# Power MOSFET, N Channel, 600 V, 120 mA, 45 ohm, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:2480625RL/)

**URL**: https://novapart.co/products/BSP135H6327XTSA1/power-mosfet-n-channel-600-v-120-ma-45-ohm-sot-223
**SKU**: BSP135H6327XTSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4890
**Stock**: 1000+
**Lead Time**: 323 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:120mA; Drain Source Voltage Vds:600V; On Resistance Rds(on):25ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:-1.4

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.8W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-223 |
| Drain Source Voltage Vds | 600V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 120mA |
| Drain Source On State Resistance | 45ohm |
| Gate Source Threshold Voltage Max | 1.4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2480625RL/)

**BSP135** 

## **SIPMOS[®] Small-Signal-Transistor** 

## **Product Summary** 

## **Features** 

- N-channel 

- Depletion mode 

|**Product Summary**|||
|---|---|---|
|||V|
|_V_DS|600||
|||W|
|_R_DS(on),max|60||
|||A|
|_I_DSS,min|0.02||



- d _v_ /d _t_ rated 

- Available with _V_ indicator on reel GS(th) 

- Pb-free lead plating; RoHS compliant 

|• Qualified according to AEC Q101|• Qualified according to AEC Q101|||||PG-SOT223|
|---|---|---|---|---|---|---|
|• Halogen­free according to IEC61249­2­21||||drain pins 2, 4<br>gate||-a<br>Sen|
|@®,Halogen-Free Acce ¢||||source pin3||7|
||||||||
|Type|Package<br>Tape and Reel Information|||Marking||Packaging|
|**Type**<br>BSP135|**Package**<br>**Tape and Reel Information**<br>PG-SOT223<br>H6327: 1000 pcs/reel|||**Marking**<br>BSP135||**Packaging**<br>Non dry|
|BSP135<br>BSP135<br>BSP135|PG-SOT223<br>L6327: 1000 pcs/reel<br>PG-SOT223<br>L6906: 1000 pcs/reel<br>PG-SOT223<br>H6906: 1000 pcs/reel<br>sorted in_V_GS(th)bands1)|||BSP135<br>BSP135<br>BSP135||Non dry<br>Non dry<br>Non dry|



- Qualified according to AEC Q101 

- Halogen­free according to IEC61249­2­21 

**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Maximum ratings,**at_T_j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|||
|---|---|---|---|---|
|**Parameter**|**Symbol **|**Conditions**|**Value**|**Unit**|
|Continuous drain current|_I_D|_T_A=25 °C|0.12|A|
|||_T_A=70 °C|0.10||
|Pulsed drain current|_I_D,pulse|_T_A=25 °C|0.48||
|Reverse diode d_v_/d_t_|d_v_/d_t_|_I_D=0.12 A,_V_DS=20 V,<br>d_i_/d_t_=200 A/µs,<br>_T_j,max=150 °C|6|kV/µs|
|Gate source voltage|_V_GS||±20|V|
|ESD Class<br>(JESD22-A114-HBM)|||1A(>250V,<500V)||
|Power dissipation|_P_tot|_T_A=25 °C|1.8|W|
|Operating and storage temperature|_T_j,_T_stg||-55 ... 150|°C|
|IEC climatic category; DIN IEC 68-1|||55/150/56||



- 1)  see table on next page and diagram 11 

Rev. 1.33 

page 1 

2012-11-29 

**BSP135** 

|**BSP135**|**BSP135**|**BSP135**|**BSP135**|**BSP135**|**BSP135**|**BSP135**|**BSP135**|
|---|---|---|---|---|---|---|---|
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~el~~||||||||
|**Thermal characteristics**||||||||
|Thermal resistance,<br>junction - soldering point (pin 4)|_R_thJS|||-|-|25|K/W|
|SMD version, device on PCB|_R_thJA|minimal footprint||-|-|115||
|||6 cm2cooling area2)||-|-|70||
|**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified||=25 °C, unless otherwise specified||||||
|**Static characteristics**||||||||
|Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=-3 V,_I_D=250 µA||600|-|-|V|
|Gate threshold voltage<br>Drain-source cutoff current<br>Gate-source leakage current<br>On-state drain current<br>Drain-source on-state resistance|_V_GS(th)<br>_V_DS=3 V,_I_D=94 µA<br>-2.1<br>-1.4<br>-1<br>_I_D(off)<br>_V_DS=600 V,<br>_V_GS=-3 V,_T_j=25 °C<br>-<br>-<br>0.1<br>_V_DS=600 V,<br>_V_GS=-3 V,_T_j=125 °C<br>-<br>-<br>10<br>_I_GSS<br>_V_GS=20 V,_V_DS=0 V<br>-<br>-<br>100<br>_I_DSS<br>_V_GS=0 V,_V_DS=10 V<br>20<br>-<br>-<br>_R_DS(on)<br>_V_GS=0 V,_I_D=0.01A<br>-<br>30<br>60<br>_V_GS=10 V,_I_D=0.12 A<br>-<br>25<br>45<br>~~P-=Frr~~<br>~~-+—_f ff~~<br>~~————~~||||||µA<br>nA<br>mA<br>W|
|Transconductance|_g_fs<br>|_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=0.1 A<br>0.08<br>0.16<br>-<br>~~CT~~||||||S|
|**Threshold voltage****_V_ GS(th) sorted in bands3)**||||||||
|J|_V_GS(th)|_V_DS=3 V,_I_D=94 µA||-1.2|-|-1|V|
|K||||-1.35|-|-1.15||
|L||||-1.5|-|-1.3||
|M||||-1.65|-|-1.45||
|N||||-1.8|-|-1.6||



