃<br>5.0  5 150 ℃<br>VGS=-2.0V 25 ℃<br>0.0  po 0 Y-<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 1 2 3 4 5<br>-VDS, DRAIN-SOURCE VOLTAGE (V) -VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1.Typical Output Characteristic Figure 2.Typical Transfer Characteristic<br>0.15 0.2<br>0.18<br>0.12 0.16<br>TT VGS=-2.5V T 0.14 REE ID= -3.7A SE<br>0.09 0.12<br>Te 0.1<br>ID= -4.4A<br>0.06 P T 0.08<br>VGS=-4.5V 0.06<br>0.03 0.04<br>RE EA E<br>0.02<br>VGS=-10.0V<br>0 SEER 0 CEP EEE EEE<br>0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20<br>-ID, DRAIN-SOURCE CURRENT (A) -VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3.Typical On-Resistance vs. Drain Current and  Figure 4. Typical On-Resistance vs. Gate Voltage<br>Gate Voltage<br>0.1 1.6<br>VGS= -4.5V VGS= -10.0V,<br>0.08 TTTTT) 1.4 OY ID=-10.0A<br>150 ℃<br>125 ℃<br>0.06 1.2<br>ee VGS= -4.5V,<br>ID=-5.0A<br>0.04 1<br>== = 25 ℃ nae<br>85 ℃<br>0.02 0.8<br>-55 ℃<br>a o e ee<br>0 ee 0.6 a<br>0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT (A) TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 5.Typical On-Resistance vs. Drain Current and  Figure 6. On-Resistance Variation with Temperature<br>Temperature<br>, DRAIN CURRENT (A)<br>, DRAIN CURRENT (A) D<br>D -I<br>-I<br>(Ω) (Ω)<br>, DRAIN-SOURCE ON-RESISTANCE  , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON) DS(ON)<br>R R<br>(Ω)<br>(NORMALIZED)<br>DRAIN-SOURCE ON-RESISTANCE  , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON),   DS(ON)<br>R R<br>**----- End of picture text -----**<br>


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0.08<br>0.06<br>VGS=-4.5V, ID=-5.0AGS=-4.5V, ID=-5.0A=-4.5V, ID=-5.0AD=-5.0A=-5.0A<br>0.04<br>0.02 VGS=-10.0V, ID=-10.0AGS=-10.0V, ID=-10.0A=-10.0V, ID=-10.0AD=-10.0A=-10.0A<br>0<br>-50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (J, JUNCTION TEMPERATURE (, JUNCTION TEMPERATURE ( ℃ )<br>Figure 7. On-Resistance Variation with Temperature<br>(Ω)<br>DRAIN-SOURCE ON-RESISTANCE<br>DS(ON),<br>R<br>**----- End of picture text -----**<br>


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0.08 2<br>1.8<br>1.6 Hf} | ID=-1mA | | | |<br>0.06<br>1.4 SS<br>VGS=-4.5V, ID=-5.0AGS=-4.5V, ID=-5.0A=-4.5V, ID=-5.0AD=-5.0A=-5.0A<br>1.2<br>Se<br>0.04 1 ID=-250μA<br>0.8 AAS<br>0.6<br>|p | | | |<br>0.02 VGS=-10.0V, ID=-10.0AGS=-10.0V, ID=-10.0A=-10.0V, ID=-10.0AD=-10.0A=-10.0A<br>0.4<br>Pp | | | |<br>0.2<br>| | | | | | ft<br>0 0 PF | | | | |<br>-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (J, JUNCTION TEMPERATURE (, JUNCTION TEMPERATURE ( ℃ ) TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 7. On-Resistance Variation with Temperature Figure 8. Gate Threshold Variation vs. Junction<br>Temperature<br>30 10000<br>150 ℃<br>25<br>1000<br>VGS=0V,  125 ℃<br>20 TA=150 ℃<br>100<br>VGS=0V,   85 ℃<br>15 VGS=0V,  TA=85 ℃<br>TA=125 ℃ 10<br>10 VGS=0V,<br>TA=25 ℃ 25 ℃<br>1<br>5<br>ey) ==ss==anm=5=<br>VGS=0V,<br>TA=-55 ℃<br>0 | |W 0.1<br>|<br>0 0.3 0.6 0.9 1.2 1.5 0 1 2 3 4 5 6 7 8 9 10 11 12<br>-VSD, SOURCE-DRAIN VOLTAGE (V) -VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current Figure 10.Typical Drain-Source Leakage Current vs.<br>Voltage<br>10<br>f=1MHz<br>Ciss 8<br>1000<br>6<br>Coss<br>SNE======<br>———_—_——_———— 4 VDS=-20V, ID=-4.9A<br>Crss<br>2<br>==<br>10  Sere 0<br>0 = 2 4 6 8 10 12 14 16 18 20 sezae 0 5 10 15 20 25<br>VDS, DRAIN-SOURCE VOLTAGE (V) Qg, TOTAL GATE CHARGE (nC)<br>Figure 11.Typical Junction Capacitance Figure 12.Gate Charge<br>(Ω)<br>, GATE THRESHOLD VOLTAGE (V)<br>GS(TH)<br>-V<br>, SOURCE CURRENT(A)<br>S<br>-I , LEAKAGE CURRENT (nA)<br>DSS<br>-I<br>GATE-SOURCE VOLTAGE (V)<br>GS,<br>, JUNCTION CAPACITANCE (pF) V<br>T<br>C<br>**----- End of picture text -----**<br>


