# MOSFET Relay, SPST-NC (1 Form B), AC / DC, 60 V, 75 mA, SOP-4, Surface Mount

![Product image](https://novapart.co/image/farnell:3995858/)

**URL**: https://novapart.co/products/CPC1106NTR/mosfet-relay-spst-nc-1-form-b-ac-dc-60-v-75-ma-sop
**SKU**: CPC1106NTR
**Manufacturer**: LITTELFUSE
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €0.8290
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NC (1 Form B) |
| Load Current | 75mA |
| Product Range | OptoMOS Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Gull Wing |
| Load Voltage Max | 60V |
| Isolation Voltage | 1.5kV |
| I/O Capacitance Typ | 1pF |
| On State Resistance Max | 10ohm |
| Mosfet Relay Package Style | SOP-4 |
| Off State Leakage Current Max | 1µA |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3995858/)

**CPC1106N Single-Pole, Normally Closed 4-Lead SOP OptoMOS[®] Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Load Current|75|mArms/ mADC|
|On-Resistance (max)|10||
|LED Current to Operate|0.5|mA|



## **Features** 

- Designed for EN50130-4 Compliant Security Systems 

- Only 0.5mA of LED Current Required to Operate 

- 1500Vrms Input/Output Isolation 

- Small 4-Lead SOP Package 

## **Description** 

The CPC1106N is a miniature, single-pole, normally closed (1-Form-B) solid state relay in a 4-lead SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. 

The relay outputs are constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED, provides the optically coupled control. 

- TTL/CMOS Compatible Input 

- No Moving Parts 

- High Reliability 

- Arc-Free With No Snubbing Circuits 

- No EMI/RFI Generation 

- Immune to Radiated EM Fields 

- SMD Pick & Place, Wave Solderable 

The CPC1106N, using IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays, offers board space savings of at least 20% over the competitor’s larger 4-lead SOP relay. 

- Tape & Reel Version Available 

## **Applications** 

- Security 

- Passive Infrared Detectors (PIR) 

- Data Signalling 

## **Approvals** 

   - UL Recognized Component: File E76270 

   - CSA Certified Component: Certificate 1175739 

   - EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 

- Sensor Circuitry 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|CPC1106N|4-Lead SOP (100/tube)|
|CPC1106NTR|4-Lead SOP (2000/reel)|



- Medical Equipment—Patient/Equipment Isolation 

- Aerospace 

- Industrial Controls 

## **Pin Configuration** 

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**----- Start of picture text -----**<br>
1 4<br>+ Control Load<br>2 3<br>– Control Load<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally Closed Devices** 

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Pb<br>**----- End of picture text -----**<br>


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e3<br>**----- End of picture text -----**<br>


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Form-B<br>IF<br>ILOAD 90%<br>10%<br>toff ton<br>**----- End of picture text -----**<br>


DS-CPC1106N-R03 

**1** 

**www.ixysic.com** 

**CPC1106N** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Disipation|70|mW|
|Total Power Dissipation1|400|mW|
|Isolation Voltage, Input to Output|1500|Vrms|
|ESD Rating, Human Body Model|8|kV|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

1  Derate linearly 3.33 mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**<br>~~ey~~|**Conditions**<br>~~ee~~|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~eyee~~|||||||
|Load Current<br>Continuous<br>Peak<br>~~ey~~|IF=0mA<br>~~ee~~|IL|-|-|75|mArms/ mADC|
||t=10ms<br>~~ee~~|ILPK|-|-|±350|mAP|
|On-Resistance1<br>~~ey ~~<br>~~es~~|IF=0mA, IL=75mA<br> ~~ee~~<br>~~ee~~|RON<br>~~ee~~|-|3.85|10||
|Off-State Leakage Current<br>~~es~~|IF=0.5mA, VL=60VP<br>~~ee~~|ILEAK<br>~~ee~~|-|-|1|µA|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~es~~|IF=2mA, VL=10V<br>~~ee~~|ton<br>~~ee~~|-|-|10|ms|
|||toff<br>~~ee~~|-|-|10||
|Output Capacitance<br>~~es~~|IF=0.5mA, VL=50V, f=1MHz<br>~~ee~~|COUT<br>~~ee~~|-|10|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate2|-|IF|-|0.16|0.5|mA|
|Input Control Current to Deactivate|IL=75mA|IF|0.05|-|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.4|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Common Characteristics**|||||||
|Capacitance, Input to Output|-|-|-|1|-|pF|