- 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (single layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

- 3) Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific band cannot be ordered separately. 

Rev. 1.33 

page 2 

2012-11-29 

**BSP135** 

|**Parameter**<br>~~ee~~|**Symbol **<br>~~ee~~|**Conditions**<br>~~ee~~|**min.**<br>~~ee~~|**typ.**<br>**Values**<br>~~ee~~|**max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|
|**Dynamic characteristics**|||||||
|Input capacitance|_C_iss||-|98|146|pF|
|Output capacitance|_C_oss|_V_GS=-3 V,_V_DS=25 V,<br>_f_=1 MHz|-|8.5|13||
|Reverse transfer capacitance|Crss||-|3.4|5.1||
|Turn-on delay time|_t_d(on)||-|5.4|8.1|ns|
|Rise time|_t_r|_V_DD=300 V,|-|5.6|8.4||
|||_V_GS=-3...5 V,|||||
|Turn-off delay time|_t_d(off)|_I_D=0.1 A,_R_G=6W|-|28|42||
|Fall time|_t_f||-|182|273||
|Gate Charge Characteristics|||||||
|Gate to source charge|_Q_gs||-|0.24|0.36|nC|
|Gate to drain charge|_Q_gd|_V_DD=400 V,_I_D=0.1 A,|-|2.0|3.0||
|Gate charge total|_Q_g|_V_GS=-3 to 5 V|-|3.7|4.9||
|Gate plateau voltage|_V_plateau||-|0.20|-|V|
|**Reverse Diode**|||||||
|Diode continous forward current|_I_S||-|-|0.12|A|
|||_T_A=25 °C|||||
|Diode pulse current|_I_S,pulse||-|-|0.48||
|Diode forward voltage|_V_SD|_V_GS=-3 V,_I_F=0.12 A,<br>_T_j=25 °C|-|0.78|1.2|V|
|Reverse recovery time|_t_rr|_V_R=300 V,_I_F=0.1 A,|-|87|130|ns|
|Reverse recovery charge|_Q_rr|d_i_F/d_t_=100 A/µs|-|70|104|nC|



Rev. 1.33 

page 3 

2012-11-29 

**BSP135** 

## **1 Power dissipation** 

_P_ tot=f( _T_ A) 

## **2 Drain current** 

_I_ D=f( _T_ A); _V_ GS≥10 V 

**==> picture [469 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
2  0.15<br>1.5<br>0.1<br>1<br>0.05<br>0.5<br>0  0<br>0  40  80  120  160  0  40  80  120  160<br>T A [°C]  T A [°C]<br> [W]<br> [A]<br>P tot I D<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

## **4 Max. transient thermal impedance** 

**==> picture [471 x 310] intentionally omitted <==**

**----- Start of picture text -----**<br>
I  D=f( V  DS);  T  A=25 °C;  D  =0 Z  thJA=f( t  p)<br>parameter:  t  p parameter:  D  = t  p/ T<br>10 [0 ] 10 [2 ]<br>10 µs<br>limited by on-state<br>resistance<br>100 µs  0.5<br>10 [-1 ]<br>1 ms  0.2<br>10 ms  10 [1 ] 0.1<br>0.05<br>10 [-2 ] single pulse<br>0.02<br>DC  0.01<br>10 [-3 ] A 10 [0 ]<br>10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ]<br>V DS [V]  t p [s]<br> [A]   [K/W]<br>I D<br>thJA<br>Z<br>**----- End of picture text -----**<br>


