# Filter, Common Mode, 80 ohm, 0.1 A, DLP11TB Series, 1 mm x 1.25 mm x 0.3 mm
**URL**: https://novapart.co/products/DLP11TB800UL2L/filter-common-mode-80-ohm-01-a-dlp11tb-series-1-mm
**SKU**: DLP11TB800UL2L
**Manufacturer**: MURATA
**Category**: Passive Components || EMC / RFI Suppression || Common Mode Chokes / Filters || SMD Common Mode Chokes / Filters
**Price**: €0.1780
**Stock**: 10+
## Specifications
| Parameter | Value |
|---|---|
| Impedance | 80ohm |
| Product Range | DLP11T |
| Product Width | 1mm |
| Product Height | 0.3mm |
| Product Length | 1.25mm |
| Dc Current Rating | 100mA |
| Common Mode Filter Case | 1.25mm x 1mm x 0.3mm |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2840094/)
Reference Only
Spec No. JEFL243E-0011G-01 P1/9
## **Chip Common Mode Choke Coil DLP11TB800UL2** □ **Reference Specification**
## **1.Scope**
This reference specification applies to Chip Common Mode Choke Coil DLP11TB series.
## **2.Part Numbering**
(ex.) DL P 11 T B 800 U L 2 L
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
(1) Chip Common Mode Choke Coil
(2) Structure (P : Film Type)
(3) Dimension (L × W)
- (4) Magnetic Shield Type Thickness (height) 0.3mm
- (6) Common mode Impedance (Typ. at 100MHz)
(7) Circuit U : Characteristic Impedance 90 Ω system
- (8) Features
- (9) Number of Line
- (10) Packaging Code L : Taping / B : Bulk
(5) Category: Cut off Frequency 8GHz(Typ.)
## **3.Rating**
|**3.Rating**||||||||||
|---|---|---|---|---|---|---|---|---|---|
|Customer
Part Number|Murata Part Number|Common
Mode Impedance
(at 100MHz,
Under Standard
Testing Condition)|Impedance
Characteristics
between signal lines
Z0
(TDR@50ps)|
Differential
mode to
common mode
conversion
characteristic
(Scd21)
@2.5GHz|Rated
Voltage
V(DC)|Withstanding
Voltage
V(DC)|
Rated
Current|DC
Resistance|Insulation
Resistance|
||DLP11TB800UL2L|80Ω+/-25%|90Ω
+/-15Ω|-40dB
(typ.)|5|12.5|100mA|1.5Ω+/-25%|100MΩ
min.|
||DLP11TB800UL2B|||||||||
Operating Temperature : -40 to +85 ° C Storage Temperature : -40 to +85 ° C
## **4. Standard Testing Conditions**
Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
## **5.Style and Dimensions**
**==> picture [280 x 224] intentionally omitted <==**
**----- Start of picture text -----**
(1) (2)
(Top View)
(4) (3)
0.30 ± 0.10
(Side View)
:Electrode
(Bottom View)
(in : mm)
0.25 +0.10/ - 0.05
1.25 [±] 0.10
0.3 ± 0.05
1.00 ± 0.10 0.55 ± 0.10
**----- End of picture text -----**
## ■ Equivalent Circuits
**==> picture [154 x 149] intentionally omitted <==**
**----- Start of picture text -----**
(1) (2)
(4) (3)
No polarity
■ Unit Mass (Typical value)
0.002g
**----- End of picture text -----**
## **6.Marking**
No Marking.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243E-0011G-01 P2/9
## **7. Electrical Performance**
|No.|Item|Specification|Test Method|
|---|---|---|---|
|7.1|Common Mode
Impedance|Meet item 3.|Measuring Frequency : 100±1MHz (ref.item 10.)
Measuring Equipment :KEYSIGHT4291A or
the equivalents
(In case of doubt, the heat treatment
(200°C,about 10minutes)shallbe applied.|
|7.2|Withstanding
Voltage|Products shall not be damaged.|Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max.(ref.item 10.)|
|7.3|DC Resistance
(Rdc)|Meet item 3.|Measuring current : 100mA max.(ref.item 10.)|
|7.4|Insulation Resistance
(I.R.)||Measuring voltage : Rated Voltage
Measuring time : 1 minute max. (ref.item 10.)|
|7.5|Impedance
Characteristics
betweensignal lines (Z0)||Network Analyzer
Measuring Equipment : E5071B or the
equivalents (ref.item 10.)|
|7.6
|Differential mode to
common mode conversion
characteristics(Scd21)||Network Analyzer
Measuring Equipment : E5071B or the
equivalents(ref.item 10.)|
## **8.Mechanical Performance**
|No.|Item|Specification|Specification|Test Method|
|---|---|---|---|---|
|8.1|Appearance and
Dimensions|Meet item 5.||Visual Inspection and measured with Slide Calipers.|
|8.2|Solderability|The electrodes shall be at least
95% covered with new solder
coating.||Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C, 1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±3°C
Immersion Time : 3±1 s
Immersion and emersion rates : 25 mm / s|
|8.3|Resistance to
Soldering Heat
Drop
Vibration|Meet Table 1.
