# Power MOSFET, N Channel, 240 V, 480 mA, 3.5 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:3127330RL/)

**URL**: https://novapart.co/products/DMN24H3D5L-7/power-mosfet-n-channel-240-v-480-ma-35-ohm-sot-23
**SKU**: DMN24H3D5L-7
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1630
**Stock**: 10+
**Lead Time**: 102 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:480mA; Drain Source Voltage Vds:240V; On Resistance Rds(on):1.5ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.95V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 760mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 760mW |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 1.5ohm |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 240V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 480mA |
| Drain Source On State Resistance | 3.5ohm |
| Automotive Qualification Standard | - |
| Gate Source Threshold Voltage Max | 1.95V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3127330RL/)

**DMN24H3D5L** ~~I~~ **N-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|**V(BR)DSS**|**RDS(ON)**|**ID **<br>**TA = +25°C**|
|---|---|---|
|240V|3.5Ω @VGS= 10V|0.48A|
||3.5Ω @VGS= 4.5V|0.48A|
||6.0Ω @VGS= 3.3V|0.37A|



## **Features and Benefits** 

- Low Gate Threshold Voltage 

- Low Input Capacitance 

- Fast Switching Speed 

- Small Surface Mount Package 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

## **Description** 

This new generation MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. 

## **Mechanical Data** 

- Case: SOT23 

- Case Material: Molded Plastic; UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity:  Level 1 per J-STD-020 

## **Applications** 

- Terminals: Solderable per MIL-STD-202, Method 208 **e3** 

**==> picture [432 x 179] intentionally omitted <==**

**----- Start of picture text -----**<br>
• Lead-Free Plating (Matte Tin Finish Annealed over Alloy 42<br>Leadframe).<br>• Terminal Connections: See Diagram<br>• Weight: 0.008 grams (Approximate)<br>D<br>SOT23<br>D<br>G<br>G S<br>. ~— 1] &<br>S<br>Top View<br>Top View<br>Pin Configuration  Equivalent Circuit<br>**----- End of picture text -----**<br>


- DC-DC Converters 

- Power Management Functions 

- Battery Operated Systems and Solid-State Relays 

- Drivers: Relays, Solenoids, Lamps, Hammers, Displays, Memories, Transistors, etc. 

## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|DMN24H3D5L-7|SOT23|3,000/Tape &Reel|
|DMN24H3D5L-13|SOT23|10,000/Tape & Reel|



- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

SOT23 | | . 2H4 = Product Type Marking Code **2H4** YM = Date Code Marking Y or Y = Year (ex: C = 2015) ~~;~~ M = Month (ex: 9 = September) Date Code Key **Year 2015 2016 2017 2018 2019 2020 2021 2022** ~~{|~~ **Code** C D ~~——_}|-~~ E F ~~|__|}~~ G H I J ~~J~~ **Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code** 1 2 3 4 5 6 7 8 9 O N D ~~{_——} —_} —_} —_| —}+—_ —_} —_| —}—_} —}—_| —~~ DMN24H3D5L 1 of 6 January 2015 Document number: DS37270  Rev. 3 - 2 **www.diodes.com** © Diodes Incorporated 

January 2015 © Diodes Incorporated 

**DMN24H3D5L** 

**Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)||||
|---|---|---|---|---|---|
|**Characteristic**|||**Symbol**|**Value**|**Units**|
|Drain-Source Voltage|||VDSS|240|V|
|Gate-Source Voltage|||VGSS|±20|V|
|Continuous Drain Current (Note 6) VGS= 10V|Steady<br>State|TA= +25°C<br>TA= +70°C|ID|0.48<br>0.39|A|
|Pulsed Drain Current (10µspulse, dutycycle≤ 1%)|||IDM|1.9|A|
|Maximum BodyDiode Continuous Current(Note 6)|||IS|1.5|A|



## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Characteristic**|**Characteristic**|**Symbol**|**Value**|**Units**|
|---|---|---|---|---|
|Total Power Dissipation|(Note 5)|PD|0.76|W|
||(Note 6)||1.26||
|Thermal Resistance, Junction to Ambient|(Note 5)|RθJA|163|°C/W|
||(Note 6)||99||
|Thermal Resistance, Junction to Case|(Note 6)|RθJC|31||
|Operatingand Storage Temperature Range||TJ,TSTG|-55 to 150|°C|



## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|**Test Condition**|
|---|---|---|---|---|---|---|
|**OFF CHARACTERISTICS(Note 7)**<br>~~ee~~|||||||
|Drain-Source Breakdown Voltage<br>~~ee~~|BVDSS<br>~~ee~~|240<br>~~ee~~|<br>~~ee~~|<br>~~ee~~|V<br>~~ee~~|VGS= 0V, ID= 250µA<br>~~ee~~|
|Zero Gate Voltage Drain Current<br>~~ee~~|IDSS<br>~~ee~~<br>~~Dn~~|<br>~~ee~~<br>~~I~~|<br>~~ee~~<br>~~ID~~|1.0<br>~~ee~~<br>~~nN~~|µA<br>~~ee~~<br>~~I~~|VDS= 192V, VGS= 0V<br>~~ee~~|
|Gate-BodyLeakage<br>~~nD~~|IGSS<br>~~nD~~<br>~~Dn~~|<br>~~nD~~<br>~~I~~|<br>~~nD~~<br>~~ID~~|±100<br>~~nD~~<br>~~nN~~|nA<br>~~nD~~<br>~~I~~|VGS= ±20V, VDS= 0V<br>~~nD~~|
|**ON CHARACTERISTICS(Note 7)**<br>~~Dn~~<br>~~I ID~~<br>~~nN I~~|||||||
|Gate Threshold Voltage|VGS(th)|1.0|1.95|2.5|V|VDS= VGS, ID= 250µA|
|Static Drain-Source On-Resistance|RDS(ON)|<br>~~ee~~|1.5<br>~~ee~~|3.5<br>~~ee~~|Ω<br>~~ee~~<br>~~Pe~~|VGS= 10V, ID= 0.3A<br>~~Pe~~|
|||<br>~~ee~~|1.5<br>~~ee~~|3.5<br>~~ee~~||VGS= 4.5V, ID= 0.2A<br>~~Pe~~|
|||<br>~~ee ~~|1.7<br> ~~ee~~|6.0<br>~~ee~~||VGS= 3.3V, ID= 0.1A<br>~~Pe~~|
|Diode Forward Voltage|VSD||0.7|1.2|V|VGS= 0V, IS= 0.3A|
|**DYNAMIC CHARACTERISTICS(Note 8)**<br>~~a~~<br>~~GO~~<br>~~eseeeel~~|||||||
|Input Capacitance<br>~~a~~<br>~~es~~|Ciss<br>~~es~~|<br>~~es~~<br>~~es~~|188<br>~~GO~~<br>~~es~~<br>~~eee~~|<br>~~es~~<br>~~eee~~|pF<br>~~es~~<br>~~el~~|VDS= 25V, VGS= 0V,<br>f = 1.0MHz<br>~~es~~|
|Output Capacitance<br>~~a~~<br>~~es~~|Coss<br>~~es~~|<br>~~es~~<br>~~es~~|11<br>~~GO~~<br>~~es~~<br>~~eee~~|<br>~~es~~<br>~~eee~~|||
|Reverse Transfer Capacitance<br>~~es~~|Crss<br>~~es~~|<br>~~es~~<br>~~es~~|8<br>~~es~~<br>~~eee~~|<br>~~es~~<br>~~eee~~|||
|Gate Resistance <br>~~es~~|Rg<br>~~es~~|<br>~~es ~~<br>~~es~~|3.86<br> ~~eee~~<br>~~es~~|<br>~~eee ~~<br>~~es~~|Ω<br> ~~el~~<br>~~es~~|VDS = 0V, VGS = 0V, f = 1.0MHz<br>~~es~~|
|Total Gate Charge<br>~~es~~<br>~~ee~~|Qg<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee~~|6.6<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee~~|nC<br>~~es~~<br>~~ee~~<br>~~ee~~|VDS= 192V, VGS= 10V,<br>ID= 0.5A<br>~~es~~<br>~~ee~~<br>~~ee~~|
|Gate-Source Charge<br>~~ee~~|Qgs<br>~~ee~~|<br>~~ee~~|0.8<br>~~ee~~|<br>~~ee~~|||
|Gate-Drain Charge<br>~~ee~~<br>~~—————~~|Qgd<br>~~ee~~|<br>~~ee~~|2.1<br>~~ee~~|<br>~~ee~~<br>~~ee~~|||
|Turn-On DelayTime<br>~~ee~~<br>~~—————~~|tD(on)<br>~~ee~~|<br>~~ee~~|2.3<br>~~ee~~|<br>~~ee~~<br>~~ee~~|nS<br>~~ee~~<br>~~ee~~|VDS= 60V, RL=200Ω <br>VGS= 10V, RG= 25Ω<br>~~ee~~<br>~~ee~~|
|Turn-On Rise Time<br>~~Pe~~<br>~~—————~~|tr||2.0|<br>~~ee~~|||
|Turn-Off DelayTime<br>~~—————~~|tD(off)||21|<br>~~ee~~|||
|Turn-Off Fall Time<br>~~—————~~|tf||7.2|<br>~~ee~~|||



Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper pad layout 7 .Short duration pulse test used to minimize self-heating effect. 

6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper pad layout 

8. Guaranteed by design. Not subject to production testing. 

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**DMN24H3D5L** 

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1.0 1<br>VGS = 10V<br>VGS = 4.0V VDS = 10V<br>VGS = 4.5V<br>e/a ee ee<br>0.8 0.8<br>VGS = 3.5V VGS = 3.0V<br>0.6 VGS = 3.3V 0.6<br>0.4 f oem 0.4 IeA<br>TA = 150°C<br>TA = 85°C<br>0.2 VGS = 2.7V 0.2 TA = 125°C<br>TA = 25°C<br>[oI<br>VGS = 2.5V TA = -55°C<br>0.0 0<br>0 Ze 1 2 3 4 5 1 1.5 2 2.5 3 ae 3.5 4<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1 Typical Output Characteristics Figure 2 Typical Transfer Characteristics<br>2.4 4<br>VGS = 10V TA = 150°C<br>2.2 3.5 TA = 125°C<br>|] | fe ee<br>VGS = 3.3V<br>3<br>2<br>a) 2.5 EEE T A  = 85°C<br>1.8<br>eee 2<br>1.6 V GS = 4.5V TA = 25°C<br>a 1.5<br>VGS = 10V<br>1.4 —o 1 T_T<br>TA = -55°C<br>1.2 | i tf 0.5 —_¥_§—<br>0 0.2 0.4 0.6 0.8 1 0 0.2 0.4 0.6 0.8 1<br>ID, DRAIN-SOURCE CURRENT (A) ID, DRAIN CURRENT (A)<br>Figure 3 Typical On-Resistance vs.  Figure 4 Typical On-Resistance vs.<br>Drain Current and Gate Voltage  Drain Current and Temperature<br>2.6 3.8<br>2.4<br>Oe VGS  10= V 3.4 )<br>2.2 ID = 0.3A<br>2 SSeeee, 3 VIGSD = 0.2A= 4.5V<br>1.8 Err A VGS = 4.5V ( ee 2.6 EeEEaneaaa 4a2<br>1.6 I D = 0.2A VGS  10= V<br>2.2 I D = 0.3A<br>1.4 a<br>1.2 aPEa = 1.8<br>a {ity<br>1<br>A 1.4 TITY<br>0.8<br>1<br>0.6 See et<br>0.4 0.6<br>CO -50 -25 0 25 50 tT 75 100 Et 125 150<br>TJ, JUNCTION TEMPERATURE (°C) , TJ, JUNCTION TEMPERATURE (°C)<br>Figure 5 On-Resistance Variation with Temperature Figure 6 On-Resistance Variation with Temperature<br>, DRAIN CURRENT (A)<br>D , DRAIN CURRENT (A)<br> I D<br> I<br>)Ω )Ω<br>, DRAIN-SOURCE ON-RESISTANCE ( , DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON) DS(ON)<br>R R<br>)Ω<br>, DRAIN-SOURCE<br>DS(ON)<br>R<br>, DRAIN-SOURCE ON-RESISTANCE (<br>ON-RESISTANCE (NORMALIZED)<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


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**DMN24H3D5L** 

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2.5<br>2.2<br>ID = 1mA<br>1.9 SA<br>ID = 250µA<br>1.6<br>1.3<br>BERRERNS<br>1 SN<br>-50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (°C)<br>Figure 7 Gate Threshold Variation vs. Ambient Temperature<br>1000<br>f = 1MHz<br>—————<br>ee<br>ee a Ciss<br>100 Creer<br>————————<br>BX rr<br>Coss<br>10 SS<br>C rss<br>——<br>ee<br>1 CEP reer<br>0 5 10 15 20 25 30 35 40<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9 Typical Junction Capacitance<br>10<br>R DS(on)<br>Limited<br>SO<br>1 a LNeeeETee<br>SONA DC NEE<br>0.1 PW = 10s<br>PW = 1s<br>P W  = 100ms<br>Sa A em NP PW = 10ms ANSAUS<br>0.01 TJ(max) = 150°C PW = 1ms<br>TVA GS = = 10V 25°C Eon Corn P W  = 100µs NC<br>Single Pulse<br>DUT on 1 * MRP Board<br>0.001 LUI LTA TVET<br>0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11 SOA, Safe Operation Area<br>, GATE THRESHOLD VOLTAGE (V)<br>GS(th)<br>V<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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1<br>0.80.6 ee<br>TA = 150°C<br>TA = 25°C<br>0.4 T A = 125°C<br>TA = 85°C TA = -55°C<br>0.2<br>7 Hp<br>0<br>0 0.2 0.4 0.6 0.8 1 1.2<br>VSD, SOURCE-DRAIN VOLTAGE (V)<br>Figure 8 Diode Forward Voltage vs. Current<br>10<br>8<br>6<br>VDS = 192V<br>ID  0.5= A<br>4<br>2<br>0<br>0 1 2 3 4 5 6 7<br>Qg [, TOTAL GATE CHARGE ] (nC)<br>Figure 10 Gate Charge<br>, SOURCE CURRENT (A)<br>IS<br> GATE THRESHOLD VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


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**DMN24H3D5L** | 

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LJECS,BOB Se)<br>**----- End of picture text -----**<br>


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;<br>1<br>D = 0.9<br>BE D = 0.7<br>D = 0.5 a reer ttt Ht<br>PAM 8 cee oc<br>D = 0.3 I reer om rn TTT<br>TE TOS MALOITMRAIIIIMROTIIIMMRTIII<br>0.1 ST ys<br>Ce D = 0.1 et LMI EL LILI HI<br>FEE I Oe Ze Oe TT<br>D = 0.05<br>Ee HR Ee EHH<br>12”<br>D = 0.02<br>eR NOTTS CAI AERATTI MMOANITIOGRANTIOMAITILIMRROIIT<br>0.01 ne<br>D = 0.01<br>Bo ERASE HE<br>FEHH<br>Ftc D = 0.005 A RR θθJAJA (t) = r(t)  = 163°C/* RW θJA UL<br>D = Single Pulse Duty Cycle, D = t1/ t2<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, PULSE DURATION TIME (sec)<br>Figure 12 Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


## **Package Outline Dimensions** 

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. 

**==> picture [434 x 350] intentionally omitted <==**

**----- Start of picture text -----**<br>
All 7° All 7°<br><2 —. $ H  ——_______m| T T ] ! GAUGE PLANE SOT23<br>GAUGE 0.25  PL ....*«<br>J Dim Min Max Typ<br>K1 kK K A 0.37  0.51  0.40<br>| | ee B  a 1.20  1.40  1.30<br>Le a a es C 2.30  es 2.50  2.40<br>A M i aed ee D  a 0.89  1.03  0.915<br>M_ es es<br>L L L “1 1 es F 0 es .45 ee 0.60 0.535<br>G 1.78 2.05 1.83<br>n s  ol ae ee H  a 2.80 3.00 2.90<br>J 0.013 0.10 0.05<br>C B | — ot] | esee K 0.890 eses 1.00  ee 0.975<br>K1 0.903 1.10  1.025<br>1 | Jd | ee ee L ee 0.45  es 0.61  ee 0.55<br>L1 0.25  0.55  0.40<br>' H H ee es ee<br>M 0.085 0.150 0.110<br>P o D ee es ee<br>a 8°<br>F G All Dimensions in mm<br>a | ___—S—CS*des<br>ested Pad Layout yout out<br>Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.<br>Dimensions Value (in mm)<br>Y Z 2.9<br>X 0.8<br>| ot| s—- Y 0.9<br>Z<br>C C 2.0<br>E 1.35<br>| +<br>X E<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout yout out** 

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 

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DMN24H3D5L Document number: DS37270  Rev. 3 - 2 

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**DMN24H3D5L** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference.  Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2015, Diodes Incorporated 

**www.diodes.com** 

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## Links

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- [Supplier page](https://es.farnell.com/diodes-inc/dmn24h3d5l-7/mosfet-n-ch-240v-0-48a-sot23/dp/3127330RL)
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