# Power MOSFET, N Channel, 60 V, 45 A, 9300 µohm, PowerDI 3333, Surface Mount

![Product image](https://novapart.co/image/farnell:3943634RL/)

**URL**: https://novapart.co/products/DMN6013LFG-7/power-mosfet-n-channel-60-v-45-a-9300-ohm-powerdi
**SKU**: DMN6013LFG-7
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2510
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PowerDI 3333 |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 45A |
| Drain Source On State Resistance | 9300µohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943634RL/)

**DMN6013LFG** 

## **60V N-CHANNEL ENHANCEMENT MODE MOSFET POWERDI** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
|**V(BR)DSS**<br>**RDS(ON) Max**<br>**ID Max**<br>**TA = +25°C**<br>60V<br>13mΩ@VGS= 10V<br>10.3A<br>18mΩ@VGS= 4.5V<br>8.8A|||
|**V(BR)DSS**|**RDS(ON) Max**|**ID Max**<br>**TA = +25°C**|
|60V|13mΩ@VGS= 10V|10.3A|
||18mΩ@VGS= 4.5V|8.8A|



## **Features and Benefits** 

- Low RDS(ON)—Ensures On-state Losses are Minimized 

- Small Form Factor Thermally Efficient Package Enables Higher Density End Products 

- Occupies Just 33% of Board Area Occupied by SO-8 Enabling Smaller End Product 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Description** 

This MOSFET has been designed to minimize the on-state resistance (RDS(ON)) yet maintain superior switching performance, which makes it ideal for high-efficiency power management applications. 

## **Mechanical Data** 

- Case: PowerDI[®] 3333-8 

- Case Material: Molded Plastic, "Green" Molding Compound UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

## **Applications** 

   - Terminal Connections Indicator: See diagram 

   - Terminals: FinishMatte Tin Annealed over Copper Leadframe Solderable per MIL-STD-202, Method 208 

- Backlighting 

- Power Management Functions 

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• Weight: 0.072 grams (Approximate)<br>PowerDI3333-8  D<br>S Pin 1<br>S<br>S<br>G<br>G<br>D<br>D<br>D<br>od D &<br>S<br>Bottom View  Top View<br>Equivalent Circuit<br> Information (Note 4)<br>Part Number Case Packaging<br>DMN6013LFG-7  PowerDI3333-8 2000/Tape & Reel<br>DMN6013LFG-13  PowerDI3333-8 3000/Tape & Reel<br>**----- End of picture text -----**<br>


- DC-DC Converters 

## **Ordering Information** (Note 4) 

- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 

   2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html. 

## **Marking Information** 

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N63<br>YYWW<br>**----- End of picture text -----**<br>


N63= Product Type Marking Code YYWW = Date Code Marking YY = Last digit of year (ex: 18 = 2018) WW = Week code (01 ~ 53) 

_PowerDI is a registered trademark of Diodes Incorporated._ DMN6013LFG Document number: DS36958 Rev. 2 - 2 

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**DMN6013LFG** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

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|||||
|---|---|---|---|
|Characteristic|Symbol|Value|Units|
|Drain-Source Voltage|VDSS|60|V|
|Gate-Source Voltage|VGSS|±20|V|
|TTAA = +25°C  = +70°C|ID|10.3 8.3|A|
|Continuous Drain Current (Note 6) VGS = 10V|
|TTCC = +100°C  = +25°C|ID|28 45|A|
|Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)|IDM|58.3|A|
|Maximum Continuous Body Diode Forward Current (Note 6)|IS|3|A|
|Avalanche Current, L = 0.1mH|IAS|33.3|A|
|Avalanche Energy, L = 0.1mH|EAS|56.8|mJ|

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## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

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|||||
|---|---|---|---|
|Characteristic|Symbol|Value|Units|
|Total Power Dissipation (Note 5)|PD|1|W|
|Steady state|123|
|Thermal Resistance, Junction to Ambient (Note 5)|RϴJA|°C/W|
|t < 10s|69|
|Total Power Dissipation (Note 6)|PD|2.1|W|
|Steady state|60|
|Thermal Resistance, Junction to Ambient (Note 6)|RϴJA|°C/W|
|t < 10s|34|
|Total Power Dissipation (Note 6)|PD|40|W|
|Thermal Resistance, Junction to Case (Note 6)|RϴJC|3.2|°C/W|
|Operating and Storage Temperature Range|TJ, TSTG|-55 to +150|°C|

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**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

