# MOSFET Relay, SPST-NC (1 Form B), AC / DC, 400 V, 100 mA, SOP-4, Surface Mount

![Product image](https://novapart.co/image/farnell:3995866/)

**URL**: https://novapart.co/products/CPC1125N/mosfet-relay-spst-nc-1-form-b-ac-dc-400-v-100-ma
**SKU**: CPC1125N
**Manufacturer**: LITTELFUSE
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €0.9660
**Stock**: 10+
**Lead Time**: 169 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NC (1 Form B) |
| Load Current | 100mA |
| Product Range | OptoMOS Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Gull Wing |
| Load Voltage Max | 400V |
| Isolation Voltage | 1.5kV |
| I/O Capacitance Typ | 1pF |
| On State Resistance Max | 35ohm |
| Mosfet Relay Package Style | SOP-4 |
| Off State Leakage Current Max | 1µA |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3995866/)

**CPC1125N Single-Pole, Normally Closed 4-Pin SOP OptoMOS[®] Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|BlockingVoltage|400|VP|
|Load Current|100|mArms/ mADC|
|On-Resistance(max)|35||
|LED Current to Operate|2|mA|



## **Description** 

CPC1125N is a miniature single-pole, normally closed (1-Form-B) solid state relay. It uses IXYS Integrated Circuits Division’s patented, optically coupled, OptoMOS architecture to provide 1500Vrms of input/output isolation in a small 4-Pin SOP package. 

## **Features** 

- 1500Vrms Input/Output Isolation 

- Low Drive Power Requirements (TTL/CMOS 

- Compatible) 

- No Moving Parts 

CPC1125N uses IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays. 

- High Reliability 

- Arc-Free With No Snubbing Circuits 

- No EMI/RFI Generation 

- Small 4-Pin SOP Package 

- Machine Insertable, Wave Solderable 

- Tape & Reel Version Available 

## **Approvals** 

- UL Recognized Component: File E76270 

- CSA Certified Component: Certificate 1172007 

• Certified to: IEC60950-1: 2005 EN60950-1: 2006 TUV Certificate: B 09 07 49410 006 

## **Applications** 

- Telecommunications 

- Telecom Switching 

- Tip/Ring Circuits 

- Modem Switching (Laptop, Notebook, Pocket 

- Size) 

**Ordering Information** 

**Part # Description** CPC1125N 4-Pin SOP (100/tube) ~~rE~~ CPC1125NTR 4-Pin SOP (2000/reel) 

- Hook Switch 

- Dial Pulsing 

- Ground Start 

## **Pin Configuration** 

- Ringing Injection 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

**==> picture [134 x 48] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 4<br>+ Control Load<br>2 3<br>– Control Load<br>**----- End of picture text -----**<br>


- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment-Patient/Equipment Isolation 

- Security 

**==> picture [100 x 18] intentionally omitted <==**

**----- Start of picture text -----**<br>
Switching Characteristics of<br>Normally Closed Devices<br>**----- End of picture text -----**<br>


- Aerospace 

- Industrial Controls 

**==> picture [96 x 61] intentionally omitted <==**

**----- Start of picture text -----**<br>
Form-B<br>IF<br>ILOAD 90%<br>10%<br>toff ton<br>**----- End of picture text -----**<br>


## Pb e3 ~~Om~~ 

DS-CPC1125N-R02 

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**www.ixysic.com** 

**CPC1125N** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|BlockingVoltage|400|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation|150|mW|
|Total Power Dissipation1|400|mW|
|Isolation Voltage, Input to Output|1500|Vrms|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

1  Derate linearly 3.33 mw / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~aee~~|||||||
|Load Current<br>Continuous1<br>Peak<br>~~a~~|IF=0mA<br>~~a~~|IL<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|100|mArms/ mADC|
||t =10ms<br>~~a~~|ILPK<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|±350|mAP|
|On-Resistance2<br>~~a~~<br>~~a~~|IL=100mA<br>~~a ~~<br>~~a~~|RON<br> ~~ee~~<br>~~a~~|-<br>~~ee~~<br>~~a~~|26<br>~~ee~~<br>~~a~~|35<br>~~a~~|<br>~~a~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~a~~|IF=5mA, VL=10V<br>~~a~~|ton<br>~~a~~|-<br>~~a~~|0.31<br>~~a~~|2<br>~~a~~|ms<br>~~a~~|
|||toff<br>~~a~~|-<br>~~a~~|0.30<br>~~a~~|2<br>~~a~~||
|Off-State Leakage Current<br>~~a~~|VL=400V, IF=2mA<br>~~a~~|ILEAK<br>~~a~~|-<br>~~a~~|-<br>~~a~~|1<br>~~a~~|µA<br>~~a~~|
|Output Capacitance|IF=2mA, VL= 50V, f=1MHz|COUT|-|6|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate3|IL=100mA|IF|-|-|2|mA|
|Input Control Current to Deactivate|-|IF|0.1|-|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.4|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Common Characteristics**|||||||
|Capacitance, Input to Output|-|CI/O|-|1|-|pF|



1   Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC. 