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100<br>ee RDS(ON) Limited Ce PW=10μs<br>S e<br>fF} {iif jem ft GC” P|OO| tt<br>10 PR PW=100μs  RE HTH<br>eeee ~ Se ee<br>e S PW=1ms  SS PW . =1μs<br>a be OO a Sc, RS,<br>a ee et ee ee eee eee<br>PW=10ms<br>Pee rRPt Tey<br>1 —————_—_——et PW=100ms  SSa<br>e a OO e ee ee rsee Se<br>PW=1s<br>o e, Pot tty<br>0.1 TJ (Max)=150 ℃<br>TSingle PulseC=25 ℃ aAPopp OD ODO OG OO  ((SG OOO<br>DUT on Infinite Heatsink<br>VGS=-10V<br>0.01<br>0.1 1 10 100<br>VDS, DRAIN-SOURCE VOLTAGE  (V)<br>Figure 13. SOA, Safe Operation Area<br>10<br>poa<br>a 0 8<br>TOTTI<br>1<br>es=SSSN on<ree eeee<br>ee D=0.9 a<br>D=0.3 D=0.7<br>4<br>yyIN|7)| gee 1 A<br>0.1 D=0.1 D=0.5<br>= Ne[aggreeee ee ee ee O eTE<br>D=0.05<br>=" Fe<br>b e<br>D=0.02<br>al l<br>0.01<br>seme 07200 L L<br>ee E E<br>Se D=0.01 Ly<br>An a RθJC (t)=r(t) * RθJC  a<br>TN D=0.005 RH HE TH RθJC =3.7 ℃ /W al<br>Duty Cycle, D=t1 /  t2<br>D=Single Pulse<br>0.001<br>1E-06 1E-05 0.0001 0.001 0.01 0.1 1 10<br>t1, PULSE DURATION TIME (sec)<br>Figure 14. Transient Thermal Resistance<br>, DRAIN CURRENT (A)<br>ID<br>r (t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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**DMP4047SK3** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

## **TO252 (DPAK)** 

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E<br>A<br>b3<br>7°± 1°<br>c<br>L3<br>TO252 (DPAK)<br>Dim  Min  Max  Typ<br>A  2.19  2.39  2.29<br>Sr D A2 <= A1  0.00  0.13  0.08<br>L4 H A2  0.97  1.17  1.07<br>b  0.64  0.88  0.783<br>b2  0.76 1.14  0.95<br>b3  5.21  5.46 5.33<br>c  0.45 0.58 0.531<br>D  6.00 6.20 6.10<br>e b(3x) D1  5.21  -  -<br>e  -  -  2.286<br>b2(2x)<br>E  6.45  6.70  6.58<br>0.508 E1  4.32  -  -<br>Gauge Plane<br>H  9.40  10.41  9.91<br>L  1.40  1.78  1.59<br>E1 D1 Seating Plane L3  0.88  1.27  1.08<br>L L4  0.64  1.02  0.83<br>A1<br>a  0°  10°  -<br>2.74REF<br>eu All Dimensions in mm<br>a<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

## **TO252 (DPAK)** 

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X1<br>Y1<br>Y2 5<br>C<br>Y<br>‘at X<br>**----- End of picture text -----**<br>


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Dimensions  Value (in mm)<br>C  4.572<br>X  1.060<br>X1  5.632<br>Y  2.600<br>Y1  5.700<br>Y2  10.700<br>**----- End of picture text -----**<br>


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## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2017, Diodes Incorporated 

**www.diodes.com** 

7 of 7 **www.diodes.com** 

DMP4047SK3 Document Number DS37317 Rev. 2 - 2 

September 2017 © Diodes Incorporated 



## Links

- [View this product on Novapart](https://novapart.co/products/DMP4047SK3-13/power-mosfet-p-channel-40-v-20-a-0033-ohm-to-252)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmp4047sk3-13/mosfet-p-ch-40v-20a-to-252/dp/3943803)
---

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