# MOSFET Relay, SPST-NO (1 Form A), AC / DC, 60 V, 400 mA, SOIC-8, Surface Mount

![Product image](https://novapart.co/image/farnell:3995889/)

**URL**: https://novapart.co/products/CPC2014N/mosfet-relay-spst-no-1-form-a-ac-dc-60-v-400-ma
**SKU**: CPC2014N
**Manufacturer**: LITTELFUSE
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €1.8400
**Stock**: 10+
**Lead Time**: 169 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NO (1 Form A) |
| Load Current | 400mA |
| Product Range | OptoMOS Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Gull Wing |
| Load Voltage Max | 60V |
| Isolation Voltage | 1.5kV |
| I/O Capacitance Typ | 1pF |
| On State Resistance Max | 2ohm |
| Mosfet Relay Package Style | SOIC-8 |
| Off State Leakage Current Max | 1µA |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3995889/)

**CPC2014N 60V, 400mA, Dual Single-Pole Normally Open Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Load Current|400|mArms/ mADC|
|On-Resistance (max)|2||
|LED Current to operate|2|mA|



## **Features** 

- Designed for use in Security Systems Complying with EN50130-4 

- 1500Vrms Input/Output Isolation 

- No EMI/RFI Generation 

- Immune to Radiated EM Fields 

- Tape & Reel Version Available 

- Small 8-Pin SOIC Package 

## **Description** 

The CPC2014N is a miniature device with two independent normally-open (1-Form-A) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. 

Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient infrared LED. 

The CPC2014N uses IXYS Integrated Circuits' state of the art, double-molded vertical construction packaging to produce one of the world’s smallest relays. The CPC2014N offers substantial board space savings over the competitor’s larger 8-pin SOIC relay. 

- Flammability Rating UL 94 V-0 

## **Applications** 

- Security 

## **Approvals** 

   - UL Recognized Component: File E76270 

   - TUV EN 62368-1: Certificate # B 082667 0008 

- Passive Infrared Detectors (PIR) 

- Data Signalling 

- Sensor Circuitry 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|CPC2014N|8-Pin SOIC (50/tube)|
|CPC2014NTR|8-Pin SOIC (2000/reel)|



- I/O Subsystems 

- Medical Equipment—Patient/Equipment Isolation 

- Industrial Controls 

## **Pin Configuration** 

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**----- Start of picture text -----**<br>
1 8<br>+ Control Load<br>2 7<br>– Control : Load<br>3 6<br>+ Control Load<br>4 5<br>– Control : Load<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally-Open (Form A) Devices** 

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**----- Start of picture text -----**<br>
Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>


**1** 

DS-CPC2014N-R06 

**www.ixysic.com** 

**CPC2014N** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation|70|mW|
|Total Power Dissipation1|600|mW|
|Isolation Voltage, Input to Output|1500|Vrms|
|Operational Temperature, Ambient|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25ºC, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 5mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~ee~~|||||||
|Blocking Voltage<br>~~es~~|IL=1A<br>~~es~~<br>~~ee~~|VDRM<br>~~es~~|60<br>~~es~~|-<br>~~es~~|-<br>~~es~~|V<br>~~es~~|
|Load Current<br>Continuous1<br>Peak<br>~~es~~|IF=2mA<br>~~es~~<br>~~ee~~|IL<br>~~es~~|-<br>~~es~~|-<br>~~es~~|400<br>~~es~~|mArms/ mADC<br>~~es~~|
||t<10ms<br>~~es~~<br>~~ee~~|ILPK<br>~~es~~|-<br>~~es~~|-<br>~~es~~|±1<br>~~es~~|AP<br>~~es~~|
|On-Resistance2<br>~~es~~|IL=400mA<br>~~es~~<br>~~ee~~|RON<br>~~es~~|-<br>~~es~~|-<br>~~es~~|2<br>~~es~~|<br>~~es~~|
|Off-State Leakage Current<br>~~ee~~|VL=60VP<br>~~ee~~|ILEAK<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|1<br>~~ee~~|µA<br>~~ee~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~ee~~|IF=5mA, VL=10V<br>~~ee~~|ton<br>~~ee~~|-<br>~~ee~~|0.47<br>~~ee~~|2<br>~~ee~~|ms<br>~~ee~~|
|||toff<br>~~ee~~|-<br>~~ee~~|0.22<br>~~ee~~|1<br>~~ee~~||
|Output Capacitance<br>~~ee~~|IF=0mA, VL=50V, f=1MHz<br>~~ee~~|COUT<br>~~ee~~|-<br>~~ee~~|25<br>~~ee~~|-<br>~~ee~~|pF<br>~~ee~~|
|Capacitance, Input to Output|VIO=0V, f=1MHz|CIO|-|1|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate3|IL=400mA|IF|-|0.25|2|mA|
|Input Control Current to Deactivate|-|IF|0.1|0.2|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.36|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|



1   Load current derates linearly from 400mA @ 25oC to 200mA @80oC, and must be derated for both poles operating simultaneously. 

