# Schottky Rectifier, Miniature, 40 V, 1 A, Single, 3-2A1A, 2 Pins, 490 mV ![Product image](https://novapart.co/image/farnell:1300793/) **URL**: https://novapart.co/products/CRS04(TE85L,Q,M)/schottky-rectifier-miniature-40-v-1-a-single-3 **SKU**: CRS04(TE85L,Q,M) **Manufacturer**: TOSHIBA **Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes **Price**: €0.0930 **Stock**: 1000+ **Lead Time**: 144 days (indicative) ## Description Repetitive Reverse Voltage Vrrm Max:40V; Forward Current If(AV):1A; Diode Configuration:Single; Diode Case Style:3-2A1A; No. of Pins:2Pins; Forward Voltage VF Max:490mV; Forward Surge Current Ifsm Ma ## Specifications | Parameter | Value | |---|---| | Svhc | No SVHC (15-Jan-2018) | | No. Of Pins | 2Pins | | Product Range | CRS04 | | Qualification | - | | Diode Mounting | Surface Mount | | Diode Case Style | 3-2A1A | | Diode Configuration | Single | | Forward Voltage Max | 490mV | | Forward Surge Current | 20A | | Average Forward Current | 1A | | Operating Temperature Max | 150°C | | Repetitive Peak Reverse Voltage | 40V | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:1300793/) CRS04 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type ## **CRS04** ## Switching Mode Power Supply Applications Unit: mm ## Portable Equipment Battery Applications - Forward voltage: VFM = 0.49 V (max) - Average forward current: IF(AV) = 1 A - Repetitive peak reverse voltage: VRRM = 40 V - Suitable for compact assembly due to small surface-mount package - “S-FLAT[TM] ” (Toshiba package name) ## **Absolute Maximum Ratings (Ta = 25°C)** ||||||lq
|
16103|| \|\
0)||| |---|---|---|---|---|---|---|---|---|---| |Characteristics|Symbol|Rating|Unit||16103||0)||| |Repetitive peak reverse voltage|VRRM|40|V|||o}|o||| |Average forward current|IF (AV)|1 (Note 1)|A|||||1.|ANODE| |Non-repetitive peak forward surge current|IFSM|20 (50 Hz)|A|||||2.|CATHODE| |Junction temperature|Tj|-55 to 150|°C||JEDEC||||―| |Storage temperature|Tstg|-55 to 150|°C||JEITA||||―| |Note 1: Ta = 31°C|||||||||| |Device mounted on a glass-epoxy board|Device mounted on a glass-epoxy board||||TOSHIBA|||3-2A1A|| Note 1: Ta = 31°C Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size: 6 mm × 6 mm) Weight: 0.013 g (typ.) Rectangular waveform (α = 180°), VR = 20 V Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). ## **Electrical Characteristics (Ta = 25°C)** |**Electrical Characteristics (Ta = 25°C) (Ta = 25°C)**|**Electrical Characteristics (Ta = 25°C) (Ta = 25°C)**|||||| |---|---|---|---|---|---|---| |Characteristics|Symbol|Test Condition|Min|Typ.|Max|Unit| |Peak forward voltage|VFM(1)|IFM =0.1 A|―|0.395|―|V| ||VFM(2)|IFM =0.7 A|―|0.475|0.49|| ||VFM(3)|IFM =1 A|―|0.51|―|| |Repetitive peak reverse current|IRRM(1)|VRRM =5 V|―|0.6|―|μA| ||IRRM(2)|VRRM =40 V|―|―|100|| |Junction capacitance|Cj|VR =10 V, f=1 MHz|―|47|―|pF| |Thermal resistance (junction to ambient)|Rth(j-a)|Device mounted on a ceramic board
(board size: 50 mm×50 mm)
(soldering land: 2 mm×2 mm)
(board thickness: 0.64 mm)|―|―|70|°C/W| |||Device mounted on a glass-epoxy board
(board size: 50 mm×50 mm)
(soldering land: 6 mm×6 mm)
(board thickness: 1.6 mm)|―|―|140|| |Thermal resistance (junction to lead)|Rth(j-ℓ)|―|―|―|20|°C/W| Start of commercial production 1999-07 2017-04-17 1 CRS04 ## **Marking** |**arking**|| |---|---| |Abbreviation Code|Part No.| |S4|CRS04| ## **Land Pattern Dimensions (for reference only)** **==> picture [176 x 74] intentionally omitted <==** **----- Start of picture text -----**
Unit: mm
1.2
1.2
2.8
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## **Handling Precaution** Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. Please take forward and reverse loss into consideration during design. The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. - VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a device at low temperature. - IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV) and Tj be below 120°C. When using this device, take the margin into consideration by using an allowable Tamax-IF(AV) curve. - IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. - Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 120°C. Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. 2017-04-17 2 CRS04 **==> picture [447 x 445] intentionally omitted <==** **----- Start of picture text -----**
IF – VF PF(AV) – IF(AV)
10 0.8
0.7 DC
Tj = 150°C 0.6
180°
1 125°C
0.5 120°
75°C 0.4 α = 60°
Rectangular
0.3 waveform
0.1 25°C
0.2
0° α 360°
0.1
Pulse measurement
Conduction angle α
0.01 0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Instantaneous forward voltage VF (V) Average forward current IF(AV) (A)
Ta max – IF(AV) Ta max – IF(AV)
Ceramic substrate (substrate size: Glass-epoxy substrate (substrate size:
50 mm × 50 mm, soldering land: 2 mm × 2 mm) 50 mm × 50 mm, soldering land: 6 mm × 6 mm)
160 160
Rectangular waveform
140 140 IF(AV)
120 120 0° α 360°
VR = 20 V
Conduction angle α
100 100
α = 60°
80 80
Rectangular 120° 180° DC
waveform
60 60
40 40
0° α 360°
20 Conduction angle α IF (AV) 20 α = 60° 120° 180° DC
VR = 20 V
0 0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current IF(AV) (A) Average forward current IF(AV) (A)
(A)
F
(W)
F(AV)
P
Average forward power dissipation
Instantaneous forward current I
Ta max (°C) Ta max (°C)
Maximum allowable ltemperature
Maximum allowable lead ltemperature
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**==> picture [213 x 189] intentionally omitted <==** **----- Start of picture text -----**
rth(j-a) – t
1000
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
100 board thickness: 1.6 mm
10
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
1 Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 mm
0.1
1 10 100 1000 10000 100000
time t (ms)
rth(j-a) (°C/W)
Transient thermal resistance
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2017-04-17 3 CRS04 **==> picture [208 x 205] intentionally omitted <==** **----- Start of picture text -----**
Peak repetitive forward current
32
Ta = 25°C
28
f = 50 Hz
24
20
16
12
8
4
0
1 10 100
Number of cycles
(A)
FRM
Peak repetitive forward current I
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IR – Tj (typ.)
100
Pulse measurement
10
1 30 V
40 V
0.1
20 V
10 V
0.01
VR = 5 V
0.001
0.0001
0 20 40 60 80 100 120 140 160
Junction temperature Tj (°C)
Reverse current IR (mA)
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**==> picture [208 x 205] intentionally omitted <==** **----- Start of picture text -----**
Cj – VR (typ.)
500
300
100
50
30
f = 1 MHz
Ta = 25°C
10
1 3 5 10 30 50 100
Reverse voltage VR (V)
Junction capacitance C (pF) j
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**==> picture [206 x 205] intentionally omitted <==** **----- Start of picture text -----**
PR(AV) – VR (typ.)
0.6
Rectangular
waveform
0° 360°
0.5
DC
VR
0.4
Conduction angle α 300°
Tj = 150°C
0.3 240°
180°
0.2 120°
60°
0.1
0
0 10 20 30 40
Reverse voltage VR (V)
PR(AV) (W)
Average reverse power dissipation
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2017-04-17 4 CRS04 ## **RESTRICTIONS ON PRODUCT USE** - Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. - This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. - Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. **TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.** - **PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT (** " **UNINTENDED USE** " **).** Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. **IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.** For details, please contact your TOSHIBA sales representative. - Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. - Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. - The information contained herein is presented only as guidance for Product use. 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Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. - Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. 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