# Power MOSFET, N Channel, 20 V, 750 mA, 0.55 ohm, X1-DFN1006, Surface Mount

![Product image](https://novapart.co/image/farnell:3943558RL/)

**URL**: https://novapart.co/products/DMN2400UFB-7/power-mosfet-n-channel-20-v-750-ma-055-ohm-x1
**SKU**: DMN2400UFB-7
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0740
**Stock**: 100+
**Lead Time**: 190 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 470mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | X1-DFN1006 |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 750mA |
| Drain Source On State Resistance | 0.55ohm |
| Gate Source Threshold Voltage Max | 900mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943558RL/)

**DMN2400UFB** [7 **N-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**V(BR)DSS**|**RDS(ON) max**|**ID max**<br>**TA = +25°C**|
|20V|0.55Ω @ VGS= 4.5V|0.75A|
||0.75Ω @ VGS= 2.5V|0.63A|



## **Features and Benefits** 

- Low On-Resistance 

- Low Gate Threshold Voltage 

- Low Input Capacitance 

- Fast Switching Speed 

- Low Input/Output Leakage 

- Ultra-Small Surface Mount Package 

- **ESD Protected up to 1.5kV** 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Description and Applications** 

This MOSFET is designed to minimize the on-state resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high-efficiency power-management applications. 

## **Mechanical Data** 

   - Case: X1-DFN1006-3 

   - Case Material: Molded Plastic, "Green" Molding Compound; UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

- Battery Charging 

- Power Management Functions 

- DC-DC Converters 

- Portable Power Adaptors 

X1-DFN1006-3 ESD PROTECTED TO 1.5kV b ¢ 

X1-DFN1006-3 

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Bottom View<br>**----- End of picture text -----**<br>


- Terminal Connections Indicator: Collector Dot 

- Terminals: Finish  NiPdAu over Copper Leadframe; Solderable per MIL-STD-202, Method 208 **e4** 

- Weight: 0.001 grams (Approximate) 

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Drain<br>S Gate<br>D<br>G    Gate<br>   Protection Source<br>E    Diode l<br>Top View<br>Package Pin Configuration<br>**----- End of picture text -----**<br>


## Equivalent Circuit 

## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|
|---|---|---|
||||
|**Part Number**|**Case**|**Packaging**|
|DMN2400UFB-7|X1-DFN1006-3|3,000/Tape &Reel|
|DMN2400UFB-7B|X1-DFN1006-3|10,000/Tape & Reel|



- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

1 of 7 **www.diodes.com** 

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**DMN2400UFB** 

## **Marking Information** 

|**DMN2400UFB-7**|**NB**<br>**NB**<br>**NB**<br>Top View<br>Bar Denotes Gate and Source Side<br>**NB**<br>From date code 1527 (YYWW),<br>this changes to:<br>**NB**<br>Top View<br>Dot Denotes Drain Side<br>**NB**<br>**NB**<br>**NB**<br>es<br>ne<br>eo|
|---|---|
|**DMN2400UFB-7B**|NB = Part Marking Code<br>**NB**<br>**NB**<br>**NB**<br>Top View<br>Bar Denotes Gate and Source Side<br>**NB**<br>ne<br>eo|



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**DMN2400UFB** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|
|||||||
|**Characteristic**|||**Symbol**|**Value**|**Units**|
|Drain-Source Voltage|||VDSS|20|V|
|Gate-Source Voltage|||VGSS|±12|V|
|Continuous Drain Current (Note 5) VGS= 4.5V|Steady<br>State|TA= +25°C<br>TA= +85°C|ID|0.75<br>0.55|A|
|Continuous Drain Current (Note 5) VGS= 2.5V|Steady<br>State|TA= +25°C<br>TA= +85°C|ID|0.63<br>0.45|A|
|Pulsed Drain Current(Note 6)|||IDM|3|A|



## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Thermal Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Units**|
|Total Power Dissipation(Note 5)|PD|0.47|mW|
|Thermal Resistance, Junction to Ambient|RJA|258|°C/W|
|Operatingand Storage Temperature Range|TJ,TSTG|-55 to +150|°C|



## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|---|
||||||||
|**Characteristic**|**Symbol**|**Min**|**Typ **|**Max**|**Unit**|**Test Condition**|
|**OFF CHARACTERISTICS**(Note 7)|||||||
|Drain-Source Breakdown Voltage|BVDSS|20|-|-|V|VGS= 0V,ID= 250μA|
|Zero Gate Voltage Drain Current                          TJ= +25°C<br>~~pe~~|= +25°C<br>IDSS<br>~~pe~~|-<br>~~pe~~|-<br>~~pe~~|100<br>~~pe~~|nA<br>~~pe~~|VDS= 20V,VGS= 0V<br>~~pe~~|
|Gate-Source Leakage<br>~~pe~~|IGSS<br>~~pe~~|-<br>~~pe~~|-<br>~~pe~~|±1.0<br>~~pe~~|µA<br>~~pe~~|VGS= ±4.5V,VDS= 0V<br>~~pe~~|
|Gate-Source Leakage<br>~~pe~~|IGSS<br>~~pe~~|-<br>~~pe~~|-<br>~~pe~~|±50<br>~~pe~~|µA<br>~~pe~~|VGS= ±10V,VDS= 0V<br>~~pe~~|
|**ON CHARACTERISTICS**(Note 7)|||||||
|Gate Threshold Voltage<br>~~===.~~|VGS(th)<br>~~===.~~|0.5<br>~~===.~~|-<br>~~===.~~|0.9<br>~~===.~~|V<br>~~===.~~|VDS= VGS,ID= 250μA<br>~~===.~~|
|Static Drain-Source On-Resistance<br>~~===.~~|RDS (ON)<br>~~===.~~|-<br>~~===.~~|-<br>~~===.~~|0.55<br>~~===.~~|Ω<br>~~===.~~|VGS= 4.5V,ID= 600mA<br>~~===.~~|
|||-<br>~~===.~~|-<br>~~===.~~|0.75<br>~~===.~~||VGS= 2.5V,ID= 500mA<br>~~===.~~|
|||-<br>~~===.~~|-<br>~~===.~~|0.9<br>~~===.~~||VGS= 1.8V,ID= 350mA<br>~~===.~~|
|Forward Transfer Admittance||Yfs||-|1.0|-|S|VDS= 10V,ID= 400mA|
|Diode Forward Voltage(Note 7)|VSD||0.7|1.2|V|VGS= 0V,IS= 150mA|
|**DYNAMIC CHARACTERISTICS**(Note 8)|||||||
|Input Capacitance|Ciss|-|36.0|-|pF|VDS= 16V, VGS= 0V,<br>f = 1.0MHz|
|Output Capacitance|Coss|-|5.7|-|pF||
|Reverse Transfer Capacitance|Crss|-|4.2|-|pF||
|Total Gate Charge|Qg|-|0.5|-|nC|VGS=4.5V, VDS= 10V,<br>ID= 250mA<br>~~ee~~|
|Gate-Source Charge|Qgs|-|0.07|-|nC||
|Gate-Drain Charge<br>~~——~~|Qgd|-|0.1|-<br>~~ee~~|nC<br>~~ee~~||
|Turn-On DelayTime<br>~~——~~|tD(on)|-|4.11|-<br>~~ee~~|ns<br>~~ee~~|VDD= 10V, VGS= 4.5V,<br>RL= 47Ω, RG= 10Ω,<br>ID= 200mA<br>~~ee~~|
|Turn-On Rise Time<br>~~——~~|tr|-|3.82|-<br>~~ee~~|ns<br>~~ee~~||
|Turn-Off DelayTime<br>~~——~~|tD(off)|-|14.8|-<br>~~ee~~|ns<br>~~ee~~||
|Turn-Off Fall Time<br>~~——~~|tf|-|9.6|-<br>~~ee~~|ns<br>~~ee~~||



Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout. 6. Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%. 