2   Measurement taken within 1 second of on-time. 

3   For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. 

R06 

**www.ixysic.com** 

**2** 

**CPC2014N** 

INTEGRATED CIRCUITS DIVISION 

## **PERFORMANCE DATA*** 

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**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical IF for Switch Operation<br>(N=50, IF=5mA) (N=50, IL=400mA)<br>30 25<br>25 eee 20 |<br>20<br>15<br>15 jf  £--<br>10<br>10 oe | oe<br>50 co _ [ane] im 50 h_ 6|lU(<$LLE wae| CT<br>1.364 1.366 1.368 1.370 1.372 0.16 0.18 0.20 0.22 0.24 0.26 0.28<br>LED Forward Voltage Drop (V) LED Current (mA)<br>Typical On-Resistance Distribution Typical Turn-On Time<br>(N=50, IF=1mA, IL=400mA) (N=50, IF=5mA, IL=100mA)<br>25 25<br>20 20 FL | TT |<br>15 15 || |<br>105 105 2228)a | oe<br>0 0 | [io] | | oe<br>0.505 0.510 0.515 0.520 0.525 0.530 0.535 0.35 0.40 0.45 0.50 0.55 0.60 0.65<br>On-Resistance ( ) Turn-On Time (ms)<br>Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Typical IF for Switch Dropout<br>(N=50, IL=400mA)<br>25<br>20<br>15<br>10<br>5<br>0<br>0.16 0.18 0.20 0.22 0.24 0.26<br>LED Current (mA)<br>Device Count (N)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Typical Turn-Off Time<br>(N=50, IF=5mA, IL=100mA)<br>30<br>25<br>20<br>15<br>10<br>5<br>0<br>0.55 0.65 0.75 0.85 0.95 1.05<br>Turn-Off Time (ms)<br>Device Count (N)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Typical Blocking Voltage Distribution<br>(N=50)<br>35<br>30<br>TTT tT<br>25 eee!<br>20 F | | | Ud |<br>15 eee<br>105 eee<br>0 eed || hdl) lhe<br>63.5 64.0 64.5 65.0 65.5 66.0 66.5<br>Blocking Voltage (VP)<br>Device Count (N)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical Ivs. TemperatureF for Switch Operation Typical Ivs. TemperatureF for Switch Dropout<br>1.8 vs. Temperature 0.36 (IL=200mA) 0.36 (IL=200mA)<br>1.7<br>1.6 ettttt4f 0.32 +E] tty) 0.32 h E<br>1.5 IIFF=10mA=5mA 0.28 0.28<br>1.4 I F =2mA<br>1.3 SSSS. 0.24 PEPPY)PTT] AT 0.24 E PE<br>1.2<br>0.20 0.20<br>1.1 SASS] ELL? EtEr<br>1.0 pububuhbuboht 0.16 E LI |I|titi| 0.16 Errl[ | ||<br>-50 -25 0 25 50 75 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>LED Current (mA) LED Current (mA)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

**www.ixysic.com** 

R06 

**3** 

all INTEGRATED CIRCUITS DIVISION **CPC2014N** ~~a~~ 

## **PERFORMANCE DATA*** 

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**----- Start of picture text -----**<br>
Typical Load Current vs. Load Voltage Typical Turn-On Time Typical Turn-Off Time<br>with One Pole Operating vs. LED Forward Current vs. LED Forward Current<br>500 (IF=2mA) 2.0 (IL=80mA) 0.7 (IL=80mA)<br>400 ee ee 1.8 a a 0.6<br>300 1.6<br>200 PF | | | |7, 1.4 a 0.5<br>100 | | |ma l_ 1.2 a 0.4 FT TEE LLL LI<br>0 1.0<br>-100 eertee[7 [|_| 0.8 ftHt TTT ee 0.3 FELEEEELILLL| | {| | | | | | |_|<br>-200 en ee ee 0.6 AC a 0.2 L771...<br>-300 F 0.4 i<br>-400 a [7 | | | 4 0.2 a 0.1 Ane<br>-500 000 ae OS SSeeSe 0 PISLLL eee] 0 Po<br>-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50<br>Load Voltage (V) LED Forward Current (mA) LED Forward Current (mA)<br>Load Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Typical On-Resistance vs. Temperature Typical Turn-On Time vs. Temperature Typical Turn-Off Time vs. Temperature<br>(IL=200mA) (IL=80mA) (IL=80mA)<br>0.9 2.0 0.60<br>0.8 FTP. IF=5mA 1.81.6 Ss 0.550.50 a<br>oc 0.7 fF | | | |KrLA IF=10mA | 1.4 SSss CCA 0.45 aa<br>0.6 2 Steady State a 1.21.0 See IF=5mA 0.400.35 See<br>0.8 0.30<br>0.5 Ft prtva Ll 0.6 aes 0.25 a IF=5mA<br>0.4 Faoe|ttt 0.40.2 aae IF=10mA 0.200.15 ————T2<br>0.3 “Ll ttt 0.0 —a ee e e a eeT 0.10 e n ee e IF=10mA<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Maximum Load Current vs. Temperature Typical Leakage vs. Temperature<br>with One Pole Operating Typical Blocking Voltage Measured Across Pins 5&6 and 7&8<br>500 (IF=2mA) 72 vs. Temperature 0.016 (VL=60V)<br>70 r+ | [| | | [| [| 0.014 ee<br>400<br>68 SEE 0.012 ee<br>300 66 a 0.010 EEE<br>pte 0.008 eee<br>200 64 a 0.006<br>62<br>tr Ler {| | {| | | 0.004 es a<br>100<br>60 Zee 0.002 Fe |Pet<br>0 58 t e tf tT tt te 0 e e re<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>On-Resistance () Turn-On Time (ms) Turn-Off Time (ms)<br>)P<br>Leakage (µA)<br>Load Current (mA) Blocking Voltage (V<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Output Capacitance vs. Load Voltage Energy Rating Curve<br>(IF=0mA, f=1MHz) (IF=2mA)<br>200 11001000 E MU<br>175<br>900<br>150 800<br>125 a ee ee 700 2500000000)<br>100 a 600 0<br>75 PA Ty 500400 0040/0000FUE THE TUTE EP TTI<br>50 FOND TE 300 2500010000001 0000<br>200<br>25 SSS 100 Fee<br>0 ee ee ee eee 0 0000080000<br>0 10 20 30 40 50 10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Load Voltage (V) Time<br>Load Current (mA)<br>Output Capacitance (pF)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R06 

