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DD-160128FC-2B
Graphic OLED, 160 x 128, RGB, 2.8V, Parallel, Serial, 39.9mm x 34mm, -20 °C
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: DENSITRON
- Product type: Graphic OLED Displays
- Resolution: 160 x 128
- Module Size: 39.9mm x 34mm
- Logic Voltage: 2.8V
- Product Range: OLED Display Modules
- Interface Type: Parallel, Serial
- Display Appearance: RGB
- Display Construction: TAB
- Operating Temperature Max: 70°C
- Operating Temperature Min: -20°C
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 18.53 € |
| Current stock | 200+ |
| Lead time | 7 days |
Datasheet
## **OLED DISPLAY MODULE**
## **Product Specification**
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CUSTOMER Standard<br>PRODUCT<br>DD-160128FC-2B<br>NUMBER<br>CUSTOMER Date<br>APPROVAL<br>**----- End of picture text -----**<br>
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INTERNAL APPROVALS<br>Product Mgr Doc. Control Electr. Eng<br>Bazile Bazile Luo<br>Peter Peter Luo<br>Date: 15 Oct 10 Date: 15 Oct 10 Date: 15 Oct 10<br>**----- End of picture text -----**<br>
DD-160128FC-2B REV. E Product No. Page 1 / 33 ~~2 eee ee |[|]~~ Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **TABLE OF CONTENTS**
|**1**|**1**|**MAIN FEATURES .......................................................................................................... 4**|**MAIN FEATURES .......................................................................................................... 4**|
|---|---|---|---|
|**2**||**MECHANICAL SPECIFICATION ............................................................................... 5**||
|||2.1|MECHANICAL CHARACTERISTICS .................................................................... 5|
|||2.2|MECHANICAL DRAWING ..................................................................................... 6|
|**3**||**ELECTRICAL SPECIFICATION ................................................................................. 7**||
|||3.1|ABSOLUTE MAXIMUM RATINGS ....................................................................... 7|
|||3.2|ELECTRICAL CHARACTERISTICS ...................................................................... 8|
|||3.3|INTERFACE PIN ASSIGNMENT ............................................................................ 9|
|||3.4|BLOCK DIAGRAM ................................................................................................ 11|
|||3.5|TIMING CHARACTERISTICS .............................................................................. 12|
|**4**||**OPTICAL SPECIFICATION ....................................................................................... 18**||
|||4.1|OPTICAL CHARACTERISTICS ............................................................................ 18|
|**5**||**FUNCTIONAL SPECIFICATION .............................................................................. 19**||
|||5.1|COMMANDS .......................................................................................................... 19|
|||5.2|POWER UP/DOWN SEQUENCE ........................................................................... 19|
|||5.3|RESET CIRCUIT ..................................................................................................... 19|
|||5.4|ACTUAL APPLICATION EXAMPLE ................................................................... 20|
|**6**||**PACKAGING AND LABELLING SPECIFICATION .............................................. 23**||
|**7**||**QUALITY ASSURANCE SPECIFICATION ............................................................. 24**||
|||7.1|CONFORMITY ....................................................................................................... 24|
|||7.2|DELIVERY ASSURANCE ..................................................................................... 24|
|||7.3|DEALING WITH CUSTOMER COMPLAINTS .................................................... 28|
|**8**||**RELIABILITY SPECIFICATION .............................................................................. 29**||
|||8.1|RELIABILITY TESTS ............................................................................................ 29|
|||8.2|LIFE TIME ............................................................................................................... 29|
