# Power MOSFET, N Channel, 200 V, 660 mA, 1.8 ohm, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:2480632RL/)

**URL**: https://novapart.co/products/BSP297H6327XTSA1/power-mosfet-n-channel-200-v-660-ma-18-ohm-sot-223
**SKU**: BSP297H6327XTSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4480
**Stock**: 10+
**Lead Time**: 358 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:660mA; Drain Source Voltage Vds:200V; On Resistance Rds(on):1ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.4V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.8W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-223 |
| Drain Source Voltage Vds | 200V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 660mA |
| Drain Source On State Resistance | 1.8ohm |
| Gate Source Threshold Voltage Max | 1.4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2480632RL/)

**BSP297** 

_**Rev. 2.2**_ 

## **SIPM Small-Signal-Transistor** 

**Product Summary Feature** . N-Channel _V_ DS 200 V _R_ 1.8 . Enhancement mode | DS(on) fe | . | _I_ D 0.66 [| A 

## **Feature** 

Logic Level 

## PG-SOT223 

d _v_ /d _t_ rated 

- [Pb-free lead plating; RoHS compliant] 

**==> picture [489 x 108] intentionally omitted <==**

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|||||||||
|---|---|---|---|---|---|---|---|
|4|
|Qualified according to AEC Q101|
|•|Halogen­free according to IEC61249­2­21|z=|ma|In|Ze|>|3|
|2|
|1|VPS05163|
|(GS)|Halogen-Free|fect *|ae NS|
|Type|Package|Tape and Reel Information|Marking|Packaging|
|BSP297|PG-SOT223|H|6327:|1000 pcs/reel|BSP297|Non dry|

**----- End of picture text -----**<br>


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|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|Pb-free|
|Yes|
|Maximum Ratings|, at|T|j = 25 °C, unless otherwise specified|
|Parameter|ee|Symbol|Value|Unit|
|Continuous drain current|I|D|A|
|T|A=25°C|0.66|
|T|A=70°C|0.53|
|Pulsed drain current|I|2.64|
|D puls|
|T|A=25°C|
|Reverse diode d|v|/d|t|d|v|/d|t|6|kV/µs|
|I|S=0.66A,|V|DS=160V, d|i|/d|t|=200A/µs,|T|jmax=150°C|
|Gate source voltage|a|V|GS|±20|V|
|ESD (JESD22-A114-HBM)|1B (>500V, <1000V)|
|ee|ee|
|Power dissipation|P|tot|1.8|W|
|T|A=25°C|
|Operating and storage temperature|T|j|,|T|stg|-55... +150|°C|
|ee|ee|
|IEC climatic category; DIN IEC 68-1|55/150/56|
|ee ee|

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20 12 - 11 - 2 8 

Page 1 

**BSP297** 

_**Rev. 2.2**_ 

|**Thermal Characteristics**||||||
|---|---|---|---|---|---|
|**Parameter**<br>**Symbol**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Characteristics**<br>~~ee~~<br>~~ee~~||||||
|Thermal resistance, junction - soldering point|_R_thJS|-|15|25|K/W|
|(Pin 4)||||||
|SMD version, device on PCB:|_R_thJA|||||
|@ min. footprint||-|80|115||
|@ 6 cm2cooling area1)||-|48|70||



|Drain-source breakdown voltage<br>_V_GS=0,_I_D=250µA<br>|<br>||_V_(BR)DSS<br>|<br>|<br>|||200<br>tt<br>fT|-<br>tt<br>fT|-<br>tt<br>|V|
|---|---|---|---|---|---|
|Gate threshold voltage,_V_GS=_V_DS<br>_I_D=400µA<br>|<br>||_V_GS(th)<br>|<br>|<br>|||0.8<br>tt<br>fT|1.4<br>tt<br>fT||1.8<br>tt<br>|||
|Zero gate voltage drain current<br>_V_DS=200V,_V_GS=0,_T_j=25°C<br>_V_DS=200V,_V_GS=0,_T_j=150°C<br>|<br>||_I_DSS<br>| |<br>ttt<br>|<br>||-<br>-<br>fT<br>ttt<br>tt|-<br>10<br>fT<br>ttt<br>tt|0.1<br>100<br><br>ttt<br>tt|µA|
|Gate-source leakage current<br>_V_GS=20V,_V_DS=0<br>|<br>||_I_GSS<br>|<br>|<br>|<br>||-<br>tt<br>i|1<br>tt<br>||10<br>tt|nA<br>i|
|Drain-source on-state resistance<br>_V_GS=4.5V,_I_D=0.53A<br>|<br>||_R_DS(on)<br>|<br>|<br>|<br>|<br>pt|-<br>tt<br>i<br>pttf|1.2<br>tt<br>|<br>tf|3<br>tt<br>tf|i|
|Drain-source on-state resistance<br>_V_GS=10V,_I_D=0.66A<br>||_R_DS(on)<br>|<br>|<br>pt|-<br>i<br>pttf|1<br>|<br>tf|1.8<br>tf||