1   Measurement taken within 1 second of on-time. 

2   For applications requiring high temperature operation (greater than 60oC) a LED drive current of 2mA is recommended. 

R03 

**www.ixysic.com** 

**2** 

cal INTEGRATED CIRCUITS DIVISION **CPC1106N** ~~a~~ 

**CPC1106N** 

## **PERFORMANCE DATA*** 

**==> picture [493 x 579] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance Distribution<br>25 (N=50, IF=2mA, IL=75mA, TA=25ºC) 25 (N=50, IF=2mA, IL=75mA, TA=25ºC) 25 (N=50, IF=0mA, IL=75mA, TA=25ºC)<br>20 eee e 20 ee ee 20 e<br>1510 eee!e PeeEee 1510 F| eee 1510 ee ee<br>5 See | | 5 Bee | 5 eee ||  aelee<br>0 ae |h=h6U 0 6$ §L MLL! 6|lUGC 0 $C  LO<br>0.50 0.53 0.56 0.59 0.62 0.65 0.68 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 3.70 3.75 3.80 3.85 3.90 3.95 4.00<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ( )<br>Typical IF for Switch Operation Typical Blocking Voltage Distribution Typical LED Forward Voltage Drop<br>20 (N=50, IL=75mA, TA=25ºC) 1412 t+ {| Lt (N=50, IF=0.5mA, TA=25ºC) 3025 (N=50, IF=5mA, TA=25ºC)<br>15<br>10 oon | oe 20<br>8<br>10 | | | ai 15 |<br>6<br>4 |eel | | i il a| 10 |<br>5<br>0 20 miimidi i iil!il 50 |m n lid)bshE i | eelt<br>0.11 0.13 0.15 0.17 0.19 0.21 0.23 79 81 83 85 87 89 91 93 1.235 1.240 1.245 1.250 1.255 1.260 1.265<br>LED Forward Current (mA) Blocking Voltage (VP) LED Forward Voltage (V)<br>Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>1.6 vs. Temperature 548 (IL=50mA, TA=25ºC) 1400 (IL=50mA, TA=25ºC)<br>1.5 et | tt IIIFFF=50mA=20mA=10mA 546544 a 12001000 ee es<br>1.4<br>etsy |. 542 GSSsS. 800 eee<br>1.3 540<br>SESE TE) baer 600<br>538<br>1.2 Sse! Ae SOC 400<br>1.1 IIIFFF=5mA=2mA=1mA 536534 200<br>1.0 EPtSStte 532 7ee+t+4+ es el ee 4 .  R 0 n e e<br>-40 -20 0 20 40 60 80 100 0 10 20 30 40 50 0 10 20 30 40 50<br>Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)<br>Typical IF for Switch Operation Typical Turn-On Time Typical Turn-Off Time<br>vs. Temperature vs. Temperature vs. Temperature<br>0.30 (IL=50mA) 900 (IL=50mA) 3000 (IL=50mA)<br>800 2500<br>0.25 700 aa IF=1mA<br>2 600 2000 4 IIFF=2mA=5mA<br>0.20 500400 ESS IIIFFF=5mA=2mA=1mA = 15001000 aN f<br>0.15 300 SEN Se<br>0.10 200100 FEESaee ee 5000 Sp t +eoe<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>s) s)<br>Turn-On Time ( Turn-Off Time (<br>LED Forward Voltage (V)<br>s) s)<br>Turn-On Time ( Turn-Off Time (<br>LED Forward Current (mA)<br>**----- End of picture text -----**<br>


*The Performance Data shown in the graphs above is typical of device performance.  For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

