# Zener Single Diode, 13 V, 300 mW, SC-79, 2 Pins, 150 °C, Surface Mount
**URL**: https://novapart.co/products/BZX585-C13,115/zener-single-diode-13-v-300-mw-sc-79-2-pins-150-c
**SKU**: BZX585-C13,115
**Manufacturer**: NEXPERIA
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Zener Single Diodes
**Price**: €0.0620
**Stock**: 500+
**Lead Time**: 2 days (indicative)
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | BZX585 Series |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | SC-79 |
| Power Dissipation | 300mW |
| Zener Voltage Nom | 13V |
| Operating Temperature Max | 150°C |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:3439791/)
## _**DISCRETE SEMICONDUCTORS**_
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**----- Start of picture text -----**
DATA SHEET
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M3D319
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## **BZX585 series** Voltage regulator diodes
Product data sheet 2004 Jun 22 Supersedes data of 2004 Mar 26
**==> picture [249 x 119] intentionally omitted <==**
**NXP Semiconductors**
**Product data sheet**
## **Voltage regulator diodes**
## **BZX585 series**
## **FEATURES**
- Total power dissipation: max. 300 mW
- Two tolerance series: ± 2 % and ± 5 %
- Working voltage range: nominal 2.4 V to 75 V (E24 range)
- Non-repetitive peak reverse power dissipation: max. 40 W.
## **APPLICATIONS**
- General regulation functions.
## **DESCRIPTION**
Low-power voltage regulator diodes encapsulated in an ultra small SOD523 plastic SMD package.
The diodes are available in the normalized E24 ± 2 % (BZX585-B) and ± 5 % (BZX585-C) tolerance range.
The series consists of 37 types with nominal working voltages from 2.4 V to 75 V.
## **PINNING**
|**PINNING**|**PINNING**|**PINNING**||||||
|---|---|---|---|---|---|---|---|
|**PIN**|||**DESCRIPTION**|||||
|1|||cathode|||||
|2|||anode|||||
|||||||||
|�||||||||
|_handbook, halfpage_
**1**|||||**2**|||
|||||||||
|||||||||
|Top view
_MAM387_||||||||
|�
Fig.1 Simplified outline (SOD523) and symbol.
The marking bar indicates the cathode.||||||||
## **MARKING**
|**MARKING**||||||||
|---|---|---|---|---|---|---|---|
|**TYPE**
**NUMBER**|**MARKING**
**CODE**|**TYPE**
**NUMBER**|**MARKING**
**CODE**|**TYPE**
**NUMBER**|**MARKING**
**CODE**|**TYPE**
**NUMBER**|**MARKING**
**CODE**|
|**Marking codes for BZX585-B2V4 to BZX585-B75**||||||||
|BZX585-B2V4|C1|BZX585-B6V2|E1|BZX585-B16|EA|BZX585-B43|EM|
|BZX585-B2V7|C2|BZX585-B6V8|E2|BZX585-B18|EB|BZX585-B47|EN|