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|||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Characteristic|Symbol|Min|Typ|Max|Unit|Test Condition|
|OFF CHARACTERISTICS (Note 7)|
|——_—_—_—_———|Drain-Source Breakdown Voltage|BVDSS|60|—|—|V|VGS = 0V, ID = 250μA|
|Zero Gate Voltage Drain Current, TJ = +25°C|IDSS|—|—|1|µA|VDS = 60V, VGS = 0V|
|Gate-Source Leakage|IGSS|—|—|±100|nA|VGS = ±20V, VDS = 0V|
|ON CHARACTERISTICS (Note 7)|
|ay|Gate Threshold Voltage|VGS|a|(th)|1|a|1.8|a|3|ye|V|rp|VDS = VGS, ID = 250μA|
|—|9.3|13|VGS = 10V, ID = 10A|
|Static Drain-Source On-Resistance|RDS(ON)|mΩ|
|ee|—|12.3|18|VGS = 4.5V, ID = 8A|
|Diode Forward Voltage|VSD|—|0.7|1.2|V|VGS = 0V, IS = 1.7A|
|a|CO|GO|
|DYNAMIC CHARACTERISTICS (Note 8)|
|pO|Input Capacitance|Ciss|—|2577|—|pF|
|Output Capacitance|Coss|—|162|—|pF|VDS = 30V, VGS = 0V,|
|f = 1MHz|
|Reverse Transfer Capacitance|Crss|—|132|—|pF|
|Gate Resistance|Rg|—|0.9|—|Ω|VDS = 0V, VGS = 0V, f = 1MHz|
|a|Total Gate Charge (VGS = 4.5V)|Qg|—|26.6|—|nC|
|pO|Total Gate Charge (VGS = 10V)|Qg|—|55.4|—|nC|VDS = 30V, ID = 10A|
|Gate-Source Charge|Qgs|—|9.3|—|nC|
|Gate-Drain Charge|Qgd|—|12.6|—|nC|
|Turn-On Delay Time|tD(on)|—|6.2|—|ns|
|Turn-On Rise Time|tr|—|9.9|—|ns|VGS = 10V, VDS = 30V,|
|Turn-Off Delay Time|tD(off)|—|27.6|—|ns|RG = 3Ω, ID = 10A|
|Turn-Off Fall Time|tf|—|11.7|—|ns|
|————|Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge|Qtrrrr|——|18.6 9.4|——|eee|nC nS|IF = 10A, di/dt = 100A/μs|
|Notes:|—————|5. Device mounted on FR-4 PCB, with minimum recommended pad layout, single sided.|ee|

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6. Device mounted on FR-4 substrate PCB, 2oz copper, with thermal bias to bottom layer 1inch square copper plate 

7. Short duration pulse test used to minimize self-heating effect. 

8. Guaranteed by design. Not subject to product testing. 

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30 30<br>27 VGS = 10V VDS = 5.0V<br>24 A VGS = 4.5V 1 25 eee |<br>VGS = 4.0V<br>21<br>20<br>18 fo<br>15 f VGS = 3.5V 15 eee ee<br>12 poo<br>10<br>9 | TA = 150°C HY<br>TA = 85°C<br>6 5 TA = 125°C T A  = 25°C<br>3 V GS = 3.0V TA = -55°C<br>| Aa IF<br>0 0<br>0 __————— 0.5 1 1.5 2 2.5 3 1 oo 1.5 2 2.5 3 3.5 4 4.5 oe 5<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1 Typical Output Characteristics Figure 2 Typical Transfer Characteristics<br>0.014 0.03<br>VGS = 4.5V ID = 10A<br>TP LLLLLLE<br>0.025<br>0.012 ID = 8mA<br>0.02 TRL<br>0.01<br>VGS = 10V<br>LEE ELE<br>0.015<br>0.008<br>0.01<br>0.006 0.005 NUTTCLE EPT TrTT<br>0 5 10 15 20 25 30 0 2 4 6 8 10 12 14 16 18 20<br>ID, DRAIN-SOURCE CURRENT (A) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3 Typical On-Resistance vs.<br>Figure 4 Typical Drain-Source On-Resistance<br>Drain Current and Gate Voltage<br>vs. Gate-Source Voltage<br>0.024 2.2<br>0.0220.02 FEC VGS = 10V EEE TA = 150°C HY 2 Dy V I GS D = 10A   10= V<br>0.018 TA = 125°C 1.8<br>0.016 1.6<br>TA = 85°C VGS = 4.5V<br>0.014 PEEP rP eye 1.4 PT, tA ID = 8A<br>0.012<br>0.01 PEER TA = 25°C 1.2 Ca<br>0.008 in 1 PTT<br>TA = -55°C<br>0.006 PEE 0.8 la-<br>0.004<br>0.6<br>0.002 RR-EFALE | |<br>0 FECEPLELee el 0.4 PtAT {fttt || ||dt t<br>0 2 4 6 8 10 12 14 16 18 20 -50 -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT (A) TJ, JUNCTION TEMPERATURE (°C)<br>Figure 5 Typical On-Resistance vs.  Figure 6 On-Resistance Variation with Temperature<br>Drain Current and Temperature<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>D D<br> I  I<br>)Ω )Ω<br>, DRAIN-SOURCE ON-RESISTANCE ( , DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON) DS(ON)<br>R R<br>)Ω<br>, DRAIN-SOURCE<br>DS(ON)<br>R<br>, DRAIN-SOURCE ON-RESISTANCE (<br>ON-RESISTANCE (NORMALIZED)<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