|||8.1|FAILURE CHECK STANDARD ............................................................................ 29|
|**9**||**HANDLING PRECAUTIONS ...................................................................................... 30**||
|||9.1|HANDLING PRECAUTIONS ................................................................................ 30|
|||9.2|STORAGE PRECAUTIONS ................................................................................... 31|
|||9.3|DESIGNING PRECAUTIONS ................................................................................ 31|
|||9.4|OTHER PRECAUTIONS ........................................................................................ 32|
|||9.5|PRECAUTIONS WHEN DISPOSING OF THE OEL DISPLAY MODULES ....... 32|
|**10** **SUPPORTED ACCESSORIES .................................................................................... 33**||||
|||10.1|DUO KIT .................................................................................................................. 33|
|||10.2|TRANSITION BOARD CARD ............................................................................... 33|
|||10.3|CONNECTOR BOARD CARD ............................................................................... 33|
|||10.4|CONNECTOR ......................................................................................................... 33|
|||Product No.|Product No.<br>DD-160128FC-2B<br>REV.E<br>Page<br>2 / 33|
Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## REVISION RECORD
|**Rev.**|**Date**|**Page**|**Chapt.**|**Comment**|**ECR no.**|
|---|---|---|---|---|---|
|A|22 Nov 06|||First Issue||
|B|26 Dec 10|4<br>5<br>7<br>8<br>18<br>6<br>11<br>17<br>19<br>29<br>4||1. Overall dimensions<br>2. Weight<br>3. Driver Supply Voltage<br>4. Operating current for VDDH<br>5. Optics Characteristics<br>6. Mechanical Drawing<br>7. Block Diagram<br>8. Add RGB interface<br>9. Power up sequence<br>10. Low Temperature Operation<br>11. Operating temperature||
|C|07 Dec 11|30<br>to<br>33|9<br>10|Handling Precautions<br>Support Acceories||
|D|28 Nov 12|33|10|Errors on 10.1 DUO KIT||
|E|24 Oct 14|6<br>7<br>11<br>16<br>19<br>20|2<br>3.2<br>3.4<br>3.5<br>5.2<br>5.4|Revised<br>Drawing<br>(sticky<br>tape<br>removed between glass and FPC)<br>Electrical characteristic<br>Block Diagram<br>Serial Interface<br>Power sequence<br>Application Example||
|||||||
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DD-160128FC-2B REV. E Product No. ~~ee eee~~
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **1 MAIN FEATURES**
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|||
|---|---|
|ITEM|CONTENTS|
|Display Format|160 (RGB) x 128 Dots|
|Overall Dimensions|Glass 39.9 x 34.0 x 1.6 mm|
|Colour|262,144 Colour|
|Active Area|33.575 x 26.864 mm|
|Viewing Area|35.575 x 28.864 mm|
|Display Mode|Passive Matrix (1.69”)|
|Driving Method|1/128 duty|
|Driver IC|SEPS525|
|Operating temperature|-40 ~ +70|
|Storage temperature|-40 ~ +80|
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|DD-160128FC-2B|REV. E|
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **2 MECHANICAL SPECIFICATION**
## _**2.1 MECHANICAL CHARACTERISTICS**_
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||||
|---|---|---|
|ITEM|CHARACTERISTIC|UNIT|
|Display Format|160 (RGB) x 128|Dots|
|Overall Dimensions|Glass 39.9 x 34.0 x 1.6|mm|
|Viewing Area|35.575 x 28.864|mm|
|Active Area|33.575 x 26.864|mm|
|Dot Size|0.045 x RGB x 0.194|mm|
|Dot Pitch|0.07 x RGB x 0.21|mm|
|Weight|4.55|g|
|IC Controller/Driver|SEPS525F0A (COF)|
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|---|---|---|
|DD-160128FC-2B|REV. E|
|Product No.|Page|5 / 33|
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## _**2.2 MECHANICAL DRAWING**_
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DD-160128FC-2B REV. E<br>Product No. Page 6 / 33<br>**----- End of picture text -----**<br>
Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **3 ELECTRICAL SPECIFICATION**
## _**3.1 ABSOLUTE MAXIMUM RATINGS**_
|||||VSS=|=0 V,Ta= 25°C|
|---|---|---|---|---|---|
|**Item**|**Symbol**|**Min**|**Max**|**Unit**|**Note**|
|Supply Voltage|VDD|-0.3|4|V|Note 1, 2|
|Supply Voltage for I/O Pins|VDDIO|-0.3|4|V||
|Driver Supply Voltage|VDDH|-0.3|16|V||