2   Measurement taken within 1 second of on-time. 

3   For applications requiring high temperature operation (greater than 60°C) a LED drive current of 4mA is recommended. 

R02 

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call INTEGRATED CIRCUITS DIVISION **CPC1125N** ~~a~~ 

## **PERFORMANCE DATA*** 

**==> picture [489 x 578] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>25 (N=50, IF=5mA, TA=25ºC) 25 (N=50, IF=5mA, IL=60mA, TA=25ºC) 30 (N=50, IF=5mA, IL=60mA, TA=25ºC)<br>20 Ft ttt |) 20 UE TE et FE ) llUC 25 UELE<br>20<br>15 15<br>Tee ogee 15<br>10 2 | ee 10 e<br>10<br>5 m= | | 5 Bee || eee 5  ee| li<br>0 IRE | 0 ‘eee 6|lUC< 0 “ [“iC]<br>1.250 1.255 1.260 1.265 1.270 1.275 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.20 0.23 0.26 0.29 0.32 0.35 0.38<br>LED Forward Voltage (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Form-B IF for Switch Operation Typical On-Resistance Distribution Typical Blocking Voltage Distribution<br>(N=50, IL=120mA, TA=25ºC) (N=50, IF=0mA, IL=100mA, TA=25ºC) (N=50, IF=2mA, TA=25ºC)<br>2520 20 2520 F LL<br>15<br>15 15<br>10 os ane Seee|LT llooTd<br>10 10<br>5 || =o. S08 |<br>5 5<br>0 0 ERs | 0 S _50wae | Ge<br>0.12 0.14 0.16 0.18 0.20 0.22 24 25 25 26 27 28 28 400 410 420 430 440 450 460 470<br>LED Current (mA)  On-Resistance ( ) Blocking Voltage (VP)<br>Typical LED Forward Voltage Typical Turn-Off Time Typical Turn-On Time<br>vs. Forward Current vs. LED Forward Current vs. LED Forward Current<br>50 (TA=25ºC) 1200 (IL=60mA, TA=25ºC) 318 (IL=60mA, TA=25ºC)<br>40 PLT ELLE LA 1000 316 p | df<br>800 314<br>30<br>Coan 600 OT 312<br>20<br>SERRE ene 400 310 1<br>10 SER0ZE000 200 308 a<br>0 SEPA 0 306 ne eee Deed nee<br>1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 0 10 20 30 40 50 0 10 20 30 40 50<br>Forward Voltage (V) LED Current (mA) LED Current (mA)<br>Typical Turn-Off Time Typical Turn-On Time<br>Typical LED Forward Voltage Drop vs. Temperature vs. Temperature<br>vs. Temperature (IL=60mA) (IL=60mA)<br>1.6 2000 500<br>1.5 SEE IIFF=50mA=20mA 1600 TTT IF=2mA 450400 ee<br>1.4<br>SSR - 1200 PPP - 350 See<br>1.3 IF=5mA 300<br>See 800 Zanes 250 IESE<br>1.21.1 S IFI=10mAF=5mA SeS 400 KY 200150 TIN IF=2mA IF=5mA<br>1.0 | IF=2mA 7yomBSH L 0 Ep+lr Hs] 100 TIEENTSS<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>s) s)<br>Turn-Off Time ( Turn-On Time (<br>Forward Current (mA)<br>s) s)<br>Turn-Off Time ( Turn-On Time (<br>LED Forward Voltage (V)<br>**----- End of picture text -----**<br>


*The Performance data shown in the graphs above is typical of device performance.  For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

R02 

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call INTEGRATED CIRCUITS DIVISION **CPC1125N** ~~a~~ 