1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 

20 12 - 11 - 28 

Page 2 

**BSP297** 

_**Rev. 2.2**_ 

|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|**Electrical Characteristics**, at_T_<br>j= 25 °C, unless otherwise specified<br>**Parameter**<br>**Symbol**<br>**Conditions**<br>**Values**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>~~TE~~|
|---|---|---|---|---|---|---|---|---|---|
|**Dynamic Characteristics**||||||||||
|Transconductance<br>Input capacitance<br>Output capacitance<br>Reverse transfer capacitance|_g_fs<br>_V_DS 2*_I_D*_R_DS(on)max,<br>_I_D=0.53A<br>0.47<br>0.94<br>-<br>_C_iss<br>_V_GS=0,_V_DS=25V,<br>_f_=1MHz<br>-<br>286<br>357<br>_C_oss<br>-<br>38<br>47<br>_C_rss<br>-<br>15.7<br>23.5<br>jttt<br>=<br>ee||||||||S<br>pF|
|Turn-on delay time<br>Rise time|_t_d(on)<br>_V_DD=100V,_V_GS=4.5V,<br>_I_D=0.6A,_R_G=15<br>-<br>5.2<br>7.8<br>_t_r<br>-<br>3.8<br>5.7<br>=||||||||ns|
|Turn-off delay time<br>Fall time|_t_d(off)<br>-<br>49<br>74<br>_t_f<br>-<br>19<br>29<br>=|||||||||
|**Gate Charge Characteristics**||||||||||
|Gate to source charge|||_Q_gs||_V_DD=160V,_I_D=0.66A|-|0.7|0.9|nC|
|Gate to drain charge|||_Q_gd|||-|5.2|7.8||
|Gate charge total|||_Q_g||_V_DD=160V,_I_D=0.66A,|-|12.9|16.1||
||||||_V_GS=0 to 10V|||||
|Gate plateau voltage|||_V_(plateau)||_V_DD=160V,_I_D= 0.66 A|-|2.7|3.3|V|
|**Reverse Diode**||||||||||
|Inverse diode continuous|||_I_S||_T_A=25°C|-|-|0.66|A|
|forward current||||||||||
|Inv. diode direct current, pulsed|||_I_SM|||-|-|2.64||
|Inverse diode forward voltage|||_V_SD||_V_GS=0,_I_F=_I_S|-|0.84|1.2|V|
|Reverse recovery time|||_t_rr||_V_R=100V,_I_F=_l_S,|-|52|78|ns|
|Reverse recovery charge|||_Q_rr||d_i_F/d_t_=100A/µs|-|80|120|nC|



20 12 - 11 - 28 

Page 3 

**BSP297** 

_**Rev. 2.2**_ 

## **1 Power dissipation** 

_P_ tot = _f_ ( _T_ A) 

## **2 Drain current** 

## _I_ D = _f_ ( _T_ A) 

parameter: _V_ GS > 10 V 

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## **3 Safe operating area** 

_I_ D = _f_ ( _V_ DS ) 

parameter : _D_ = 0 , _T_ A = 25 °C 

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## **4 Transient thermal impedance** 

_Z_ thJA = _f_ ( _t_ p) 

parameter : _D_ = _t_ p/ _T_ 

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20 12 - 11 - 28 

Page 4 

**BSP297** 

_**Rev. 2.2**_ 

## **6 Typ. drain-source on resistance** 

## **5 Typ. output characteristic** 

_I_ D = _f_ ( _V_ DS) parameter: _T_ j = 25 °C, _V_ GS 

_R_ DS(on) = _f_ ( _I_ D) parameter: _T_ j = 25 °C, _V_ GS 

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## **7 Typ. transfer characteristics** 

_I_ D= _f_ ( _V_ GS ); _V_ DS 2 x _I_ D x _R_ DS(on)max parameter: _T_ j = 25 °C 

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## **8 Typ. forward transconductance** 

_g_ fs = f( _I_ D) 

parameter: _T_ j = 25 °C 

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20 12 - 11 - 28 

Page 5 

**BSP297** 

_**Rev. 2.2**_ 

## **9 Drain-source on-state resistance** 

## **10 Typ. gate threshold voltage** 

_R_ DS(on) = _f_ ( _T_ j) 

_V_ GS(th) = _f_ ( _T_ j) 

parameter : _I_ D = 0.66 A, _V_ GS = 10 V 

parameter: _V_ GS = _V_ DS; _I_ D =400µA 

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## **11 Typ. capacitances** 

_C_ = _f_ ( _V_ DS) 

parameter: _V_ GS=0, _f_ =1 MHz, _T_ j = 25 °C 

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## **12 Forward character. of reverse diode** 

_I_ F = _f_ (VSD) 

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parameter: T<br>j<br>10 1 = BSP297 ==<br>A =<br>rreerr<br>10 0<br>Sea er 2eSeeaaoe<br>+ 10 -1 IYc=a off——<br>T j = 25 °C typ<br>— T j = 150 °C typ {=<br>T j = 25 °C (98%)<br>T j = 150 °C (98%)<br>10 -2 Ehir LL|<br>0 0.4 0.8 1.2 1.6 2 2.4 V 3<br>— V SD<br>I F<br>**----- End of picture text -----**<br>


20 12 - 11 - 28 

Page 6 

**BSP297** 

_**Rev. 2.2**_ 

## **13 Typ. gate charge** 

## _V_ GS = _f_ ( _Q_ G);   parameter: _V_ DS , 

## **14 Drain-source breakdown voltage** 

_V_ (BR)DSS = _f_ ( _T_ j) 

_I_ D = 0.66 A pulsed, _T_ j = 25 °C 

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20 12 - 11 - 28 

Page 7 

**BSP297** 

## _**Rev. 2.2**_ 

20 12 - 11 - 28 

Page 8 



## Links

- [View this product on Novapart](https://novapart.co/products/BSP297H6327XTSA1/power-mosfet-n-channel-200-v-660-ma-18-ohm-sot-223)
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- [Supplier page](https://es.farnell.com/infineon/bsp297h6327xtsa1/mosfet-n-ch-200v-0-66a-sot-223/dp/2480632RL)
---

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