|Operating Temperature|Top|-40|70|°C||
|Storage Temperature|Tst|-40|85|°C||
|Static Electricity|Be sure that you are grounded when handling displays.|||||
Note 1: All the above voltages are on the basis of “VSS=0V”.
Note 2: When this module is used beyond the above absolute maximum ratings, permanent damage to the module may occur. Also for normal operations it’s desirable to use this module under the conditions according to Section 3.2 “Electrical Characteristics”. If this module is used beyond these conditions the module may malfunction and the reliability could deteriorate.
DD-160128FC-2B REV. E Product No. Page ~~ee eee |~~ Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
Page 7 / 33
## _**3.2 ELECTRICAL CHARACTERISTICS**_
|~~po~~|||||||
|---|---|---|---|---|---|---|
|**Characteristics**<br>~~po~~|**Symbol**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|Supply Voltage<br>~~po~~<br>~~a~~|VDD<br>~~OO~~|~~OO~~|2.6<br>~~OO~~|2.8<br>~~OO~~|3.3<br>~~OO~~|V<br>~~OO~~|
|Supply Voltage x I/O pins<br>~~a ~~<br>~~a ~~|VDDIO<br> ~~OO~~<br> ~~OO~~|~~OO~~<br>~~OO~~|1.6<br>~~OO~~<br>~~OO~~|2.8<br>~~OO~~<br>~~OO~~|3.3<br>~~OO~~<br>~~OO~~|V<br>~~OO~~<br>~~OO~~|
|Driver Supply Voltage<br>~~a~~|VDDH<br>~~OO~~|Note 1<br>~~OO~~|13.5<br>~~OO~~|14<br>~~OO~~|14.5<br>~~OO~~|V<br>~~OO~~|
|High Level Input<br>~~a ~~<br>~~a ~~|VIH<br> ~~OO~~<br> ~~OO~~|~~OO~~<br>~~OO~~|0.8xVDD<br>~~OO~~<br>~~OO~~|-<br>~~OO~~<br>~~OO~~|VDD<br>~~OO~~<br>~~OO~~|V<br>~~OO~~<br>~~OO~~|
|Low Level Input<br>~~a~~|VIL<br>~~CO~~|~~CO~~|0|-|0.4|V|
|High Level Output<br>~~a ~~|VOH<br> ~~OO~~|IOH= -0.4mA<br>~~OO~~<br>~~OO~~|VDD-0.4<br>~~OO~~<br>~~OO~~|-<br>~~OO~~|-<br>~~OO~~|V<br>~~OO~~|
|Low Level Output<br>~~a~~|VOL<br>~~a~~|IOL= -0.1mA<br>~~a~~<br>~~OO~~|-<br>~~a~~<br>~~OO~~|-<br>~~a~~|0.4<br>~~a~~|V<br>~~a~~|
|Operating current for VDD<br>~~OO~~|IDD<br>~~OO~~|~~OO~~<br>~~OO~~|-<br>~~OO~~<br>~~OO~~<br>~~ee~~|2.5<br>~~OO~~|3.5<br>~~OO~~|mA<br>~~OO~~|
|Operating current for<br>VDDH|IDDH|Note 2<br>~~es~~|~~es~~<br>~~ee~~<br>~~ee~~|10.5<br>~~es~~|13.2<br>~~es~~|mA|
|||Note 3<br>~~re~~|-<br>~~ee~~<br>~~re~~<br>~~ee~~|14.9<br>~~re~~|18.6<br>~~re~~||
|||Note 4<br>~~re~~<br>~~es~~|-<br>~~re~~<br>~~ee~~<br>~~es~~|26.2<br>~~re~~<br>~~es~~|32.8<br>~~re~~<br>~~es~~||
|Sleep Mode Current for<br>VDD<br>~~a~~|IDD, Sleep<br>~~ee~~|~~ee~~|~~ee~~|3<br>~~ee~~|5<br>~~ee~~|uA<br>~~ee~~|
|Sleep Mode Current for<br>VDDH<br>~~a ~~|IDDH, Sleep<br> ~~ee~~|~~ee~~|~~ee~~|1<br>~~ee~~|5<br>~~ee~~|uA<br>~~ee~~|
Note 1 Brightness (Lbr) and Supply Voltage for Display (VDDH) are subject to the change of the panel characteristics and the customer’s request.
Note 2 VDD = 2.8V, VDDH = 14V, 30% Display Area Turn On Note 3 VDD =2.8V, VDDH = 14V, 50% Display Area Turn On Note 4 VDD = 2.8V, VDDH = 14V, 100% Display Area Turn On
DD-160128FC-2B REV. E Product No. Page 8 / 33 ~~ee eee |~~ Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## _**3.3 INTERFACE PIN ASSIGNMENT**_
|**No.**<br>~~Tf~~|**Symbol**<br>~~Tf~~|**Function**<br>~~Tf~~|
|---|---|---|
|1<br>~~Tf~~|N.C.<br>~~Tf~~|Reserved Pin (Supporting Pin).<br>The supporting pins can reduce the influences from stresses<br>on the function pins. These pins must be connected to<br>external ground<br>~~Tf~~|
|2<br>~~Tf~~|VSDH<br>~~Tf~~|Ground of OEL Panel<br>These are the ground pins for analog circuits. It must be<br>connected to external ground.<br>VSDH: Data Driver Ground<br>~~Tf~~|
|3|VDDH|Power supply of OEL Panel<br>This is the most positive voltage supply pin of the chip.<br>It must be connected to external source.|
|4|VSSH|Ground of OEL Panel<br>These are the ground pins for analog circuits. It must be<br>connected to external ground.<br>VSSH: Scan Driver Ground|
|5<br>~~=~~|IREF<br>~~=~~|Current reference for brightness Adjustment<br>This pin is segment (data) current reference pin. A 68KΏ<br>Resistor should be connected between this pin and VSS<br>~~=~~|
|6<br>~~=~~|OSCA2<br>~~=~~|Fine Adjustment for Oscillation<br>The frequency is controlled by external 5.1 kΏ Resistor<br>between OSCA1 and OSCA2. The oscillator signal is used for<br>system clock generation. When the external clock mode is<br>selected, OSCA1 is used external clock input.<br>~~=~~<br>~~op~~|
|7<br>~~=~~<br>~~sp~~|OSCA1<br>~~=~~<br>~~spo~~||
