# MOSFET Relay, SPST-NC (1 Form B), AC / DC, 60 V, 150 mA, SOP-4, Surface Mount

![Product image](https://novapart.co/image/farnell:3995897/)

**URL**: https://novapart.co/products/CPC1117N/mosfet-relay-spst-nc-1-form-b-ac-dc-60-v-150-ma
**SKU**: CPC1117N
**Manufacturer**: LITTELFUSE
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €0.8750
**Stock**: 1000+
**Lead Time**: 169 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NC (1 Form B) |
| Load Current | 150mA |
| Product Range | OptoMOS Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Gull Wing |
| Load Voltage Max | 60V |
| Isolation Voltage | 1.5kV |
| I/O Capacitance Typ | 1pF |
| On State Resistance Max | 16ohm |
| Mosfet Relay Package Style | SOP-4 |
| Off State Leakage Current Max | 1µA |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3995897/)

**CPC1117N 60V, 150mArms/mADC Single-Pole** INTEGRATED CIRCUITS DIVISION **Normally Closed Relay** ~~OIXYS~~ 

**Parameter Rating Units** Blocking Voltage 60 VP Load Current 150 mArms / mADC On-Resistance (max) 16  LED Current to Operate 1 mA ~~—~~ 

## **Features** 

- Designed for use in security systems complying with EN50130-4 

- Only 1mA of LED current required to operate 

- 1500Vrms Input/Output Isolation 

- Small 4-Pin SOP Package 

- High Reliability 

- No EMI/RFI Generation 

## **Description** 

The CPC1117N is a miniature normally-closed single-pole (1-Form-B) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input/ output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS architecture. The optically coupled output is controlled by the input's highly efficient infrared LED. 

IXYS Integrated Circuits' state of the art doublemolded vertical construction packaging makes the CPC1117N one of the world’s smallest relays. It offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. 

- Immune to radiated EM fields 

- Tape & Reel Version Available 

- Flammability Rating UL 94 V-0 

## **Approvals** 

- UL Recognized Component: File E76270 

- CSA Certified Component: Certificate 1172007 

- TUV EN 62368-1: Certificate # B 082667 0008 

## **Applications** 

- Security 

- Passive Infrared Detectors (PIR) 

- Data Signalling 

- Sensor Circuitry 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment—Patient/Equipment Isolation 

- Industrial Controls 

**Ordering Information** 

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**----- Start of picture text -----**<br>
Part # Description<br>CPC1117N 4-Pin SOP (100/tube)<br>CPC1117NTR 4-Pin SOP (2000/reel)<br>—<br>Pin Configuration<br>1 4<br>+ Control Load<br>2 3<br>– Control Load<br>**----- End of picture text -----**<br>


## **Pin Configuration** 

## **Switching Characteristics of Normally-Closed Devices** 

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Form-B<br>IF<br>ILOAD<br>90%<br>10%<br>toff ton<br>**----- End of picture text -----**<br>


**1** 

DS-CPC1117N-R11 

**www.ixysic.com** 

**CPC1117N** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Disipation1|70|mW|
|Total Power Dissipation2|400|mW|
|Isolation Voltage, Input to Output|1500|Vrms|
|Operational Temperature, Ambient|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC 

2  Derate output power linearly 3.33 mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Blocking Voltage<br>~~es~~|IL=1A<br>~~es~~|VDRM<br>~~es~~|60<br>~~es~~|-<br>~~es~~|-<br>~~es~~|V<br>~~es~~|
|Load Current<br>Continuous1<br>Peak<br>~~es~~|IF=0mA<br>~~es~~|IL<br>~~es~~|-<br>~~es~~|-<br>~~es~~|150<br>~~es~~|mArms/ mADC<br>~~es~~|
||t=10ms<br>~~es~~|ILPK<br>~~es~~|-<br>~~es~~|-<br>~~es~~|±350<br>~~es~~|mAP<br>~~es~~|
|On-Resistance2|IF=0mA, IL=120mA<br>~~es~~|RON|-|5|16||
|Off-State Leakage Current<br>~~ee~~|IF=1mA, VL=60VP<br>~~ee~~<br>~~es~~|ILEAK<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|1<br>~~ee~~|µA<br>~~ee~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~ee~~|IF=2mA, VL=10V<br>~~ee~~<br>~~es~~|ton<br>~~ee~~|-<br>~~ee~~|0.316<br>~~ee~~|10<br>~~ee~~|ms<br>~~ee~~|
|||toff<br>~~ee~~|-<br>~~ee~~|1.55<br>~~ee~~|10<br>~~ee~~||
|Output Capacitance<br>~~ee~~|IF=1mA, VL=50V, f=1MHz<br>~~ee~~<br>~~es~~|COUT<br>~~ee~~|-<br>~~ee~~|10<br>~~ee~~|-<br>~~ee~~|pF<br>~~ee~~|
|**Input Characteristics**|||||||
|Input Control Current to Activate (Output Open)3|-|IF|-|0.16|1|mA|
|Input Control Current to Deactivate (Output Closed)|IL=120mA|IF|0.1|0.14|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Common Characteristics**|||||||
|Capacitance, Input to Output|VIO=0V, f=1MHz|CIO|-|1|-|pF|