Table 1
Appearance
Common Mode
Impedance
Change
I.R.
DC Resistance
Change|No damaged
within±20%
100MΩmin.
within±30%|Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C ,1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 10±1 s
Immersion and emersion rates : 25 mm / s
Then measured arter exposure in the room condition
for 4 to 48 hours.|
|8.4||||It shall be dropped on concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 3 times|
|8.5||||It shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions.|
|8.6|Bending
Strength|Meet Table 2.
Table 2
Appearance
DC Resistance
Change|No damaged
within±30%|Substrate : (t =1.0 mm).
Deflection : 2 mm
Speed of Applying Force : 0.5 mm / s
Keeping time : 30 s
45
R230
F
Deflection
45
Product
Pressure jig|
MURATA MFG.CO.,LTD
## Reference Only
Spec No. JEFL243E-0011G-01 P3/9
## **9.Environmental Performance** (Products shall be soldered on the glass-epoxy substrate)
|No.|Item|Specification|Test Method|
|---|---|---|---|
|9.1|Temperature
Cycle|Meet Table 1.|1 Cycle
Step 1
-40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2
Ordinary Temp. / within 3 min
Step 3
+85(+3°C,-0°C) / 30(+3,-0) min
Step 4
Ordinary Temp. / within 3 min
Total of 100 cycles.
Then measured after exposure in the room condition
for 4 to48hours.|
|9.2|Humidity||Temperature : 40±2°C
Humidity : 90 to 95 % (RH)
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.|
|9.3|Heat life||Temperature : 85±2°C
Test Voltage : 2 times for Rated Voltage
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to48hours. (ref. Item 10.)|
|9.4|Cold Resistance||Temperature : -40± 2°C
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.|
## **10. Terminal to be Tested.**
When measuring and supplying the voltage,the following terminal is applied.
**==> picture [386 x 205] intentionally omitted <==**
**----- Start of picture text -----**
No. Item Terminal to be Tested
10.1 Impedance Characteristics PORT 1 PORT 2
between signal lines
Differential mode to common PORT 3 PORT 4
mode conversion characteristic
10.2 Common Mode
Impedance ＩＮ ＯＵＴ
10.3 Withstanding Voltage ＩＮ
Insulation Resistance
Heat Life ＯＵＴ
10.4 DC Resistance ＩＮ ＯＵＴ
ＩＮ ＯＵＴ
**----- End of picture text -----**
## **11. Measuring method for common mode impedance.**
Measured common mode impedance may be included measurement error due to stray capacitance, residual inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go Bo.
(2) Measure impedance of the fixture(shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance Z using the formula below.
Z = (Rx[2] +Xx[2] )[1/2]
Where
**==> picture [170 x 63] intentionally omitted <==**
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243E-0011G-01 P4/9
## **12. P.C.B., Flux, Solder and Soldering condition**
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the case of being specified special condition.
## **13.Impedance Frequency Characteristics(Typical)**
**==> picture [476 x 116] intentionally omitted <==**
**----- Start of picture text -----**
1k 0 - 10
- 5 - 20
Differential Mode (Sdd21) - 30
100 - 10
- 40
- 15
- 50
10 - 20 - 60
- 25 Common Mode (Scc21) - 70
1 10M 100M 1G - 30 100M 1G - 80 100M 1G
Freq[Hz] Freq[Hz] Freq[Hz]
Zc[Ω]
Scd21[dB]Scd12[dB]
Sdd21,Scc21[dB]
**----- End of picture text -----**
**Common Mode Impedance Insertion Loss** Differential mode to common mode conversion characteristic
## **14. Specification of Packaging**
## **14.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)**
**==> picture [469 x 149] intentionally omitted <==**
**----- Start of picture text -----**
Sprocket Hole φ 1.5 [+0.1] -0 4.0±0.1 Cavity 0.25±0.05
* Dimension of the Cavity is measured
at the bottom side.