|8<br>~~sp~~<br>~~=S~~|VDDIO<br>~~spo~~<br>~~=S~~|Power supply for Interface logic level<br>This is a voltage supply pin. It should be match with MCU<br>interface voltage level. It must always be equal or lower than<br>VDD<br>~~op~~<br>~~—~~|
|9<br>~~sp~~<br>~~ee~~<br>~~=S~~|VSYNCO<br>~~spo~~<br>~~eee~~<br>~~=S~~|RGB Mode functional Pins<br>VSYNCO : Vertical Sync Output<br>VSYNC: Vertical Sync Input<br>HSYNC : Horizontal Sync Input<br>DOTCLK : Dot Clock Input<br>ENNABLE : Video Enable Input<br>_While using MCU interface, it must be connected to VDD._<br>~~op~~<br>~~eee~~<br>~~—~~|
|10<br>~~sp~~<br>~~ee~~<br>~~ee~~<br>~~=S~~|VSYNC<br>~~spo~~<br>~~eee~~<br>~~eee~~<br>~~=S~~||
|11<br>~~ee ~~<br>~~ee~~<br>~~=S~~|HSYNC<br> ~~eee~~<br>~~eee~~<br>~~=S~~||
|12<br>~~ee ~~<br>~~=S~~|DOTCLK<br> ~~eee~~<br>~~=S~~||
|13<br>~~=S~~|ENABLE<br>~~=S~~||
|14<br>~~=S~~<br>~~ee~~|CPU<br>~~=S~~<br>~~ee~~|Select CPU type<br>Low: 80-Series High: 68-Series<br>~~—~~<br>|
|15<br>~~ee—aae~~|PS<br>~~ee—aae~~|_Select Parallel/Serial Interface_<br>Low: Serial High: Parallel<br>~~—aae~~|
|16<br>~~ee—aae~~|D17<br>~~ee—aae~~|_Host Data Input/Output Bus._<br>These pins are 9-bit bi-directional data bus to be connected<br>with MCU data bus.<br>PS<br>Description<br>1<br>8-bit Bus: D17 to D10<br>9-bitBus: D17toD9<br>~~—aae~~<br>~~eee~~<br>~~eee~~<br>~~eee~~|
|17<br>~~ee—aae~~<br>~~ee~~|D16<br>~~ee—aae~~<br>~~eee~~||
|18<br>~~—aae~~<br>~~ee~~<br>~~ee~~|D15<br>~~—aae~~<br>~~eee~~<br>~~eee~~||
|19<br>~~—aae~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~|D14<br>~~—aae~~<br> ~~eee~~<br>~~eee~~<br>~~eee~~||
|20<br>~~—aae~~<br>~~ee ~~<br>~~ee~~<br>~~ee eee~~|D13<br>~~—aae~~<br> ~~eee~~<br>~~eee~~<br>~~eee~~||
|21<br>~~—aae~~<br>~~ee ~~<br>~~ee eee~~<br>~~ee~~|D12<br>~~—aae~~<br> ~~eee~~<br>~~eee~~<br>~~eee~~||
|22<br>~~—aae~~<br>~~ee eee~~<br>~~ee~~|D11<br>~~—aae~~<br>~~eee~~<br>~~eee~~||
Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
|23|D10||0|D[17] SCL: Synchronous Clock Input<br>D[16] SDI: Serial Data Input<br>D[15] SDO: Serial Data Output||
|---|---|---|---|---|---|
|24|D9|||||
|25|RS|_Selects Data/Command_<br>Low: Command High: Parameter/data||||
|26|CSB|_Chip Select_<br>Low: SEPS525 is selected and can be accessed<br>High: SEPS525 is not selected and cannot be accessed||||
|27|RDB|Read or Read/Write enable<br>80-system bus interface: read strobe signal (active low )<br>68-system bus interface: bus enable strobe (active high)<br>When serial mode, fix it to VDD or VSS level||||
|28|WRB|Write or Read/Write select<br>80-system bus interface: write strobe signal (active low)<br>68-system bus interface: read/write select<br>Low: write, High: read<br>When serial mode, fix it to VDD or VSS level||||
|29|RESETB|Power Reset for Controller and Driver<br>This pin is reset signal input. When the pin is low, initialization<br>of the chip is executed.||||
|30|VSS|Ground of Logic Circuit<br>A reference for the logic pins. It must be connected to<br>external ground||||
|31|VDD|Power supply for logic circuit<br>This is a voltage supply pin. It must be connected to external<br>source||||
|32|VSSH|Ground of OEL Panel<br>These are the ground pins for analog circuits. It must be<br>connected to external ground.<br>VSSH: Scan Driver Ground||||
|33|VDDH|Power supply of OEL Panel<br>This is the most positive voltage supply pin of the chip.<br>It must be connected to external source.||||
|34|VSDH|Ground of OEL Panel<br>These are the ground pins for analog circuits. It must be<br>connected to external ground.<br>VSDH: Data Driver Ground||||
|35|NC|Reserved Pin (Supporting Pin).<br>The supporting pins can reduce the influences from stresses<br>on the function pins. These pins must be connected to<br>externalground||||
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## _**3.4 BLOCK DIAGRAM**_
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Active Area 1.69”<br>160 x RGB x 128 Pixels<br>**----- End of picture text -----**<br>
MCU Interface Selection: CPU, PS Pins connected to MCU interface: D17~D9, RS, CSB, RDB, WRB, and RESETB Pins connected to RGB interface: D17~D12, VSYNC, HSYNC, DOTCLK, and ENABLE
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||||||||
|---|---|---|---|---|---|---|
|C1,|C3,|C5|0.1μF|C4,|C6|4.7μF/25V Tantalum Capacitor|
|C2|4.7μF|R2|5.1kΩ|