Rev. 1.33 

page 4 

2012-11-29 

**BSP135** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C 

parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C parameter: _V_ GS 

**==> picture [467 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.25  100<br>10 V 1 V -0.2 V  0 V  0.2 V  0.5 V<br>-0.1 V  0.1 V<br>0.2  80<br>0.5 V<br>0.15  60<br>0.2 V<br>0.1  0.1 V 40<br>0 V<br>1 V<br>-0.1 V<br>-0.2 V<br>10 V<br>0.05  20<br>0  0<br>0  2  4  6  8  10  0  0.04  0.08  0.12  0.16  0.2<br>V DS [V]  I D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>=f( V  GS); |); | V  DS|>2||>2| I  D|| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>0.25  0.2<br>0.2<br>0.15<br>0.15<br>0.1<br>0.1<br>0.05<br>0.05<br>0  0<br>-2  -1  0  1  0.00  0.04  0.08  0.12<br>V GS [V]  I D [A]<br>]<br>W<br> [A]   [<br>I D<br>DS(on)<br>R<br> [A]   [S]<br>I D g fs<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); |); | _V_ DS|>2||>2| _I_ D|| _R_ DS(on)max 

Rev. 1.33 

2012-11-29 

page 5 

**BSP135** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=0.01 A; _V_ GS=0 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ DS=3 V; _I_ D=94 µA parameter: _I_ D 

**==> picture [468 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
160  0<br>140<br>-0.5<br>120<br>-1  98 %<br>100<br>80  -1.5  typ<br>98 %<br>60<br>-2<br>2 %<br>40<br>typ<br>-2.5<br>20<br>0  -3<br>-60  -20  20  60  100  140  180  -60  -20  20  60  100  140  180<br>T j [°C]  T j [°C]<br>11 Threshold voltage bands 12 Typ. capacitances<br>=f( V  GS); );  V  DS=3 V; =3 V;  T  j=25 °C=25 °C C  =f( V  DS);  V  GS=-3 V;  f  =1 MHz<br>10 [1 ] 10 [3 ]<br> N    M     L     K     J<br>10 [0 ] 10 [2 ] Ciss<br>10 [-1 ] 10 [1 ] Coss<br>94 µA<br>Crss<br>10 [-2 ] 10 [0 ]<br>-2  -1.5  -1  -0.5  0  10  20  30<br>V GS [V]  V DS [V]<br>]<br>[ W<br> [V]<br>DS(on)<br>R V GS(th)<br> [mA]   [pF]<br>I D C<br>**----- End of picture text -----**<br>


## **11 Threshold voltage bands** 

_I_ D=f( _V_ GS); ); _V_ DS=3 V; =3 V; _T_ j=25 °C=25 °C 

Rev. 1.33 

page 6 

2012-11-29 

**BSP135** 

## **13 Forward characteristics of reverse diode** _I_ F=f( _V_ SD) 

parameter: _T_ j 

## **15 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=0.1 A pulsed parameter: _V_ DD 

**==> picture [461 x 611] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [0 ] 8<br>0.5 VDS(max)<br>0.2 VDS(max)<br>6<br>0.8 VDS(max)<br>10 [-1 ] 25 °C  4<br>150 °C  150 °C, 98%<br>25 °C, 98%<br>2<br>10 [-2 ] 0<br>-2<br>| fe<br>10 [-3 ] -4<br>0  0.5  1  1.5  2  0  1  2  3  4<br>V SD [V]  Q gate [nC]<br>16 Drain-source breakdown voltage<br> BR(DSS)=f(=f( T  j); );  I  D=250 µA=250 µA<br>700<br>660<br>620<br>580<br>540<br>500<br>-60  -20  20  60  100  140  180<br>T j [°C]<br> [V]<br> [A]<br>I F GS<br>V<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>


## **16 Drain-source breakdown voltage** 

_V_ BR(DSS)=f(=f( _T_ j); ); _I_ D=250 µA=250 µA 

Rev. 1.33 

2012-11-29 

page 7 

**BSP135** 

## **Package Outline:** 

## **Footprint:** 

## **Packaging:** 

Dimensions in mm 

Rev. 1.33 

page 8 

2012-11-29 

**BSP135** 

## **Published by** 

## **Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 1.33 

page 9 

2012-11-29 



## Links

- [View this product on Novapart](https://novapart.co/products/BSP135H6327XTSA1/power-mosfet-n-channel-600-v-120-ma-45-ohm-sot-223)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/bsp135h6327xtsa1/mosfet-n-ch-600v-0-12a-sot-223/dp/2480625RL)
---

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