# Power MOSFET, P Channel, 250 V, 140 mA, 11 ohm, SC-59, Surface Mount

![Product image](https://novapart.co/image/farnell:2530222RL/)

**URL**: https://novapart.co/products/BSR92PH6327XTSA1/power-mosfet-p-channel-250-v-140-ma-11-ohm-sc-59
**SKU**: BSR92PH6327XTSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2110
**Stock**: 10+
**Lead Time**: 358 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-140mA; Drain Source Voltage Vds:-250V; On Resistance Rds(on):8ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 500mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SC-59 |
| Drain Source Voltage Vds | 250V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 140mA |
| Drain Source On State Resistance | 11ohm |
| Gate Source Threshold Voltage Max | 1.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2530222RL/)

**BSR92P** 

## **SIPMOS[®] Small-Signal-Transistor** 

## **Product Summary** 

## **Features** 

- P-Channel 

- Enhancement mode / Logic level 

|**Product Summary**|||
|---|---|---|
||||
|_V_DS|-250|V|
||||
|_R_DS(on),max|11|W|
||||
|_I_D|-0.14|A|



- Avalanche rated 

- Pb-free lead plating; RoHS compliant 

- Footprint compatible to SOT23 

|• Footprint compatible to SOT23|||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|• Footprint compatible to SOT23||||||||||||PG-SC59||PG-SC59|||
|• Qualified according to AEC Q101<br>• Halogen free according to IEC61249-2-21<br>RoHS<br>**~** —-<br>—<br>“4<br>AEG alfied &sonia|||GatePin1|||1|Drain Pin 3<br>1@<br>SourcePin 2|||||3||'||2|
||||||||||||||||||
|**Type**<br>**Package**||**Tape and Reel Information**|||||**Marking**|||**Halogen-free**||||||**Packing**|
||||||||||||||||||
|BSR92P<br>PG-SC59||H6327 = 3000 pcs. / reel|||||LD|||Yes||Yes||||Non dry|



- Qualified according to AEC Q101 

- Halogen free according to IEC61249-2-21 

**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Parameter**|**Symbol **|**Conditions**<br>~~FS~~<br>~~FS~~|**Unit**<br>**Value**<br>**steady state**<br>~~FS~~<br>~~FS~~|**Unit**|
|---|---|---|---|---|
|Continuous drain current|_I_D<br>~~a~~|_T_A=25 °C<br>~~FS~~<br>~~ee~~<br>~~**e**e~~|A<br>-0.14<br>-0.11<br>-0.56<br>~~FS~~<br>~~ee~~<br>~~ee~~<br>~~e~~|A|
|||_T_A=70 °C<br>~~**e**e~~|||
|Pulsed drain current|_I_D,pulse<br>~~a~~|_T_A=25 °C<br>~~**e**e~~|||
|Avalanche energy, single pulse|_E_AS|_I_D=-0.14 A,_R_GS=25W|mJ<br>24|mJ|
|Gate source voltage|_V_GS<br>~~a ee~~<br>~~a~~|~~ee~~<br>~~ee~~|V<br>±20<br>~~ee~~<br>~~ee~~|V|
|Power dissipation|_P_tot<br>~~a~~<br>~~ee~~|_T_C=25 °C<br>~~ee~~<br>~~ee~~|W<br>0.5<br>~~ee~~<br>~~ee~~|W|
|Operating and storage temperature|_T_j,_T_stg<br>~~a ~~<br>~~ee~~<br>~~a~~|~~ee~~<br>~~ee~~<br>~~ee~~|°C<br>-55 ... 150<br>~~ee~~<br>~~ee~~<br>~~ee~~|°C|
|ESD class|~~ee~~<br>~~a~~<br>~~ee~~|JESD22-A114 (HBM)<br>~~ee~~<br>~~ee~~<br>~~ee~~|1A (250V to 500V)<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|Soldering temperature|~~a ~~<br>~~ee~~<br>~~ee~~|~~ee ~~<br>~~ee~~<br>~~ee~~|260 °C<br> ~~ee~~<br>~~ee~~<br>~~ee~~||
|IEC climatic category; DIN IEC 68-1|~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|55/150/56<br>~~ee~~<br>~~ee~~||