|R1:|68kΩ|
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## _**3.5 TIMING CHARACTERISTICS**_
## **3.5.1 AC CHARACTERISTICS**
## **3.5.1.1 6800-Series MPU Parallel Interface Timing Characteristics**
VDD = 2.8V, Ta = 25˚C
||~~Ge~~|~~en~~|~~(en~~|||
|---|---|---|---|---|---|
|**Characteristics**<br>~~ee~~|**Symbol**<br>~~ee~~<br>~~Ge~~|**Min**<br>~~ee~~<br>~~en~~|**Max**<br>~~ee~~<br>~~(en~~|**Unit**<br>~~ee~~|**Port**<br>~~ee~~|
|**Write Timing**<br>~~Ge en (en~~||||||
|Address hold timing<br>~~ee~~<br>~~a~~|tAH6<br>~~a~~|5<br>~~a~~|**-**<br>~~a~~|nS<br>~~a~~|CSB<br>~~a~~|
|Address setuptiming<br>~~a~~|tAS6<br>~~a~~|5<br>~~a~~|||RS<br>~~a~~|
|System cycle timingWrite<br>~~rr~~|tCYC6<br>~~rr~~<br>~~ee~~|100<br>~~rr~~|**-**<br>~~rr~~|nS<br>~~rr~~|E<br>~~rr~~|
|“L”pulse width Write<br>~~rr~~<br>~~ee~~|tELW6<br>~~rr~~<br>~~ee~~<br>~~ee~~|45<br>~~rr~~<br>~~ee~~||||
|“H”pulse width<br>~~rr~~|tEHW6<br>~~rr~~<br>~~ee~~|45<br>~~rr~~||||
|Data setuptiming|tDS6|40|**-**|nS|DB[17:0]|
|Data hold timing|tDH6|10||||
|**Read Timing**||||||
|Address hold timing<br>~~Po~~<br>~~a~~|tAH6<br>~~a~~|10<br>~~a~~|**-**<br>~~a~~|nS<br>~~a~~|CSB<br>~~a~~|
|Address setuptiming<br>~~a~~|tAS6<br>~~a~~<br>~~es~~|10<br>~~a~~|||RS<br>~~a~~|
|System cycle timingWrite<br>~~ee~~|tCYC6<br>~~ee~~<br>~~es~~|200<br>~~ee~~|**-**|nS|E|
|“L”pulse width Write|tELW6<br>~~es~~|90||||
|“H”pulse width<br>~~—~~|tEHW6|90||||
|Data setuptiming (CL= 15pF)|tDS6|0|70|nS|DB[17:0]|
|Data hold timing (CL= 15pF)|tDH6|||||
_**All the timing should be based on 10% and 90% of VDD.**_
## **Write Timing**
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|---|---|
## **Read Timing**
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
**3.5.1.2 8080-Series MPU Parallel Interface Timing Characteristics**
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**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|es|Characteristics|Symbol|Min|Max|Unit|Port|
|Write Timing|
|Ce|es|
|Address hold timing|tAH8|5|CSB|
|-|nS|
|es|Address setup timing|a|tAS8|5|TS|RS|
|ee|System cycle timing Write|tCYC8|eeee|100|es A|
|ee|“L” pulse width Write|tELW8|ee|45|-|nS|WRB|
|ee|“H” pulse width|tEHW8|ee|45|
|Data setup timing|tDS8|30|
|-|nS|DB[17:0]|
|ee|Data hold timing|ETGe|tDH8|10|
|Read Timing|
|Address hold timing|tAH8|10|CSB|
|-|nS|
|Address setup timing|—+——~|tAS8|10|RS|
|ee|ee|CS|
|ee|||-—|
|ee|System cycle timing Write|tCYC8|ee|200|
|ee|“L” pulse width Write|tELW8|ee|ee|90|-|nS|RDB|
|ee|“H” pulse width|tEHW8|ee|90|
|Data setup timing|(CL= 15pF)|tDS8|
|0|60|nS|DB[17:0]|
|ee|Data hold timing|—r7|(CL= 15pF)|tDH8|||||||
|* All the timing should be based on 10% and 90% of VDD|
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## **Write Timing**
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## **Read timing**
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## **3.5.1.3 Serial Interface Timing Characteristics**
VDD = 2.8V , Ta = 25˚C
|**ITEM**|**SYMBOL**|**MIN**|**MAX**|**UNIT**|**PORT**|
|---|---|---|---|---|---|
|Serial clock cycle SCL|tCYCS|100|-|nS|SCL|
|“H”pulse width SCL|tSHW|45||||
|“L”pulse width|tSLW|45||||
|Data setuptimingData|tDSS|5|-|nS|SDI|
|Hold timing|tDHS|5||||
|CSB-SCL timing|tCSS|5|-|nS|CSB|
|CSB-hold timing|tCSH|5||||
|RSB-SCL timing|TRSS|5|-|nS|RS|
|RSB-hold timing|TRSH|5||||
## _*** All the timing should be based on 10% and 90% of VDD**_
## **Serial Interface Timing**
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## **3.5.1.4 RGB Interface Timing Characteristics:**
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **4 OPTICAL SPECIFICATION**
## _**4.1 OPTICAL CHARACTERISTICS**_
**Characteristics Symbol Condition Min Typ Max Unit** ~~a ee ee ee~~ Brightness(White) Lbr Note 1 60 75 - cd/m[2] ~~a ee ee ee~~ (X) 0.26 0.30 0.34 C.I.E.(White) C.I.E. 1931 - (Y) 0.29 0.33 0.37 ~~loos= P|~~ (X) 0.60 0.64 0.68 C.I.E.(Red) C.I.E. 1931 - (Y) 0.30 0.34 0.38 ~~oe= P|~~ (X) 0.27 0.31 0.35 C.I.E.(Green) C.I.E. 1931 - (Y) 0.58 0.62 0.66 ~~soe= P|~~ (X) 0.10 0.14 0.18 C.I.E.(Blue) C.I.E. 1931 - (Y) 0.12 0.16 0.20 ~~=e= P|~~ Dark Room CR - >10000:1 - - Contrast ~~a ee ee ee~~ Viewing Angle >160 - - degree ~~a ee~~
Note 1: Brightness (Lbr) and Supply Voltage for Display (VDDH) are subject to the change of the panel characteristics and the customer’s request.