**www.ixysic.com** 

**4** 

**CPC2014N** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of ¢) the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~————~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~————~~|
|---|---|
|CPC2014N<br>~~————~~|MSL 3<br>~~————~~|



## **ESD Sensitivity** 

This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. 

|**Device**<br>~~————————~~|**Classifi cation Temperature (Tc)**<br>~~————————~~|**Dwell Time (tP)**<br>~~————————~~|**Max Refl ow Cycles**<br>~~————————~~|
|---|---|---|---|
|CPC2014N<br>~~————————~~|260ºC<br>~~————————~~|30 seconds<br>~~————————~~|3<br>~~————————~~|



## **Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 

**www.ixysic.com** 

R06 

**5** 

**CPC2014N** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **CPC2014N** 

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**----- Start of picture text -----**<br>
1.016  ±  0.025 0.203  ±  0.025 PCB Land Pattern<br>9.347  ±  0.203 (0.040  ±  0.001) (0.008  ±  0.001)<br>(0.368  ±  0.008)<br>nl s p<br>5.60<br>(0.22)<br>1.30<br>Pin 1<br>6.096  ±  0.102 (0.051)<br>2.540  TYP (0.240  ±  0.004) 0.432  ±  0.127<br>a (0.100  TYP il ) 3.810  ±  0.051 8 (0.017  - ±  0.005) 0.55 _ 2.54 [<br>~ (0.150  ±  0.002) " B ett<br>2.184  MAX (0.022) (0.100)<br>(0.086  MAX ) Pin to Package Standoff Dimensions<br>MIN 0.0254 (0.001) mm<br>(MAX 0.102 (0.004) (inches)<br>o o o _<br>te 0.838  ±  0.102 0.381  ±  0.051 Note:<br>(0.033  ±  0.004) (0.015  ±  0.002) 1. Lead dimensions do not include plating: 1000 microinches max.<br>**----- End of picture text -----**<br>


## **CPC2014NTR Tape & Reel** 

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**----- Start of picture text -----**<br>
330.2 DIA. 1.75 ± 0.10 4.00 ± 0.10 P1=8.00 ± 0.10<br>(13.00 DIA.) 2.00 ± 0.10<br>Top Cover<br>Tape Thickness 1.20<br>0.102 MAX.<br>(0.004 MAX.) 7.50 ± 0.10<br>Ø1.50<br>+0.1, -0<br>WY H E E re ] fe]<br>6.50 9.65 ± 0.10<br>16.00 ± 0.30<br>Sy 0 LEE<br>Embossed Carrier<br>Direction of feed<br>TT Ø1.50 MIN<br>Embossment 3.50 6.55 ± 0.10<br>2.35 ± 0.10 2.85 ± 0.10<br>NOTES: “40tSr<br>1. All dimensions in millimeters 4. Tape material : Black Conductive Polystyrene Alloy.<br>2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 5. All dimensions meet EIA-481-C requirements.<br>**----- End of picture text -----**<br>


3. Carrier camber is within 1mm in 250mm. 

6. Thickness : 0.30 ± 0.05mm. 

## **For additional information please visit our website at: https://www.ixysic.com** 

**Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** 

Specification:  DS-CPC2014N-R06 

©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits 9/7/2021 

**6** 



## Links

- [View this product on Novapart](https://novapart.co/products/CPC2014N/mosfet-relay-spst-no-1-form-a-ac-dc-60-v-400-ma)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/littelfuse/cpc2014n/mosfet-relay-spst-no-0-4a-60v/dp/3995889)
---

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