7. Short duration pulse test used to minimize self-heating effect. 

8. Guaranteed by design. Not subject to product testing. 

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2.0 1.5<br>VGS = 4.5V<br>VGS = 2.5V VDS = 5V<br>atten<br>1.5 V GS  = 2.0V<br>1.0<br>VGS = 1.8V<br>1.0<br>0.5<br>0.5 VGS = 1.5V TA = 150°C<br>TA = 125°C<br>TA = 85°C TA = 25°C<br>0 (ANGER VGS = 1.2V 0 ane TA = -55°C<br>0 1 2 3 4 5 0 0.5 1 1.5 2 2.5 3<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE SOURCE VOLTAGE (V)<br>Fig. 1 Typical Output Characteristics Fig. 2 Typical Transfer Characteristics<br>2.0 0.8<br>VGS = 4.5V<br>1.6 HEHE EEE EE<br>0.6<br>PtTTT<br>TA = 150°C<br>1.2 VGS = 1.5V<br>0.4 TA = 125°C<br>TA = 85°C<br>0.8<br>TA = 25°C<br>VGS = 1.8V VGS = 2.5V 0.2 T A  = -55°C<br>ane<br>0.4<br>VGS = 5.0V V GS = 4.5V<br>0 SESTt ye 0 =<br>0 0.4 0.8 1.2 1.6 EE 2 0 0.4 0.8 1.2 1.6<br>ID, DRAIN-SOURCE CURRENT (A) ID, DRAIN CURRENT (A)<br>Fig. 3 Typical On-Resistance  Fig. 4 Typical Drain-Source On-Resistance<br>vs. Drain Current and Gate Voltage vs. Drain Current and Temperature<br>1.6 0.8<br>VGS = 4.5V<br>1.4 ID = 1.0A<br>of<br>0.6<br>VGS = 2.5.V<br>ID = 500mA<br>1.2 Tile<br>0.4 VGS = 2.5V<br>ID = 500mA<br>1.0<br>0.2 V GS  = 4.5V<br>0.8 ID = 1.0A<br>eT LL<br>0.6-50 LLLrE -25 EEL 0 25 50 75 100 125 150 0-50 a -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)<br>Fig. 5 On-Resistance Variation with Temperature Fig. 6 On-Resistance Variation with Temperature<br>, DRAIN CURRENT (A)<br>ID<br>D<br>, DRAIN CURRENT (A)<br>I<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>R<br>DS(ON)<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>R<br>DS(ON)<br>)<br>, DRAIN-SOURCE ON-RESISTANCE (<br>R<br>DS(ON)<br>, DRAIN-SOURCE<br>R<br>ON-RESISTANCE (NORMALIZED)<br>DS(ON)<br>**----- End of picture text -----**<br>


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**DMN2400UFB** [ 

## DIODES 

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1.6<br>1.2 TA = 25°CA = 25°C = 25°C<br>||| | ty<br>0.8 | | [| i<br>fe<br>0.4<br>0 HGR<br>0 0.2 0.4 0.6 0.8 1.0 1.2<br>VSD, SOURCE-DRAIN VOLTAGE (V)SD, SOURCE-DRAIN VOLTAGE (V), SOURCE-DRAIN VOLTAGE (V)<br>Fig. 8 Diode Forward Voltage vs. Current<br>5<br>4<br>VDS = 10VDS = 10V = 10V<br>ID = 250mAD = 250mA = 250mA<br>3<br>2<br>1<br>0<br>0 0.1 0.2 0.3 0.4 0.5 0.6<br>Qg, TOTAL GATE CHARGE (nC) g, TOTAL GATE CHARGE (nC) , TOTAL GATE CHARGE (nC)<br>Fig. 10 Gate-Charge Characteristics<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, SOURCE CURRENT (A)<br>ISS<br>**----- End of picture text -----**<br>