Optical measurement with polarizer is taken at VDD, VDDIO = 2.8V, VDDH = 14V and the software initial setting with section 5.4.1 Reference parameter table for normal operation mode.
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## **5 FUNCTIONAL SPECIFICATION**
## _**5.1 COMMANDS**_
Please refer to the Technical Manual for the SEPS525
## _**5.2 POWER UP/DOWN SEQUENCE**_
To protect panel and extend the panel lifetime, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the panel enough time to complete the action of charge and discharge before/after the operation.
## **5.2.1 POWER UP SEQUENCE**
VDD,, VDDIO ON VDDH ON Display On
1. Power up VDD & VDD IO
2. Send Display off command VDDH
- [ 3. Initialization ]
4. Clear Screen
5. Power up VDDH
6. Delay 100ms (When VDD & VDDIO is stable)
VDD
7. Send Display on command
Ground
## **5.2.2 POWER DOWN SEQUENCE**
Display off VDDH off VDD,, VDDIO off
1. Send Display off command
2. Power down VDDH VDDH 3. Delay 100ms (When VDDH reach 0 and panel is completely discharges) VDD
4. Power down VDD & VDDIO
Ground
1) Since an ESD protection circuit is connected between VDD, VDDIO and VDDH inside the driver IC, VDDH becomes lower than VDD & VDDIO whenever VDD & VDDIO is ON and VDDH is OFF.
2) VDDH should be kept float (disable) when it is OFF.
3) Power Pins (VDD, VDDIO, VDDH) can never be pulled to ground under any circumstance.
- 4) VDD & VDDIO should not be power down before VDDH power down.
## _**5.3 RESET CIRCUIT**_
When RESETB input is low, the chip is initialized with the following status:
1. Frame frequency: 90Hz
2. OSC: internal OSC
3. Internal OSC: ON
4. DDRAM write horizontal address: MX1 = 00h, MX2 = 9Fh
5. DDRAM write vertical address: MY1 = 00h, MY2 = 7Fh
6. Display data RAM write: HC = 1, VC = 1, HV = 0
7. RGB data swap: OFF
8. Row scan shift direction: G0, G1, … , G126, G127
9. Column data shift direction: S0, S1, … , S478, S479
10. Display ON/OFF: OFF
11. Panel display size: FX1 = 00h, FX2 = 9Fh, FY1 = 00h, FY2 = 7Fh
12. Display data RAM read column/row address: FAC = 00h, FAR = 00h
13. Pre-charge time(R/G/B): 0 clock
14. Pre-charge current(R/G/B): 0 uA 15. Driving current(R/G/B): 0 uA
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## _**5.4 ACTUAL APPLICATION EXAMPLE**_ **Power up Sequence**
## Product No.
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If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function
## **Power down Sequence**
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## Entering Sleep mode
Exiting sleep mode
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **6 PACKAGING AND LABELLING SPECIFICATION**
DENSITRON DD-160128FC-2B TW YY MM
28 pieces per tray 15 trays per inner carton 4 inner cartons per outer carton Total 1680 displays
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **7 QUALITY ASSURANCE SPECIFICATION**
## _**7.1 CONFORMITY**_
The performance, function and reliability of the shipped products conform to the Product Specification.
