# Power MOSFET, N Channel, 20 V, 540 mA, 0.4 ohm, SOT-523, Surface Mount

![Product image](https://novapart.co/image/farnell:3943531RL/)

**URL**: https://novapart.co/products/DMN2004TK-7/power-mosfet-n-channel-20-v-540-ma-04-ohm-sot-523
**SKU**: DMN2004TK-7
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1580
**Stock**: 200+
**Lead Time**: 190 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 150mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOT-523 |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 540mA |
| Drain Source On State Resistance | 0.4ohm |
| Gate Source Threshold Voltage Max | 1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943531RL/)

**DMN2004TK** 

**N-CHANNEL ENHANCEMENT MODE MOSFET** 

## **Features** 

- Low On-Resistance 

- Low Gate Threshold Voltage 

- Low Input Capacitance 

- Fast Switching Speed 

- Low Input/Output Leakage 

- **ESD Protected up to 2kV** 

- **Lead Free By Design/RoHS Compliant (Note 1)** 

- **"Green" Device (Note 2)** 

## **Mechanical Data** 

   - Case: SOT-523 

   - Case Material: Molded Plastic, “Green” Molding Compound.  UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

   - Terminals: Finish ⎯ Matte Tin annealed over Alloy 42 leadframe.  Solderable per MIL-STD-202, Method 208 

   - Terminal Connections: See Diagram 

   - Weight: 0.002 grams (approximate) 

- **Qualified to AEC-Q101 standards for High Reliability** 

ESD PROTECTED TO 2kV 

**==> picture [246 x 102] intentionally omitted <==**

**----- Start of picture text -----**<br>
Drain<br>SOT-523 D<br>Gate<br>   Gate G S<br>  Protection Source<br>   Diode<br>®& al<br>Top View  Equivalent Circuit Top View<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 3) 

|**Ordering Informationg Information Information** (Note 3)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|DMN2004TK-7|SOT-523|3000/Tape &Reel|



Notes: 1. No purposefully added lead. 

2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com. 

3. For packaging details, go to our website at http://www.diodes.com. 

## **Marking Information** 

NAB = Product Type Marking Code **NAB YM** YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September) Date Code Key **Year 2006 2007 2008 2009 2010 2011 2012 Code** T U V W X Y Z ~~_F~~ **Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code** 1 2 3 4 5 6 7 8 9 O N D ~~_——————~~ 

1 of 6 **www.diodes.com** 

DMN2004TK Document number: DS30936 Rev. 5 - 2 

November 2010 © Diodes Incorporated 

**DMN2004TK** 

## **Maximum Ratings** @TA = 25°C unless otherwise specified 

|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|
|---|---|---|---|---|
||||||
|**Characteristic**||**Symbol **|**Value**|**Units**|
|Drain-Source Voltage||VDSS|20|V|
|Gate-Source Voltage||VGSS|±8|V|
|Drain Current (Note 4)<br>Steady<br>State|TA= 25°C<br>TA= 85°C|ID|540<br>390|mA|
|Pulsed Drain Current(Note 5)||IDM|1.5|A|



## **Thermal Characteristics** @TA = 25°C unless otherwise specified 

**Characteristic Symbol Value Units** Total Power Dissipation (Note 4) PD 150 mW Thermal Resistance, Junction to Ambient RθJA 833 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C **Electrical Characteristics** @TA = 25°C unless otherwise specified **Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 6)** Drain-Source Breakdown Voltage BVDSS 20 ⎯ ⎯ V VGS = 0V, ID = 10μA ⎯ 0.8 300 nA VDS = 16V, VGS = 0V Zero Gate Voltage Drain Current IDSS ⎯ 0.9 ⎯ nA VDS = 20V, VGS = 0V Gate-Source Leakage IGSS ⎯ ⎯ ±1 μA VGS = ±4.5V, VDS = 0V **ON CHARACTERISTICS (Note 6)** Gate Threshold Voltage VGS(th) 0.5 ⎯ 1.0 V VDS = VGS, ID = 250μA 0.4 0.55 VGS = 4.5V, ID = 540mA Static Drain-Source On-Resistance RDS (ON) ⎯ 0.5 0.70 Ω VGS = 2.5V, ID = 500mA 0.7 0.9 VGS = 1.8V, ID = 350mA Forward Transfer Admittance |Yfs| 200 ⎯ ⎯ ms VDS =10V, ID = 0.2A Diode Forward Voltage (Note 6) VSD 0.5 ⎯ 1.4 V VGS = 0V, IS = 115mA **DYNAMIC CHARACTERISTICS** Input Capacitance Ciss ⎯ ⎯ 150 pF Output Capacitance Coss ⎯ ⎯ 25 pF VDS = 16V, VGS = 0V f = 1.0MHz ~~See~~ Reverse Transfer Capacitance Crss ⎯ ⎯ 20 pF **SWITCHING CHARACTERISTICS** Turn-On Delay Time td(on) ⎯ 8.5 ⎯ ns Rise Time tr ⎯ 9.1 ⎯ ns VDD = 10V, RL = 47Ω, ID = 200mA, Turn-Off Delay Time td(off) ⎯ 51 ⎯ ns VGEN = 4.5V, RG = 10Ω ~~>~~ Fall Time tf ⎯ 28 ⎯ ns Notes: 4. Device mounted on FR-4 PCB. 5. Pulse width ≤10μS, Duty Cycle ≤1% 6. Short duration pulse test used to minimize self-heating effect. ~~[==]~~ DMN2004TK 2 of 6 November 2010 Document number: DS30936 Rev. 5 - 2 **www.diodes.com** © Diodes Incorporated 

**DMN2004TK** 

**==> picture [215 x 623] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.3<br>0 A |<br>0 1 2 3 4 5<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Fig. 1  Typical Output Characteristics<br>1 PT<br>S [99\—~] eeeVps= 10V |<br>BoBop sTNTN Pie<br>ze<br>Bop<br>a” ><br>got LET ETT SY<br>poet LETTEET<br>wo | | |<br>& 0.3<br>soi= 0 . 2 | | | tt tt<br>Bo 0 . 1 tT |<br>0 Pi PT Tt | ttf<br>- 75 - 50 - 25 0 25 50 75 100 125 150<br>Tch, CHANNEL TEMPERATURE (°C)<br>Fig. 3  Gate Threshold Voltage<br>vs. Channel Temperature<br>VGS = 5V<br>Pulsed<br>Fo<br>><br>a T A  = 150°C TA = 125°C TA = 85°C<br>— —<br>TA = -55°C<br>—T<br>TA = 25°C TA = 0°C TA = -25°C<br>" 2 0 . 4 0.6 0 . 8 1<br>ID, DRAIN CURRENT (A)<br>Fig. 5  Static Drain-Source On-Resistance<br>vs. Drain Current<br>, DRAIN CURRENT (A)<br>ID<br>)Ω<br>, STATIC DRAIN-SOURCE<br>ON-RESISTANCE (<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**==> picture [196 x 20] intentionally omitted <==**

**----- Start of picture text -----**<br>
VGS, GATE-SOURCE VOLTAGE (V)<br>Fig. 2  Reverse Drain Current vs. Source-Drain Voltage<br>**----- End of picture text -----**<br>


**==> picture [220 x 420] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>aean<br>es-—-—}—_Jee<br>0.5<br>ee<br>wri |asc<br>ee<br>—_<br>———— ne<br>Se<br>——,_ ><br>— Td<br>Ty = 25°C wee<br>0.1<br>meee rare<br>0 . 2 0.4 0.6 0 . 8 1 .<br>ID [,]  DRAIN CURRENT (A)<br>Fig. 4 Static Drain-Source On-Resistance<br>vs. Drain Current<br>mee {<br>pe | ee ee<br>06— \<br>0.3 a———<br>rree ee<br>es<br>ee% 2 4 6<br>)Ω<br>, STATIC DRAIN-SOURCE<br>ON-RESISTANCE (<br>DS(on)<br>R<br>) (NORMALIZED)<br>Ω<br>, STATIC DRAIN-SOURCE<br>DS(on)<br>R<br>ON-RESISTANCE (<br>**----- End of picture text -----**<br>


3 of 6 

DMN2004TK 

November 2010 © Diodes Incorporated 

**www.diodes.com** 

Document number: DS30936 Rev. 5 - 2 

**DMN2004TK** 

**==> picture [492 x 636] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ip = 540MA<br>Ee) 0.4 Tee<br>we ee ey | ber<br>Veg = 10V,<br>foe<br>Ves= 4.5V<br>0 . 3 fi ' —wee TT<br>0 . 2 0<br>0 0 . 2 0 . 4 0.6 0.8 1 1.2 - 50 = - -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT (A) T , JUNCTION TEMPERATURE (j °C)<br>Fig. 7  On-Resistance vs. Drain Current and Gate Voltage Fig. 8  Static Drain-Source, On-Resistance vs. Temperature<br>= Vos = Vi LS<br>1,000100 en ——— ee 7, = 160°C ee|__| ////An . ==emn/4/DYTy 212 5 CfffTOfff —ae<br>— pane a a A A A AY 0<br>T= 100°C T,=85cL_Tf hy /f/f | | |<br>° iii T= 25°C<br>s/s)<br>tare<br>YY<br>{ a<br>tp Py] fe 1: osc 0 . 001 ——TFERyTS<br>O t 4 6 8 10 12 14 16 18 20 | HLALL HMPee 1<br>Vos, DRAI N- SOURCE VOLTAGE (V) Vsp; DRAI N- SOURCE VOLTAGE (V)<br>Fig . 9 Drain Source Leakage Current vs . Voltage Fig . 10 Reverse Drain Current vs . Source -D rain Voltage<br>a 120<br>=rsVos a= 10V-HHtHFI 1,=-89cAZ|WAZeier TN,NT Vicf= 41MHz= OV<br>Pt 0 674 Gs<br>TTT Ae 100 Ne<br>4 Ty = 25°C mm<br>Sen /Al _ ™S p feml | Et |<br>BE an i trmare ll & 0 eee<br>0 . 1 y,,§ —= Ta = 85°C < \<br>og 4 A ee ~ 60<br>[AYAa 27 247 Ooa<br>LT AAA a<br>LA PAA LT TT S<br>AYAoNttt tt G4 WNL}K FE]<br>0 . 01, 7/7UTE 10 | EEE100 | | EET 1,000 20%Ceceect — 2 4 6 8  tj 10 12 |14 |16+S|18 20<br>ID, DRAIN CURRENT (mA) VDS, DRAIN SOURCE VOLTAGE (V)DS, DRAIN SOURCE VOLTAGE (V), DRAIN SOURCE VOLTAGE (V)<br>Fig. 11  Forward Transfer Admittance vs. Drain Current Fig. 12  Capacitance Variation<br>)Ω<br>) (NORMALIZED)<br>Ω<br>, STATIC DRAIN-SOURCE  , STATIC DRAIN-SOURCE<br>ON-RESISTANCE (<br>DS(on) DS(on)<br>R R<br>ON-RESISTANCE (<br>, REVERSE DRAIN CURRENT (A)<br>IDR<br>, DRAIN-SOURCE LEAKAGE CURRENT (nA)<br>IDSS<br>|, FORWARD TRANSFER  ADMITTANCE (S)<br>fs<br>|Y<br>**----- End of picture text -----**<br>


**==> picture [132 x 20] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDS, DRAIN SOURCE VOLTAGE (V)DS, DRAIN SOURCE VOLTAGE (V), DRAIN SOURCE VOLTAGE (V)<br>Fig. 12  Capacitance Variation<br>**----- End of picture text -----**<br>


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DMN2004TK 

November 2010 © Diodes Incorporated 

Document number: DS30936 Rev. 5 - 2 

**DMN2004TK** 

## **Package Outline Dimensions** 

**==> picture [315 x 148] intentionally omitted <==**

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||||||||
|---|---|---|---|---|---|---|
|A|SOT-523|
|Dim|Min|Max|Typ|
|A|0.15|0.30|0.22|
|B|0.75|0.85|0.80|
|B|C|C|1.45|1.75|1.60|
|D|⎯|⎯|0.50|
|G|0.90|1.10|1.00|
|=n|G|====|H|1.50|1.70|1.60|
|H|J|0.00|0.10|0.05|
|K|0.60|0.80|0.75|
|K|N|M|L|0.10|0.30|0.22|
|M|0.10|0.20|0.12|
|N|0.45|0.65|0.50|
|J|
|D|L|α|0°|8°|⎯|
|ee|
|All Dimensions in mm|

**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Y Z ~~TLEK+~~ C ~~X E facieah~~ 

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**----- Start of picture text -----**<br>
||||
|---|---|---|
|Dimensions|Value|(in mm)|
|Z|1.8|
|X|0.4|
|Y|0.51|
|C|1.3|
|E|0.7|

**----- End of picture text -----**<br>


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DMN2004TK Document number: DS30936 Rev. 5 - 2 

November 2010 © Diodes Incorporated 

**DMN2004TK** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

A.   Life support devices or systems are devices or systems which: 

1. are intended to implant into the body, or 

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2010, Diodes Incorporated 

**www.diodes.com** 

6 of 6 **www.diodes.com** 

DMN2004TK Document number: DS30936 Rev. 5 - 2 

November 2010 © Diodes Incorporated 



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- [Supplier page](https://es.farnell.com/diodes-inc/dmn2004tk-7/mosfet-n-ch-20v-0-54a-sot-523/dp/3943531RL)
---

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