|BZX585-B3V0|C3|BZX585-B7V5|E3|BZX585-B20|EC|BZX585-B51|EP|
|BZX585-B3V3|C4|BZX585-B8V2|E4|BZX585-B22|ED|BZX585-B56|ER|
|BZX585-B3V6|C5|BZX585-B9V1|E5|BZX585-B24|EE|BZX585-B62|ES|
|BZX585-B3V9|C6|BZX585-B10|E6|BZX585-B27|EF|BZX585-B68|ET|
|BZX585-B4V3|C7|BZX585-B11|E7|BZX585-B30|EG|BZX585-B75|EU|
|BZX585-B4V7|C8|BZX585-B12|E8|BZX585-B33|EH|||
|BZX585-B5V1|C9|BZX585-B13|E9|BZX585-B36|EK|||
|BZX585-B5V6|C0|BZX585-B15|E0|BZX585-B39|EL|||
2004 Jun 22
2
NXP Semiconductors
Product data sheet
## Voltage regulator diodes
## BZX585 series
|**TYPE**
**NUMBER**|**MARKING**
**CODE**|**TYPE**
**NUMBER**|**MARKING**
**CODE**|**TYPE**
**NUMBER**|**MARKING**
**CODE**|**TYPE**
**NUMBER**|**MARKING**
**CODE**|
|---|---|---|---|---|---|---|---|
|**Marking codes for BZX585-C2V4 to BZX585-C75**||||||||
|BZX585-C2V4|F1|BZX585-C6V2|H1|BZX585-C16|HA|BZX585-C43|HM|
|BZX585-C2V7|F2|BZX585-C6V8|H2|BZX585-C18|HB|BZX585-C47|HN|
|BZX585-C3V0|F3|BZX585-C7V5|H3|BZX585-C20|HC|BZX585-C51|HP|
|BZX585-C3V3|F4|BZX585-C8V2|H4|BZX585-C22|HD|BZX585-C56|HR|
|BZX585-C3V6|F5|BZX585-C9V1|H5|BZX585-C24|HE|BZX585-C62|HS|
|BZX585-C3V9|F6|BZX585-C10|H6|BZX585-C27|HF|BZX585-C68|HT|
|BZX585-C4V3|F7|BZX585-C11|H7|BZX585-C30|HG|BZX585-C75|HU|
|BZX585-C4V7|F8|BZX585-C12|H8|BZX585-C33|HH|||
|BZX585-C5V1|F9|BZX585-C13|H9|BZX585-C36|HK|||
|BZX585-C5V6|F0|BZX585-C15|H0|BZX585-C39|HL|||
## **ORDERING INFORMATION**
|**TYPE**
**NUMBER**|**PACKAGE**|**PACKAGE**|**PACKAGE**|
|---|---|---|---|
||**NAME**|**DESCRIPTION**|**VERSION**|
|BZX585-B2V4
to
BZX585-B75|−|Plastic surface mounted package; 2 leads|SOD523|
|BZX585-C2V4
to
BZX585-C75|−|Plastic surface mounted package; 2 leads|SOD523|
## **LIMITING VALUES**
In accordance with the Absolute Maximum Rating System (IEC 60134).
|**SYMBOL**|**PARAMETER**|**CONDITIONS**|**MIN.**|**MAX.**|**UNIT**|
|---|---|---|---|---|---|
|IF|continuous forward current||−|200|mA|
|IZSM|non-repetitive peak reverse
current|tp= 100μs; square wave;
Tamb= 25°Cprior to surge|see Tables 1 and 2|||
|PZSM|non-repetitive peak reverse
power dissipation|tp= 100μs; square wave;
Tamb= 25°Cprior to surge|−|40|W|
|Ptot|totalpower dissipation|Tamb= 25°C; note 1|−|300|mW|
|Tstg|storage temperature||−65|+150|°C|
|Tj|junction temperature||−65|+150|°C|
## **Note**
1. Device mounted on an FR4 printed-circuit board with approximately 35 mm[2] Cu area at cathode tab.
2004 Jun 22
3
NXP Semiconductors
Product data sheet
## Voltage regulator diodes
## BZX585 series
## **ELECTRICAL CHARACTERISTICS**
## **Total BZX585-B and C series**
Tamb = 25 °C unless otherwise specified.
|Tamb= 25°|C unless otherwise specified.||||
|---|---|---|---|---|
|**SYMBOL**|**PARAMETER**|**CONDITIONS**|**MAX.**|**UNIT**|
|VF|forward voltage|IF= 10 mA; see Fig.2|0.9|V|
|||IF= 100 mA; see Fig.2|1.1|V|
|IR|reverse current
BZX585-B/C2V4
BZX585-B/C2V7
BZX585-B/C3V0
BZX585-B/C3V3
BZX585-B/C3V6
BZX585-B/C3V9
BZX585-B/C4V3
BZX585-B/C4V7
BZX585-B/C5V1
BZX585-B/C5V6
BZX585-B/C6V2
BZX585-B/C6V8
BZX585-B/C7V5
BZX585-B/C8V2
BZX585-B/C9V1
BZX585-B/C10
BZX585-B/C11
BZX585-B/C12
BZX585-B/C13
BZX585-B/C15 to 75|VR= 1 V
VR= 1 V
VR= 1 V
VR= 1 V
VR= 1 V
VR= 1 V
VR= 1 V|50
20
10
5
5
3
3|μA
μA
μA
μA
μA
μA
μA|
|||VR= 2 V
VR= 2 V
VR= 2 V|3
2
1|μA
μA
μA|
|||VR= 4 V
VR= 4 V|3
2|μA
μA|
|||VR= 5 V
VR= 5 V|1
700|μA
nA|
|||VR= 6 V|500|nA|
|||VR= 7 V|200|nA|
|||VR= 8 V
VR= 8 V
VR= 8 V|100
100
100|nA
nA
nA|
|||VR= 0.7VZnom|50|nA|
2004 Jun 22
4
## **Table 1** Per type BZX585- **B/C2V4** to **B/C24** Tamb = 25 °C unless otherwise specified. **WORKING VOLTAGE VZ (V)**
|Tamb= 25|°C unless otherwise specified.|°C unless otherwise specified.|°C unless otherwise specified.|°C unless otherwise specified.||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|**BZX585-**
**B or C**
**XXX**|**WORKING VOLTAGE**
**VZ (V)**
**at IZtest = 5 mA**||||**DIFFERENTIAL RESISTANCE**
**rdif (**Ω**)**||||**TEMP. COEFF.**
**SZ (mV/K)**
**at IZtest = 5 mA**
**(see figs**3**AND**4**)**|**DIODE CAP.**
**Cd (pF)**
**at f = 1 MHz;**
**VR = 0 V**|**NON-REPETITIVE PEAK**
**REVERSE CURRENT**
**IZSM (A) at tp = 100**μ**s**|
||**Tol.**±**2% (B)**||**Tol.**±**5% (C)**||**at IZtest = 1 mA**||**at IZtest = 5 mA**|||||
||**MIN.**|**MAX.**|**MIN.**|**MAX.**|**TYP.**|**MAX.**|**TYP.**|**MAX.**|**TYP.**|**MAX.**|**MAX.**|
|2V4|2.35|2.45|2.28|2.52|275|400|70|100|−1.3|450|6.0|
|2V7|2.65|2.75|2.57|2.84|300|450|75|100|−1.4|440|6.0|
|3V0|2.94|3.06|2.85|3.15|325|500|80|95|−1.6|425|6.0|
|3V3|3.23|3.37|3.14|3.47|350|500|85|95|−1.8|410|6.0|
|3V6|3.53|3.67|3.42|3.78|375|500|85|90|−1.9|390|6.0|
|3V9|3.82|3.98|3.71|4.10|400|500|85|90|−1.9|370|6.0|
|4V3|4.21|4.39|4.09|4.52|410|600|80|90|−1.7|350|6.0|
|4V7|4.61|4.79|4.47|4.94|425|500|50|80|−1.2|325|6.0|
|5V1|5.00|5.20|4.85|5.36|400|480|40|60|−0.5|300|6.0|
|5V6|5.49|5.71|5.32|5.88|80|400|15|40|1.0|275|6.0|
|6V2|6.08|6.32|5.89|6.51|40|150|6|10|2.2|250|6.0|
|6V8|6.66|6.94|6.46|7.14|30|80|6|15|3.0|215|6.0|
|7V5|7.35|7.65|7.13|7.88|15|80|2|10|3.6|170|4.0|
|8V2|8.04|8.36|7.79|8.61|20|80|2|10|4.3|150|4.0|
|9V1|8.92|9.28|8.65|9.56|20|100|2|10|5.2|120|3.0|
|10|9.80|10.20|9.50|10.50|20|150|2|10|6.0|110|3.0|
|11|10.78|11.22|10.45|11.55|25|150|2|10|6.9|110|2.5|
|12|11.76|12.24|11.40|12.60|25|150|2|10|7.9|105|2.5|
|13|12.74|13.26|12.35|13.65|25|170|2|10|8.8|105|2.5|
|15|14.70|15.30|14.25|15.75|25|200|3|15|10.7|100|2.0|
|16|15.68|16.32|15.20|16.80|50|200|10|40|12.4|90|1.5|
|18|17.64|18.36|17.10|18.90|50|225|10|45|14.4|80|1.5|
|20|19.60|20.40|19.00|21.00|60|225|15|55|16.4|70|1.5|
|22|21.56|22.44|20.90|23.10|60|250|20|55|18.4|60|1.25|
|24|23.52|24.48|22.80|25.20|60|250|25|70|20.4|55|1.25|
##
## **Table 2** Per type BZX585- **B/C27** to **B/C75**
Tamb = 25 °C unless otherwise specified.
|Tamb= 25|°C unless otherwise specified.|°C unless otherwise specified.|°C unless otherwise specified.|°C unless otherwise specified.||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|**BZX585-**
**B or C**
**XXX**|**WORKING VOLTAGE**
**VZ (V)**
**at IZtest = 2 mA**||||**DIFFERENTIAL RESISTANCE**
**rdif (**Ω**)**||||**TEMP. COEFF.**
**SZ (mV/K)**
**at IZtest = 2 mA**
**(see figs**3**and**4**)**|**DIODE CAP.**
**Cd (pF)**
**at f = 1 MHz;**
**VR = 0 V**|**NON-REPETITIVE**
**PEAK REVERSE**
**CURRENT**
**IZSM (A) at tp = 100**μ**s**|
||**Tol.**±**2 % (B)**||**Tol.**±**5 % (C)**||**at IZtest = 0.5 mA**||**at IZtest = 2 mA**|||||
||**MIN.**|**MAX.**|**MIN.**|**MAX.**|**TYP.**|**MAX.**|**TYP.**|**MAX.**|**TYP.**|**MAX.**|**MAX.**|
|27|26.46|27.54|25.65|28.35|65|300|25|80|23.4|50|1.0|
|30|29.40|30.60|28.50|31.50|70|300|30|80|26.6|50|1.0|
|33|32.34|33.66|31.35|34.65|75|325|35|80|29.7|45|0.9|
|36|35.28|36.72|34.20|37.80|80|350|35|90|33.0|45|0.8|
|39|38.22|39.78|37.05|40.95|80|350|40|130|36.4|45|0.7|
|43|42.14|43.86|40.85|45.15|85|375|45|150|41.2|40|0.6|
|47|46.06|47.94|44.65|49.35|85|375|50|170|46.1|40|0.5|
|51|49.98|52.02|48.45|53.55|90|400|60|180|51.0|40|0.4|
|56|54.88|57.12|53.20|58.80|100|425|70|200|57.0|40|0.3|
|62|60.76|63.24|58.90|65.10|120|450|80|215|64.4|35|0.3|
|68|66.64|69.36|64.60|71.40|150|475|90|240|71.7|35|0.25|
|75|73.50|76.50|71.25|78.75|170|500|95|255|80.2|35|0.2|
## **THERMAL CHARACTERISTICS**
|**SYMBOL**|**PARAMETER**|**CONDITIONS**|**VALUE**|**UNIT**|
|---|---|---|---|---|
|Rth(j-a)|thermal resistance fromjunction to ambient|note 1|350|K/W|
|Rth(j-s)|thermal resistance fromjunction to solderpoint|note 2|65|K/W|
## **Notes**
1. Device mounted on a FR4 printed-circuit board with approximately 35 mm[2] Cu area at cathode tab.
2. Solder point at cathode tab.
NXP Semiconductors
Product data sheet
## Voltage regulator diodes
## BZX585 series
## **GRAPHICAL DATA**
**==> picture [242 x 608] intentionally omitted <==**
**----- Start of picture text -----**
MBG781
300
handbook, halfpage
IF
(mA)
200
100
0
0.6 0.8 VF (V) 1
Tamb = 25 °C.
Fig.2 Forward current as a function of forward
voltage; typical values.
MLD445
12
handbook, halfpage
15
SZ
(mV/K)
13
8 12
11
10
9V1
8V2
4 7V5
6V8
6V2
5V6
5V1
0
− 4
10 [−] [1] 1 10 10 [2]
IZ (mA)
BZX585-B/C5V1 to B/C15.
Tamb = 25 °C to 150 °C.
Fig.4 Temperature coefficient as a function of
working current; typical values.
**----- End of picture text -----**
**==> picture [242 x 290] intentionally omitted <==**
**----- Start of picture text -----**
MLD444
0.5
handbook, halfpage
SZ
(mV/K) 4V7
0
4V3
− 0.5
2V4
2V7
3V9
− 1
3V6
− 1.5
3V3
3V0
− 2
10 [[−]] [[1]] 1 10 10 [[2]]
IZ (mA)
BZX585-B/C2V4 to B/C4V7.
Tamb = 25 °C to 150 °C.amb = 25 °C to 150 °C. = 25 °C to 150 °C. °C to 150 °C.C to 150 °C.°C.C.
Fig.3 Temperature coefficient as a function of
working current; typical values.
**----- End of picture text -----**
**==> picture [242 x 290] intentionally omitted <==**
**----- Start of picture text -----**
MLD444
0.5
handbook, halfpage
SZ
(mV/K) 4V7
0
4V3
− 0.5
2V4
2V7
3V9
− 1
3V6
− 1.5
3V3
3V0
− 2
10 [[−]] [[1]] 1 10 10 [[2]]
IZ (mA)
BZX585-B/C2V4 to B/C4V7.
Tamb = 25 °C to 150 °C.amb = 25 °C to 150 °C. = 25 °C to 150 °C. °C to 150 °C.C to 150 °C.°C.C.
Fig.3 Temperature coefficient as a function of
working current; typical values.
**----- End of picture text -----**
2004 Jun 22
7
NXP Semiconductors
Product data sheet
## Voltage regulator diodes
## BZX585 series
## **PACKAGE OUTLINE**
**==> picture [479 x 289] intentionally omitted <==**
**----- Start of picture text -----**
Plastic surface-mounted package; 2 leads SOD523
A
c
HE v M A
D A
0 0.5 1 mm
scale
1 2
DIMENSIONS (mm are the original dimensions)
E bp
UNIT A bp c D E HE v
0.65 0.34 0.17 1.25 0.85 1.65
mm 0.1
(1) 0.58 0.26 0.11 1.15 0.75 1.55
Note
1. The marking bar indicates the cathode.
OUTLINE REFERENCES EUROPEAN
ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
02-12-13
SOD523 SC-79
06-03-16
**----- End of picture text -----**
2004 Jun 22
8
NXP Semiconductors
Product data sheet
## Voltage regulator diodes
## BZX585 series
## **DATA SHEET STATUS**
|**DATA SHEET STATUS**|||
|---|---|---|
|**DOCUMENT**
**STATUS**(1)|**PRODUCT**
**STATUS**(2)|**DEFINITION**|
|Objective data sheet|Development|This document contains data from the objective specification for product
development.|
|Preliminarydata sheet|Qualification|This document contains data from thepreliminaryspecification.|
|Product data sheet|Production|This document contains theproduct specification.|
## **Notes**
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
## **DISCLAIMERS**
**General** ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
**Right to make changes** ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
**Suitability for use** ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
⎯ **Applications** Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
**Terms and conditions of sale** ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.
**No offer to sell or license** ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
⎯ **Export control** This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
**Quick reference data** ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
⎯ **Limiting values** Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions
2004 Jun 22
9
## _**NXP Semiconductors**_
## **Customer notification**
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version.
## **Contact information**
For additional information please visit: **http://www.nxp.com** For sales offices addresses send e-mail to: **salesaddresses@nxp.com**
## © NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
**==> picture [178 x 143] intentionally omitted <==**
Date of release: 2004 Jun 22
R76/04/pp10
Document order number: 9397 750 13303
## Links
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