# Power MOSFET, N Channel, 50 V, 500 mA, 1.6 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:3127340RL/)

**URL**: https://novapart.co/products/DMN53D0LQ-7/power-mosfet-n-channel-50-v-500-ma-16-ohm-sot-23
**SKU**: DMN53D0LQ-7
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0810
**Stock**: 10+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:500mA; Drain Source Voltage Vds:50V; On Resistance Rds(on):1.6ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.5V; Powe

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 370mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 370mW |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 1.6ohm |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 50V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 500mA |
| Drain Source On State Resistance | 1.6ohm |
| Automotive Qualification Standard | AEC-Q101 |
| Gate Source Threshold Voltage Max | 1.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3127340RL/)

**DMN53D0LQ** @, [7 **N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR** 

## **Product Summary** 

||||
|---|---|---|
|**V(BR)DSS**|**RDS(ON)**|**ID **<br>**TA = +25°C**|
|50V|1.6Ω@VGS= 10V|500 mA|
||2.5Ω@VGS= 4.5V|200 mA|



## **Features and Benefits** 

- Low On-Resistance 

- Very Low Gate Threshold Voltage 

- Low Input Capacitance 

- Fast Switching Speed 

- Low Input/Output Leakage 

- ESD Protected to 2KV 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

- **PPAP Capable (Note 4)** 

## **Description and Applications** 

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high-efficiency power management applications. 

## **Mechanical Data** 

- Case: SOT23 

- Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 

- Terminal Connections: See Diagram 

||||||||Terminal Connections: See Diagram|Terminal Connections: See Diagram|Terminal Connections: See Diagram|Terminal Connections: See Diagram|Terminal Connections: See Diagram|Terminal Connections: See Diagram|Terminal Connections: See Diagram|Terminal Connections: See Diagram|Terminal Connections: See Diagram|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||Weight: 0.008 grams (Approximate)|||||||||
|Z|SOT23<br> @|||D<br>G<br>S<br> (J &||||||||||||
|**ESD protected**|||Top View|||||Top View|||Top View||||Equivalent Circuit|
|**Information** (Note 5)||||||||||||||||
|||||||||||||||||
|**Part Number**||||**Case**|||||||||||**Packaging**|
|DMN53D0LQ-7||||SOT23|||||||||||3,000/Tape & Reel|
|DMN53D0LQ-13||||SOT23|||||||||||10,000/Tape & Reel|



## **Ordering Information** (Note 5) 

- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/quality/product_compliance_definitions/. 

   5. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

53E = Product Type Marking Code YM = Date Code Marking Y or    = Year (ex: B = 2014) M = Month (ex: 9 = September) 

Date Code Key **Year 2014 2015 2016 2017 2018 2019 2020 2021 2022** ~~[|4]~~ **Code** B C D E F G H I ~~tH~~ J **Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec** ~~/_|}~~ **Code** ~~|~~ 1 2 3 4 5 6 7 8 ~~—~~ 9 O ~~|~~ N ~~—~~ D 

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**Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

**==> picture [485 x 48] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|Characteristic|Symbol|Value|Unit|
|Drain Source Voltage|VDSS|50|V|
|Gate-Source Voltage|VGSS|20|V|
|Drain Current (Note 7)|ID|500|mA|

**----- End of picture text -----**<br>


## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

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**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|Characteristic|Symbol|Value|Unit|
|Total Power Dissipation (Note 6)|PD|370|mW|
|Thermal Resistance, Junction to Ambient (Note 6)|RJA|344|C/W|
|Total Power Dissipation (Note 7)|PD|540|mW|
|Thermal Resistance, Junction to Ambient (Note 7)|RJA|236|C/W|
|Operating and Storage Temperature Range|TJ, TSTG|-55 to +150|C|