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0.028 2.4<br>2.2<br>0.024 et ttt tt ty mf fT tT<br>0.02 TLL V GS ID = 8A= 4.5V Te 2 i ID = 1mA<br>1.8<br>Senne 62a ID = 250µA Seena<br>0.016<br>VGS  10= V 1.6<br>0.012 yee I D = 10A Sener<br>ee 1.4 CCCE NNO<br>—s<br>0.008<br>1.2<br><a CEES<br>0.004<br>1<br>eT TT TT PPP<br>TELL,<br>0 Pt tT ttt yy 0.8 PT N<br>-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)<br>Figure 7 On-Resistance Variation with Temperature Figure 8 Gate Threshold Variation vs. Ambient Temperature<br>30 ee li 10000 ==S===——<br>25<br>C iss<br>SEE<br>ei es ee es es es es<br>2015 WE T A = 150°C 1000 VER<br>TP TA = 125°C ——————<br>10<br>TA = 25°C<br>TA = 85°C<br>7 A ASSO<br>5 T A = -55°C C oss<br>f = 1MHz Crss<br>0 ODFYP 100 Se| CFR:<br>0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 5 10 15 20 25 30 35 40<br>VSD, SOURCE-DRAIN VOLTAGE (V) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9 Diode Forward Voltage vs. Current Figure 10 Typical Junction Capacitance<br>10 100<br>RDS(on)<br>Limited<br>8 10<br>DC<br>6 1 P W  = 10s<br>PW = 1s<br>VDS = 30V<br>ID  10= A P W = 100ms<br>4 VA 0.1 CEE we PW = 10ms ARES TEE<br>PW = 1ms<br>2 0.01 T TJ(max)A = 25 = °C  150°C P W  = 100µs<br>V GS  = 10V<br>Single Pulse<br>0.001 DUT on 1 * MRP Board a<br>0<br>0 6 12 18 24 30 36 42 48 54 60 0.01 0.1 1 10 100<br>Qg [, TOTAL GATE CHARGE ] (nC) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11 Gate Charge Figure 12 SOA, Safe Operation Area<br>)Ω<br>, DRAIN-SOURCE ON-RESISTANCE ( , GATE THRESHOLD VOLTAGE (V)<br>GS(th)<br>V<br>DS(ON)<br>R<br>, SOURCE CURRENT (A)<br>IS , JUNCTION CAPACITANCE (pF)<br>T<br>C<br>, DRAIN CURRENT (A)<br>ID<br> GATE THRESHOLD VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


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1<br>D = 0.9<br>eee D = 0.7<br>D = 0.5<br>Ey [EST] rt tet<br>D = 0.3 SS Tr<br>ee el<br>0.1<br>ATISar D = 0.1 OeIATT2 | | Ul<br>a eee eee tees) ae ee ee TT<br>a a A/aa a 2/80<br>D = 0.05<br>EH AIT IT<br>EE a A<br>D = 0.02<br>ATTA THT NT TT<br>0.01 Se<br>BC D = 0.01 aeZ4N<br>Ee<br>D = 0.005 R θJA (t) = r(t) * R θJA<br>Fo tite Toh HH<br>HUN A PP R θJA  = 126°C/W HT<br>Duty Cycle, D = t1/ t2<br>D = Single Pulse<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, PULSE DURATION TIME (sec)<br>Figure 13 Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

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PowerDI3333-8<br>**----- End of picture text -----**<br>


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A1 A3<br>A<br>PowerDI3333-8<br>Seating Plane<br>Dim  Min  Max  Typ<br>A  0.75 0.85 0.80<br>Te seal D === A1  0.00 0.05 0.02<br>A3  —  —  0.203<br>L( 4x)<br>D2 b  0.27  0.37  0.32<br>1 b2  0.15 0.25 0.20<br>D  3.25 3.35 3.30<br>Pin #1 ID D2  2.22  2.32  2.27<br>b2( 4x) E4 E  3.25 3.35 3.30<br>E2  1.56 1.66 1.61<br>E3  0.79 0.89 0.84<br>E<br>E4  1.60 1.70 1.65<br>E2 E3 e —  —  0.65<br>L  0.35 0.45 0.40<br>L1  —  —  0.39<br>L1( 3x) z  —  —  0.515<br>8 All Dimensions in mm<br>z( 4x) b<br>e<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**PowerDI3333-8** 

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X3<br>X2<br>8<br>Y4<br>Y1 X1<br>Y2<br>Y3<br>my<br>Y<br>1<br>noon X C<br>**----- End of picture text -----**<br>


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Dimensions Value (in mm)<br>C  0.650<br>X  0.420<br>X1  0.420<br>X2  0.230<br>X3 2.370<br>Y  0.700<br>Y1  1.850<br>Y2  2.250<br>Y3  3.700<br>Y4  0.540<br>**----- End of picture text -----**<br>


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## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

1. are intended to implant into the body, or 

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.  A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2018, Diodes Incorporated 

**www.diodes.com** 

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## Links

- [View this product on Novapart](https://novapart.co/products/DMN6013LFG-7/power-mosfet-n-channel-60-v-45-a-9300-ohm-powerdi)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmn6013lfg-7/mosfet-n-ch-60v-45a-powerdi-3333/dp/3943634RL)
---

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