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1.2 1.6<br>1.0<br>1.2 TA = 25°CA = 25°C = 25°C<br>0.8 SS I D  = 1mA<br>——— ||| | ty<br>ID = 250µA<br>0.6 i. 0.8 | | [|<br>fe<br>0.4<br>0.4<br>0.2<br>0 PL iELELiL 0 HGR<br>-50 -25 0 25 50 75 100 125 150 0 0.2 0.4 0.6 0.8<br>TA, AMBIENT TEMPERATURE (°C) VSD, SOURCE-DRAIN VOLTAGE (V)SD, SOURCE-DRAIN VOLTAGE (V), SOURCE-DRAIN VOLTAGE (V)<br>Fig. 7 Gate Threshold Variation vs. Ambient Temperature Fig. 8 Diode Forward Voltage vs. Current<br>60 5<br>50 f = 1MHz<br>4<br>VDS = 10VDS = 10V = 10V<br>40 ID = 250mAD = 250mA = 250mA<br>3<br>Ciss<br>30 eee<br>2<br>20 Pf ff<br>1<br>10 Coss<br>0 SS Crss 0<br>0 5 10 15 20 0 0.1 0.2 0.3 0.4<br>VDS, DRAIN-SOURCE VOLTAGE (V) Qg, TOTAL GATE CHARGE (nC) g, TOTAL GATE CHARGE (nC) , TOTAL GATE CHARGE (nC)<br>Fig. 9 Typical Capacitance Fig. 10 Gate-Charge Characteristics<br>1<br>bE D = 0.7 ore<br>D = 0.5 EHR EH ee<br>bo ttt<br>D = 0.3 NT ee eee ee<br>Tee GRATIN<br>0.1<br>PI D = 0.1 IN ANIME UTI TIMEEITM<br>Series ass Soe ae ee ee doesent eee eet<br>a cy ae ee ee ee<br>D = 0.05 D = 0.9<br>agent ame eee ee<br>SOT TE RJA(t) = r(t) * RJA ml<br>D = 0.02 RJA = 253°C/W<br>AIT HIT CT<br>0.01 D = 0.01 P(pk)<br>pmHM| RM TEIE TTT cn t1 nltH|<br>[| | SV FT {>| t2 [TTT<br>Ket D = 0.005 PU TET TT T J  - T A  = P * R JA (t) ml<br>D = Single Pulse Duty Cycle, D = t 1 /t 2<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000<br>t1, PULSE DURATION TIME (s)<br>Fig. 11 Transient Thermal Response<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>C, CAPACITANCE (pF)<br>, SOURCE CURRENT (A)<br>ISS<br>, GATE THRESHOLD VOLTAGE (V)<br>GS(TH)<br>V<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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**DMN2400UFB** 

## **Package Outline Dimensions** 

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. 

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A X1-DFN1006-3<br>A1<br>Dim  Min  Max Typ<br>|(| Seating Plane = A  0.47  = 0.53 0.50<br>A1  0.00 0.05 0.03<br>— D b  0.10 0.20 0.15<br>Pin #1 ID b === b2  0.45 0.55 0.50<br>D  0.95 1.075 1.00<br>E  0.55 0.675 0.60<br>e  -  -  0.35<br>[ | = L1  0.20 0.30 0.25<br>E b2 a] e — L2  0.20 0.30 0.25<br>L3  -  -  0.40<br>z  0.02  0.08 0.05<br>All Dimensions in mm<br>z<br>‘a L2 L3 L1<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 

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Y C<br>Y1<br>G2<br>=<br>“ol X G1<br>X1<br>**----- End of picture text -----**<br>


|**Dimensions**|**Value(in mm)**|
|---|---|
|**Dimensions**<br>**C**|**Value(in mm)**<br>0.70|
|**G1 **|00<br>0.30|
|**G2**<br>**X**|0.20<br>0.40|
|**X**<br>**X1**|0.40<br>1.10|
|**X1**|1.10|
|**Y**|0.25|
|**Y1**|0.70|



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**DMN2400UFB** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference.  Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2015, Diodes Incorporated 

**www.diodes.com** 

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## Links

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- [Supplier page](https://es.farnell.com/diodes-inc/dmn2400ufb-7/mosfet-n-ch-20v-0-75a-x1-dfn1006/dp/3943558RL)
---

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