## _**7.2 DELIVERY ASSURANCE**_
## **7.2.1 DELIVERY INSPECTION STANDARDS**
IPC-AA610, class 2 electronic assemblies standard
## **7.2.2 Zone definition**
A Active B Outside Active
## **7.2.3 Visual inspection**
Test and measurement to be conducted under following conditions ：
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||||
|---|---|---|
|Temperature:|23±5|℃|
|Humidity:|55±15%RH|
|Fluorescent lamp:|30 W|
|Distance between the Panel & Eyes of the Inspector:|≧|30cm|
|Distance between the Panel & the lamp:|≧|50cm|
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
Units: mm
## **7.2.4 Standard of appearance inspection**
|**Class**<br>~~ee~~|**Item**<br>~~ee~~|**Criteria**<br>~~ee~~|**Criteria**<br>~~ee~~|
|---|---|---|---|
|Minor<br>~~ee~~<br>~~a~~|Packing &<br>Label<br>~~ee~~<br>~~A~~|Outside & insidepackage<br>~~ee~~|Presence ofproduct no.,lot no., quantity<br>~~ee~~|
|Critical<br>~~a~~<br>~~Ln~~||Product must not be mixed with others and quantity must not be different from<br>thatindicated onthelabel||
|Major<br>~~a ~~<br>~~Ln~~<br>~~Ln~~|Dimension<br> ~~A~~|Product dimensions must be according to specification and drawing||
|Major<br>~~Ln~~<br>~~Ln~~|Electrical|Product electrical characteristics must be according to specification||
|Critical<br>~~Ln~~<br>~~a ~~|OLED<br>Display<br>|Missing lines, short circuits or wrong patterns on OLED display are not<br>allowed<br>||
|Minor<br>|Black spot,<br>white spot,<br>dust<br>|Round type: as per following drawing<br>= (X+Y)/2<br>Acceptable quantity<br>Size<br>ZoneA<br>ZoneB<br> <0.1<br>Anynumber<br>Any number<br>0.1<<0.2<br>3<br>0.2<<0.25<br>1<br>0.25<<br>0<br>Line type: as per following drawing<br>Acceptable quantity<br>Length<br>Width<br>ZoneA<br>ZoneB<br>- -<br> W≤0.05<br>Anynumber<br>Any number<br>L≤2.0<br>W≤0.1<br>3<br>L>2.0<br>0<br>Total acceptable quantity: 3<br>X<br>Y<br>L<br>W<br> ~~ae~~<br>~~——— =~~||
|Minor<br>~~Ca~~|Polariser<br>scratch<br>~~Ca~~|Scratch on protective film is permitted<br>Scratchonpolariser: same as No.1<br>~~Ca~~||
|Minor<br>~~ia~~|Polariser<br>bubble<br>~~ia~~|= (X+Y)/2<br>Acceptable quantity<br>Size<br>Zone A<br>Zone B<br> <0.5<br>Anynumber<br>Any number<br>>0.5<br>0<br>X<br>Y<br>~~ia~~||
||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Class**||**Item**|**Criteria**|||||||||||||
|Minor|Minor||Segment<br>deformation|1b. Pin hole on dot matrix display<br>Acceptab<br>Size<br> a,b<<br> (a+b)/2≤0.<br>0.5<<<br>Total acceptable quantity: 7<br>2. Segments / dots with different width|||||||||||||
||||||2. Segments / dots with different width||||||||||||
|||||||||||Acceptable|||||||
|||||cceptab<br>a≥b<br>a<b<br>3. Alignment layer defect<br>= (a+b)/2<br>Acceptable<br>Size<br> ≤0.4<br>0.4<≤1.0<br>1.0<≤1.5<br>1.5<≤2.0<br>Total acceptable quantity: 7|cceptab<br>a≥b<br>a<b<br>3. Alignment layer defect|||||cceptab<br>a≥b||cceptab|cceptab<br>a/b≤4/3||a/b≤4/3||
|||||||||||a<b|||a/b||a/b>4/3||
||||||||||||||||||
||||||||||||||||||
||||||||Total acceptable quantity: 7|||||Total acceptable quantity: 7|||||
|Minor||Minor|Panel||||||||||||||
||||Chipping|X ≤ 1/6 Panel length<br>Y ≤ 1<br>Z ≤ T||X ≤ 1/6 Panel length|||||||||||
|Minor|||Panel<br>Cracking|Cracks not allowed|||||||||||||
|||||||||Cracks not allowed|||||||||
|||||||||Cracks not allowed|||||||||
|Minor|||Cupper<br>exposed<br>(pin or film)|Not allowed if visible by eye inspection|||||||||||||
|Minor|||Film or<br>Trace<br>Damage|Not allowed if affect electrical function|||||||||||||
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||||||||
|---|---|---|---|---|---|---|
|Class|Item|Criteria|
|Minor|Contact|
|Lead Twist|Not allowed|
|f|1|i|i|‘|
|HCHINN|RID}i|
|Vu|!|
|N|va|
|Minor|Contact|
|Lead|Not allowed|/an|A.|BROKEN|LEAD|
|Broken||/\|
|{\|d1|
|‘\~N|“4ét|
|Minor|Contact|
|Lead Bent|Not allowed if|a|,|a|
|bent lead causes|f|
|short circuit|!|SMUMl|\|
|%|i|LU|/|
|Not allowed if bent lead|a|:|oS|
|extends horizontally|i|IVa|)\|
|more than 50%|
|of its width|\,|\|J|24|bi|nod|
|Minor|Colour|Level of sample for approval set as limit sample|
|uniformity|
|Major|PCB|No unmelted solder paste should be present on PCB|
|Critical|Cold solder joints, missing solder connections, or oxidation are not allowed|
|Minor|No residue or solder balls on PCB are allowed|
|Critical|Short circuits on components are not allowed|
|Minor|Tray|Size|Quantity|
|particles||<0.2|Any number|
|On tray|
||>0.25|4|
||0.25|2|
|On display|
|L = 3|1|
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## _**7.3 DEALING WITH CUSTOMER COMPLAINTS**_
## **7.3.1 Non-conforming analysis**
Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample.
If the analysis cannot be completed on time, Densitron must inform the purchaser.
## **7.3.2 Handling of non-conforming displays**
If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron.
Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear.
Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard.
