# Power MOSFET, N Channel, 45 V, 4.8 A, 0.037 ohm, TSOT-26, Surface Mount

![Product image](https://novapart.co/image/farnell:3943622RL/)

**URL**: https://novapart.co/products/DMN4060SVT-7/power-mosfet-n-channel-45-v-48-a-0037-ohm-tsot-26
**SKU**: DMN4060SVT-7
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1020
**Stock**: 500+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 6Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.2W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TSOT-26 |
| Drain Source Voltage Vds | 45V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 4.8A |
| Drain Source On State Resistance | 0.037ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943622RL/)

**DMN4060SVT** oe **45V N-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**V(BR)DSS**|**RDS(on) max**|**ID**<br>**TA = 25°C**|
|45V|46mΩ@ VGS= 10V|4.8A|
||62mΩ@ VGS= 4.5V|4.1A|



## **Features and Benefits** 

- Low  Input Capacitance 

- Low On-Resistance 

- Fast Switching Speed 

- **Lead, Halogen, and Antimony Free, RoHS Compliant (Note 1)** 

- **"Green" Device (Note 2)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Description and Applications** 

## **Mechanical Data** 

This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. 

   - Case: TSOT26 

   - Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

   - Terminal Connections: See Diagram 

- DC-DC Converters 

   - Terminals: Finish – Tin Finish annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 

- Power management functions 

- Backlighting 

• Weight: 0.013 grams (approximate) Drain TSOT26 D 1 6 D Body Diode Gate D 2 5 D G 3 4 S Source ~~i~~ Equivalent Circuit Top View Top View Pin Configuration **Information** (Note 3) **Part Number Case Packaging** DMN4060SVT-7 TSOT26 3,000/Tape & Reel 

## **Ordering Information** (Note 3) 

Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free. 

2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com. 

3. For packaging details, go to our website at http://www.diodes.com. 

## **Marking Information** 

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34D = Product Type Marking Code<br>34D YM = Date Code Marking<br>Y = Year (ex: Z = 2012)<br>M = Month (ex: 9 = September)<br>Date Code Key<br>Year 2011 2012 2013 2014 2015 2016 2017<br>————ee MCodeonth Jan Y  Feb M Z  ar Apr A  May Jun B  Jul Aug C Sep Oct D  Nov E  Dec<br>[rr Code 1  2  3 4  5 6 7  8 9 O tt N  D<br>DMN4060SVT 1 of 7  February 2012<br>Document number: DS35702  Rev. 2 - 2 www.diodes.com   © Diodes Incorporated<br>YM<br>**----- End of picture text -----**<br>


February 2012 © Diodes Incorporated 

BOB, Sey 1 nu co R PO R AT = D 

**DMN4060SVT** | 

## **Maximum Ratings** @TA = 25°C unless otherwise specified 

|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|
|---|---|---|---|---|---|
|||||||
|**Characteristic**|||**Symbo**|**bol **<br>**Value**|**Units**|
|Drain-Source Voltage|||VDSS|DSS<br>45|V|
|Gate-Source Voltage|||VGSS|GSS<br>±20|V|
|Continuous Drain Current (Note 5) VGS= 10V|Steady<br>State|TA= 25°C<br>TA= 70°C|ID|4.8<br>3.8|A|
||t<10s|TA= 25°C<br>TA= 70°C|ID|6.1<br>4.8|A|
|Continuous Drain Current (Note 5) VGS= 5V|Steady<br>State|TA= 25°C<br>TA= 70°C|ID|4.1<br>3.2|A|
||t<10s|TA= 25°C<br>TA= 70°C|ID|5.2<br>4.1|A|
|Maximum BodyDiode Forward Current(Note 5)|||IS|2.1|A|
|Pulsed Drain Current(10μspulse,dutycycle = 1%)|||IDM|30|A|
|Avalanche Current(Note 6)L = 0.1mH|||IAR|14.2|A|
|Avalanche Energy (Note 6)L = 0.1mH|||EAR|10|mJ|



**Thermal Characteristics** @TA = 25°C unless otherwise specified 

|**Thermal Characteristics **@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Thermal Characteristics **@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified||||
|---|---|---|---|---|
|**Characteristic**<br>**Sy**||**Symbol **|**Value**|**Units**|
|Total Power Dissipation (Note 4)|TA= 25°C<br>TA= 70°C|PD|1.2|W|
||||0.75||
|Thermal Resistance, Junction to Ambient (Note 4)|Steadystate<br>t<10s|RθJA|106|°C/W|
||||69|°C/W|
|Total Power Dissipation (Note 5)|TA= 25°C<br>TA= 70°C|PD|1.8|W|
||||1.1||
|Thermal Resistance, Junction to Ambient (Note 5)|Steady state<br>t<10s|RθJA|68|°C/W|
||||44|°C/W|
|Thermal Resistance,Junction to Case(Note 5)||RθJC|20|°C/W|
|Operatingand Storage Temperature Range<br>T||TJ,TSTG|-55 to +150|°C|



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100 100 ——<br>Feee HH<br>Single Pulse otPeoe eeNTT ON P W  = 10µs<br>80 Rθ JA  = 72°C/W RDS(on)<br>RθJA(t) = r(t) * RθJA 10 |__| Pt Limited PN ON .<br>| TJ - TA = P * RθJA(t) poyta SeeoINRUl EDNNUENGaPISSNS<br>60 TS NWN SENNEEE Hill<br>NIRS DC OSRPRONil<br>1 Se [| Na i Sl<br>— PW = 10s oT ee NN eS nl on PA<br>40 — P W  = 1s SSNS NN<br>\ —ee oe a PW = 100ms INCINNECIR—> as SY NSONENE Hill<br>ft P W  = 10ms NENA NTS iil<br>lll PW = 1ms DANN<br>20 0.1 oe es PW = 100µs NSN EH<br>\ Tyymaxy = 150°C EE NON<br>eee eI<br>0 i 0.01 Ty = 25°C H¥H—_} | {tii tT NEAay<br>0.0001 0.001 0.01 0.1 1 10 100 1,000 0.1 1 10 100<br>t1, PULSE DURATION TIME (sec) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Fig. 1 Single Pulse Maximum Power Dissipation Fig. 2 SOA, Safe Operation Area<br>, DRAIN CURRENT (A)<br>ID<br>, PEAK TRANSIENT POIWER (W)<br>(PK)<br>P<br>**----- End of picture text -----**<br>


2 of 7 **www.diodes.com** 

DMN4060SVT Document number: DS35702  Rev. 2 - 2 

February 2012 © Diodes Incorporated 

**DMN4060SVT** 

## **Electrical Characteristics** @TA = 25°C unless otherwise specified 

|**Electrical Characteristics** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Electrical Characteristics** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Electrical Characteristics** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Electrical Characteristics** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Electrical Characteristics** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Electrical Characteristics** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Electrical Characteristics** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|
|---|---|---|---|---|---|---|
||||||||
|**Characteristic**<br>~~RN~~|**Symbol**<br>~~RN~~|**mbol**<br>**Min**<br>~~RN~~<br>~~NGO~~|**Typ**<br>~~RN~~<br>~~NGO~~|**Max**<br>~~RN~~<br>~~(OS~~|**Unit**<br>~~RN~~<br>~~(OS(OO~~|**Test Condition**<br>~~RN~~<br>~~(OO~~|
|**OFFCHARACTERISTICS (Note 7)**<br>~~NGO~~<br>~~(OS(OO~~<br>~~Ce~~|||||||
|Drain-Source Breakdown Voltage<br>~~a~~|BVDSS|45|⎯|⎯|V<br>V|VGS= 0V,ID= 250μA|
|Zero Gate Voltage Drain Current<br>~~DN~~|IDSS<br>~~DN~~|⎯<br>~~DN~~<br>~~ED~~|⎯<br>~~DN~~|100<br>~~DN~~|nA<br>V<br>~~DN~~|VDS= 45V,VGS= 0V<br>~~DN~~|
|Gate-Source Leakage<br>~~DD~~|IGSS<br>~~DD~~|⎯<br>~~DD~~<br>~~ED~~|⎯<br>~~DD~~|±100<br>~~DD~~|nA<br>V<br>~~DD~~|VGS=±20V,VDS= 0V<br>~~DD~~|
|**ON CHARACTERISTICS (Note 7)**<br>~~ED~~<br>~~Ce~~<br>~~a~~|||||||
|Gate Threshold Voltage<br>~~a~~|VGS(th)<br>|1<br>|⎯<br><br>~~ee~~|3<br><br>~~ee~~|V<br>V<br><br>~~ee~~|VDS= VGS,ID= 250μA<br>|
|Static Drain-Source On-Resistance<br>~~aOe~~<br>~~a~~|RDS (ON)<br>~~Oe~~|DS (ON)<br>⎯<br>⎯<br>~~Oe~~<br>~~ee~~|37<br>~~Oe~~<br>~~ee~~<br>~~ee~~|46<br>~~Oe~~<br>~~ee~~<br>~~ee~~|mΩ<br>V<br>V<br>~~Oe~~<br>~~ee~~<br>~~ee~~|VGS= 10V,ID= 4.3A<br>~~Oe~~|
||||52<br>~~Oe~~<br>~~ee~~<br>~~ee~~|62<br>~~Oe~~<br>~~ee~~<br>~~ee~~||VGS= 4.5V,ID= 4A<br>~~Oe~~|
|Forward Transfer Admittance<br>~~a~~||Yfs||⎯<br>~~ee~~|4.5<br>~~ee~~<br>~~ee~~|⎯<br>~~ee~~<br>~~ee~~|S<br>V<br>~~ee~~<br>~~ee~~|VDS= 10V,ID= 4.3A|
|Diode Forward Voltage<br>~~OG~~|VSD<br>~~OG~~|⎯<br>~~OG~~|0.7<br>~~ee~~<br>~~OG~~|1.2<br>~~ee~~<br>~~OG~~|V<br>V<br>~~ee~~<br>~~OG~~|VGS= 0V,IS= 1A<br>~~OG~~|
|**DYNAMIC CHARACTERISTICS (Note 8)**<br>~~Ce~~|||||||
|Input Capacitance<br>~~a~~<br>~~a~~|Ciss<br>~~a~~<br>|⎯<br>~~a~~<br>|1287<br>~~a~~<br>|⎯<br>~~a~~<br>|pF<br>V<br>f = 1.0MHz<br>~~a~~<br>~~sD~~|VDS= 25V, VGS= 0V<br>f = 1.0MHz|
|Output Capacitance<br>~~a~~|Coss<br>|⎯<br><br>~~I~~|57<br>|⎯<br>|||
|Reverse Transfer Capacitance<br>~~asD~~|Crss<br>~~sD~~|⎯<br>~~sD~~<br>~~I~~<br>~~I~~|44<br>~~sD~~|⎯<br>~~sD~~|||
|Gate Resistance<br>~~DD~~|RG<br>~~DD~~|⎯<br>~~I~~<br>~~DD~~<br>~~I~~|1.2<br>~~DD~~|⎯<br>~~DD~~|Ω<br>V<br>~~DD~~|VDS= 0V,VGS= 0V,f = 1.0MHz<br>~~DD~~|
|Total Gate Charge(VGS= 10V)<br>~~en~~<br>~~a~~|Qg<br>~~en~~<br>|⎯<br>~~I~~<br>~~en~~<br>|22.4<br>~~en~~<br>|⎯<br>~~en~~<br>|nC<br>V<br>~~en~~<br>~~nD~~<br>~~a~~|VDS= 30V, ID= 4.3A|
|Total Gate Charge(VGS= 4.5V)<br>~~a~~|Qg<br>|⎯<br>|10.4<br>|⎯<br>|||
|Gate-Source Charge<br>~~anD~~|Qgs<br>~~nD~~|⎯<br>~~nD~~|4.9<br>~~nD~~|⎯<br>~~nD~~|||
|Gate-Drain Charge<br>~~a~~|Qgd<br>~~a~~|⎯<br>~~a~~|3.0<br>~~a~~|⎯<br>~~a~~|||
|Turn-On DelayTime<br>~~en~~<br>~~a~~|tD(on)<br>~~en~~<br>|⎯<br>~~en~~<br>|6.6<br>~~en~~<br>|⎯<br>~~en~~<br>|nS<br>V<br>ID<br>~~en~~<br>~~nD~~<br>~~a~~|VGS= 10V, VDD= 30V, RG= 6Ω,<br>D= 4.3A|
|Turn-On Rise Time<br>~~a~~|tr<br>|⎯<br>|8.1<br>|⎯<br>|||
|Turn-Off DelayTime<br>~~anD~~|tD(off)<br>~~nD~~|⎯<br>~~nD~~|20.1<br>~~nD~~|⎯<br>~~nD~~|||
|Turn-Off Fall Time<br>~~a~~|tf<br>~~a~~|⎯<br>~~a~~<br>~~I~~|4.0<br>~~a~~|⎯<br>~~a~~|||
|BodyDiode Reverse RecoveryTime<br>~~DD~~|trr<br>~~DD~~|⎯<br>~~DD~~<br>~~I~~|18<br>~~DD~~|⎯<br>~~DD~~|nS<br>IS<br>~~DD~~|S= 4.3A,dI/dt = 100A/μs<br>~~DD~~|
|BodyDiode Reverse RecoveryCharge<br>~~ff~~|Qrr<br>~~ff~~|⎯<br>~~I~~<br>~~ff~~|11.9<br>~~ff~~|⎯<br>~~ff~~|nC<br>IS<br>~~ff~~|S= 4.3A,dI/dt = 100A/μs<br>~~ff~~|



- Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 6. IAR and EAR rating are based on low frequency and duty cycles to keep TJ = 25°C 

   7. Short duration pulse test used to minimize self-heating effect. 

   8. Guaranteed by design. Not subject to product testing. 

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1 D = 0.9<br>Pe D = 0.7<br>D = 0.5 tT<br>bo eee<br>CT D = 0.3 EtTT er<br>0.1 CT CU a | ETT ELIMI TEE LE<br>Eee D = 0.1 et<br>eee eee ee ee eee eee eee eee<br>D = 0.05<br>Ree eee Aa<br>a 2 |<br>LT AZ NE ETT ETT<br>D = 0.02<br>0.01 PU D = 0.01 ealTI EEL LLIN EEN TTT TI<br>SE sss 7 ee ee ee ee ee eet<br>Eeth<br>a D = 0.005 A Zeaa | RR θθJA(t)JA  = 72 = r° (t) C/W * R θJA  PL)TT<br>Duty Cycle, D = t1/t2<br>D = Single Pulse<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000<br>t1, PULSE DURATION TIME (sec)<br>Fig. 3 Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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20 20<br>cof _— V DS = 5.0V ee ia<br>ai ee |i<br>1612 fe 1612<br>a e/a<br>TA = 150°C<br>8 , 8 s/o<br>TA = 125°C<br>fon er’ jaan<br>TA = 85°C<br>4 eee 4 s/s)<br>TA = 25°C<br>TA = -55°C<br>A //; a<br>0 [eps 0<br>0 0.5 1.0 1.5 2.0 2.5 3.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE<br>Fig. 4 Typical Output Characteristic Fig. 5 Typical Transfer Characteristics<br>0.14 0.10<br>0.09 V GS = 4.5V<br>0.12<br>coo) Se<br>0.08<br>TA = 150°C<br>0.10 LLL ELL LAA 0.07 oe<br>0.08 PELLET 0.06 — TA = 125°C |_<br>TLL 0.05 ——e<br>0.06 TA = 85°C<br>0.04<br>titty SS<br>VGS = 4.5V<br>0.04 0.03 T A  = 25°C<br>0.02 a VGS = 10V 0.02 SS TA = -55°C<br>arr a<br>0.01<br>0 ELE EEEL EL 0 ee<br>0 4 8 12 16 20 0 4 8 12 16 20<br>ID, DRAIN-SOURCE CURRENT ID, DRAIN CURRENT<br>Fig. 6 Typical On-Resistance vs.  Fig. 7 Typical On-Resistance vs.<br>Drain Current and Gate Voltage  Drain Current and Temperature<br>2.4 0.10<br>2.2 “TELELLE 0.09 es<br>0.08<br>2.0<br>0.07<br>1.8 yy V I GS D = 10A   10= V 0.06 SEE EEL” VGS ID = 5A = 4.5V<br>1.6<br>Seen 0.05 naa<br>ty Z, Tee eater<br>1.4<br>0.04<br>1.2 an et VGSID = 5A= 4.5V 0.03 ere VIGSD = 10A  10= V<br>1.0 0.02<br>0.8 SoeSt,  settAa 0.01 arteSpE<br>0.6 PT | | | ct Et 0 PEE EEE<br>50 -25 0 25 50 75 100 125 150 - 50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)<br>Fig. 8 On-Resistance Variation with Temperature Fig. 9 On-Resistance Variation with Temperature<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>D D<br> I  I<br>)<br>Ω )Ω<br>, DRAIN-SOURCE ON-RESISTANCE (<br>, DRAIN-SOURCE ON-RESISTANCE (<br>RDS(ON) DS(ON)<br>R<br>)Ω<br>, DRAIN-SOURCE<br>DS(ON)<br>R<br>, DRAIN-SOURCE ON-RESISTANCE (<br>ON-RESISTANCE (NORMALIZED)<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


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4.0 20<br>3.5 ry | >]... ee<br>16<br>3.0<br>So ID = 1mA EE<br>See<br>2.5 ——— |<br>12<br> Sa ee<br>2.0 ID = 250µA TA = 25 ° C<br>FEES 8 EEE<br>1.5<br>1.0<br>4<br>PP re ry ry SSS<br>0.5<br>fit ty ee<br>0 Pt | tt tt ty 0 FtEID<br>-50 -25 0 25 50 75 100 125 150 0 0.2 0.4 0.6 0.8 1.0 1.2<br>TJ, JUNCTION TEMPERATURE (°C) VSD, SOURCE-DRAIN VOLTAGE (V)<br>Fig. 10 Gate Threshold Variation vs. Ambient Temperature Fig. 11 Diode Forward Voltage vs. Current<br>10,000 === SSS ——————<br>SSS ee ——————<br>1,000 TA = 150°C<br>ae eee ——<br>Ciss<br>=== ———————<br>TA = 125°C<br>100 FETE, ——————_————<br>TA = 85°C<br>ee ee ee NN a<br>= w SS Coss<br>10 TA = -55°C TA = 25°C<br>C rss<br>————— ee f = 1MHz<br>1 FEEPELELLELL, (ooee<br>0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30<br>VDS, DRAIN-SOURCE VOLTAGE (V) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Fig. 12 Typical Drain-Source Leakage Current vs. Voltage Fig. 13 Typical Junction Capacitance<br>VDS = 30V<br>ID  4.3= A<br>7 (|—| f<br>TT<br>a | Yi<br>a<br>TT<br>TT [AT] 4<br>jy<br>T/7/i_[ TT<br>7<br>rn<br>0 5 10 15 20 25<br>Qg [, TOTAL GATE CHARGE ] (nC)<br>Fig. 14 Gate Charge<br>, SOURCE CURRENT (V)<br>, GATE THRESHOLD VOLTAGE (V) IS<br>GS(th)<br>V<br>, JUNCTION CAPACITANCE (pF)<br>, DRAIN LEAKAGE CURRENT (nA) T<br>IDSS C<br> GATE THRESHOLD VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


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**DMN4060SVT** 

## **Package Outline Dimensions** 

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**----- Start of picture text -----**<br>
|||||||
|---|---|---|---|---|---|
|D|TSOT26|
|e1|Dim|Min|Max|Typ|
|A|—|1.00|—|
|A1|0.01|0.10|—|
|A2|0.84|0.90|—|
|D|—|—|2.90|
|E1|E|E|—|—|2.80|
|E1|—|—|1.60|
|c|L2|b|0.30|0.45|—|
|θ|c|0.12|0.20|—|
|Pe|ue|L|
|e|4x θ1|e|—|—|0.95|
|e1|—|—|1.90|
|6x b|
|L|0.30|0.50|—|
|L2|—|—|0.25|
|A|A2|θ|0°|8°|4°|
|θ1|4°|12°|—|
|iasesass|A1|SS==|All Dimensions in mm|

**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

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**----- Start of picture text -----**<br>
$< C C<br>Y1<br>Y (6x)<br>O00<br>X (6x)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Dimensions Value (in mm)<br>C 0.950<br>X  0.700<br>Y  1.000<br>Y1  3.199<br>**----- End of picture text -----**<br>


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**DMN4060SVT** 

## ~~[OY~~ **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. **LIFE SUPPORT** Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A.   Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated **www.diodes.com** 

7 of 7 **www.diodes.com** 

DMN4060SVT Document number: DS35702  Rev. 2 - 2 

February 2012 © Diodes Incorporated 



## Links

- [View this product on Novapart](https://novapart.co/products/DMN4060SVT-7/power-mosfet-n-channel-45-v-48-a-0037-ohm-tsot-26)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmn4060svt-7/mosfet-n-ch-45v-4-8a-tsot-26/dp/3943622RL)
---

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