1   Load current derates linearly from 150mA @ 25oC to 100mA @85oC. 

2   Measurement taken within 1 second of on-time. 

3   For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended. 

R11 

**www.ixysic.com** 

**2** 

call INTEGRATED CIRCUITS DIVISION **CPC1117N** ~~a~~ 

## **PERFORMANCE DATA*** 

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**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical IF for Switch Operation Typical On-Resistance Distribution<br>(N=50, IF=5mA) (N=50, IL=150mA) (N=50, IL=150mA)<br>3530 20 3530 T ODD LLL<br>2520 15 2520 TOTa<br>10<br>1510 5 1510 =|2a|<br>50 0 50 an_<br>1.17 1.19 1.21 1.23 1.25 0.11 0.13 0.15 0.17 0.19 0.21 0.23 5.0 5.1 5.2 5.3 5.4 5.5 5.6<br>LED Forward Voltage Drop (V) LED Current (mA) On-Resistance ( )<br>Typical Turn-On Time Typical Turn-Off Time Typical Blocking Voltage Distribution<br>(N=50, IF=2mA, IL=100mA) (N=50, IF=2mA, IL=100mA) (N=50, IF=1mA)<br>25 20 35<br>30<br>20<br>15 ete tee) 25<br>15 20<br>10 20<br>10 | See 15<br>5 10<br>5<br>||| 5 -— | 22<br>0 0 Hii. | $ 0 ——ii<br>0.28 0.30 0.32 0.34 0.36 0.38 1.15 1.30 1.45 1.60 1.75 1.90 2.05 85 90 95 100 105 110 115<br>Turn-On Time (ms) Turn-Off Time (ms) Blocking Voltage (VP)<br>Typical IF for Switch Operation<br>Typical LED Forward Voltage Drop vs. Temperature<br>1.6 vs. Temperature 0.30 (IL=100mA) 150 Typical Load Current vs. Load Voltage<br>IF=50mA<br>1.5 IF=20mA 100<br>IF=10mA 0.25<br>1.4 yi 50<br>1.3 SST 0.20 0<br>1.2 Poses -50<br>IF=5mA 0.15<br>1.1 IF=2mA -100<br>IF=1mA<br>1.0 | ttt F 0.10 -150<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -1.00 -0.66 -0.33 0 0.33 0.66 1.00<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Typical Turn-On Time Typical Turn-Off Time<br>vs. LED Forward Current vs. LED Forward Current Typical On-Resistance vs. Temperature<br>0.35 (IL=100mA) 3.0 (IL=100mA) 8 (IF=0mA, IL=150mA)<br>0.34<br>0.33 —-—+--+ + 4 2.5 7 PEEL LILA<br>0.32 —— 2.0 ef 6 | | |[71]<br>0.31<br>0.30 1.5 5<br>0.29<br>0.28 1.0 4<br>0.27 — +++ 4 0.5 3 =T LLL,<br>0.26<br>0.25 — + + 0.0 2 EEL<br>0 10 20 30 40 50 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100<br>LED Current (mA) LED Current (mA) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>LED Current (mA) Load Current (mA)<br>LED Forward Voltage (V)<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ()<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