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## **8 RELIABILITY SPECIFICATION**
## _**8.1 RELIABILITY TESTS**_
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|||||
|---|---|---|---|
|Test Item|Test Condition|Evaluation and assessment|
|No abnormalities in function|
|High Temperature Operation|70°C±2, 240 hours|
|and|appearance|
|No abnormalities in function|
|Low Temperature Operation|-40°C±2, 240 hours|
|and|appearance|
|No abnormalities in function|
|High Temperature Storage|80°C±2, 240 hours|
|and|appearance|
|No abnormalities in function|
|Low Temperature Storage|-40°C±2, 240 hours|
|and|appearance|
|High Temperature & High|No abnormalities in function|
|60°C±2, 90%RH, 120 hours|
|Humidity|Storage(Operation)|and|appearance|
|24 cycle of|
|No abnormalities in function|
|Thermal Shock|-40°C 1 Hour,|
|°|and appearance|
|85|C 1 Hour|
**----- End of picture text -----**<br>
- The brightness should be greater than 50% of the initial brightness.
- The samples used for above tests do not include polarizer.
- No moisture condensation is observed during tests.
## **8.1.1 FAILURE CHECK STANDARD**
After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure teat at 23±5 °C; 55±15% RH
## _**8.2 LIFE TIME**_
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|||
|---|---|
|Item|Description|
|Function, performance, appearance, etc. shall be free from remarkable deterioration|
|more than 10,000 hours under 75 cd/m² brightness and storage conditions of room|
|1|
|temperature (25±10 °C), normal humidity (45±20% RH), and in area not exposed to|
|direct|sunlight.|
|2|End of lifetime is specified as 50% of initial brightness.|
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## _**8.1 FAILURE CHECK STANDARD**_
After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **9 HANDLING PRECAUTIONS**
## _**9.1 HANDLING PRECAUTIONS**_
- 1) Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position.
- 2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance.
- 3) If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections.
- 4) The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module.
- 5) When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using following adhesion tape.
- Scotch Mending Tape No. 810 or an equivalent
- Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy.
- Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water
- Ketone
- Aromatic Solvents
- 6) Hold OEL display module very carefully when placing OEL display module into the system housing. Do not apply excessive stress or pressure to OEL display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases.
- 7) Do not apply stress to the LSI chips and the surrounding molded sections.
- 8) Do not disassemble nor modify the OEL display module.
- 9) Do not apply input signals while the logic power is off.
- 10) Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity.
- Be sure to make human body grounding when handling OEL display modules.
- Be sure to ground tools to use or assembly such as soldering irons.
- To suppress generation of static electricity, avoid carrying out assembly work under dry environments.
- Protective film is being applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film.
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- 11) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5).
- 12) If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above.
## _**9.2 STORAGE PRECAUTIONS**_
- 1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0 ° C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Densitron Technologies Plc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them.
- 2) If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above.
## _**9.3 DESIGNING PRECAUTIONS**_
- 1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen.
- 2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible.
- 3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A)
- 4) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices.
- 5) As for EMI, take necessary measures on the equipment side basically.
- 6) When fastening the OEL display module, fasten the external plastic housing section.
- 7) If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module.
- 8) The electric potential to be connected to the rear face of the IC chip should be as follows: US2066
- Connection (contact) to any other potential than the above may lead to rupture of the IC.
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## _**9.4 OTHER PRECAUTIONS**_
- 1) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module.
- 2) To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules.
- Pins and electrodes
- Pattern layouts such as the FPC
- 3) With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur.
- Design the product and installation method so that the OEL driver may be shielded from light in actual usage.
- Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes.
- 4) Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design.
- 5) We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise.
## _**9.5 PRECAUTIONS WHEN DISPOSING OF THE OEL DISPLAY MODULES**_
- 1) Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations.
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
## **10 SUPPORTED ACCESSORIES**
## _**10.1 DUO KIT**_
Densitron has developed an easy to use yet powerful development and demonstration tool for driving its range of Passive matrix OLED displays from the USB port of a PC.
DUO (Densitron USB OLED) kit is hot pluggable and does not require extra cables or power supply to run, allowing users to be up and running in minutes.
The kit consists of an OLED display with transition Board, USB controller card, mini USB cable and a CD with software application and drivers.
## **Part number: PDK-N-160128FC-2B**
## _**10.2 TRANSITION BOARD CARD**_
A Transition board card is like a daughterboard which is meant to be a circuit board for connections between the baseboards (DUO).
It has connector pins for interfacing between the display and the baseboards. It also includes the OLED display.
**Part number: PDT-N-160128FC-2B**
## _**10.3 CONNECTOR BOARD CARD**_
A Connector board card is also a daughterboard which is a circuit board for connection between a microprocessor or microcontroller (customer’s system). **Part number: EVK-CONNECT-010**
## _**10.4 CONNECTOR**_
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|||||
|---|---|---|---|
|Type: ZIF connector|
|No. of|Pitch|Manufacturer part|
|Manufacturer|Distributor part no.|
|connections|(mm)|no.|
|Farnell/1112561|
|35|0.50|Omron|XF2M-3515-1A|
|Digikey/ OR727CT-ND|
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Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
Updated at February 9, 2023
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →