# Power MOSFET, N Channel, 100 V, 170 mA, 6 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:2985357/)

**URL**: https://novapart.co/products/BSS123L/power-mosfet-n-channel-100-v-170-ma-6-ohm-sot-23
**SKU**: BSS123L
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0350
**Stock**: 1000+
**Lead Time**: 141 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:170mA; Drain Source Voltage Vds:100V; On Resistance Rds(on):2.98ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vg

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 360mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 170mA |
| Drain Source On State Resistance | 6ohm |
| Gate Source Threshold Voltage Max | 1.405V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2985357/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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## **BSS123L N-Channel Logic Level Enhancement Mode Field Effect Transistor** 

## **Features** 

- 0.17 A, 100 V, RDS(ON) = 6 Ω at VGS = 10 V 

- RDS(ON) = 10 Ω at VGS = 4.5 V 

- High Density Cell Design for Low RDS(ON) 

- Rugged and Reliable 

- Compact Industry Standard SOT-23 Surface Mount 

- Package 

- Very Low Capacitance 

- Fast Switching Speed 

## **Description** 

This N-channel enhancement mode field effect transistor is produced using high cell density, trench MOSFET technology. This product minimizes on-state resistance while providing rugged, reliable and fast switching performance. This product is particularly suited for low-voltage, low-current applications such as small servo motor control, power MOSFET gate drivers, logic level transistor, high speed line drivers, power management/power supply and switching applications. 

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D<br>S<br>G SOT-23<br>**----- End of picture text -----**<br>


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## **Ordering Information** 

**Part Number Marking Package Packing Method** BSS123L SB SOT-23 3L Tape and Reel 

© 2014 Fairchild Semiconductor Corporation BSS123L Rev. 1.0.1 

www.fairchildsemi.com 

1 

## **Absolute Maximum Ratings** 

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VDSS|Drain-Source Voltage||100|V|
|VGSS|Gate-Source Voltage||±20|V|
|ID|Maximum Drain Current|Continuous|0.17|A|
|||Pulsed|0.68||
|TJ, TSTG|Operating and Storage Temperature Range||-55 to +150|°C|
|TL|Maximum Lead Temperature for Soldering Purposes, 1/16 inch from Case<br>for 10 Seconds||300|°C|



## **Thermal Characteristics** 

Values are at TA = 25°C unless otherwise noted. 

|Values are at TA = 25°C unless otherwise noted.|Values are at TA = 25°C unless otherwise noted.A = 25°C unless otherwise noted.= 25°C unless otherwise noted.|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|PD|Maximum Power Dissipation(1)|0.36|W|
||Derate Above 25°C|2.8|mW/°C|
|RθJA|Thermal Resistance, Junction-to-Ambient(1)|380|°C/W|



## **Note:** 

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a) 380 ° C/W when mounted on a minimum pad. 

Scale 1: 1 on letter size paper 

**ESD Rating**[(2)] 

**Symbol Parameter Value Unit** HBM Human Body Model per ANSI/ESDA/JEDEC JS-001-2012 50 V CDM Charged Device Model per JEDEC C101C >2000 ~~————~~ **Note:** 

