# Schottky Rectifier, 40 V, 2 A, Single, SMD, 2 Pins, 550 mV

![Product image](https://novapart.co/image/farnell:3872243/)

**URL**: https://novapart.co/products/CMS11(TE12L,Q,M)/schottky-rectifier-40-v-2-a-single-smd-pins-550-mv
**SKU**: CMS11(TE12L,Q,M)
**Manufacturer**: TOSHIBA
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1570
**Stock**: 1000+
**Lead Time**: 148 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | SMD |
| Diode Configuration | Single |
| Forward Voltage Max | 550mV |
| Forward Surge Current | 30A |
| Average Forward Current | 2A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3872243/)

CMS11 

TOSHIBA Schottky Barrier Rectifier  Schottky Barrier Type 

## **CMS11** 

## Switching Mode Power Supply Applications 

Unit: mm 

## Portable Equipment Battery Applications 

- Forward voltage: VFM = 0.55 V (max) 

- Average forward current: IF (AV) = 2.0 A 

- Repetitive peak reverse voltage: VRRM = 40 V 

- Suitable for compact assembly due to small surface-mount package “M−FLAT[TM] ” (Toshiba package name) 

## = **Absolute Maximum Ratings (Ta 25°C)** 

|Characteristics|Symbol|Rating|Unit|
|---|---|---|---|
|Repetitive peak reverse voltage|VRRM|40|V|
|Average forward current|IF (AV)<br>(Note 1)|2.0<br>(Ta=34°C)|A|
||IF (AV)|2.0<br>(Tℓ=119°C)||
|Peak one cycle surge forward current<br>(non-repetitive)|IFSM|30 (50 Hz)|A|
|Junction temperature|Tj|−40~150|°C|
|Storage temperature|Tstg|−40~150|°C|



- Note 1: Device mounted on a ceramic board 

|JEDEC|―|
|---|---|
|JEITA|―|
|TOSHIBA|3-4E1A|



(board size: 50 mm × 50 mm, soldering land: 2 mm × 2 mm) 

Weight: 0.023 g (typ.) 

- Note 2: Using continuously under heavy loads (e.g. the application of 

high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. 

- Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 

## **Electrical Characteristics (Ta** = **25°C)** 

|**Electrical Characteristics (Ta(Ta**|**Electrical Characteristics (Ta(Ta**=**25°C)**||||||
|---|---|---|---|---|---|---|
|Characteristics|Symbol|Test Condition|Min|Typ.|Max|Unit|
|Peak forward voltage<br>~~BE~~|VFM (1)<br>~~BE~~<br>~~ee~~|IFM =0.5 A<br>~~BE~~<br>~~ee~~|⎯<br>~~BE~~<br>~~ee~~|0.38<br>~~BE~~<br>~~ee~~|⎯<br>~~BE~~<br>~~ee~~|V|
||VFM (2)<br>~~BE~~<br>~~ee~~<br>~~ee~~|IFM =1.0 A<br>~~BE~~<br>~~ee~~<br>~~ee~~|⎯<br>~~BE~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.42<br>~~BE~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|⎯<br>~~BE~~<br>~~ee~~<br>~~ee~~||
||VFM (3)<br>~~BE~~<br>~~ee~~<br>~~ee~~|IFM =2.0 A<br>~~BE~~<br>~~ee~~<br>~~ee~~|⎯<br>~~BE~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.49<br>~~BE~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.55<br>~~BE~~<br>~~ee~~<br>~~ee~~||
|Repetitive peak reverse current<br>~~EEE~~<br>~~P|~~|IRRM<br>~~ee~~<br>~~EEE~~<br>~~rs~~<br>~~P|~~|VRRM =5.0 V<br>~~ee~~<br>~~EEE~~|⎯<br>~~ee~~<br>~~ee ~~<br>~~EEE~~|2.0<br>~~ee~~<br> ~~ee~~<br>~~EEE~~|⎯<br>~~ee~~<br>~~EEE~~|μA<br>|
|||VRRM =40 V<br>~~EEE~~<br>~~es~~<br>~~rs~~<br>|⎯<br>~~EEE~~<br>~~es~~<br>~~se~~<br>|20.0<br>~~EEE~~<br>~~es~~<br>~~se~~<br>|500<br>~~EEE~~<br>~~es~~<br>~~se~~<br>||
|Junction capacitance<br>~~es~~<br>~~P|~~|Cj<br>~~es~~<br>~~rs~~<br>~~P|~~|VR =10 V, f=1.0 MHz<br>~~es~~<br>~~rs~~<br>|⎯<br>~~es~~<br>~~se~~<br>|95<br>~~es~~<br>~~se~~<br>|⎯<br>~~es~~<br>~~se~~<br>|pF<br>~~es~~<br>|
|Thermal resistance<br>~~P|~~|Rth (j-a)<br>~~rs~~<br>~~P|~~|Device mounted on a ceramic board<br>(soldering land: 2 mm×2 mm)<br>~~rs~~<br>~~FF~~|⎯<br>~~se~~<br>~~FF~~|⎯<br>~~se~~<br>~~FF~~|60<br>~~se~~<br>~~FF~~|°C/W<br>~~FF~~|
|||Device mounted on a glass-epoxy<br>board<br>(soldering land: 6 mm×6 mm)<br>~~rs~~<br>~~FF~~|⎯<br>~~se~~<br>~~FF~~|⎯<br>~~se~~<br>~~FF~~|135<br>~~se~~<br>~~FF~~||
||Rth (j-ℓ)<br>~~rs~~<br>~~P| ~~|⎯<br>~~rs~~<br> ~~FF~~|⎯<br>~~se~~<br>~~FF~~|⎯<br>~~se~~<br>~~FF~~|16<br>~~se~~<br>~~FF~~||



2013-11-01 

CMS11 

## **Marking** 

|**arking**||
|---|---|
|Abbreviation Code|Part No.|
|SA|CMS11|



## **Standard Soldering Pad** 

**==> picture [169 x 84] intentionally omitted <==**

**----- Start of picture text -----**<br>
Unit: mm<br>1.4  3.0  1.4<br>2.1<br>**----- End of picture text -----**<br>


## **Handling Precaution** 

Schottky barrier diodes have reverse current characteristics compared to other diodes. 

There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. Please take forward and reverse loss into consideration during design. 

The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. 

- VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a device at low temperature. 

- IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV) and Tj be below 120°C. When using this device, take the margin into consideration by using an allowable Tamax-IF(AV) curve. 

- IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. 

- Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 120°C. 

Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 

Please refer to the Rectifiers databook for further information. 

2013-11-01 

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CMS11 

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**----- Start of picture text -----**<br>
iF – vF PF (AV) – IF (AV)<br>100 1.6<br>DC<br>SSSpf ft tf fy ty pe te eeSS 1.4 PE E a<br>α = 180°<br>1.2<br>Soe SS See eee PEPEPEEE E EE<br>10 α = 120°<br>a Tj = 150°C  Ls 1.0 PEE PAA<br>BE 125°C  EEE EES 0.8 Seagg28/ α = 60°<br>CO 2 ease<br>75°C  oY 0.6 | | | LAA Ti Rectangular waveform  i tt |<br>1<br>coy<br>eee) [/AERSREEEEEE] / 0.4 Semmes) 470<br>25°C<br>0°  α 360°<br>0.2<br>0.1 TEoo]. TTT EET tT 0.0 HAIAALtt tt Conduction angle:  te α<br>0  0.2  0.4  0.6  0.8  1.0  1.2  1.4  1.6  0.0  0.4  0.8  1.2  1.6  2.0  2.4  2.8  3.2<br>Instantaneous forward voltage  vF   (V)  Average forward current  IF (AV)  (A)<br>Ta max – IF (AV)<br>Device mounted on a ceramic board<br>(board size: 50 mm × 50 mm)  Tℓ max – IF (AV)<br>160  160<br>Coe Rectangular waveform Cooooo<br>140  DC  140 DC<br>n-Sngee IF(AV) sees —_ SsSeSnneee<br>Ps oF Fb == =<br>120  PEEP PSE 0°  α 360°  120 PRRSESS<br>Conduction angle: α α = 120°<br>100  CECCCCRSEPRETEEN le VR = 20 V  100 S 02S eee 2 oe<br>= α = 180°  PCP α = 60° ARP α = 180°<br>80  ROSEN α = 120°  80 SSSR SS 6 eee ae<br>CARCCO Rectangular  osos<br>PSENSSN S S ee waveform<br>60  CENCOONNOREENNSEC 60 ae osaos<br>40  α = 60°  40 0° α 360°<br>PO SSE em osoo<br>20  Coho00sSENSoe 20 Conduction  lo IF(AV) fesoooo<br>angle: α<br>20000 oe VR = 20 V feos<br>0  0<br>0  S000 0.4  0.8  1.2  oe 1.6  oe 2.0  2.4  2.8  3.2  0  0.4  0.8  1.2  COIPC 1.6  2.0  Ceci 2.4  2.8  3.2<br>Average forward current  IF (AV)  (A)  Average forward current  IF (AV)  (A)<br>rth (j-a) – t<br>1000<br>Device mounted on a glass-epoxy board<br>Soldering land: 2.1 mm × 1.4 mm<br>100<br>ST Ly sy dle<br>SS ett<br>Device mounted on a glass-epoxy board<br>10 Hi Hee Soldering land: 6.0 mm × 6.0 mm<br>Device mounted on a ceramic board<br>Centon Soldering land: 2.0 mm × 2.0 mm  mail<br>1<br>0.001  Peat 0.01  0.1  1  10  100  1000<br>Time  t  (s)<br>PF (AV)  (W)<br>Average forward power dissipation<br>Instantaneous forward current  iF  (A)<br>Tℓ max  (°C)  Tℓ max  (°C)<br>Maximum allowable lead temperature<br>Maximum allowable ambient temperature<br>Transient thermal impedance  rth (j-a)  (°C/W)<br>**----- End of picture text -----**<br>