(in:mm)
4.0±0.1 2.0±0.05 1.10±0.051.2±0.1 . 0.98±0.050.45+/-0.05
Direction of feed
1.75±0.1
3.5±0.05
8.0±0.2
1.4±0.1
1.35+/-0.05
**----- End of picture text -----**
## **14.2 Specification of Taping**
(1)Packing quantity(Standard quantity) 5000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3)Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)Spliced point
The cover tape have no spliced point.
- (5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept.
## **14.3 Pull Strength of Plastic Tape**
|Plastic|Tape|5N min.|
|---|---|---|
|Cover|Tape|10N min.|
## **14.4 Peeling off force of Cover Tape**
0.2 to 0.7N(Minimum value is Typical) Speed of Peeling off : 300 mm/min.
165 to 180 degree F Cover tape Plastic tape
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243E-0011G-01 P5/9
## **14.5 Dimensions of Leader-tape, Trailer and Reel**
**==> picture [368 x 136] intentionally omitted <==**
**----- Start of picture text -----**
Trailer Leader
2.0±0.5 160 min.
Label 190 min. 210 min.
Empty tape Top tape
φ 13.0±0.2
φ 60± 10
9± 10 φ 21.0±0.8 Direction of feed
13±1.4 (in:mm)
φ 180± 03
**----- End of picture text -----**
## **14.6 Marking for reel**
Customer part number **,** MURATA part number, Inspection number( ∗ 1), RoHS Marking( ∗ 2), Quantity, etc ∗ 1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No.
∗ 2) « Expression of RoHS Marking » ROHS – Y (△)
(1) (2)
- (1) RoHS regulation conformity parts.
- (2) MURATA classification number
## **14.7 Marking for Outside package**
Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS Marking ( ∗ 2), Quantity, etc
## **14.8 Specification of Outer Case**
|||||
|---|---|---|---|
|Outer
W
186|Case Dimensions
(mm)||Standard Reel Quantity in Outer Case
(Reel)|
||D|H||
||186|93|5|
|Above Outer Case size is typical. It depends on a quantity of an order.||||
## **15.** △ **! Caution**
## **15.1 Mounting Direction**
Mount products in right direction.
Wrong direction which is 90 ° rotated from right direction causes not only open or short circuit but also flames or other serious trouble.
**==> picture [203 x 56] intentionally omitted <==**
**----- Start of picture text -----**
Ｚ Ｚ
right direction wrong direction
**----- End of picture text -----**
## **15.2 Limitation of Applications**
Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life,body or property.
(1) Aircraft equipment
(2) Aerospace equipment
- (6) Transportation equipment (vehicles, trains, ships, etc.)
- (7) Traffic signal equipment
- (3) Undersea equipment (8) Disaster prevention / crime prevention equipment
- (4) Power plant control equipment
- (9) Data-processing equipment
- (5) Medical equipment (10) Applications of similar complexity and / or reliability requirements comparable to the applications listed in the above.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243E-0011G-01 P6/9
## **16. Notice**
This product is designed for solder mounting. (reflow soldering only) Please consult us in advance for applying other mounting method such as conductive adhesive.
## **16.1 Flux and Solder**
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance.
## **16.2 Assembling**
Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max.
## **16.3 Resin coating**
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set.
## **16.4 Attention regarding P.C.B. bending**
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［ Products direction ］
> a Products shall be location the sideways
> b Direction (Length : a D *1|
|(2)Add slits in the board separationpart.|A > B|
|(3)Keepthe mounting position of the component awayfrom the board separation surface.|A > C|
**==> picture [418 x 72] intentionally omitted <==**
**----- Start of picture text -----**
C
Perforation
B *1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
D
A If a Cutting Disc is used, stress will be diagonal to the PCB, therefore
Slit
A > D is invalid.
**----- End of picture text -----**
## (3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
**==> picture [98 x 8] intentionally omitted <==**
**----- Start of picture text -----**
Screw Hole Recommended
**----- End of picture text -----**
MURATA MFG.CO.,LTD
~~PT~~ Reference Only
Spec No. JEFL243E-0011G-01 P7/9
**==> picture [366 x 250] intentionally omitted <==**
**----- Start of picture text -----**
Portion of
Perforation
16.5 Attention Regarding P.C.B. Design ×
P.C.B .
