# Power MOSFET, N Channel, 100 V, 11 A, 0.164 ohm, PowerDI 3333, Surface Mount

![Product image](https://novapart.co/image/farnell:3589317/)

**URL**: https://novapart.co/products/DMN10H220LFVW-7/power-mosfet-n-channel-100-v-11-a-0164-ohm-powerdi
**SKU**: DMN10H220LFVW-7
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1040
**Stock**: 10+
**Lead Time**: 106 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.4W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PowerDI 3333 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 11A |
| Drain Source On State Resistance | 0.164ohm |
| Gate Source Threshold Voltage Max | 2.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3589317/)

**DMN10H220LFVW** 

**100V N-CHANNEL ENHANCEMENT MODE MOSFET PowerDI3333-8** 

## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**BVDSS**|**RDS(ON) Max**|**ID**<br>**TC = +25°C**|
|100V|222mΩ @ VGS= 10V|11A|
||270mΩ @ VGS= 4.5V|10A|



## **Features and Benefits** 

- 100% Unclamped Inductive Switch (UIS) Test in Production 

- Low On-Resistance 

- Low Input Capacitance 

- Fast Switching Speed 

- Low Input/Output Leakage 

- Wettable Flank for Improved Optical Inspections 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative.** 

**https://www.diodes.com/quality/product-definitions/** 

## **Description and Applications** 

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) yet maintain superior switching performance, making it ideal for high-efficiency power management applications. 

## **Mechanical Data** 

   - Case: PowerDI[®] 3333-8 

   - Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

- Load Switch 

- Terminal Connections Indicator: See Diagram 

- Terminals: Finish  Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 

- Weight: 0.072 grams (Approximate) 

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PowerDI3333-8 (SWP) (Type UX)<br>**----- End of picture text -----**<br>


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D<br>G<br>S<br>Equivalent Circuit<br>**----- End of picture text -----**<br>


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D<br>D<br>D<br>D<br>G<br>G<br>S<br>S<br>S S<br>Top View Pin1  TY Bottom View Equivalent Circuit<br> Information (Note 4)<br>Part Number Case Packaging<br>DMN10H220LFVW-7  PowerDI3333-8 (SWP) (Type UX) 2,000/Tape & Reel<br>DMN10H220LFVW-13  PowerDI3333-8 (SWP) (Type UX) 3,000/Tape & Reel<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 

2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and 

Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. 

## **Marking Information** 

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1H2<br>YYWW<br>**----- End of picture text -----**<br>


1H2 = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 20 = 2020) WW = Week Code (01 to 53) 

_PowerDI is a registered trademark of Diodes Incorporated._ 

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**DMN10H220LFVW** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|
||||||
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Drain-Source Voltage||VDSS|100|V|
|Gate-Source Voltage||VGSS|±20|V|
|Continuous Drain Current (Note 6) VGS= 10V|TC= +25°C<br>TC= +70°C|ID|11<br>9|A|
|Maximum Body Diode Forward Current (Note 6)||IS|11|A|
|Pulsed Drain Current (10µs Pulse, DutyCycle = 1%)||IDM|44|A|
|Pulsed Source Current (10µs Pulse, Duty Cycle = 1%)||ISM|44|A|
|Avalanche Current (Note 7)|L = 0.1mH|IAS|4.7|A|
|Avalanche Energy(Note 7)|L = 0.1mH|EAS|1.1|mJ|



## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Thermal Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Thermal Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|
||||||
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Total Power Dissipation (Note 5)|TA= +25°C|PD|2.4|W|
|Thermal Resistance, Junction to Ambient (Note 5)||RθJA|53|°C/W|
|Total Power Dissipation (Note 6)|TC= +25°C|PD|41|W|
|Thermal Resistance, Junction to Case (Note 6)||RθJC|3.02|°C/W|
|Operating and Storage Temperature Range||TJ,TSTG|-55 to +150|°C|



## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|---|
||||||||
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|**Test Condition**|
|**OFF CHARACTERISTICS(Note 8)**<br>~~oO~~|||||||
|Drain-Source Breakdown Voltage<br>~~oO~~|BVDSS|100|—|—|V|VGS= 0V, ID= 250µA|
|Zero Gate Voltage Drain Current<br>~~oO~~|IDSS|—|—|1|µA|VDS= 100V, VGS= 0V|
|Gate-Source Leakage<br>~~oO~~|IGSS|—|—|100|nA|VGS= ±20V, VDS= 0V|
|**ON CHARACTERISTICS(Note 8)**<br>~~oO~~<br>~~GO~~<br>~~COCO~~|||||||
|Gate Threshold Voltage<br>~~oO~~<br>~~GG~~|VGS(TH)<br>~~GG~~|1<br>~~GG~~|—<br>~~GG~~<br>~~GO~~|2.5<br>~~GG~~<br>~~CO~~|V<br>~~GG~~<br>~~CO~~|VDS= VGS, ID= 250µA<br>~~GG~~<br>~~CO~~|
|Static Drain-Source On-Resistance<br>~~ee~~|RDS(ON)<br>~~ee~~|—<br>~~ee~~|164<br>~~GO~~<br>~~ee~~|222<br>~~CO ~~<br>~~ee~~|mΩ<br> ~~CO~~<br>~~ee~~|VGS= 10V, ID= 2A<br>~~CO~~<br>~~ee~~|
|||—<br>~~ee~~<br>~~CGO~~|197<br>~~ee~~<br>~~CGO~~|270<br>~~ee~~<br>~~CGO~~|mΩ<br>~~ee~~<br>~~OO~~|VGS= 4.5V, ID= 1A<br>~~ee~~<br>~~OO~~|
|Diode Forward Voltage<br>~~Ge~~|VSD<br>~~Ge~~|—<br>~~Ge~~<br>~~CGO~~|0.8<br>~~Ge~~<br>~~CGO~~|1.3<br>~~Ge~~<br>~~CGO~~|V<br>~~Ge~~<br>~~OO~~|VGS= 0V, IS= 2A<br>~~Ge~~<br>~~OO~~|
|**DYNAMIC CHARACTERISTICS(Note 9)**<br>~~CGO OO~~|||||||
|Input Capacitance<br>~~pO~~|Ciss|—|366|—|pF|VDS= 50V, f = 1MHz,<br>VGS= 0V|
|Output Capacitance|Coss|—|16|—|||
|Reverse Transfer Capacitance|Crss|—|12|—|||
|Gate Resistance<br>~~——~~|RG|—|2.4|—<br>~~e~~|Ω<br>~~e~~|VDS= 0V, VGS= 0V, f = 1MHz<br>~~ee~~|
|Total Gate Charge(VGS= 4.5V)<br>~~DO~~<br>~~——~~|Qg<br>~~DO~~|—<br>~~DO~~|3.7<br>~~DO~~|—<br>~~DO~~<br>~~e~~|nC<br>~~e~~|VDD= 50V, ID= 1.6A<br>~~ee~~|
|Total Gate Charge(VGS= 10V)<br>~~——~~|Qg|—|6.7|—<br>~~e~~|||
|Gate-Source Charge<br>~~——~~|Qgs|—|1.3|—<br>~~e~~|||
|Gate-Drain Charge<br>~~——~~|Qgd|—|2.0|—<br>~~e~~|||
|Turn-On Delay Time<br>~~——~~<br>~~DO~~|tD(ON)<br>~~DO~~|—<br>~~DO~~|6.2<br>~~DO~~|—<br>~~e~~<br>~~DO~~|ns<br>~~e~~|VDD= 50V, VGS= 4.5V,<br>RG= 6.8Ω, ID= 1.0A<br>~~ee~~|
|Turn-On Rise Time<br>~~——~~<br>~~pO~~|tR|—|8.7|—<br>~~e~~|||
|Turn-Off Delay Time|tD(OFF)|—|7.4|—|||
|Turn-Off Fall Time|tF|—|4.2|—|||
|Body Diode Reverse Recovery Time<br>~~ee~~|tRR<br>~~ee~~|—<br>~~ee~~|20<br>~~ee~~|—<br>~~ee~~|ns<br>~~ee~~|IS= 1.1A, dI/dt = 100A/μs<br>~~ee~~|
|BodyDiode Reverse RecoveryCharge<br>~~ee~~|QRR<br>~~ee~~|—<br>~~ee~~|11<br>~~ee~~|—<br>~~ee~~|nC<br>~~ee~~||



Notes:      5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate. 

6. Thermal resistance from junction to soldering point (on the exposed drain pad). 

7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C. 