Rev 1.05 

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2015-07-24 

|**Static characteristics**|||||||
|---|---|---|---|---|---|---|
|Drain-source breakdown voltage|_V_(BR)DSS <br>~~ee~~|_V_GS=0 V,_I_D=-250 µA<br>~~ee~~|-250<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~eee~~|-<br>~~ee~~<br>~~eee~~|V|
|Gate threshold voltage|_V_GS(th)<br>~~eff~~|_V_DS=_V_GS,<br>_I_D=-130 µA<br>~~eff~~|-2<br>~~ee ~~<br>~~eff~~<br>~~|~~|-1.5<br> ~~eee~~<br>~~eff~~<br>~~|~~|-1<br>~~eee~~<br>~~eff~~||
|Zero gate voltage drain current|_I_DSS<br>~~arr~~<br>~~re~~|_V_DS=-250 V,_V_GS=0 V,<br>_T_j=25 °C<br>~~arr~~|=0 V,<br>-<br>~~|~~<br>~~arr~~|-0.1<br>~~|~~<br>~~arr~~|-1<br>~~arr~~|µA|
|||_V_DS=-250 V,_V_GS=0 V,<br>_T_j=150 °C<br>~~arr~~<br>~~tt~~<br>~~re~~|=0 V,<br>-<br>~~arr~~<br>~~tt~~<br>~~ee~~|-10<br>~~arr~~<br>~~tt~~<br>~~ee~~|-100<br>~~arr~~<br>~~tt~~<br>~~ee~~||
|Gate-source leakage current|_I_GSS<br>~~re~~|_V_GS=-20 V,_V_DS=0 V<br>~~re~~|-<br>~~ee~~|-10<br>~~ee~~|-100<br>~~ee~~|nA|
|Drain-source on-state resistance|_R_DS(on)<br>~~re~~|_V_GS=-2.8 V,<br>_I_D=-0.025 A<br>~~re ~~<br>~~tt~~|-<br> ~~ee~~<br>~~tt~~|11<br>~~ee~~<br>~~tt~~|20<br>~~ee~~<br>~~tt~~|W|
|||_V_GS=-4.5 V,_I_D=-<br>0.13 A<br>~~Tt~~|-<br>~~Tt~~|9<br>~~Tt~~|13<br>~~Tt~~||
|||_V_GS=-10 V,<br>_I_D=-0.14 A<br>~~tt~~<br>~~ft~~|-<br>~~tt~~<br>~~ft|~~|8<br>~~tt~~<br>~~|~~|11<br>~~tt~~||
|Transconductance|_g_fs<br>~~pt;~~||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=-0.11 A<br>~~pt;~~<br>~~ft~~|0.1<br>~~pt;~~<br>~~ft|~~|0.3<br>~~pt;~~<br>~~|~~|-<br>~~pt;~~|S|



Rev 1.05 

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2015-07-24 

**BSR92P** 

|**Parameter**<br>~~ee~~|**Symbol Conditions**<br>~~ee~~<br>~~ee~~|**Symbol Conditions**<br>~~ee~~<br>~~ee~~|**min.**<br>~~ee~~|**typ.**<br>**Values**<br>~~ee~~|**max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|**Dynamic characteristics3)**|||||||
|Input capacitance|_C_iss||-|82|109|pF|
|Output capacitance|_C_oss|_V_GS=0 V,_V_DS=-25 V,<br>_f_=1 MHz|-|12|16||
|Reverse transfer capacitance|_C_rss||-|5|8||
|Turn-on delay time|_t_d(on)||-|6.4|9.0|ns|
|Rise time|_t_r|_V_DD=-125 V,|-|6.3|9.0||
|||_V_GS=-10 V,|||||
|Turn-off delay time|_t_d(off)|_I_D=-0.14 A,_R_G,ext=6W|-|75.0|112||
|Fall time|_t_f||-|71.0|163||
|Gate Charge Characteristics2), 3)|||||||
|Gate to source charge|_Q_gs||-|-0.2|-0.3|nC|
|Gate to drain charge|_Q_gd|_V_DD=-200 V,_I_D=-|-|-1.2|-1.8||
|||0.14 A,_V_GS=0 to -|||||
|Gate charge total|_Q_g|10 V|-|-3.6|-4.8||
|Gate plateau voltage|_V_plateau||-|-2.7|-|V|
|**Reverse Diode**|||||||
|Diode continuous forward current|_I_S||-|-|-0.14|A|
|||_T_C=25 °C|||||
|Diode pulse current|_I_S,pulse||-|-|-0.56||
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=0.14 A,<br>_T_j=25 °C|-|-0.8|-1.2|V|
|Reverse recovery time3)|_t_rr||-|66|-|ns|
|||_V_R=125 V,_I_F=|_I_S|,|||||
|Reverse recovery charge3)|_Q_rr|d_i_F/d_t_=100 A/µs|-|125|-|nC|



2) See figure 16 for gate charge parameter definition 

3) Defined by design. Not subjected to production test 

Rev 1.05 

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2015-07-24 

**BSR92P** 

## **1 Power dissipation** 

_P_ tot=f( _T_ C) 

## **2 Drain current** 

_I_ D=f( _T_ C); | _V_ GS|≥10 V 

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**----- Start of picture text -----**<br>
0.6<br>0.5<br>0.4<br>0.3<br>0.2<br>0.1<br>0<br>0 40 80 120 160<br>T A [°C]<br> [W]<br>tot<br>P<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
0.15<br>0.1<br>0.05<br>0<br>0 40 80 120 160<br>T A [°C]<br> [A]<br>D<br>-I<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 parameter: _t_ p 

## **4 Max. transient thermal impedance** 

_Z_ thJC=f( _t_ p) parameter: _D_ = _t_ p/ _T_ 

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**----- Start of picture text -----**<br>
10 [0 ] 10 [3 ]<br>limited by on-state<br>resistance  100 µs<br>1 ms  0.5<br>10 [2 ]<br>10 ms  0.2<br>= f<br>10 [-1 ]<br>0.1<br>100 ms  0.05<br>10 [1 ]<br>0.02<br>DC<br>0.01<br>single pulse<br>10 [-2 ]<br>10 [0 ]<br>10 [-3 ] 10 [-1 ]<br>10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ] 10 [-5 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ]<br>-V DS [V]  t p [s]<br> [A]   [K/W]<br>D<br>-I thJS<br>Z<br>**----- End of picture text -----**<br>


