# MOSFET Relay, SPST-NO (1 Form A), AC / DC, 60 V, 75 mA, SOP-4, Surface Mount

![Product image](https://novapart.co/image/farnell:3995905/)

**URL**: https://novapart.co/products/CPC1006NTR/mosfet-relay-spst-no-1-form-a-ac-dc-60-v-75-ma-sop
**SKU**: CPC1006NTR
**Manufacturer**: LITTELFUSE
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €0.7040
**Stock**: 1000+
**Lead Time**: 85 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NO (1 Form A) |
| Load Current | 75mA |
| Product Range | OptoMOS Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Gull Wing |
| Load Voltage Max | 60V |
| Isolation Voltage | 1.5kV |
| I/O Capacitance Typ | 1pF |
| On State Resistance Max | 10ohm |
| Mosfet Relay Package Style | SOP-4 |
| Off State Leakage Current Max | 1µA |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3995905/)

**CPC1006N 60V, 75mArms/mADC Single-Pole Normally Open Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Load Current|75|mArms/ mADC|
|On-Resistance (max)|10||
|LED Current to operate|0.5|mA|



## **Features** 

- Designed for EN50130-4 Compliant Security Systems 

- 1500Vrms Input/Output Isolation 

- Only 0.5mA of LED Current Required to Operate 

- Small 4-Pin SOP Package 

- High Reliability 

- No EMI/RFI Generation 

- Immune to Radiated EM Fields 

- Tape & Reel Version Available 

## **Description** 

The CPC1006N  is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. 

The relay outputs are constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. 

Using IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays, the CPC1006N offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. 

- Flammability Rating UL 94 V-0 

## **Approvals** 

## **Applications** 

- Security 

- Passive Infrared Detectors (PIR) 

- Data Signalling 

- Sensor Circuitry 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- UL Recognized Component: File E76270 

- CSA Certified Component: Certificate 1172007 

- TUV EN 62368-1: Certificate # B 082667 0008 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|CPC1006N|4-Pin SOP (100/tube)|
|CPC1006NTR|4-Pin SOP (2000/reel)|



- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

## **Pin Configuration** 

- Medical Equipment—Patient/Equipment Isolation 

- Industrial Controls 

**==> picture [109 x 39] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 4<br>+ Control Load<br>2 3<br>– Control Load<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally-Open Devices** 

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**----- Start of picture text -----**<br>
Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>


**1** 

DS-CPC1006N-R06 

**www.ixysic.com** 

**CPC1006N** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation1|70|mW|
|Total Power Dissipation2|400|mW|
|Isolation Voltage Input to Output|1500|Vrms|
|ESD Rating, Human Body Model|4|kV|
|Operational Temperature, Ambient|-40 to +85|ºC|
|Storage Temperature|-40 to +125|ºC|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC 

2  Derate output power linearly 3.33 mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~esee~~|||||||
|Blocking Voltage<br>~~es~~|IL=1A<br>~~ee~~|VDRM|60|-|-|V|
|Load Current<br>Continuous<br>Peak<br>~~es~~|IF=0.5mA<br>~~ee~~|IL|-|-|75|mArms/ mADC|
||t=10ms<br>~~ee~~|ILPK|-|-|±350|mAP|
|On-Resistance1<br>~~es ~~<br>~~ee~~|IF=0.5mA, IL=75mA<br> ~~ee~~|RON|-|7|10||
|Off-State Leakage Current<br>~~ee~~|IF=0mA, VL=60VP|ILEAK|-|-|1|A|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~ee~~|IF=2mA, VL=10V|ton|-|-|10|ms|
|||toff|-|-|10|ms|
|Output Capacitance<br>~~ee~~|IF=0mA, VL=50V, f=1MHz|COUT|-|5|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate2|IL=75mA|IF|-|0.1|0.5|mA|
|Input Control Current to Deactivate|-|IF|0.05|-|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|A|
|**Common Characteristics**|||||||
|Capacitance, Input to Output|VIO=0V, f=1MHz|CIO|-|1|-|pF|



1   Measurement taken within 1 second of on-time. 

2   For applications requiring high temperature operation (greater than 60ºC) a minimum LED drive current of 2mA is recommended. 

R06 

**www.ixysic.com** 

**2** 

call INTEGRATED CIRCUITS DIVISION **CPC1006N** ~~OOS~~ 

**CPC1006N** 

## **PERFORMANCE DATA*** 

**==> picture [495 x 569] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical IF for Switch Operation Typical On-Resistance Distribution<br>(N=50, IF=5mA) (N=50, IL=75mA) (N=50, IF=0.5mA, IL=75mA)<br>302520 T2 e 2520 2520<br>15 15<br>15 22<br>10 10<br>10 ==<br>5 5 5<br>an /!oo<br>0 = | | 0 0<br>1.235 1.240 1.245 1.250 1.255 1.260 1.265 0.07 0.08 0.09 0.10 0.11 0.12 6.7 6.8 6.9 7.0 7.1 7.2 7.3<br>LED Forward Voltage (V) LED Forward Current (mA) On-Resistance ( )<br>Typical Turn-On Time Typical Turn-Off Time Typical Blocking Voltage Distribution<br>(N=50, IF=2mA, IL=75mA) (N=50, IF=2mA, IL=75mA) (N=50, IF=0mA)<br>25 25 25<br>20 20 20<br>1510 20S00Pt tT eyGeesEE 1510 eteee 1510 EtBeTT<br>5 26 | ~Se e eeee 5  Sees 5 Bee<br>0 2 | | See 0 ee | | dS| lh e 0 e s |<br>0.099 0.108 0.117 0.126 0.135 0.144 0.153 0.400 0.415 0.430 0.445 0.460 0.475 0.490 83 84 85 86 | 87 | 88 | 89 90 91<br>Turn-On Time (ms) Turn-Off Time (ms) Blocking Voltage (VP)<br>Typical IF for Switch Operation Typical Load Current<br>Typical LED Forward Voltage Drop vs. Temperature vs. Load Voltage<br>1.6 vs. Temperature 0.18 (IL=50mA) 100 (IF=0.5mA)<br>IF=50mA<br>1.5 IF=20mA 0.16<br>1.4 SS)<A IF=10mA 0.14 eea A 50<br>1.3 SESSA] 0.12 FL 0<br>1.2 0.10<br>SSS IF=5mA | EDT -50<br>1.1 IF=2mA 0.08<br>1.0 ZAR IF=1mA eee 0.06 eer -100<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance<br>vs. LED Forward Current vs. LED Forward Current vs. Temperature<br>300 (IL=50mA) 449 (IL=50mA) 12 (IF=1mA, IL=50mA)<br>250 Seer 448 beeper 11 eee<br>ee<br>10<br>200 447<br>_ I) - See =  A 9<br>150 446<br>{4 8 YA<br>100 Tr 445 AO 7 a<br>500 SSESSS 444443 a 65 eea<br>0 10 20 30 40 50 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100<br>LED Forward Current (mA) LED Forward Current (mA) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br> (mA)IF<br>Load Current (mA)<br>LED Forward Voltage (V)<br>s) s) )<br>Turn-On Time ( Turn-Off Time ( On-Resistance (<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