8. Short duration pulse test used to minimize self-heating effect. 

9. Guaranteed by design. Not subject to product testing. 

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10.0 5<br>9.0 eee VGS = 6.0V  Ae VDS = 5V<br>8.0 any 4enp>— 4 —<br>7.0 VGS = 10V VGS = 4.5V<br>6.0 OF fo KA) 3 eee |<br>5.0 f i<br>4.0 a) Asean VGS = 4.0V 2 il<br>3.0 VGS = 3.8V<br>2.0 f = 1 ft TJ = 150℃ TJ = 85℃<br>TJ = 25℃<br>1.0 f= VGS = 3.3V VGS = 3.5V TJ = 125℃ AIK.<br>TJ = -55℃<br>0.0 _= _—— —— 0 Dp<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 1 2 3 4 5 6<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1. Typical Output Characteristic Figure 2. Typical Transfer Characteristic<br>0.5 0.9<br>0.45 Pi tt tt tty yl 0.8 Beae<br>0.4 COOLEY 0.7 Sn eee<br>0.35 VGS = 4.5V 0.6 ID = 2A<br>0.3 Peer Tyr on De en<br>| Je 0.5 TC E<br>0.25 E e ID = 1A EL<br>0.4<br>0.2 HCEER oH C O RE<br>0.3<br>0.15 ae EE AR CO A<br>VGS = 10V 0.2<br>0.1<br>0.050 KERFCCC ER a  EEEEEEe EE 0.10 aCSRSCOCCEEGHeeeeee EESS<br>0 1 2 3 4 5 6 7 8 9 10 0 2 4 6 8 10 12 14 16 18 20<br>ID, DRAIN-SOURCE CURRENT (A)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current  Figure 4. Typical Transfer Characteristic<br>and Gate Voltage<br>1.2 2.4<br>VGS = 10V 2.2<br>1 VGS = 10V, ID = 2A<br>2<br>TJ = 150℃ f 1.8 eee)<br>0.8<br>SE E AS 1.6 Te ae<br>TJ = 125℃<br>0.6 1.4<br>SL 1.2 Off<br>0.4 TJ = 85℃ 1<br>e es AL<br>0.8<br>0.2 TJ = 25℃ VGS = 4.5V, ID = 1A<br>Peer eT 0.6 > Aan<br>TJ = -55℃<br>0 ee 0.4 ene<br>0 1 2 3 4 5 6 7 8 9 10 -50 -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT (A) TJ, JUNCTION TEMPERATURE (℃)<br>Figure 5. Typical On-Resistance vs. Drain Current and  Figure 6. On-Resistance Variation with Junction<br>Junction Temperature Temperature<br>, DRAIN CURRENT (A)ID , DRAIN CURRENT (A)ID<br>, DRAIN-SOURCE ON-RESISTANCE (Ω) , DRAIN-SOURCE ON-RESISTANCE (Ω)<br>DS(ON) DS(ON)<br>R R<br>(NORMALIZED)<br>, DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN-SOURCE ON-RESISTANCE (Ω)<br>DS(ON)<br>DS(ON) R<br>R<br>**----- End of picture text -----**<br>


Figure 5. Typical On-Resistance vs. Drain Current and Junction Temperature 

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0.45<br>0.4 TTL,<br>0.35<br>TOCTT Te<br>0.3<br>Sonne<br>VGS = 4.5V, ID = 1A<br>0.25<br>0.2 poSae-cene<br>0.15<br>VGS = 10V, ID = 2A<br>0.1 =~ 2eene<br>0.05 e e<br>0<br>CEP Peer<br>-50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (℃)<br>Figure 7. On-Resistance Variation with Junction<br>Temperature<br>20<br>VGS = 0V<br>15 |<br>10<br>H<br>TJ = 150℃ TJ = 85℃<br>5 OR<br>TJ = 125℃ hy TJ = 25℃<br>TJ = -55℃<br>0 ZS)<br>0 0.3 0.6 0.9 1.2 1.5<br>VSD, SOURCE-DRAIN VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current<br>10<br>8<br>6<br>4<br>VDS = 50V, ID = 1.6A<br>2<br>0<br>0 2 4 6 8 10<br>Qg (nC)<br>Figure 11. Gate Charge<br>, DRAIN-SOURCE ON-RESISTANCE (Ω)<br>DS(ON)<br>R<br>, SOURCE CURRENT (A)<br>IS<br> (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


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3<br>ID = 1mA<br>2.5<br>tt tt<br>2<br>o e<br>ID = 250μA<br>1.5<br>oo :><br>1<br>Petit yy<br>0.5<br>PTT UTE<br>0<br>PTET LLL<br>-50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE (℃)<br>Figure 8. Gate Threshold Variation vs. Junction<br>Temperature<br>, GATE THRESHOLD VOLTAGE (V)<br>GS(TH)<br>V<br>**----- End of picture text -----**<br>