< The Arrangement of Products > ○
P.C.B. shall be designed so that products are ○
far from the portion of perforation. Product
Portion of ×
Perforation
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the P.C.B . ○ SS ×
case of P.C.B. separation.
Product
Products shall not be arranged on the line Hole
an |
of a series of holes when there are big holes in P.C.B.
(Because the stress concentrate on the line of holes.) we]
Pick-up nozzle
Support pins shall be set under P.C.B . Product
to prevent causing a warp to P.C.B.
during placing the products on the other side of P.C.B.
P.C.B.
ee
**----- End of picture text -----**
## **16.5 Attention Regarding P.C.B. Design**
< The Arrangement of Products >
The portion of perforation shall be designed
as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation.
of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.)
## < Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other side of P.C.B.
## < P.C.B. Separation >
## Support pin
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
## **16.6 Attention Regarding P.C.B. Mounting**
In case of mounting by use of mounting machine, please choose nozzle which can pick up components of 1005 size or the equivalents.
## **16.7 Standard Land Dimensions**
**==> picture [245 x 99] intentionally omitted <==**
**----- Start of picture text -----**
0.55
(1) (2)
(4) (3)
*(1)(2)(3)(4)Indicates terminal number
Resist
Copper foil pattern
1.55 No pattern
(in : mm)
0.30
0.85 0.55
**----- End of picture text -----**
## **16.8 Soldering(Reflow soldering)**
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality.
**==> picture [303 x 205] intentionally omitted <==**
**----- Start of picture text -----**
Temp. 260℃
( ℃)
245℃±3℃
230℃
220℃
Limit Profile
180
150
30s ～ 60s Standard Profile
60s max.
Ld 90s±30s Time ( s)
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C、10s
Cycle of reflow 2 times 2 times
**----- End of picture text -----**
MURATA MFG.CO.,LTD
~~PO~~ Reference Only Spec No. JEFL243E-0011G-01 P8/9
**==> picture [434 x 59] intentionally omitted <==**
**----- Start of picture text -----**
Standard printing pattern of solder paste
• Standard thickness of the solder paste should be around 100µm.
• Use the solder paste printing pattern of the right pattern. L | si
• For the resist and copper foil pattern, use standard land dimensions.
• Use Sn-3.0Ag-0.5Cu solder. 0.50 0.55 0.50 (in：mm)
0.55
0.30
**----- End of picture text -----**
## (1) Standard printing pattern of solder paste
- (2) Reworking with Soldering iron
- The following conditions shall be strictly followed when using a soldering iron after being mounted by reflow soldering.
- Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
- Tip temperature: 380°C max. · Tip diameter:φ3mm max.
- Soldering time : 3(+1,-0) seconds. · Times : 2times max.
- Do not touch the products directly with the tip of the soldering iron.
- (3) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
**==> picture [373 x 80] intentionally omitted <==**
**----- Start of picture text -----**
Upper Limit
Recommendable Upper Limit
‘ie af Recommendable
ee t
1/3 T ≦ ｔ ≦ T （T : Chip thickness）
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
**----- End of picture text -----**
## **16.9 Cleaning Conditions**
Products shall be cleaned on the following conditions.
- (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
- (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B..
- ・ Power : 20W/ l max. ・ Frequency : 28kHz to 40kHz ・ Time : 5 minutes max.
- (3) Cleaner
1. Alternative cleaner • Isopropyl alcohol (IPA)
2. Aqueous agent • PINE ALPHA ST-100S
- (4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
- (5) Other cleaning Please contact us.
## **16.10 Handling of a substrate**
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
## **16.11 Operating Environment**
Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use.
- (1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
- (2) in the atmosphere where liquid such as organic solvent, may splash on the products.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243E-0011G-01 P9/9
## **16.12 Storage Conditions**
- (1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
- (2) Storage environment condition
- Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity : 15 to 85% relative humidity
No rapid change on temperature and humidity
- Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to
- prevent the following deterioration.
Poor solderability due to the oxidized electrode.
- Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
- Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
- Products should be stored under the airtight packaged condition.
- (3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
## **17.** △ **! Note**
- (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product.
- (2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD
## Links
- [View this product on Novapart](https://novapart.co/products/DLP11TB800UL2L/filter-common-mode-80-ohm-01-a-dlp11tb-series-1-mm)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/murata/dlp11tb800ul2l/common-mode-filter-80-ohm-0-1a/dp/2840094)
---
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