# Power MOSFET, N Channel, 20 V, 9.8 A, 0.02 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:1863719/)

**URL**: https://novapart.co/products/DMN2028USS-13/power-mosfet-n-channel-20-v-98-a-002-ohm-soic
**SKU**: DMN2028USS-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2070
**Stock**: 500+
**Lead Time**: 106 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:9.8A; Drain Source Voltage Vds:20V; On Resistance Rds(on):0.011ohm; Rds(on) Test Voltage Vgs:4.5V; Threshold Voltage Vgs:1V; Power Diss

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.56W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 9.8A |
| Drain Source On State Resistance | 0.02ohm |
| Gate Source Threshold Voltage Max | 1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1863719/)

**DMN2028USS** 

**20V N-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**V(BR)DSS**|**RDS(on) max**|**ID max**<br>TA= +25°C<br>(Note 6)|
|20V|20mΩ @ VGS= 4.5V|9.8A|
||28mΩ @ VGS= 2.5V|8.3A|



## **Features and Benefits** 

- Low On-Resistance 

- Low Input Capacitance 

- Fast Switching Speed 

- Low Output Leakage 

- **ESD Protected Up to 2kV** 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Description and Applications** 

This MOSFET has been designed to minimize the on-state resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. 

## **Mechanical Data** 

   - Case: SO-8 

   - Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 (Note 1) 

   - Moisture Sensitivity: Level 1 per J-STD-020 

- Battery charging 

- Power management functions 

- DC-DC converters 

- Portable power adaptors 

**==> picture [85 x 6] intentionally omitted <==**

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ESD PROTECTED TO 2kV<br>**----- End of picture text -----**<br>


**==> picture [36 x 105] intentionally omitted <==**

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SO-8<br>Top View<br>**----- End of picture text -----**<br>


- Terminal Connections: See Diagram Below 

- Terminals: Finish – Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 

- Weight: 0.074 grams (approximate) 

**==> picture [248 x 138] intentionally omitted <==**

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D<br>S D<br>S D<br>G<br>S D<br>G D Gate Protection Diode S<br>Top View  Equivalent Circuit<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|
|---|---|---|---|---|
||||||
|**Product**|**Marking**|**Reel size(inches)**|**Tape width(mm)**|**Quantity per reel**|
|DMN2028USS-13|N2028US|13|12|2,500|



Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

**==> picture [220 x 105] intentionally omitted <==**

**----- Start of picture text -----**<br>
8 5 8 5<br>Pty EE TT See<br>N2028US N2028US<br>YY WW YY WW<br>1 4 Oooo 1 4<br>Chengdu A/T Site Shanghai A/T Site<br>**----- End of picture text -----**<br>


> = Manufacturer’s Marking 7 N2028US = Product Type Marking Code YYWYY or YY = Year (ex: 13 = 2013) W ~~|~~ = Date Code Marking WW = Week (01 - 53) 

~~-~~ YY YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)= Date Code Marking for SAT (Shanghai Assembly/ Test site) 

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**DMN2028USS** 

**Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|||
|---|---|---|---|---|---|
|**Characteristic**|||**Symbol**|**Value**|**Unit**|
|Drain-Source voltage|||VDSS|20|V|
|Gate-Source voltage|||VGS|12||
|Continuous Drain current|VGS= 4.5V|(Note 6)|ID|9.8|A|
|||TA= +70°C(Note 6)||7.9||
|||(Note 5)||7.3||
|Pulsed Drain current|VGS= 4.5V|(Note 7)|IDM|45.0||
|Continuous Source current(Bodydiode)||(Note 6)|IS|6.0||
|Pulsed Source current(Bodydiode)||(Note 7)|ISM|45.0||



**Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Thermal Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|||
|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Power dissipation<br>Linear derating factor|(Note 5)|PD|1.56<br>12.5|W<br>mW/°C|
||(Note 6)||2.81<br>22.5||
|Thermal Resistance, Junction to Ambient|(Note 5)|RJA|80.0|°C/W|
||(Note 6)||44.5||
|Thermal Resistance,Junction to Lead|(Note 8)|RJL|37.0||
|Operatingand storage temperature range||TJ,TSTG|-55 to +150|°C|



Notes: 5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition. 

6. Same as note (5), except the device is measured at t  10 sec. 

7. Same as note (5), except the device is pulsed with D = 0.02 and pulse width 300µs. 

8. Thermal resistance from junction to solder-point (at the end of the drain lead). 

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**DMN2028USS** 

lmcoRrRPORATED® 

## **Thermal Characteristics** 

**==> picture [451 x 362] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.6<br>R  Limited<br>DS(on) Seed 1.4 IN<br>10 et PAA 25mm x 25mm<br>1.2 1oz FR4<br>1 | ANS 1.0 TEE NEE<br>DC<br>100m 1s 0.8<br>a aeeee a<br>__——— 100ms _——_— oo 0.6 eee eee<br>10m -—+--H] Single Pulse 10ms ei 1ms 0.4 POE NEE<br>1m Tamb=25°C 100µs 0.2<br>S Se [>>>.] OrSSNS== === —5 0.0 PrrTrreryrececececesctye ttIN cNT e sss<br>100m 1 10 0 20 40 60 80 100 120 140 160<br>VDS  Drain-Source Voltage (V)  Temperature (°C)<br>Safe Operating Area Derating Curve<br>80 | , onoo oo oo oo<br>25mm x 25mm<br>70 1oz FR4 AHO A NIECANC C E  CTCTM TTT Single Pulse Hyti<br>T =25°C<br>60 T amb =25°C ee 100 CNC amb Tl<br>50<br>D=0.5 aeall a PETE HNMRNe TEER TEED SEI cd<br>40 Ce ea [HET] ee a ASe tiai ema, eal lleG<br>30 10<br>D=0.2 Single Pulse<br>20<br>D=0.05<br>10 AF tH CO Con CnC SS ony<br>pa ml ee | D=0.1 pp UTI TTI TTT TTT PETTITT<br>0 Settee ins== Mg EE 1 UII TTI ET ITN CTT Wnt<br>100µ 1m 10m 100m 1 10 100 1k 100µ 1m 10m 100m 1 10 100 1k<br>Pulse Width (s) Pulse Width (s)<br>Transient Thermal Impedance Pulse Power Dissipation<br>  Drain Current (A)<br>ID<br> Max Power Dissipation (W)<br> Maximum Power (W)<br>Thermal Resistance (°C/W)<br>**----- End of picture text -----**<br>


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**DMN2028USS** 

## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|---|---|
|||||||||
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|**Test Condition**||
|**OFF CHARACTERISTICS**||||||||
|Drain-Source Breakdown Voltage|BVDSS|20|-|-|V|VGS= 0V,ID= 250μA||
|Zero Gate Voltage Drain Current|IDSS|-|-|1.0|μA|VDS= 20V,VGS= 0V||
|Gate-Source Leakage|IGSS|-|-|±10|μA|VGS= ±12V,VDS= 0V||
|**ON CHARACTERISTICS**||||||||
|Gate Threshold Voltage<br>~~ee~~|VGS(th)<br>~~ee~~|0.6<br>~~ee~~|1.0<br>~~ee~~|1.3<br>~~ee~~|V<br>~~ee~~|VDS= VGS,ID= 250μA<br>~~ee~~||
|Static Drain-Source On-Resistance (Note 9)<br>~~ee~~|RDS (ON)<br>~~ee~~|-<br>~~ee~~|11<br>~~ee~~|20<br>~~ee~~|mΩ<br>~~ee~~|VGS= 4.5V,ID= 9.4A<br>~~ee~~||
||||15<br>~~ee~~|28<br>~~ee~~||VGS= 2.5V,ID= 8.3A<br>~~ee~~||
|Forward Transfer Admittance(Note 9 & 10)<br>~~ee~~||Yfs|<br>~~ee~~|-<br>~~ee~~|16<br>~~ee~~|-<br>~~ee~~|S<br>~~ee~~|VDS= 5V,ID= 9.4A<br>~~ee~~||
|Diode Forward Voltage(Note 9)|VSD|-|0.7|1.3|V|VGS= 0V,IS= 1.3A||
|**DYNAMIC CHARACTERISTICS(Note 10)**||||||||
|Input Capacitance<br>~~———~~|Ciss<br>~~———~~|-<br>~~———~~|1000<br>~~———~~|-<br>~~———~~|pF<br>~~———~~|VDS= 10V, VGS= 0V,<br>f = 1.0MHz<br>~~———~~||
|Output Capacitance<br>~~———~~|Coss<br>~~———~~|-<br>~~———~~|166<br>~~———~~|-<br>~~———~~||||
|Reverse Transfer Capacitance<br>~~———~~|Crss<br>~~———~~|-<br>~~———~~|158<br>~~———~~|-<br>~~———~~||||
|Gate Resistance<br>~~———~~<br>~~————~~|Rg<br>~~———~~|-<br>~~———~~|1.51<br>~~———~~|-<br>~~———~~<br>~~e~~|Ω<br>~~———~~<br>~~e~~|VDS= 0V,VGS= 0V,f = 1MHz<br>~~———~~<br>~~ee~~||
|Total Gate Charge(Note 11)<br>~~————~~|Qg|-|7.0|-<br>~~e~~|nC<br>~~e~~<br>~~ee~~|VGS= 2.5V<br>~~ee~~|VDS= 10V<br>ID= 9.4A<br>~~e~~<br>~~ee~~|
|Total Gate Charge(Note 11)<br>~~————~~|Qg|-|11.6|-<br>~~e~~||VGS= 4.5V<br>~~ee~~<br>~~ee~~||
|Gate-Source Charge(Note 11)<br>~~————~~|Qgs|-|2.7|-<br>~~e~~||||
|Gate-Drain Charge(Note 11)<br>~~————~~<br>~~————~~|Qgd|-|3.4|-<br>~~e~~<br>~~ee~~||||
|Turn-On DelayTime(Note 11)<br>~~————~~<br>~~————~~|tD(on)|-|11.67|-<br>~~e~~<br>~~ee~~|ns<br>~~e~~<br>~~ee~~|VGS= 4.5V, VDS= 10V,<br>RG= 6Ω , ID= 1A<br>~~ee~~<br>~~ee~~||
|Turn-On Rise Time(Note 11)<br>~~————~~<br>~~————~~|tr|-|12.49|-<br>~~e~~<br>~~ee~~||||
|Turn-Off DelayTime(Note 11)<br>~~————~~|tD(off)|-|35.89|-<br>~~ee~~||||
|Turn-Off Fall Time(Note 11)<br>~~————~~|tf|-|12.33|-<br>~~ee~~||||



- Notes: 9.   Measured under pulsed conditions. Pulse width  300μs; duty cycle  2% 10.   For design aid only, not subject to production testing. 11.   Switching characteristics are independent of operating junction temperatures. 

**==> picture [204 x 209] intentionally omitted <==**

**----- Start of picture text -----**<br>
30<br>VGS = 10V<br>VGS = 4.5V<br>25<br>VGS = 4.0V<br>VGS = 3.5V<br>20 VGS = 3.0V<br>VGS = 2.5V<br>15<br>VGS = 2.0V<br>10<br>5 VGS = 1.8V<br>0<br>0 0.5 1 1.5 2<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Fig. 1 Typical Output Characteristic<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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20<br>15<br>10<br>5 T A  = 150°C<br>TA = 125°C TA = 85°C<br>TA = 25°C<br>TA = -55°C<br>0<br>0 0.5 1 1.5 2 2.5 3<br>VGS, GATE-SOURCE VOLTAGE (V)<br>Fig. 2  Typical Transfer Characteristic<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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0.030 0.030<br>0.025 0.025 V GS  = 4.5V<br>0.020 0.020<br>TA = 150°C<br>0.015 0.015<br>OO VGS = 2.5V a TA = 125°C<br>TA = 85°C<br>0.010 0.010 T A  = 25°C<br>VGS = 4.5V<br>TA = -55°C<br>0.005 0.005<br>0 0<br>0 5 10 15 20 0 5 10 15 20<br>ID, DRAIN-SOURCE CURRENT (A) ID, DRAIN CURRENT (A)<br>Fig. 3  Typical On-Resistance  Fig. 4 Typical On-Resistance<br>vs. Drain Current and Gate Voltage  vs. Drain Current and Temperature<br>1.6 0.030<br>0.025<br>1.4<br>0.020<br>1.2 VGS = 2.5V<br>ID = 5A<br>0.015<br>1.0 V GS  = 2.5V<br>ID = 5A 0.010<br>VGS = 4.5V<br>0.8 V GS  = 4.5V 0.005 ID = 10A<br>ID = 10A<br>0.6 0<br>-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150<br>TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)<br>Fig. 5 On-Resistance Variation with Temperature Fig. 6 On-Resistance Variation with Temperature<br>3.0 20<br>2.5<br>16<br>2.0<br>12 T A  = 25°C<br>1.5<br>8<br>1.0 I D  = 1mA<br>ID = 250µA 4<br>0.5<br>0 0<br>-50 -25 0 25 50 75 100 125 150 0 0.2 0.4 0.6 0.8 1.0 1.2<br>TA, AMBIENT TEMPERATURE (°C) VSD, SOURCE-DRAIN VOLTAGE (V)<br>Fig. 7 Gate Threshold Variation vs. Ambient Temperature Fig. 8 Diode Forward Voltage vs. Current<br>) )<br>, DRAIN-SOURCE ON-RESISTANCE ( ,  DRAIN-SOURCE ON-RESISTANCE (<br>DS(ON) DS(ON)<br>R R<br>, DRAIN-SOURCE  , DRAIN-SOURCE<br>DSON DSON<br>R R<br>ON-RESISTANCE (NORMALIZED) ON-RESISTANCE (NORMALIZED)<br>, GATE THRESHOLD VOLTAGE (V)GS(TH) , SOURCE CURRENT (A)IS<br>V<br>**----- End of picture text -----**<br>


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10,000 10,000<br>f = 1MHz SS TA = 150 ° C<br>1,000<br>1,000 SC Ciss SS SS TA = 125 ° C<br>C oss 100<br>Crss<br>100 NN = TA = 85°C<br>10<br>SS TA = 25°C<br>10 1<br>0 5 10 15 20 0 5 10 15 20<br>VDS, DRAIN-SOURCE VOLTAGE (V) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Fig. 9 Typical Total Capacitance Fig. 10 Typical Leakage Current<br>vs. Drain-Source Voltage<br>10<br>8 VDS = 15V<br>ID = 9.4A<br>6<br>4<br>2<br>0<br>0 5 10 15 20 25 30<br>Qg, TOTAL GATE CHARGE (nC)<br>Fig. 11 Gate-Charge Characteristics<br>C, CAPACITANCE (pF) , LEAKAGE CURRENT (nA)<br>IDSS<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


## **Package Outline Dimensions** 

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 

**==> picture [245 x 128] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1 E<br>Gauge Plane<br>A1 Seating Plane<br>L<br>Detail ‘A’<br>h 7°~9°<br>45°<br>Detail ‘A’<br>A2 A A3<br>e b<br>D<br>0.254<br>**----- End of picture text -----**<br>


|**SO-8**|**SO-8**|**SO-8**|
|---|---|---|
|**Dim**|**Min**|**Max**|
|**A**|-|1.75|
|**A1**|0.10|0.20|
|**A2**<br>**A3**|1.30<br>0.15|1.50<br>0.25|
|**A3**<br>**b**|0.15<br>0.3|0.25<br>0.5|
|**D**|4.85|4.95|
|**E**|5.90|6.10|
|**E1**|3.85|3.95|
|**e**|1.27 Typ||
|**h**|-|0.35|
|**L**|0.62|0.82|
||0|8|
|All Dimensions in mm|||



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## **Suggested Pad Layout** 

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 

**==> picture [340 x 109] intentionally omitted <==**

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|||||
|---|---|---|---|
|X|
|THEE|Dimensions|Value|(in mm)|
|X|0.60|
|Y|1.55|
|C1|C1|5.4|
|||
|C2|1.27|
|C2|
|Y|
|TH|HG|i|

**----- End of picture text -----**<br>


## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference.  Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

- B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2013, Diodes Incorporated 

**www.diodes.com** 

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