# Power MOSFET, N Channel, 20 V, 100 A, 4600 µohm, PowerDI 5060, Surface Mount

![Product image](https://novapart.co/image/farnell:3943538RL/)

**URL**: https://novapart.co/products/DMN2005UPS-13/power-mosfet-n-channel-20-v-100-a-4600-ohm-powerdi
**SKU**: DMN2005UPS-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2710
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | PowerDI 5060 |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 4600µohm |
| Gate Source Threshold Voltage Max | 700mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943538RL/)

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## **DMN2005UPS 20V N-CHANNEL ENHANCEMENT MODE MOSFET PowerDI5060-8** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**BVDSS**|**RDS(ON)**|**ID **<br>**TC = +25°C**|
|20V|4.6mΩ@VGS= 4.5V|100A|
||8.7mΩ@VGS= 2.5V|80A|



## **Features** 

- Thermally Efficient Package-Cooler Running Applications 

- High Conversion Efficiency 

- Low RDS(ON) – Minimizes On State Losses 

- Low Input Capacitance 

- Fast Switching Speed 

- <1.1mm Package Profile – Ideal for Thin Applications 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

## **Description** 

This new generation N-Channel Enhancement Mode MOSFET has been designed to minimize RDS(ON) yet maintain superior switching performance. This device is ideal for use in Notebook battery power management and Load switch. 

- **For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at** 

   - 

   - **https://www.diodes.com/products/automotive/automotive products/.** 

- **This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability.** 

**https://www.diodes.com/quality/product-definitions/** 

## **Applications** 

- Motor Control 

- DC-DC Converters 

- Power Management 

## **Mechanical Data** 

- Case: PowerDI[®] 5060-8 

- Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminal Finish - Matte Tin Annealed over Copper Leadframe; Solderable per MIL-STD-202, Method 208 

- Terminal Connections: See Diagram Below 

 

- Weight: 0.097 grams (Approximate) 

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PowerDI5060-8  D<br>S D<br>Pin1<br>S D<br>G S D<br>G D<br>oe | 8<br>S<br>Top View  Bottom View  Top View<br>Internal Schematic  Pin Configuration<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|DMN2005UPS-13|PowerDI5060-8|2,500 / Tape & Reel|



Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 

2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. 

_PowerDI is a registered trademark of Diodes Incorporated._ 

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## **Marking Information** 

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D D D D<br>; 31 ;<br>N2005US<br>YY WW<br>S S S G<br>**----- End of picture text -----**<br>


> = Manufacturer’s Marking ot N2005US = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 20 = 2020) WW = Week Code (01 to 53) 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|
|||||||
|**Characteristic**|||**Symbol**|**Value**|**Unit**|
|Drain-Source Voltage|||VDSS|20|V|
|Gate-Source Voltage|||VGSS|±12|V|
|Continuous Drain Current (Note 6) VGS= 10V|Steady<br>State|TA= +25°C<br>TA= +70°C|ID|20<br>15|A|
|Continuous Drain Current (Note 6) VGS= 10V|Steady<br>State|TC= +25°C<br>TC= +70°C|ID|100<br>88|A|
|Pulsed Drain Current(380μs Pulse,DutyCycle = 1%)|||IDM|150|A|
|Maximum Continuous BodyDiode Forward Current(Mounted on Infinite Heatsink)|||IS|150|A|
|Avalanche Current(Note 7)L=0.2mH|||IAS|36|A|
|Avalanche Energy (Note 7)L=0.2mH|||EAS|133|mJ|



## **Thermal Characteristics** 

|**Thermal Characteristics**|**Thermal Characteristics**||||
|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Total Power Dissipation(Note 5)||PD|1.5|W|
|Thermal Resistance, Junction to Ambient (Note 5)|Steadystate|RJA|98|°C/W|
||t<10s||83||
|Total Power Dissipation(Note 6)||PD|2.5|W|
|Thermal Resistance, Junction to Ambient (Note 6)|Steadystate|RJA|51|°C/W|
||t<10s||43||
|Thermal Resistance,Junction to Case||RJC|1.5||
|Operatingand Storage Temperature Range||TJ, TSTG|-55 to +150|°C|



- Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 

   6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 

   7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C. 

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**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

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||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|CO|Characteristic|Symbol|Min|GO|Typ|Max|I|Unit|Test Condition|
|OFF CHARACTERISTICS (Note 8)|
|Drain-Source Breakdown Voltage|BVDSS|20|—|—|V|VGS = 0V, ID = 250μA|
|a|GO|CO|CO|
|a|Zero Gate Voltage Drain Current TJ = +25°C|IDSS|eG|—|—|OO|1|µA|VDS = 20V, VGS = 0V|
|Gate-Source Leakage|IGSS|—|—|±100|nA|VGS = ±12V, VDS = 0V|
|a|GO|CO|
|pT|ON CHARACTERISTICS (Note 8)|
|Gate Threshold Voltage|VGS(TH)|0.4|0.7|1.2|V|VDS = VGS, ID = 250μA|
|—|—|4.6|VGS = 4.5V, ID = 13.5A|
|Static Drain-Source On-Resistance|RDS(ON)|mΩ|
|ee|—|—|8.7|VGS = 2.5V, ID = 13.5A|
|Diode Forward Voltage|VSD|—|0.8|1.1|V|VGS = 0V, IS = 27A|
|a|GO|CO|
|DYNAMIC CHARACTERISTICS (Note 9)|
|a|Input Capacitance|Ciss|—|5337|—|pF|
|Output Capacitance|Coss|—|560|—|pF|VDS = 10V, VGS = 0V,|
|f = 1MHz|
|Reverse Transfer Capacitance|Crss|—|505|—|pF|
|———|oe|oe eee|
|a|Gate Resistance|R|eG|g|—|0.7|GO|—|Ω|VDS = 0V, VGS = 0V, f = 1MHz|
|i|Total Gate Charge (VGS = 4.5V)|Qg|ee|—|60|—|nC|
|a|Total Gate Charge (VGS = 10V)|Qg|—|142|—|nC|
|Ge|VDS = 16V, ID = 27A|
|GO|Gate-Source Charge|Qgs|—|7|—|nC|
|a|Gate-Drain Charge|Qgd|—|11|—|nC|
|Turn-On Delay Time|tD(ON)|—|12.4|—|ns|
|a|Turn-On Rise Time|tR|—|29.8|—|ns|VGS = 5V, VDS = 10V,|
|a|Turn-Off Delay Time|tD(OFF)|Ge|—|117|—|ns|RG = 4.7Ω, ID = 13.5A|
|GO|Turn-Off Fall Time|tF|Ge|—|52|—|ns|oe|
|a|Body Diode Reverse Recovery Time|tRR|eG|—|17.8|GO|—|ns|IF = 13.5A, di/dt = 100A/μs|
|es|Body Diode Reverse Recovery Charge|QRR|ss|—|8.6|—|nC|IF = 13.5A, di/dt = 100A/μs|
|Notes:|8. Short duration pulse test used to minimize self-heating effect.|
|9. Guaranteed by design. Not subject to product testing.|

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50.0 30<br>45.0 VGS=1.5V VDS= 5V<br>40.0 VGS=2.0V 25<br>35.0 |PR VGS=2.5V See e ee | ee<br>VGS=3.0V 20<br>30.0<br>VGS=3.5V<br>25.0 | Se cemeee 15 ine<br>VGS=4.0V<br>20.0 | VGS=4.5V VGS=1.2V 10 125℃ |<br>15.0<br>85℃<br>10.0 —— VGS=10V a 5 d 150℃ p 25℃<br>5.0 VGS=1.0V<br>-55℃<br>0.0 aeZaS=ae 0 >)[E o aa<br>0 0.5 1 1.5 2 2.5 3 0 0.5 1 1.5 2 2.5<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1. Typical Output Characteristic Figure 2. Typical Transfer Characteristic<br>0.006 0.0180.02 Pdi ft fl lt<br>0.005<br>0.016 ee eee<br>0.014 eee<br>0.004 0.012 ee eee<br>VGS=2.5V<br>0.003 0.01<br>0.008<br>0.002 VGS=4.5V<br>0.006<br>ID=13.5A<br>0.004<br>0.001 0.002 e e<br>0 a 0 |ee| [| ft  eee| ft<br>0 5 10 15 20 25 30 0 2 4 6 8 10 12<br>ID, DRAIN-SOURCE CURRENT (A)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current and  Figure 4. Typical Transfer Characteristic<br>Gate Voltage<br>0.006 2.5<br>VGS= 4.5V<br>0.005<br>125℃ 150℃ 2<br>0.004 EFT T ILL VGS=4.5V, ID=13.5A<br>85℃<br>e o 1.5 i nne<br>0.003 25℃<br>SEO 1<br>-55℃<br>0.002<br>0.5 VGS=2.5V, ID=13.5A<br>0.001 SS S Be t<br>0 et | ft | 0 TEL ELLE<br>0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT(A) TJ, JUNCTION TEMPERATURE (℃)<br>Figure 5. Typical On-Resistance vs. Drain Current and   Figure 6. On-Resistance Variation with Junction<br>Junction Temperature Temperature<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>ID ID<br>(Ω) (Ω)<br>, DRAIN-SOURCE ON-RESISTANCE  , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON) DS(ON)<br>R R<br>(NORMALIZED)<br>,  DRAIN-SOURCE ON-RESISTANCE (Ω)  DRAIN-SOURCE ON-RESISTANCE<br>DS(ON),<br>R<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


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0.006 1.2<br>0.005 Pi EE 1 EER<br>0.004 VGS=2.5V, ID=13.5A 0.8<br>Le e EERE<br>0.003 0.6 ID=1mA<br>VGS=4.5V, ID=13.5A<br>0.002 BED ? 426 0.4 SS ID=250μA<br>0.001 a PE EE 0.2 i, tT ia<br>0 PET TT EE 0 PELTL EEN<br>-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (℃) TJ, JUNCTION TEMPERATURE (℃)<br>Figure 7. On-Resistance Variation with Junction  Figure 8. Gate Threshold Variation vs. Junction<br>Temperature Temperature<br>30 1000000<br>150℃<br>25 | 100000 125℃<br>10000<br>20 VGS=0V, TJ=125℃ 85℃<br>1000<br>15 P VGS=0V, TJ=150℃ E<br>100<br>10 OS | VGS=0V, TJ=85℃ —_——— 25℃<br>10 =<br>VGS=0V, TJ=25℃<br>5<br>1<br>VGS=0V, TJ=-55℃<br>0 ze 0.1<br>0 0.3 0.6 0.9 1.2 0 5 10 15 20<br>VSD, SOURCE-DRAIN VOLTAGE (V) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current Figure 10 .Typical Drain-Source Leakage Current vs.<br>Voltage<br>100000 10<br>f=1MHz<br>e S 8 ff<br>10000 Ciss<br>— — _ 6 na |4nYY]<br>1000<br>Coss<br>4 VDS=16V, ID=27A<br>Crss<br>100<br>S= == 2 S ic<br>10 = 0 Pitt<br>0 5 10 15 20 0 30 60 90 120 150<br>VDS, DRAIN-SOURCE VOLTAGE (V) Qg (nC)<br>Figure 11. Typical Junction Capacitance Figure 12. Gate Charge<br>(Ω)<br>, DRAIN-SOURCE ON-RESISTANCE  , GATE THRESHOLD VOLTAGE (V)<br>DS(ON) GS(TH)<br>R V<br>, LEAKAGE CURRENT (nA)<br>, SOURCE CURRENT (A)<br>IS IDSS<br> (V)<br>GS<br>V<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br>**----- End of picture text -----**<br>


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## **DMN2005UPS** 

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1000<br>RDS(ON)  ERR PW=100μs  att PW=10μs  tS<br>Limited PW=1μs<br>re ie<br>100 ||| ee ea |<br>a ee ee, SD. NC NE,<br>ae PW=1ms  Eee<br>10 lree| PW=10ms  EmaNl NeEll<br>etHH PW=100ms  aSaa meets<br>a PW=1s  ER<br>TJ(MAX)=150 ℃<br>1 TC=25 ℃ mani<br>Single Pulse es<br>DUT on infinite heatsink ee<br>VGS=10V<br>0.1 ni<br>0.1 1 10 100<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 13. SOA, Safe Operation Area<br>1<br>SSSpoLexoooO—e—eEEeEeeeeeeTatime see nn <aReneliee e e| smittyemmaTT a<br>ane a emmy S| et tT<br>D=0.5<br>EHHTOC oer ea Th D=0.9 a1<br>0.1 D=0.3 HLwHIMeeeLILTLartyp D=0.7 EITMLLETI LETT<br>D=0.1 HSE og A ee ee eee<br>FE feYT TT ge or<br>mr<br>D=0.05<br>ETT | | Ami | | iii | tii TTT Tri tT Pi<br>a AIT<br>sezasal A er<br>D=0.02 git! AAIITIGEATITIGATLTIGRRATLTIGE RATLTIGMATIVIOR ATI<br>0.01 eeTS et) A | a|ee<br>D=0.01 a A YA OO 0<br>EaServSEE i<br>Lm | | A | | tii | cP<br>ESI D=0.005 TCon oh RθJC (t)=r(t) * RθJC l<br>LT= [WC] EAI EEE TTI ETI RθJC=1.5 ℃ /W |<br>D=Single Pulse Duty Cycle, D=t1 /  t2<br>0.001<br>1E-06 1E-05 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, PULSE DURATION TIME (sec)<br>Figure 14. Transient Thermal Resistance<br>, DRAIN CURRENT (A)<br>ID<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

## **PowerDI5060-8** 

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Po PowerDI5060-8<br>D Dim  Min  Max  Typ<br>D1 Detail A A  0.90 1.10 1.00<br>0 (4X) A1  0.00  0.05  <br>b  0.33 0.51  0.41<br>c b2  0.200 0.350 0.273<br>A1 b3  0.40 0.80 0.60<br>c 0.230 0.330 0.277<br>E1 E | HE a<br>D  5.15 BSC<br>e D1  4.70 5.10 4.90<br>D2  3.70 4.10 3.90<br>1 0 1 (4X) D3 E  3.90 6.14.5 B30SC 4.10<br>E1  5.60 6.00 5.80<br>b (8X) e/2 E2  3.28 3.68 3.48<br>1 E3  3.99 4.39 4.19<br>L b2 (4X) e  1.27 BSC<br>D3 K G  0.51  0.71  0.61<br>K  0.51  <br>L  0.51  0.71  0.61<br>meet A E3 NP E2 | D2 | M b3 (4X) oe—— L1  0.100 0.200 0.175<br>M  3.235 4.035 3.635<br>M1 M1  1.00 1.40 1.21<br>S Detail A ta<br>Θ  10°  12°  11°<br>G : at L1 4 — Θ1  6°  8°  7°<br>All Dimensions in mm<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**PowerDI5060-8** 

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X4<br>Y2<br>in X3 T oo<br>Y3 Y1<br>anu<br>X2<br>Y5<br>Y4 X1<br>Y7<br>C — G1<br>Y6 fo7<br>Y(4x)<br>Oo X oo G :<br>**----- End of picture text -----**<br>


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Dimensions  Value (in mm)<br>C  1.270<br>G  0.660<br>G1  0.820<br>X  0.610<br>X1  4.100<br>X2  0.755<br>X3  4.420<br>X4  5.610<br>Y  1.270<br>Y1  0.600<br>Y2  1.020<br>Y3  0.295<br>Y4  1.825<br>Y5  3.810<br>Y6  0.180<br>Y7  6.610<br>**----- End of picture text -----**<br>


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**DMN2005UPS** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

- B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2020, Diodes Incorporated 

**www.diodes.com** 

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## Links

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- [Supplier page](https://es.farnell.com/diodes-inc/dmn2005ups-13/mosfet-n-ch-20v-100a-powerdi-5060/dp/3943538RL)
---

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