# Power MOSFET, N Channel, 100 V, 40 A, 0.016 ohm, PG-TSDSON, Surface Mount

![Product image](https://novapart.co/image/farnell:3132235/)

**URL**: https://novapart.co/products/BSZ160N10NS3GATMA1/power-mosfet-n-channel-100-v-40-a-0016-ohm-pg
**SKU**: BSZ160N10NS3GATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5130
**Stock**: 1000+
**Lead Time**: 358 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:40A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.014ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2.8V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | OptiMOS 3 |
| Qualification | - |
| Power Dissipation | 63W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PG-TSDSON |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 40A |
| Drain Source On State Resistance | 0.016ohm |
| Gate Source Threshold Voltage Max | 2.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3132235/)

## MOSFET 

BSZ160N10NS3 

Final 

**BSZ160N10NS3 G** 

## **OptiMOS[TM] 3 Power-Transistor** 

## **Features** 

- Ideal for high frequency switching 

- Optimized technology for DC/DC converters 

## **Product Summary** 

|**Product Summary**|||
|---|---|---|
|||V|
|_V_DS|100||
|||mW|
|_R_DS(on),max|16||
|||A|
|_I_D|40||



- Excellent gate charge x _R_ DS(on) product (FOM) 

- N-channel, normal level 

## PG-TSDSON-8 

- 100% avalanche tested 

- Pb-free plating; RoHS compliant 

- Qualified according to JEDEC[1)] for target applications 

- Halogen-free according to IEC61249-2-21 

|S/|®Halogen-Free|Halogen-Free|
|---|---|---|
|**Type**|**Package**|**Marking**|
||||
|BSZ160N10NS3 G|PG-TSDSON-8|160N10N|



**Maximum ratings,** at _T_ A=25 °C, unless otherwise specified 

|**Parameter**|**Symbol **|**Conditions**|**Unit**<br>**Value**|**Unit**|
|---|---|---|---|---|
|Continuous drain current|_I_D|_V_GS=10 V,_T_C=25 °C|40<br>A<br>28<br>8<br>160<br>80<br>mJ|A<br>mJ|
|||_V_GS=10 V,_T_C=100 °C|||
|||_V_GS=10 V,_T_A=25 °C,<br>_R_thJA=60 K/W2)|||
|Pulsed drain current3)|_I_D,pulse|_T_C=25 °C|||
|Avalanche energy, single pulse4)|_E_AS|_I_D=20 A,_R_GS=25W|||
|Gate source voltage|_V_GS||±20<br>V|V|



- 1) J-STD20 and JESD22 

- 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

- 3) See Diagram 3 for more detailed information 

- 4) See Diagram 13 for more detailed information 

Rev. 2.1 

page 1 

2015-09-17 

**BSZ160N10NS3 G** 

**Maximum ratings,** at _T_ A=25 °C, unless otherwise specified 

|**Parameter**||**Symbol **|**Conditions**||**Value**||**Unit**|
|---|---|---|---|---|---|---|---|
|Power dissipation||_P_tot|_T_C=25 °C||63||W|
||||_T_A=25 °C,<br>_R_thJA=60 K/W2)||2.1|||
|Operating and storage temperature||_T_j,_T_stg||-55 ... 150|||°C|
|IEC climatic category; DIN IEC 68-1||||55/150/56||||
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~<br>~~ee ee~~||||||||
|**Thermal characteristics**||||||||
|Thermal resistance, junction - case<br>_R_thJC<br>-<br>-<br>2.1<br>K/W<br>Device on PCB<br>_R_thJA<br>minimal footprint<br>-<br>-<br>62<br>6 cm2cooling area2)<br>-<br>-<br>60<br>~~a~~||||||||
|**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified||=25 °C, unless otherwise specified|||||