**www.ixysic.com** 

R11 

**3** 

a all INTEGRATED CIRCUITS DIVISION **CPC1117N** ~~iss~~ 

## **PERFORMANCE DATA*** 

**==> picture [496 x 429] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Turn-On Time Typical Turn-Off Time Maximum Load Current<br>vs. Temperature vs. Temperature vs. Temperature<br>0.45 (IL=100mA) 5 (IL=100mA) 225 (IF=0mA)<br>IF=1mA 200<br>0.400.35 w/t ft ft ft IIFF=10mA=5mA 43 IFII=10mAFF=2mA=5mA | | | LF] 175150 eS<br>SNC>. QR : IF=2mA |SseesSS 125 EEEREEEEEos<br>IF=1mA 100<br>0.30 ET IN|| 2 E Sex] —<br>“<4, LA | | L 75 FET<br>0.25 ~Gin 1 FTaTter]— 50 Po| tT fT | ht lt<br>SN ft<br>he RSEE 25 EEE<br>0.20 0 0<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 120<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical Blocking Voltage Typical Leakage vs. Temperature<br>vs. Temperature Measured Across Pins 3&4 Output Capacitance vs. Load Voltage<br>125 (IF=2mA) 0.40 (IF=2mA, VL=60V) 40 (IF=0.5mA)<br>120 TILL 0.35 Fe | hE hE hE hE 35<br>0.30<br>115 30<br>110 So 0.25 SS 25 ea<br>0.20<br>105 a pot tT ft ft ty | 20 ee<br>=> 0.15 FE—__+++|+| huT hud hdl CUE FE;4 PCE~<br>100 15<br>95 ae 0.100.05 a 10 ee<br>90 FLLELLL 1 0 ——— ae 5 FLL<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 10 20 30 40 50 60<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Energy Rating Curve<br>1.0<br>0.9 F T MTTTT<br>0.8 UR<br>0.7 a a a<br>0.6<br>ELTMINGTNT TTT TT TT TTT TT<br>0.5 EM EASA TTT TTT TIT TTT<br>0.4 ETM TIM SAU TTT TTT TTT Til<br>0.3 ETM TTUTNETTT TTI TT<br>0.2 00<br>0.1 ET TEMA CUTE UTILPoste<br>0 F CTEVIME TEIN TCE TET TAIT<br>10μs 100μs 1ms 10ms 100ms 1s 10s 100s<br>Time<br>Turn-On Time (ms) Turn-Off Time (ms) Load Current (mA)<br>)P<br>Leakage (µA)<br>Blocking Voltage (V<br>Output Capacitance (pF)<br>Load Current (A)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R11 

**www.ixysic.com** 

**4** 

**CPC1117N** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of % the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~———————~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~———————~~|
|---|---|
|CPC1117N<br>~~———————~~|MSL 3<br>~~———————~~|



## **ESD Sensitivity** 

This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. 

|**Device**<br>~~oe~~|**Classifi cation Temperature (Tc)**<br>~~oe~~|**Dwell Time (tP)**<br>~~oe~~|**Max Refl ow Cycles**<br>~~oe~~|
|---|---|---|---|
|CPC1117N<br>~~oe~~|260ºC<br>~~oe~~|30 seconds<br>~~oe~~|3<br>~~oe~~|



## **Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 

**www.ixysic.com** 

R11 

**5** 

**CPC1117N** 

INTEGRATED CIRCUITS DIVISION 

## **Mechanical Dimensions** 

## **CPC1117N** 

**==> picture [386 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.089  ±  0.025 Recommended PCB Land Pattern<br>(0.161  ±  0.001)<br>0.203 ± 0.025<br>0.60<br>(0.008 ± 0.001)<br>(0.024)<br>3.810  ±  0.025 att 6.096  ±  0.102 a o t e<br>(0.150  ±  0.001) (0.240  ±  0.004)<br>0.559  ±  0.127<br>(0.022  ±  0.005) 3.85<br>Pin 1 0.910  ±  0.025 (0.152)<br>Ly, 2.54 Typ (0.036  ±  0.001) an 1.54 vs ,<br>(0.100 Typ) (0.061)<br>4<br>2.030 ±  0.025 2.54<br>(0.080 ±  0.001) Dimensions (0.10)<br>Package standoff: mm<br>0.051 ± 0.051 (inches)<br>0.481 (0.0020 ± 0.0020)<br>(0.019) Note:<br>(0-0.004)0-0.1 cal (0.015 0.381  ±±  0.025 0.001) 1. Lead dimensions do not include plating: 1000 microinches max.2. Controlling dimension: mm<br>**----- End of picture text -----**<br>


## **CPC1117NTR Tape & Reel** 

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**----- Start of picture text -----**<br>
330.2 Dia<br>(13.00 Dia)<br>L beeeoeo60 ] |<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>K0=2.70 A0=6.50 P1=8.00(0.315)<br>(0.106) (0.256)<br>K1=2.30<br>(0.091)<br>a, User Direction of Feed<br>Dimensions<br>Embossed mm<br>Carrier (inches)<br>ND -<br>Embossment NOTE:  All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br>


## **For additional information please visit our website at: https://www.ixysic.com** 

**Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** 

Specification:  DS-CPC1117N-R11 

©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved.  Printed in USA. 

**6** 

8/9/2021 



## Links

- [View this product on Novapart](https://novapart.co/products/CPC1117N/mosfet-relay-spst-nc-1-form-b-ac-dc-60-v-150-ma)
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- [Supplier page](https://es.farnell.com/littelfuse/cpc1117n/mosfet-relay-spst-nc-0-15a-60v/dp/3995897)
---

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