R03 

**www.ixysic.com** 

**3** 

al INTEGRATED CIRCUITS DIVISION **CPC1106N** ~~a~~ 

**CPC1106N** 

## **PERFORMANCE DATA*** 

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**----- Start of picture text -----**<br>
Typical On-Resistance Typical Load Current Maximum Load Current<br>vs. Temperature vs. Load Voltage vs. Temperature<br>5.0 (IF=0mA, IL=50mA) 100 (IF=0mA, TA=25ºC) 80 (IF=0mA)<br>75<br>- 4.5 TTT 50 70 so<br>65<br>4.0 FL] [|] LeZ 0 60 FSSa  SE<br>55<br>3.5 | | tee]7 | | -50 50 eeee ee ee<br>45<br>3.0 CLE -100 40 Fe e ERRERS ee ee<br>-40 -20 0 20 40 60 80 100 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Load Voltage (V) Temperature (ºC)<br>Typical Blocking Voltage Typical Leakage vs. Temperature<br>vs. Temperature Measured Across Pins 3&4 Output Capacitance vs. Load Voltage<br>84 (IF=1mA) 50 (IF=1mA, VL=60V) 40 (IF=0.5mA)<br>82 r | | | | pr 40 35 Fs. | | [ [ 4]<br>30<br>80<br>r | | [| Pe 30 25 eee<br>78<br>rf | ef 20 os<br>20<br>76<br>15<br>74 Seey 10 10 f+REECE|ry<br>72 ~| | tt tl 0 5 Te LoL|Lo|<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 10 20 30 40 50 60<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Energy Rating Curve<br>(IF=0mA)<br>800<br>700 Tintin<br>600 2301) SS 0000A<br>500 2301/0005 ENNAOR<br>400300200 2001TECMUCLA [0] LNSTA LT<br>100 2001000 0000<br>0 2 301/0000 001i<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time<br>)<br>On-Resistance ( Load Current (mA) Load Current (mA)<br>)Blocking Voltage (VP Leakage Current (nA)<br>Output Capacitance (pF)<br>Load Current (mA)<br>**----- End of picture text -----**<br>


*The Performance Data shown in the graphs above is typical of device performance.  For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

R03 

**www.ixysic.com** 

**4** 

**CPC1106N** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to Y) the latest version of the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL) rating** as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~—EO~~|**Moisture Sensitivity Level (MSL) Rating**<br>~~—EO~~|
|---|---|
|CPC1106N<br>~~—EO~~|MSL 3<br>~~—EO~~|



## **ESD Sensitivity** 

This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **Reflow Profile** 

This product has a maximum body temperature and time rating as shown below. All other guidelines of **J-STD-020** must be observed. 

|**Device**<br>~~es~~|**Maximum Temperature x Time**<br>~~es~~|
|---|---|
|CPC1106N<br>~~es~~|260ºC for 30 seconds<br>~~es~~|



## **Board Wash** 

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 

## Pb e3 © ors 

R03 

**www.ixysic.com** 

**5** 

**CPC1106N** 

INTEGRATED CIRCUITS DIVISION 

## **Mechanical Dimensions** 

## **CPC1106N** 

**==> picture [404 x 418] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.089  ±  0.203 Recommended PCB Land Pattern<br>(0.161  ±  0.008) 0.200  ±  0.025<br>(0.008  ±  0.001) 0.60<br>(0.0217)<br>3.810  ±  0.076 6.096  ±  0.102<br>(0.150  ±  0.003) (0.240  ±  0.004)<br>0.432  ±  0.127<br>(0.017  ±  0.005) 5.60<br>Pin 1 1.02  ±  0.025 (0.2205)<br>(0.040  ±  0.001)<br>2.54 Typ 1.30<br>(0.100 Typ) (0.0512)<br>: 4<br>2.184 Max<br>2.54<br>(0.086 Max)<br>(0.10)<br>Lead to package standoff:<br>0.0637 ± 0.0383<br>i. (0.0025 ± 0.0015)<br>(0.030 0.762  ±±  0.102 0.004) JL (0.015 TYP.)0.381 TYP. — Dimensionsmm<br>(inches)<br>330.2 Dia<br>(13.00 Dia)<br>- | beeoe06<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>ra Eh elce 86 6 \}[<br>K(0.106)0=2.70 A(0.256)0=6.50 P=8.00(0.315)<br>K1=2.30<br>(0.091)<br>a, User Direction of Feed<br>Dimensions<br>Embossed mm<br>Carrier (inches)<br>ND |<br>Embossment NOTE:  All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br>


## **CPC1106NTR Tape & Reel** 

## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.  Neither circuit patent licenses nor indemnity are expressed or implied.  Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage.  IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 

Specification:  DS-CPC1106N-R03 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved.  Printed in USA. 

**6** 

12/14/2012 



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- [Supplier page](https://es.farnell.com/littelfuse/cpc1106ntr/mosfet-relay-spst-nc-0-075a-60v/dp/3995858)
---

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