## **Static characteristics** 

|Drain-source breakdown voltage|_V_(BR)DSS <br>~~PE=Frr~~|_V_GS=0 V,_I_D=1 mA<br>~~PE=Frr~~|100<br>~~PE=Frr~~|-<br>~~PE=Frr~~|-<br>~~PE=Frr~~|V|
|---|---|---|---|---|---|---|
|Gate threshold voltage|_V_GS(th)<br>~~PE=Frr~~|_V_DS=_V_GS,_I_D=33 µA<br>~~PE=Frr~~|2<br>~~PE=Frr~~|2.8<br>~~PE=Frr~~|3.5<br>~~PE=Frr~~||
|Zero gate voltage drain current|_I_DSS<br>~~PE=Frr~~<br>~~-—_}~~|_V_DS=100 V,_V_GS=0 V,<br>_T_j=25 °C<br>~~PE=Frr~~<br>~~—_}~~|-<br>~~PE=Frr~~<br>~~—_}ff~~|0.1<br>~~PE=Frr~~<br>~~ff~~|1<br>~~PE=Frr~~<br>~~ff~~|µA|
|||_V_DS=100 V,_V_GS=0 V,<br>_T_j=125 °C<br>~~PE=Frr~~<br>~~—_}~~|-<br>~~PE=Frr~~<br>~~—_}ff~~|10<br>~~PE=Frr~~<br>~~ff~~|100<br>~~PE=Frr~~<br>~~ff~~||
|Gate-source leakage current|_I_GSS<br>~~PE=Frr~~<br>~~-—_}~~|_V_GS=20 V,_V_DS=0 V<br>~~PE=Frr~~<br>~~—_}~~|-<br>~~PE=Frr~~<br>~~—_}ff~~|10<br>~~PE=Frr~~<br>~~ff~~|100<br>~~PE=Frr~~<br>~~ff~~|nA|
|Drain-source on-state resistance|_R_DS(on)<br>~~-—_}~~<br>~~rt~~|_V_GS=10 V,_I_D=20 A<br>~~—_}~~<br>~~rt~~|-<br>~~—_} ff~~<br>~~rt~~|14<br>~~ff~~<br>~~rt~~|16<br>~~ff~~<br>~~rt~~|mW|
|||_V_GS=6 V,_I_D=10 A<br>~~rt~~|-<br>~~rt~~|18<br>~~rt~~|33<br>~~rt~~||
|Gate resistance|_R_G<br>~~rt~~|~~rt~~|-<br>~~rt~~|1.4<br>~~rt~~|-<br>~~rt~~|W|
|Transconductance|_g_fs<br>~~CC~~||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=20 A<br>~~CC~~|16<br>~~CC~~|33<br>~~CC~~|-<br>~~CC~~|S|



Rev. 2.1 

page 2 

2015-09-17 

**BSZ160N10NS3 G** 

**Parameter Symbol Conditions Values Unit min. typ. max.** ~~2~~ 

|**Parameter**<br>~~2~~|**Symbol **<br>~~2~~|**Conditions**<br>~~2~~|**min.**<br>~~2~~|**typ.**<br>**Values**<br>~~2~~|**max.**<br>~~2~~|**Unit**<br>~~2~~|
|---|---|---|---|---|---|---|
|**Dynamic characteristics**|||||||
|Input capacitance|_C_iss||-|1300|1700|pF|
|Output capacitance|_C_oss|_V_GS=0 V,_V_DS=50 V,<br>_f_=1 MHz|-|240|320||
|Reverse transfer capacitance|Crss||-|11|-||
|Turn-on delay time|_t_d(on)||-|13.0|-|ns|
|Rise time|_t_r|_V_DD=50 V,_V_GS=10 V,|-|10.0|-||
|Turn-off delay time|_t_d(off)|_I_D=10 A,_R_G,ext=1.6W|-|22.0|-||
|Fall time|_t_f||-|5.0|-||
|Gate Charge Characteristics5)|||||||
|Gate to source charge|_Q_gs||-|5.7|-|nC|
|Gate charge at threshold|_Q_g(th)||-|3.8|-||
|Gate to drain charge|_Q_gd|_V_DD=50 V,_I_D=10 A,|-|3.4|-||
|Switching charge|_Q_sw|_V_GS=0 to 10 V|-|5.3|-||
|Gate charge total|_Q_g||-|19|25||
|Gate plateau voltage|_V_plateau||-|4.2|-|V|
|Output charge|_Q_oss|_V_DD=40 V,_V_GS=0 V|-|25|33|nC|
|**Reverse Diode**|||||||
|Diode continuous forward current|_I_S||-|-|40|A|
|||_T_C=25 °C|||||
|Diode pulse current|_I_S,pulse||-|-|160||
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=20 A,<br>_T_j=25 °C|-|0.9|1.2|V|
|Reverse recovery time|_t_rr|_V_R=50 V,_I_F=_10A_,|-|73|-|ns|
|Reverse recovery charge|_Q_rr|d_i_F/d_t_=100 A/µs|-|52|-|nC|



5) See figure 16 for gate charge parameter definition 

Rev. 2.1 

page 3 

2015-09-17 

**BSZ160N10NS3 G** 

_P_ tot=f( _T_ C) 

_I_ D=f( _T_ C); _V_ GS≥10 V 

## **1 Power dissipation** 

## **2 Drain current** 

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**----- Start of picture text -----**<br>
80<br>70<br>60<br>BEEEEEH<br>50<br>PNP<br>40 Nee<br>30<br>20 po Ne<br>10 Poo<br>0 PEN}<br>0 25 50 75 100 125 150 175<br>T C [°C]<br> [W]<br>tot<br>P<br>**----- End of picture text -----**<br>


**==> picture [225 x 265] intentionally omitted <==**

**----- Start of picture text -----**<br>
50<br>45<br>40<br>35 EERE<br>30 PP PNEr<br>25<br>20<br>15<br>pp<br>10<br>EEA<br>5<br>0 be<br>0 25 50 75 100 125 150 175<br>T C [°C]<br> [A]<br>I D<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 parameter: _t_ p 

**4 Max. transient thermal impedance** _Z_ thJC=f( _t_ p) 

parameter: _D_ = _t_ p/ _T_ 

**==> picture [467 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [3 ] 10<br>limited by on-state<br>resistance<br>1 µs<br>10 [2 ]<br>ary 10 µs  1 0.5  EE<br>DC<br>100 µs  0.2<br>. ff<br>10 [1 ]<br>0.1<br>\ 0.1 0.05  A<br>1 ms<br>10 [0 ] 0.02<br>0.01<br>10 ms<br>single pulse<br>0.01 0 0 0 0 0 0 1<br>10 [-1 ]<br>10 [-6 ] 10 [-5 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10 [0 ]<br>10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ]<br>V DS [V]  t p [s]<br> [A]   [K/W]<br>I D<br>thJC<br>Z<br>**----- End of picture text -----**<br>


Rev. 2.1 

page 4 

2015-09-17 

**BSZ160N10NS3 G** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C 

parameter: _V_ GS 

**==> picture [468 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 40<br>9 V  7 V<br>10 V  8 V  36<br>6 V<br>80 32<br>5 V<br>28<br>/ Hy e S<br>60 24 J Jy<br>5.5 V<br>20 5.5 V  6 V<br>7 V<br>40 16 8 V<br>5 V  9 V<br>10 V<br>12<br>20 4.5 V  8<br>4<br>0 pectin 0 Beet<br>0 1 2 3 4 5 0 20 40 60 80 100<br>V DS [V]  I D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>=f( V  GS); |); | V  DS|>2||>2| I  D|| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>80 40<br>60 PA 30 LL<br>40 Pere 20 LLL<br>20 Perea 10 WAL<br>150 °C<br>25 °C<br>p oe<br>0 0<br>0 1 2 3 4 5 6 7 0 10 20 30 40 50<br>V GS [V]  I D [A]<br>]<br>W<br> [m<br> [A]<br>I D<br>DS(on)<br>R<br> [A]   [S]<br>I D g fs<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); |); | _V_ DS|>2||>2| _I_ D|| _R_ DS(on)max parameter: _T_ j 

Rev. 2.1 

page 5 

2015-09-17 

**BSZ160N10NS3 G** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=20 A; _V_ GS=10 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS 

**==> picture [468 x 611] intentionally omitted <==**

**----- Start of picture text -----**<br>
40 4<br>35<br>30 3 330 µA<br>33 µA<br>25<br>20 98%  A 2 S<br>15<br>Typ<br>10 1<br>5<br>ni<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C]  T j [°C]<br>11 Typ. capacitances 12 Forward characteristics of reverse diode<br> =f( V  DS); );  V  GS=0 V; =0 V;  f  =1 MHz I  F=f( V  SD)<br>parameter:  T  j<br>10 [4 ] 1000<br>Ciss<br>=== ><br>10 [3 ]<br>150 °C<br>100<br>25 °C, max<br>Coss<br>25 °C<br>10 [2 ] 150 °C, max<br>rr ) | fr<br>10<br>Crss<br>10 [1 ]<br>10 [0 ] Ssette 1 f|/<br>0 20 40 60 80 0.0 0.5 1.0 1.5 2.0<br>V DS [V]  V SD [V]<br>]<br>W<br>[m  [V]<br>DS(on) GS(th)<br>R V<br>C  [pF]   [A]  I F<br>**----- End of picture text -----**<br>


## **11 Typ. capacitances** 

_C_ =f( _V_ DS); ); _V_ GS=0 V; =0 V; _f_ =1 MHz 

Rev. 2.1 

page 6 

2015-09-17 

**BSZ160N10NS3 G** 

## **13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=25 W parameter: _T_ j(start) 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=10 A pulsed parameter: _V_ DD 

**==> picture [472 x 611] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 12<br>50 V<br>10<br>20 V<br>80 V<br>8<br>10 6<br>100 °C  25 °C<br>125 °C<br>4<br>2<br>1 0<br>0.1 1 10 100 1000 0 5 10 15 20<br>t AV [µs]  Q gate [nC]<br>15 Drain-source breakdown voltage 16 Gate charge waveforms<br>V  BR(DSS)=f( T  j);  I  D=1 mA<br>110<br>V  GS<br>Q g<br>105<br>100<br>V  gs(th)<br>95<br>Q  g(th) Q  sw Q gate<br>90 Q  gs Q  gd<br>-60 a -20 20 60 100 aa 140 180<br>T j [°C]<br> [A]   [V]<br>I AV V GS<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>


Rev. 2.1 

page 7 

2015-09-17 

**BSZ160N10NS3 G** 

## **Package Outline: PG-TSDSON-8** 

Dimensions in mm 

**Footprint** 

Rev. 2.1 

page 8 

2015-09-17 

OptiMOS™ 3 Power BSZ160N10NS3 Transistor 

BSZ160N10NS3 

BSZ160N10NS3 

|Previous Revision|Previous Revision||
|---|---|---|
|Revision|Date|Subjects (major changes since last revision)|
|2.1|2015-10-05|Update Id condition for Vgs(th) and Tj to Ta condition for "Maximum ratings"|



## **erratum@infineon.com** 

## **Information** 

**www.infineon.com** ). 

## **Warnings** 

10 



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