# Power MOSFET, P Channel, 30 V, 7 A, 0.017 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2839435/)

**URL**: https://novapart.co/products/BSO303PHXUMA1/power-mosfet-p-channel-30-v-7-a-0017-ohm-soic
**SKU**: BSO303PHXUMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3700
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | OptiMOS |
| Power Dissipation | 2W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | P Channel |
| Power Dissipation Pd | 2W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.017ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 7A |
| Drain Source On State Resistance | 0.017ohm |
| Gate Source Threshold Voltage Max | 1.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2839435/)

## **BSO303P H** ~~Cinfineon ce~~ **OptiMOS[®] -P Small-Signal-Transistor Product Summary Features** 

- Dual P-Channel in SO8 

- Enhancement mode 

- Logic level 

|~~ce~~|~~ce~~|~~ce~~|~~ce~~|**BSO303P H**<br>~~ce~~|**BSO303P H**<br>~~ce~~|
|---|---|---|---|---|---|
|**Product Summary**||||||
|_V_DS||||||
|_V_DS||||-30|V|
|_R_DS(on),max||_VGS=-10V_||21|mW|
|||_VGS=-4.5V_||32||
|||||||
|_I_D||||-8.2|A|



- 150°C operating temperature 

- Qualified according JEDEC for target applications 

|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|• Qualified according JEDEC for target applications|||||||||SO 8|SO 8|SO 8|SO 8|SO 8|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|• Halogen-free according to IEC61249-2-21|||||||||||||||||||||||
|• Pb-free lead plating; RoHS compliant|||||||||||||||||||||||
|S/ (Gp Halogen-Free||||||“-@)IE||||||||||||||||<|
||||||||||||||||||||||||
|**Type**||**Package**||**Marking**|||||**Lead free**||||**Halogen free**|||||||||**Packing**|
||||||||||||||||||||||||
||||||||||||||||||||||||
|BSO303P H||PG-DSO- 8|||303P|||||Yes||||Yes||||||||dry|



- Halogen-free according to IEC61249-2-21 

- Pb-free lead plating; RoHS compliant 

**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Maximum ratings,**at_T_j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|||
|---|---|---|---|---|
|**Parameter**|**Symbol **<br>~~|~~<br>~~EES~~|**Conditions**<br>~~|~~<br>~~-~~<br>~~EES~~|**Unit**<br>**10 secs**<br>**steady state**<br>**Value**<br>~~Po~~<br>~~|~~<br>~~-|~~<br>~~EES~~|**Unit**|
||||**10 secs**<br>~~|~~<br>~~-|~~<br>~~EES~~||
|Continuous drain current1)|_I_D<br>~~EES~~|_T_C=25 °C<br>~~-~~<br>~~EES~~|-8,2<br>~~- |~~<br>~~EES~~|A|
|||_T_C=70 °C<br>~~EES~~<br>~~a~~|-6,6<br>~~EES~~<br>~~a~~||
|Pulsed drain current2)|_I_D,pulse<br>~~EES~~<br>~~es~~|_T_C=25 °C<br>~~EES~~<br>~~es~~|||
|Avalanche energy, single pulse|_E_AS<br>~~es~~|_I_D=-8.2 A,_R_GS=25W<br>~~es~~|mJ<br>97<br>~~es~~|mJ|
|Gate source voltage|_V_GS<br>~~a~~|~~a~~|V<br>±20<br>~~a~~|V|
|Power dissipation|_P_tot<br>~~ee~~<br>~~ee~~|_T_A=25 °C<br>~~ee~~<br>~~ee~~|W<br>2<br>~~ee~~<br>~~ee~~|W|
|Operating and storage temperature|_T_j,_T_stg<br>~~ee~~|~~ee~~|°C<br>-55 ... 150<br>~~ee~~|°C|
|ESD class|~~ee~~<br>~~ee~~<br>~~ee~~|JESD22-A114 HBM<br>~~ee~~<br>~~ee~~<br>~~ee~~|1B (500V - 1kV)<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|Soldering temperature|~~ee~~|~~ee~~|260 °C<br>~~ee~~||
|IEC climatic category; DIN IEC 68-1|~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|55/150/56<br>~~ee~~<br>~~ee~~||