2. ESD values are in typical, no over-voltage rating is implied, ESD CDM zap voltage is 2000 V maximum. 

© 2014 Fairchild Semiconductor Corporation BSS123L Rev. 1.0.1 

www.fairchildsemi.com 

2 

## **Electrical Characteristics** 

Values are at TA = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|**Off Characteristics**|||||||
|BVDSS|Drain-Source Breakdown Voltage|VGS= 0 V, ID= 250μA|100|103||V|
|ΔBVDSS<br>ΔTJ|Breakdown Voltage<br>Temperature Coefficient|ID= 250μA,Referenced to 25°C||100||mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= 100 V, VGS= 0 V||0.027|1|μA|
|||VDS= 100 V, VGS= 0 V,<br>TJ= 125°C||0.159|60||
|||VDS= 20 V, VGS= 0 V||0.07|10|nA|
|IGSSF|Gate-Body Leakage, Forward|VGS= 20 V, VDS= 0 V||0.036|50|nA|
|IGSSR|Gate-Body Leakage, Reverse|VGS= -20 V, VDS= 0 V||-0.019|-50||
|**On Characteristics**(3)|||||||
|VGS(th)|Gate Threshold Voltage|VDS = VGS,ID = 1 mA|0.8|1.405|2|V|
|ΔVGS(th)<br> ΔTJ|Gate Threshold Voltage<br>Temperature Coefficient|ID= 1 mA, Referenced to 25°C||-2.82||mV/°C|
|RDS(ON)|Static Drain-Source<br>On-Resistance|VGS = 10 V, ID = 0.17 A||2.98|6|Ω|
|||VGS = 4.5 V, ID= 0.17 A||3.17|10||
|||VGS= 10 V, ID= 0.17 A,<br>TJ= 125°C||5.63|12||
|ID(ON)|On-State Drain Current|VGS= 10 V, VDS= 5 V|0.680|0.735||A|
|gFS|Forward Transconductance|VDS= 10 V, ID= 0.17 A|0.08|2.13||S|
|**Dynamic Characteristics**|||||||
|Ciss|Input Capacitance|VDS= 25 V, VGS = 0 V,<br>f = 1.0 MHz||21.5||pF|
|Coss|Output Capacitance|||3.52||pF|
|Crss|Reverse Transfer Capacitance|||1.67||pF|
|RG|Gate Resistance|VGS= 15 V, VGS= 1.0 MHz||7.18||Ω|
|**Switching Characteristics**(3)|||||||
|td(on)|Turn-On Delay|VDD= 30 V, ID = 0.28 A,<br>VGS= 10 V, RGEN= 6Ω||2.2|3.4|ns|
|tr|Turn-On Rise Time|||1.7|18|ns|
|td(off)|Turn-Off Delay|||5.9|31|ns|
|tf|Turn-Off Fall Time|||5.6|5|ns|
|Qg|Total Gate Charge|VDS= 25 V, ID= 0.22 A,<br>VGS= 10 V||0.793|2.5|nC|
|Qgs|Gate-Source Charge|||0.092||nC|
|Qgd|Gate-Drain Charge|||0.171||nC|
|**Drain-Source Diode Characteristics and Maximum Ratings**|||||||
|VSD|Drain-Source Diode Forward<br>Voltage|VGS= 0 V, IS= 440 mA(1)||0.867|1.3|V|
|Trr|Diode Reverse Recovery Time|IF= 0.2 A, diF/dt = 100 A/μS||11.9||ns|
|Qrr|Diode Reverse Recovery Charge|||1.3||nC|