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|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|Electrical Characteristics|(@TA = +25°C, unless otherwise specified.)|
|Characteristic|Symbol|Min|Typ|Max|Unit|Test Condition|
|OFF CHARACTERISTICS (Note 8)|
|Drain-Source Breakdown Voltage|BVDSS|50|||V|VGS = 0V, ID = 250µA|
|re|Zero Gate Voltage Drain Current|IDSS|ee|||1.0|µA|VDS = 50V, VGS = 0V|
|ee|Gate-Body Leakage|IGSS|||10|µA|VGS = ±20V, VDS = 0V|
|ON CHARACTERISTICS (Note 8)|
|a|Gate Threshold Voltage|VGS(th)|0.8||ee|1.5|V|VDS = VGS, ID = 250µA|
|GO|GO|(O|
|||1.6|VGS = 10V, ID = 500mA|
|Static Drain-Source On-Resistance|RDS(ON)|||2.5|Ω|VGS = 4.5V, ID = 200mA|
|ee|||4.5|VGS = 2.5V, ID = 100mA|
|Source-Drain Diode Forward Voltage|V|ee|SD||ee||1.4|V|VGS = 0V, IS = 500mA|
|rr|DYNAMIC CHARACTERISTICS (Note 9)|
|a|Input Capacitance|Ciss||46||pF|
|Output Capacitance|Coss|CO||5.3||pF|VDS = 25V, VGS = 0V|
|f = 1.0MHz|
|Reverse Transfer Capacitance|Crss||4.0||pF|
|Total Gate Charge|Qg||0.6||nC|
|Gate-Source Charge|Qgs||0.2||nC|VIDGS = 250mA  = 4.5V, VDS = 10V,|
|Gate-Drain Charge|Qgd||0.1||nC|
|Turn-On Delay Time|tD(on)||2.7||ns|
|Turn-On Rise Time|tr||2.5||ns|VDD = 30V, VGS = 10V,|
|Turn-Off Delay Time|tD(off)||19||ns|RG = 25Ω, ID = 200mA|
|Turn-Off Fall Time|tf||11||ns|

**----- End of picture text -----**<br>


- Notes: 6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout 

   7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate 

   8. Short duration pulse test used to minimize self-heating effect. 

   9. Guaranteed by design. Not subject to product testing. 

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1.5 1<br>VGS = 10V VGS = 3V<br>VDS = 5V<br>1.2 JS] 0.8 Ce<br>VGS = 5V<br>0.9 VGS = 4.5V 0.6<br>VGS = 2.5V<br>0.6 eo VGS = 3.5V 0.4 TA = 150°C<br>TA = 85°C<br>TA = 125°C<br>0.3 VGS = 2V VGS = 1.8V 0.2 TA = 25°C<br>TA = -55°C<br>0.0 pe 0<br>0 1 2 3 4 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1  Typical Output Characteristics Figure 2  Typical Transfer Characteristics<br>1 2.5<br>VGS = 4.5V<br>0.9 TH 2 fee<br>TA = 150°C<br>VGS = 5V<br>0.8 V GS = 10V 1.5 TA = 125 ° C<br>See ees<br>TA = 85°C<br>0.7 1<br>=e TA = 25°C<br>0.6 PPP) 0.5 SERRE<br>TA = -55°C<br>0.5 PTT) 0 =COOEE<br>0 0.2 0.4 0.6 0.8 1 0 0.2 0.4 0.6 0.8 1<br>ID, DRAIN-SOURCE CURRENT (A) ID, DRAIN CURRENT (A)<br>Figure 3  Typical On-Resistance vs.  Figure 4  Typical On-Resistance vs.<br>Drain Current and Gate Voltage  Drain Current and Temperature<br>2.4 2<br>1.8<br>2.0 1.6<br>VGS  10= V<br>ID = 500mA 1.4 VGS = 5V<br>1.6 TT] 1.2 EEE ID = 300mA<br>VGS = 5V 1<br>ID = 300mA<br>1.2 0.8 V GS   10= V<br>ID = 500mA<br>yaar 0.6 anee<br>0.8 0.4<br>Bee 0.2 REE<br>0.4 0<br>-50 TET -25 0 25 TT 50 75 100 125 150 -50 FEE -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C)<br>Figure 5  On-Resistance Variation with Temperature Figure 6  On-Resistance Variation with Temperature<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON)<br>R<br>, DRAIN CURRENT (A)<br> I<br>D<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON)<br>R<br>DS(ON)<br>, DRAIN-SOURCE<br>R<br>ON-RESISTANCE (NORMALIZED)<br>, DRAIN CURRENT (A)<br> I<br>D<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>R<br>DS(ON)<br>**----- End of picture text -----**<br>