## **PERFORMANCE DATA*** 

**==> picture [490 x 428] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical IF for Switch Operation Typical On-Resistance vs. Temperature Typical Load Current vs. Load Voltage<br>(IL=60mA) (IF=0mA, IL=60mA) (IF=0mA, TA=25ºC)<br>0.80.7 ee 45 150100<br>0.6 PELL ELL - 40<br>50<br>0.5 ee 35<br>0<br>0.4 COLLET 30<br>0.3 ELLY -50<br>0.2 P>LLLY TI 25 -100<br>0.1 eee 20 -150<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -3 -2 -1 0 1 2 3<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Maximum Load Current Typical Blocking Voltage Leakage Current vs. Temperature<br>vs. Temperature vs. Temperature Measured Between Pins 3&4<br>110 (IF=0mA) 465 (IF=5mA) 140 (IF=5mA, VL=400V)<br>100 460 120<br>90 —— 100 es<br>455 80<br>80 Ft D.DONE|STI r+FECL | | | | [ fg |<br>60<br>450<br>70 40<br>6050 F R E ERELJ [NE] 445440 200 c4sey<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Output Capacitance vs. Load Voltage Energy Rating Curve<br>(IF=2mA, f=1MHz, TA=25ºC) (TA=25ºC)<br>70 1.0<br>60<br>0.8<br>50 SLM laaneaiaea ST TT<br>40 STC rn 0.6<br>30 0.4<br>20 ST Ne<br>0.2<br>10 PEON SUC CCT A<br>0 C HIC CMH 0.0<br>0.1 1 10 100 1000 10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Load Voltage (V) Time<br>LED Current (mA) On-Resistance () Load Current (mA)<br>Load Current (mA) )Blocking Voltage (VP Leakage Current (nA)<br>Load Current (A)<br>Output Capacitence (pF)<br>**----- End of picture text -----**<br>


*The Performance data shown in the graphs above is typical of device performance.  For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

R02 

**www.ixysic.com** 

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**CPC1125N** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to Y) the latest version of the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL) rating** as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~—EO~~|**Moisture Sensitivity Level (MSL) Rating**<br>~~—EO~~|
|---|---|
|CPC1125N<br>~~—EO~~|MSL 3<br>~~—EO~~|



## **ESD Sensitivity** 

This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **Reflow Profile** 

This product has a maximum body temperature and time rating as shown below. All other guidelines of **J-STD-020** must be observed. 

|**Device**<br>~~es~~|**Maximum Temperature x Time**<br>~~es~~|
|---|---|
|CPC1125N<br>~~es~~|260ºC for 30 seconds<br>~~es~~|



## **Board Wash** 

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 

## Pb e3 © ors 

R02 

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**CPC1125N** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **CPC1125N** 

**==> picture [440 x 418] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.089  ±  0.203 Recommended PCB Land Pattern<br>(0.161  ±  0.008)<br>0.200  ±  0.025<br>0.60<br>(0.008  ±  0.001)<br>(0.0217)<br>3.810  ±  0.076 6.096  ±  0.102<br>(0.150  ±  0.003) (0.240  ±  0.004)<br>0.432  ±  0.127<br>(0.017  ±  0.005) 5.60<br>Pin 1 i n h 1.02  ±  0.025 = (0.2205)<br>: (0.040  ±  0.001) ian Te<br>2.54 Typ 1.30<br>(0.100 Typ) (0.0512)<br>en<br>2.184 Max<br>2.54<br>(0.086 Max)<br>(0.10)<br>Lead to package standoff:<br>0.0637 ± 0.0383<br>=. (0.0025 ± 0.0015)<br>0.762  ±  0.102 0.381 TYP. Dimensions<br>(0.030  ±  0.004) Jhb (0.015 TYP.) a mm<br>(inches)<br>330.2 Dia<br>(13.00 Dia)<br>7 L 6eee6860<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>re 6 \ [<br>K0=2.70 A0=6.50 P=8.00(0.315)<br>(0.106) (0.256)<br>K1=2.30<br>(0.091)<br>a, User Direction of Feed<br>—_ Dimensions<br>Embossed mm<br>Carrier (inches)<br>AD e lc e}<br>Embossment NOTE:  All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br>


## **CPC1125NTR Tape & Reel** 

## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.  Neither circuit patent licenses nor indemnity are expressed or implied.  Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage.  IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 

Specification:  DS-CPC1125N-R02 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved.  Printed in USA. 

12/14/2012 

**6** 



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- [Supplier page](https://es.farnell.com/littelfuse/cpc1125n/mosfet-relay-spst-nc-0-1a-400v/dp/3995866)
---

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