## **Note:** 

3. Pulse test: pulse width ≤ 300 μ s, duty cycle ≤ 2.0%. 

© 2014 Fairchild Semiconductor Corporation BSS123L Rev. 1.0.1 

www.fairchildsemi.com 

3 

## **Typical Performance Characteristics** 

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1.0  2.8<br>0.9  | | | | | | | | | VGS=10V [ VGS=2.5V<br>0.8  6.0<br>4.5 2.3  3.0<br>0.7  3.0<br>3.5 3.5<br>0.6  = e e)<br>er es<br>0.5  1.8  4.5<br>2.5<br>0.4<br>6.0<br>0.3<br>1.3  10<br>0.2<br>2.0<br>0.1<br>0.0  a a 0.8  — Ae<br>0.0  0.5  1.0  1.5  2.0  2.5  3.0  3.5  4.0  4.5  5.0  0 0.2 0.4 0.6 0.8 1<br>VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics Figure 2. On-Resistance Variation with Gate Voltage<br>and Drain Current<br>2.5 8<br>VIDGS = 0.17A = 10V 7 PE ID = 0.08 A<br>2 6 ee<br>5 ee a<br>1.5 4 TJ = 125 [o] C<br>3 ho<br>TJ = 25 [o] C<br>1 2 P RE<br>1 ee =<br>0.5 0 a eeee eeeeeeeee<br>-75 -50 -25 0 25 50 75 100 125 150 0 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with Temperature Figure 4. On-Resistance Variation with Gate-to-<br>Source Voltage<br>1.00 1<br>VDS = 10V 25 [o] C VGS = 0V<br>0.80<br>TJ = 125 [o] C 0.1<br>0.60 -55 [o] C<br>0.01 TJ= 150 [o] C 125 [o] C 25 [o] C -55 [o] C<br>0.40<br>0.001<br>0.20<br>0.00 0.0001<br>0 1 2 3 4 0.2  0.4  0.6  0.8  1.0  1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>, NORMALIZED<br>, DRAIN CURRENT (A)<br>ID RDS(ON)<br>DRAIN-SOUCE ON-RESISTANCE<br>, NORMALIZED<br>DS(ON) , ON-RESISTANCE (OHM)<br>R DRAIN-SOUCE ON-RESISTANCE RDS(ON)<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 2. On-Resistance Variation with Gate Voltage and Drain Current** 

**Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature** 

**Figure 5. Transfer Characteristics** 

© 2014 Fairchild Semiconductor Corporation BSS123L Rev. 1.0.1 

www.fairchildsemi.com 

4 

## **Typical Performance Characteristics** (Continued) 

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100 SSSS AODRS REENOHOS RSOO<br>10 aRS AA ASOOOOOe<br>a<br>8 Ciss<br>30V 50V 70V SSE TO<br>6<br>10<br>4 /// aSanaaaERSTEes EEa1ee (AGEN EEE ELSI Coss LEE—|aEHH{| Tit EEL<br>2 / a eS<br>f = 1MHz e e<br>VGS = 0V Crss<br>0 0 J {| 0.5 | 1 ft 1.5 2 1 0.1 l 1 l 10 rnlll 100<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics Figure 8. Capacitance Characteristics<br>1<br>2 eTNONE 100 SS SS ____—  —  ————<br>TTT tT TST NT TIN —_ eaee ee<br>PP ese 100  s μ ESSE<br>FS \ \ a |<br>0.1 |=errr RDS(ON) LIMIT Allee_| “3wihNUS NUL 10 HRLUTTETTT FETT FETT TTTHHTTT<br>YT TTT ZoPi RTS SSSN 1ms eesEESeee eat TT TT<br>rt QIN ON |<br>0.01 ATeeSaas|eeeae Sa SINGLE PULSER θ et JATA TTT = 380 = 25 nen [o][o] CC/W SENETeeeTITLaONS [{|] N aR 100ms10ms1s10sDC 0.11 HHeiconn SINGLE PULSER JATA= 3= 25 58 0 [o][o] CC/W HT|HEELL HPT cE0 | TTT<br>0.001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>0.01 0.1 1 10 100 300 t1 (s)<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Maximum Safe Operating Area Figure 10. Single Pulse Maximum Power Dissipation<br>TRANSIENT THERMAL IMPEDANCE<br>10<br>a Aee<br>Po<br>CTT TTT TTT<br>1 PEPet 0.5 rT ttt ttt<br>= er Tt —t tt} tt<br>a eee<br>0.2<br>0.1<br>0.1 = ara<br>SS 0.05 aecome | UTM LITT ELT | CEMee[ET<br>0.02<br>P e<br>0.01 A TT TTT TT TTT<br>Cc AlaTTT<br>Single Pulse<br>0.01<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, Rectangular Pulse Duration<br>Figure 11. Transient Thermal Response Curve.<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>PEAK TRANSIENT POWER (W)<br>Normalized Thermal Impedance ZoJA<br>**----- End of picture text -----**<br>


© 2014 Fairchild Semiconductor Corporation BSS123L Rev. 1.0.1 

www.fairchildsemi.com 

5 

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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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