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2.0 TTT) 1.0<br>1.8<br>0.8<br>1.6 TA = 150°C<br>SI 0.6<br>1.4<br>SS SeEEEn ID = 1mA TA = 125°C “HL<br>1.2 ID = 250µA 0.4<br>TA = 25°C<br>1.0 TSISS TA = 85°C<br>0.2<br>0.8 TA = -55°C<br>et ELL LUN ij<br>0.6 CELE ELT 0 DS<br>-50 -25 0 25 50 75 100 125 150 0 0.3 0.6 0.9 1.2 1.5<br>TJ, JUNCTION TEMPERATURE (C) VSD, SOURCE-DRAIN VOLTAGE (V)<br>Figure 7  Gate Threshold Variation vs. Ambient Temperature<br>Figure 8  Diode Forward Voltage vs. Current<br>100 10<br>Ciss<br>=====—5— 8 ene<br>pa 7<br>ee<br>6<br>VDS = 10V<br>10 ID  250m= A<br>NISSS 4 VA<br>Coss<br>eeSSSee ee C rss ee 2 TY<br>FARA)<br>f = 1MHz<br>1 EE ELEL LI 0<br>0 5 10 15 20 25 30 35 40 0 0.3 0.6 0.9 1.2 1.5<br>VDS, DRAIN-SOURCE VOLTAGE (V) Qg [, TOTAL GATE CHARGE ] (nC)<br>Figure 9  Typical Junction Capacitance Figure 10  Gate Charge<br>10<br>R DS(on) P W  = 100µs<br>Limited<br>1<br>DC<br>0.1 PW = 10s<br>P W  = 1s<br>P W  = 100ms<br>0.01 TJ(m ax) = 150 ° C i PW = 10ms FSA<br>TA = 25°C PW = 1ms<br>VGS = 10V<br>Single Pulse<br>DUT on 1 * MRP Board<br>0.001 BeeSell<br>0.1 1 10 100<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11 SOA, Safe Operation Area<br>, SOURCE CURRENT (A)<br>IS<br> GATE THRESHOLD VOLTAGE (V)<br>GS<br>V<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br>GS(th)<br>, GATE THRESHOLD VOLTAGE (V)<br>V<br>, DRAIN CURRENT (A)<br>D<br>I<br>**----- End of picture text -----**<br>


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1<br>D = 0.9<br>SS D = 0.7<br>FS D = 0.5 me<br>D = 0.3 ee<br>CME TT cr | TIE TT TT<br>0.1 PAE UU eT LEI ELEN TAIN ETI<br>FE D = 0.1 EeOO<br>I rg<br>D = 0.05<br>a 7A<br>Ea A<br>LE eZTT<br>D = 0.02<br>0.01 Pr27a LATIN PETTITTE EIT EE<br>D = 0.01<br>er UPA aTT<br>eT D = 0.005 R JA (t) = r(t) * R JA CT<br>HE PP PEt R JA = 339°C/W UT<br>Single Pulse Duty Cycle, D = t1/ t2<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, PULSE DURATION TIMES (sec)<br>Figure 12  Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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**DMN53D0LQ** CT 

## DIODES 

## **Package Outline Dimensions** 

Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version. 

**==> picture [17 x 6] intentionally omitted <==**

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All 7°<br>**----- End of picture text -----**<br>


**==> picture [448 x 178] intentionally omitted <==**

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H SOT23<br>GAUGE PLANE Dim  Min  Max  Typ<br>0.25<br>- J op ——— A  0.37  0.51  0.40<br>K1 K B  1.20  1.40  1.30<br>C  2.30  2.50  2.40<br>a D  0.89  1.03  0.915<br>A M F  0.45  0.60  0.535<br>_. L L1 G  1.78  2.05  1.83<br>teal; Jk, | ——— H  2.80  3.00  2.90<br>J  0.013 0.10 0.05<br>K  0.890 1.00 0.975<br>( , oOo '4 ee — K1  0. —— 903 — 1.10 1.025<br>C B<br>L  0.45 0.61  0.55<br>L1  0.25  0.55  0.40<br>r=oO oO SESS+ M a  0.085 0.150 0°  8°  0.110 --<br>D All Dimensions in mm  44<br>F G<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

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Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version.<br>Y<br>Y1 tt C<br>ate<br>FIL X X1 a<br>**----- End of picture text -----**<br>


|**Dimensions**|**Value(in mm)**|
|---|---|
|**C**|2.0|
|**X**|0.8|
|**X1**|1.35|
|**Y**|0.9|
|**Y1**|2.9|



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## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2016, Diodes Incorporated 

**www.diodes.com** 

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## Links

- [View this product on Novapart](https://novapart.co/products/DMN53D0LQ-7/power-mosfet-n-channel-50-v-500-ma-16-ohm-sot-23)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmn53d0lq-7/mosfet-n-ch-50v-0-5a-sot23/dp/3127340RL)
---

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