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CMS11 

**==> picture [197 x 425] intentionally omitted <==**

**----- Start of picture text -----**<br>
Surge forward current (non-repetitive)<br>50<br>Ta = 25°C<br>f = 50 Hz<br>40  ai n sia<br>30  eeee el<br>20  sco ellin<br>10  aea = ll<br>ell<br>0<br>1  10  100<br>——<br>Number of cycles<br>IR – Tj (typ.)<br>100<br>Pulse test<br>Se<br>a [ee]<br>10  FERRE VR = 40 V  eee<br>Se | aa<br> aanaaaasse eae<br>1<br>Saaeeeeer?7/ een<br>0.1<br>aN VR = 30 V  TT<br>=== == VR = 20 V<br>0.01  VR = 10 V<br>==27 == VR = 5 V =====—<br>fa a<br>0.001  PERE EEE EEE<br>0  20  40  60  80  100  120  140  160<br>Junction temperature  Tj  (°C)<br>Peak surge forward current  IFSM  (A)<br>Repetitive peak reverse current  IR  (mA)<br>**----- End of picture text -----**<br>


**==> picture [205 x 423] intentionally omitted <==**

**----- Start of picture text -----**<br>
IR – Tj (typ.)<br>1000<br>f = 1 MHz<br>Ta = 25°C<br>==ee<br>Paooot$§|)<br>100 peaPET TET is<br>a<br>a<br>rTP<br>10 UTI CT<br>1  10  100<br>Reverse voltage  VR  (V)<br>PR (AV) – VR (typ.)<br>1.6<br>Rectangular<br>1.4 waveform  SPSS<br>0° 360° E<br>1.2 FEE L DC<br>1.0 VR LL α Sooo,<br>ron E AE 300°<br>0.8 Conduction angle: Tj = 150°C  α 240°<br>0.6 180°<br>th<br>120°<br>0.4 ae<br>0.2 SESRRREED? 2252292008<br>0.0 eeeeal α = 60°<br>0  10  20  30  40<br>Reverse voltage  VR  (V)<br>Junction capacitance  Cj  (pF)<br>PR (AV)  (W)<br>Average reverse power dissipation<br>**----- End of picture text -----**<br>


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CMS11 

## **RESTRICTIONS ON PRODUCT USE** 

- Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. 

- This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. 

- Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. **TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.** 

- **PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT (** " **UNINTENDED USE** " **).** Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. **IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.** For details, please contact your TOSHIBA sales representative. 

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- **ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.** 

- Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. 

- Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. **TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.** 

2013-11-01 

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