# Power MOSFET, N Channel, 30 V, 15 A, 0.015 ohm, TSSOP, Surface Mount

![Product image](https://novapart.co/image/farnell:3943580/)

**URL**: https://novapart.co/products/DMN3020UTS-13/power-mosfet-n-channel-30-v-15-a-0015-ohm-tssop
**SKU**: DMN3020UTS-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1510
**Stock**: 1000+
**Lead Time**: 162 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 850mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | TSSOP |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 15A |
| Drain Source On State Resistance | 0.015ohm |
| Gate Source Threshold Voltage Max | 1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943580/)

**DMN3020UTS** 

**N-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**BVDSS**|**RDS(ON) max**|**ID max**<br>**TC = +25°C**|
|30V|20mΩ@VGS= 4.5V|15A|
||25mΩ@VGS= 2.5V|14A|



## **Features and Benefits** 

- Low Gate Threshold Voltage 

- Low On-Resistance 

- **ESD Protected Gate** 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Description and Applications** 

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. 

- Battery Management Application 

- Power Management Functions 

- DC-DC Converters 

## **Mechanical Data** 

- Case: TSSOP-8 

- Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminals: Finish  Matte Tin Annealed over Copper Lead Frame. Solderable per MIL-STD-202, Method 208 

- Weight: 0.039 grams (Approximate) 

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TSSOP-8  D<br>S D<br>S D G<br>S D<br>ESD PROTECTED<br>G D<br>“ADD © Gate Protection<br>Diode S<br>Pin1  Top View  Bottom View  Pin Out<br>Equivalent Circuit<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|DMN3020UTS-13|TSSOP-8|2,500/Tape & Reel|



- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. 

## **Marking Information** 

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8 5<br>N3020U<br>YY WW<br>1 4<br>TOD<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
      = Manufacturer’s Marking<br>N3020U = Product Type Marking Code<br>YYWW = Date Code Marking<br>YY = Year (ex: 17 = 2017)<br>WW = Week (01 to 53)<br>**----- End of picture text -----**<br>


1 of 7 **www.diodes.com** 

DMN3020UTS Document number: DS39580  Rev. 2 - 2 

July 2017 © Diodes Incorporated 

**DMN3020UTS** 

**Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

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|||||||
|---|---|---|---|---|---|
|QQ|Characteristic|Symbol|Value|Unit|
|QO|Drain-Source Voltage|VDSS|30|V|
|Gate-Source Voltage|VGSS|±12|V|
|Steady State|TTAA = +25°C  = +70°C|ID|6.8 5.4|A|
|Continuous Drain Current (Note 7) VGS = 4.5V|
|BF|Steady State|TTCC = +25°C  = +70°C|ID|15 12|A|
|GO|Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)|IDM|GO|-(0|A|
|eee|Continuous Source-Drain Diode Current (Note 7)|IS|tt|A|
|a|Pulsed Source-Drain Diode Current (10μs Pulse, Duty Cycle = 1%)|ISM|<0|A|
|ft|Avalanche Current (Note 8) L = 0.1mH|IAS|A|
|Ce|Avalanche Energy|(Note 8) L = 0.1mH|EAS|tt|mJ|

**----- End of picture text -----**<br>


## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

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||||||
|---|---|---|---|---|
|Characteristic|Symbol|Value|Unit|
|Total Power Dissipation (Note 5)|TA = +25°C|PD|0.85|W|
|Thermal Resistance, Junction to Ambient (Note 5)|Steady State|RJA|150|°C/W|
|Total Power Dissipation (Note 6)|TA = +25°C|PD|1.4|W|
|Thermal Resistance, Junction to Ambient (Note 6)|Steady State|RJA|90|°C/W|
|Thermal Resistance, Junction to Case (Note 6)|RJC|17|
|Operating and Storage Temperature Range|TJ, TSTG|-55 to +150|°C|

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**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

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|||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|GG|Characteristic|Symbol|Min|Typ|Max|((e|Unit|Test Condition|
|Cee|OFF CHARACTERISTICS (Note 8)|
|DD|Drain-Source Breakdown Voltage|BVDSS|30|—|—|V|VGS = 0V, ID = 250μA|
|Ce|Zero Gate Voltage Drain Current TJ = +25°C|IDSS|—|—|1|µA|VDS = 30V, VGS = 0V|
|nN|Gate-Source Leakage|IGSS|I|—|—|I (OS|±10|(O(n|µA|VGS = ±10V, VDS = 0V|
|Co|ON CHARACTERISTICS (Note 8)|
|(O|Gate Threshold Voltage|VGS(TH)|S|0.4|—|1.0|(Of|V|VDS = VGS, ID = 250μA|
|a|15|20|Ps|VGS = 4.5V, ID = 4.5A|
|Static Drain-Source On-Resistance|RDS(ON)|—|ee|18|25|mΩ|PF|VGS = 2.5V, ID = 3.5A|
|ee|25|50|ee|Pr|VGS = 1.8V, ID = 2.0A|
|nD|Diode Forward Voltage|V|I|SD|I|—|0.8|S(O|1.2|(OO|V|(OO|VGS = 0V, IS = 1.0A|
|Cee|DYNAMIC CHARACTERISTICS (Note 9)|
|aa|InOutput Caput Capacitance  pacitance|CCossiss|— —|1304 87|— —|pF|Vf = 1.0MHz DS = 15V, VGS = 0V,|
|nD|Reverse Transfer Capacitance|Crss|—|80|—|
|en|Gate Resistance|Rg|—|1.3|—|Ω|VDS = 0V, VGS = 0V, f = 1MHz|
|a|Total Gate Charge (VGS = 4.5V)|Q|DD|g|—|15|S(O|—|(O(n|
|a|Total Gate Charge (VGS = 8V)|Qg|—|27|nC|VDS = 15V,  ID = 4.5A|
|a|Gate-Source Charge|Qgs|—|2.0|—|
|nD|Gate-Drain Charge|Qgd|—|2.1|—|
|a|Turn-On Delay Time|tD(ON)|—|4.1|—|
|a|Turn-On Rise Time|tR|—|4.8|—|ns|VDS = 15V, VGS = 4.5V,|
|a|Turn-Off Delay Time|tD(OFF)|—|20.5|—|RG = 1Ω, ID = 4.5A|
|nD|Turn-Off Fall Time|tF|—|3.2|—|
|Reverse Recovery Time|tRR|—|7.1|—|ns|
|IF = 1.0A, di/dt = 100A/μs|
|SSny|Reverse Recovery Charge|nn|QRR|—|1.7|—|eee|nC|

**----- End of picture text -----**<br>


- Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 

   6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 

   7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C. 

   8. Short duration pulse test used to minimize self-heating effect. 

   9. Guaranteed by design. Not subject to product testing. 

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**DMN3020UTS** 

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30.0  30<br>VGS = 2.0V VDS = 5.0V<br>25.0  VGS = 2.5V 25<br>20.0  f f VGS —  = 1.8V 20 ee e eee<br>{K VGS = 3.0V e ee eee<br>15.0  VGS = 4.5V 15<br>Wi ae oe ee<br>VGS = 6.0V<br>10.0  VGS = 10V VGS = 1.5V 10<br>| e es cee<br>TJ = 150 [o] C TJ = 85 [o] C<br>5.0  5<br>TJ = 125 [o] C TJ = 25 [o] C<br>VGS = 1.2V TJ = -55 [o] C<br>0.0  {—_Ani 0 ffYo<br>0 0.5 1 1.5 2 2.5 3 0 0.5 1 1.5 2 2.5 3<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1. Typical Output Characteristic Figure 2. Typical Transfer Characteristic<br>60.00  50<br>VGS = 1.5V 45 ID = 4.5A<br>50.00  yp py ft<br>ID = 2.5A<br>40<br>ID = 1.8A<br>40.00  J tf<br>35 ID = 1.5A<br>30.00  VGS = 1.8V ea 30 e e<br>VGS = 2.5V 25<br>20.00  an a<br>20<br>10.00  VGS = 4.5V<br>Ss 15 FEE<br>0.00  ee 10 ed<br>0 5 10 15 20 0 2 4 6 8 10 12<br>ID, DRAIN-SOURCE CURRENT (A)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current and  Figure 4. Typical Transfer Characteristic<br>Gate Voltage<br>0.04 2<br>VGS = 10V T_._. 1.8 rT VGS = 4.5V, ID = 4.5A<br>0.03 TJ = 150 [o] C 1.6 VGS = 2.5V, ID = 3.5A<br>oo 1.4 | DT .<br>TJ = 125 [o] C<br>0.02 T P TJ = 85 [o] C 1.2 Ae<br>ee TJ = 25 [o] C 1 — A VGS = 1.8V, ID = 2.0A<br>0.01 0.8<br>TJ = -55 [o] C<br>Tt ott 0.6 a<br>0 ee Sanam (i 0.4  caceeeeeEEE<br>0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT (A) TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 5. Typical On-Resistance vs. Drain Current and  Figure 6. On-Resistance Variation with Temperature<br>Temperature<br>, DRAIN CURRENT (A)ID , DRAIN CURRENT (A)ID<br>) )<br>(m (m<br>, DRAIN-SOURCE ON-RESISTANCE , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON) DS(ON)<br>R R<br>)<br>(NORMALIZED)<br>, DRAIN-SOURCE ON-RESISTANCE<br>,  DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON)<br>R<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


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**DMN3020UTS** 

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0.04 1.2<br>VGS = 1.8V, ID = 1.0A<br>0.03 ee 0.9 eee<br>ID = 1mA<br>pan 95 5a<br>0.02 0.6<br>ID = 250µA<br>VGS = 2.5V, ID = 3.5A<br>0.01 p ee — e 0.3 aaa ee<br>VGS = 4.5V, ID = 4.5A<br>0 0<br>-50 ered -25 0 25 50 75 100 125 150 | -50 ECH -25 0 25 50 75 100 R 125 150<br>TJ, JUNCTION TEMPERATURE ( ℃ ) TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 7. On-Resistance Variation with Temperature Figure 8. Gate Threshold Variation vs.<br>JunctionTemperature<br>30 10000<br>VGS = 0V f = 1MHz<br>25 =<br>Ciss<br>20 I 1000<br>15 WE<br>TJ = 150 [o] C<br>10 TJ = 125 [o] C 100  Coss<br>TJ = 85 [o] C oY Crss<br>5<br>TJ = 25 [o] C<br>TJ = -55 [o] C<br>0 10<br>ZY |<br>0 0.3 0.6 0.9 1.2 0 5 10 15 20 25 30<br>VSD, SOURCE-DRAIN VOLTAGE (V) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current Figure 10. Typical Junction Capacitance<br>8 100<br>RDS(ON) PW = 1ms<br>Limited<br>PW = 100µs<br>6 10<br>4 1 DC<br>PW = 10s<br>TJ(Max) = 150 ℃<br>2 VDS = 15V, ID = 4.5A 0.1 TC = 25 ℃<br>Single Pulse PW = 1s<br>DUT on 1*MRP  PW = 100ms<br>Board<br>VGS = 10V PW = 10ms<br>0 0.01<br>0 4 8 12 16 20 24 28 0.1 1 10 100<br>Qg (nC) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11. Gate Charge Figure 12. SOA, Safe Operation Area<br>)<br>, GATE THRESHOLD VOLTAGE (V)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>GS(TH)<br>DS(ON) V<br>R<br>, SOURCE CURRENT (A)<br>IS<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br> (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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**DMN3020UTS** 

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1 ee aOO<br>SSS<br>Toro _ nn arr neil<br>ee Ee D=0.9 ll<br>S D=0.5 een ey oe D=0.7 |Ett<br>D=0.3 C TIEEer In ETT<br>i if<br>0.1 ere alll<br>at EAE AL<br>D=0.1 a "ee<br>B [Agrr<br>rr<br>D=0.05<br>FH | [MT] i<br>Sd, ea Ee<br>A N<br>D=0.02<br>0.01 ty<br>irre20<br>D=0.01 LAA<br>Ey ZA eHee HH<br>Lamrrte | ATT OT TTTT<br>D=0.005<br>F ATTLI TEI RθJA (t) = r(t) * RθJA maiiill<br>eta a [ACUTE] en RθJA = 149 ℃ /W mill<br>Duty Cycle, D = t1/t2<br>D=Single Pulse<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, PULSE DURATION TIME (sec)<br>Figure 13. Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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DMN3020UTS Document number: DS39580  Rev. 2 - 2 

July 2017 © Diodes Incorporated 

**DMN3020UTS** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

## **TSSOP-8** 

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|||||||||
|---|---|---|---|---|---|---|---|
|D|
|TSSOP-8|
|Dim|Min|Max|Typ|
|See Detail C|a|0.09|||
|E|A||1.20||
|E1|
|A1|0.05|0.15||
|A2|0.825 1.025|0.925|
|b|0.19|0.30||
|c|0.09|0.20||
|D|2.90|3.10|3.025|
|ed|e|b|c|e|||0.65|
|Gauge plane|E|||6.40|
|A|A2|a|E1|4.30|4.50 4.425|
|L|L|0.45|0.75|0.60|
|D|A1|All Dimensions in mm|
|ea;|PY|Detail C|GEER|

**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

## **TSSOP-8** 

Y X C3 C1 C2 G ~~aH~~ l 

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|||
|---|---|
|Dimensions Value|(in mm)|
|X|0.45|
|Y|1.78|
|C1|7.72|
|C2|0.65|
|C3|4.16|
|G|0.20|

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DMN3020UTS Document number: DS39580  Rev. 2 - 2 

July 2017 © Diodes Incorporated 

**DMN3020UTS** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2017, Diodes Incorporated 

**www.diodes.com** 

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DMN3020UTS Document number: DS39580  Rev. 2 - 2 

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## Links

- [View this product on Novapart](https://novapart.co/products/DMN3020UTS-13/power-mosfet-n-channel-30-v-15-a-0015-ohm-tssop)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmn3020uts-13/mosfet-n-ch-30v-15a-tssop/dp/3943580)
---

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