**www.ixysic.com** 

R06 

**3** 

A INTEGRATED CIRCUITS DIVISION **CPC1006N** ~~eee~~ 

## **PERFORMANCE DATA*** 

**==> picture [495 x 428] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Turn-On Time Typical Turn-Off Time Maximum Load Current<br>vs. Temperature vs. Temperature vs. Temperature<br>600 (IL=50mA) 700 (IL=50mA) 80 (IF=1mA)<br>500 600 75<br>IF=1mA 70<br>400 PEACE. IIFF=2mA=5mA 500 SEEPS 65 EERE<br>300<br>Fa Ses 400 SPSceeo 60 EERE<br>200 a= aNea as IF=5mA 55 FOE<br>100 300 IIFF=2mA=1mA 50<br>0 TEEerste) 200 NNL ELELLINS 45 aTTT<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical Leakage vs. Temperature<br>Typical Blocking Voltage Measured Across Pins 3&4 Output Capacitance vs. Load Voltage<br>94 vs. Temperature 10 (VL=60V) 14 (IF=0mA, f=1MHz)<br>92 8 12<br>Fi tT tt<br>90 6 10<br>Fi tT t_tE T AT;e UOEL ET T tT<br>88 4 8<br>PieeT tT vt} A<br>86 2 6<br>84 0 4<br>Pee LL L LL [PEL]<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 10 20 30 40 50 60<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Energy Rating Curve<br>(IF=0.5mA)<br>800<br>700<br>600 FUN ETT CTTETT<br>500400 02 1/0 011/0000)S80 NY<br>300 0011/0000<br>200 2 01 00/0A S00 A<br>100 CAE ICITC<br>0 NGM 011 000 A A<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time<br>s) s)<br>Turn-On Time ( Turn-Off Time ( Load Current (mA)<br>)Blocking Voltage (VP Leakage Current (nA)<br>Output Capacitance (pF)<br>Load Current (mA)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R06 

**www.ixysic.com** 

**4** 

**CPC1006N** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of ) the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~————~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~————~~|
|---|---|
|CPC1006N<br>~~————~~|MSL 3<br>~~————~~|



## **ESD Sensitivity** 

This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. 

|**Device**<br>~~———————~~|**Classifi cation Temperature (Tc)**<br>~~———————~~|**Dwell Time (tP)**<br>~~———————~~|**Max Refl ow Cycles**<br>~~———————~~|
|---|---|---|---|
|CPC1006N<br>~~———————~~|260ºC<br>~~———————~~|30 seconds<br>~~———————~~|3<br>~~———————~~|



## **Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 

**www.ixysic.com** 

R06 

**5** 

**CPC1006N** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **CPC1006N** 

**==> picture [454 x 410] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.089  ±  0.025 Recommended PCB Land Pattern<br>(0.161  ±  0.001)<br>0.203 ± 0.025<br>0.60<br>(0.008 ± 0.001)<br>(0.024)<br>feat a<br>3.810  ±  0.025 6.096  ±  0.102<br>(0.150  ±  0.001) (0.240  ±  0.004)<br>0.559  ±  0.127<br>(0.022  ±  0.005) 3.85<br>Pin 1 I 0.910  ±  0.025 - to (0.152)<br>(0.036  ±  0.001)<br>2.54 Typ 1.54<br>(0.100 Typ) (0.061)<br>a a nd<br>2.030 ±  0.025 2.54<br>(0.080 ±  0.001) Dimensions (0.10)<br>Package standoff: mm<br>0.051 ± 0.051 (inches)<br>0.481 (0.0020 ± 0.0020)<br>Note:<br>(0.019)<br>(0-0.004)0-0.1 cal (0.015 0.381  ±±  0.025 0.001) 1. Lead dimensions do not include plating: 1000 microinches max.2. Controlling dimension: mm<br>CPC1006NTR Tape & Reel<br>330.2 Dia<br>(13.00 Dia)<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>K(0.106)0=2.70 A(0.256)0=6.50 P1=8.00(0.315)<br>K1=2.30<br>(0.091)<br>oy b Saca, User Direction of Feed<br>Embossed — Dimensionsmm<br>Carrier (inches)<br>Embossment NOTE:  All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br>


## **CPC1006NTR Tape & Reel** 

## **For additional information please visit our website at: https://www.ixysic.com** 

**Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** 

Specification:  DS-CPC1006N-R06 

©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved.  Printed in USA. 

**6** 

8/9/2021 



## Links

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- [Supplier page](https://es.farnell.com/littelfuse/cpc1006ntr/mosfet-relay-spst-no-0-075a-60v/dp/3995905)
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