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10000<br>f = 1MHz<br>Po<br>1000 o o<br>Ciss<br>ee<br>100<br>Coss eee ee eee<br>10 Wane ee eeen<br>Crss<br>Se<br>1 PF | | tT | tT<br>0 20 40 60 80 100<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 10. Typical Junction Capacitance<br>1000<br>R<br>DS(ON)<br>Limited<br>100 — PW = 100µs Lt PW = 10µs<br>PW = 1µs<br>10<br>PW = 1ms<br>1 PW = 10ms<br>TJ(Max) = 150 ℃ PW = 100ms<br>TC = 25 ℃<br>0.1 Single Pulse PW = 1s<br>DUT on Infinite<br>Heatsink<br>VGS = 10V<br>0.01<br>1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 12. SOA, Safe Operation Area<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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**DMN10H220LFVW** | 

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Iu coRPORATE D®<br>**----- End of picture text -----**<br>


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1 pe se en ee a a<br>Sa<br><9mee D=0.9 TTaee ne<br>Pt eoANll D=0.7 PTHE T ETTIPTPI<br>aN D=0.5 PTE PETIT TTT ETI TTI TEETH]<br>Se AeCa D=0.3 TA TIT EAT TET PETIT ETT<br>D=0.1<br>0.1 OUiN<br>“UeHpHA SST D=0.05 NAIM | LI LIM ELLTTEELT<br>~ fet No Poo<br>| VAP| JgNIN TNETT D=0.02 a PTTee TPPn)<br>Y/YNSli D=0.01 CEIWTPETTITTETT ETIPTTTTT PIE EIT TE ETT<br>AuTi) D=0.005 VMTN TUTE TET EET TIE TTT TET ETT<br>D=Single Pulse<br>0.01<br>|<br>POT n n<br>aaPE ETT ET PTPTIre ee | ||<br>RθJC(t) = r(t) * RθJC<br>RθJC = 3.02℃/W<br>Duty Cycle, D = t1 / t2<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 100000 1000000<br>t1, PULSE DURATION TIME (sec)<br>Figure 13. Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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**DMN10H220LFVW** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

## **PowerDI3333-8 (SWP) (Type UX)** 

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D<br>A<br>D1 A1<br>PowerDI3333-8 (SWP)<br>(Type UX)<br>Dim  Min  Max  Typ<br>A  0.75 0.85 0.80<br>E1 E A1  0.00 0.05 --<br>==== b  0.25 0.40 0.32<br>c  0.10 0.25 0.15<br>D  3.20 3.40 3.30<br>4 0 — D1  2.95 3.15 3.05<br>D2  2.30 2.70 2.50<br>Detail A c E  3.20 3.40 3.30<br>E1  2.95 3.15 3.05<br>Detail A E2  1.60 2.00 1.80<br>L<br>E3  0.95 1.35 1.15<br>E4  0.10 0.30 0.20<br>E3 E4 e    0.65<br>E2 k  0.50 0.90 0.70<br>L  0.30 0.50 0.40<br>0.050 θ  0° 12° 10°<br>D2 0.150 All Dimensions in mm<br>k<br>L<br>‘ee se S—=<br>e<br>b acs<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**PowerDI3333-8 (SWP) (Type UX)** 

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X3<br>X1<br>X2<br>Y1<br>Y2<br>Y5 Y4<br>Y6<br>= X4<br>Y3<br>Y<br>X<br>“ C qu<br>**----- End of picture text -----**<br>


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Dimensions Value (in mm)<br>C  0.650<br>X  0.420<br>X1  0.420<br>X2  0.230<br>X3 2.600<br>X4  3.500<br>Y  0.700<br>Y1  0.550<br>Y2  1.650<br>Y3  0.600<br>Y4  2.450<br>Y5 0.400<br>Y6  3.700<br>**----- End of picture text -----**<br>


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## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

- B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2020, Diodes Incorporated 

**www.diodes.com** 

7 of 7 **www.diodes.com** 

DMN10H220LFVW Document number: DS42452  Rev. 2 - 2 

June 2020 © Diodes Incorporated 



## Links

- [View this product on Novapart](https://novapart.co/products/DMN10H220LFVW-7/power-mosfet-n-channel-100-v-11-a-0164-ohm-powerdi)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmn10h220lfvw-7/mosfet-n-ch-100v-11a-powerdi-3333/dp/3589317)
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