Rev 1.05 

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**BSR92P** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C 

parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j parameter: _V_ GS 

**==> picture [466 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.5 14<br>4.5 V<br>10 V  6 V  -2.5 V<br>0.4 3.5 V  -3 V<br>12<br>3 V<br>0.3<br>10 -3.5 V<br>0.2<br>-4.5 V<br>-6 V<br>2.5 V  8 -10 V<br>0.1<br>2 V<br>0 Ze 6<br>0 1 2 3 4 5 0 0.1 0.2 0.3 0.4<br>V DS [V]  -I D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>I  D=f( V  GS); | V  DS|>2| I  D| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>0.5 0.4<br>25 °C<br>150 °C<br>0.4<br>0.3<br>0.3<br>0.2<br>0.2<br>0.1<br>0.1<br>0 0<br>0 1 2 3 4 0.00 0.04 0.08 0.12 0.16<br>-V GS [V]  [V]  -I D [A]<br>]<br>W<br> [A]   [<br>I D<br>DS(on)<br>R<br> [A]   [S]<br>D fs<br>-I g<br>**----- End of picture text -----**<br>


**==> picture [217 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.5<br>25 °C<br>150 °C<br>0.4<br>0.3<br>0.2<br>0.1<br>0<br>0 1 2 3 4<br>-V GS [V]  [V]<br> [A]<br>D<br>-I<br>**----- End of picture text -----**<br>


Rev 1.05 

2015-07-24 

page 5 

**BSR92P** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=-0.14 A; _V_ GS=-10 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=-130 µA 

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**----- Start of picture text -----**<br>
30<br>25 ELLE ELD<br>20<br>LEELA<br>15<br>LA<br>98%<br>10<br>10V<br>TE L ETT<br>5 a r t<br>0 LEE<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>]<br>W<br> [m<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


_T_ j [°C] 

**==> picture [200 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.5<br>2<br>min<br>1.5 typ<br>1<br>max<br>0.5<br>0<br>-60 -20 20 60 100 140<br>T j [°C]<br> [V]<br>GS(th)<br>-V<br>**----- End of picture text -----**<br>


## **11 Typ. capacitances** 

_C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz 

## **12 Forward characteristics of reverse diode** 

_I_ F=f( _V_ SD) parameter: _T_ j 

**==> picture [459 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 1<br>100 0.1 25 °C<br>Ciss  150 °C<br>Coss<br>10 0.01<br>25°C, 98%<br>Crss<br>150°C, 98%<br>1 0.001<br>0 20 40 60 80 100 0 0.4 0.8 1.2 1.6<br>-V DS [V]  -V SD [V]<br>C  [pF]   [A]  I F<br>**----- End of picture text -----**<br>


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**BSR92P** 

## **13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=25 W 

parameter: _T_ j(start) 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=-0.14 A pulsed parameter: _V_ DD 

**==> picture [464 x 612] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [0 ] 10<br>8<br>50 V<br>25 °C  6<br>125 V<br>10 [-1 ] 100 °C<br>4 200 V<br>125 °C<br>2<br>10 [-2 ] m ess: 0 po<br>0 1 2 3<br>10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ]<br>t AV [µs]  - Qgate [nC]<br>15 Drain-source breakdown voltage 16 Gate charge waveforms<br> BR(DSS)=f(=f( T  j); );  I  D=-250 µA=-250 µA<br>300<br>V  GS<br>290<br>Q g<br>280<br>270<br>260<br>250<br>240 V  gs(th)<br>230<br>220<br>210 Q  g(th) Q  sw Q gate<br>200 Q  gs Q  gd<br>-60 -20 20 60 100 140<br>T j [°C]<br> [V]<br> [A]<br>GS<br>-I AV V -<br> [V]<br>BR(DSS)<br>-V<br>**----- End of picture text -----**<br>


## **15 Drain-source breakdown voltage** 

_V_ BR(DSS)=f(=f( _T_ j); ); _I_ D=-250 µA=-250 µA 

Rev 1.05 

2015-07-24 

page 7 

**BSR92P** 

## **Package Outline** 

## **SC-59: Outline** 

**==> picture [50 x 185] intentionally omitted <==**

**----- Start of picture text -----**<br>
Footprint<br>Packaging<br>Tape<br>**----- End of picture text -----**<br>


Dimensions in mm 

Rev 1.05 

page 8 

2015-07-24 

**BSR92P** 

## Published by 

Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved. 

## Attention please! 

The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

## Information 

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). 

## Warnings 

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. 

Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev 1.05 

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2015-07-24 



## Links

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- [Supplier page](https://es.farnell.com/infineon/bsr92ph6327xtsa1/mosfet-p-ch-250v-0-14a-sc-59-3/dp/2530222RL)
---

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