Rev. 1.3 

page 1 

2010-02-10 

|**Thermal characteristics**|~~ee~~|~~ee ~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|
|---|---|---|---|---|---|---|
|Thermal resistance,<br>junction - soldering point|_R_thJS||-|-|50|K/W|
|SMD version, device on PCB:|_R_thJA|minimal footprint, t<<br>10s|||110||
|||minimal footprint,<br>steady state|||150||
|||6 cm2cooling area1)<br>t<10s|-|-|62,5||
|||6 cm2cooling area1),<br>steadystate|-|-|80||



**Electrical characteristics,** at _T_ j=25 °C, unless otherwise specified 

## **Static characteristics** 

|Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=0 V,_I_D=-250µA|-30|-|-|V|
|---|---|---|---|---|---|---|
|Gate threshold voltage|_V_GS(th)|_V_DS=_V_GS,_I_D=-100 µA|-1|-1,5|-2||
|Zero gate voltage drain current|_I_DSS|_V_DS=-30 V,_V_GS=0 V,<br>_T_j=25 °C|-|-0,1|-1|µA|
|||_V_DS=-30 V,_V_GS=0 V,<br>_T_j=150 °C|-|-10|-100||
|Gate-source leakage current|_I_GSS|_V_GS=-20 V,_V_DS=0 V|-|-|-100|nA|
|Drain-source on-state resistance|_R_DS(on)|_V_GS=-4.5 V,_I_D=-6.6 A|-|25|32|mW|
|||_V_GS=-10 V,_I_D=-8.2 A|-|17|21||
|Transconductance|_g_fs||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=-6.6 A|11|27|-|S|



1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air; t≤10 sec. 

2.) See figure3 for more detailed information 

Rev. 1.3 

page 2 

2010-02-10 

||Cinfineon|||||||
|---|---|---|---|---|---|---|---|
||Cinfineon|||||**BSO303P H**||
|||||||||
||**Parameter**|**Symbol **|**Conditions**||**Values**||**Unit**|
|||||**min.**|**typ.**|**max.**||
||**Dynamic characteristics**|||||||
|Input capacitance<br>Output capacitance<br>Reverse transfer capacitance<br>Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time<br>~~—— ~~||_C_iss<br>_C_oss<br>_C_rss<br>_t_d(on)<br>_t_r<br>_t_d(off)<br>_t_f<br>|-<br>1785<br>2678<br>pF<br>-<br>510<br>765<br>-<br>425<br>638<br>-<br>11<br>17<br>ns<br>-<br>13<br>20<br>-<br>55<br>83<br>-<br>39<br>59<br>_V_GS=0 V,_V_DS=-25 V,<br>_f_=1 MHz<br>_V_DD=-15 V,_V_GS=-<br>10 V,_I_D=-1 A,<br>_R_G=6W<br> ~~ws~~|||||
||Gate Charge Characteristics3)|||||||
||Gate to source charge|_Q_gs||-|-5|-6|nC|
||Gate to drain charge|_Q_gd|_V_DD=-24 V,_I_D=-8.2 A,|-|-14|-20||
||Gate charge total|_Q_g|_V_GS=0 to 10 V|-|-36|-49||
||Gate plateau voltage|_V_plateau||-|-2,7|-|V|
||**Reverse Diode**|||||||
||Diode continous forward current|_I_S||-|-|-2,2|A|
||||_T_C=25 °C|||||
||Diode direct current, pulsed|_I_SM||-|-|-32,8||
||Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=-8.2 A,<br>_T_j=25 °C|-|-0,9|-1,3|V|
||Reverse recovery time|_t_rr|_V_R=-15 V,_I_F=|_I_S|,<br>d_i_F/d_t_=100 A/µs|-|24|36|ns|
||Reverse recovery charge|_Q_rr||-|13|19|nC|



Rev. 1.3 

page 3 

2010-02-10 

**BSO303P H** 

**1 Power dissipation** 

## **2 Drain current** 

**==> picture [470 x 653] intentionally omitted <==**

**----- Start of picture text -----**<br>
P  tot=f( T  A) I  D=f( T  A); | V  GS|≥10 V<br>2,5<br>8<br>2<br>6<br>1,5<br>4<br>1<br>2<br>0,5<br>0 aH 0<br>0 40 80 120 160 0 40 80 120 160<br>T A [°C] T A [°C]<br>3 Safe operating area 4 Max. transient thermal impedance<br>I  D=f( V  DS);  T  A=25 °C [1)] ;  D  =0 Z  thJS=f( t  p)<br>parameter:  t  p parameter:  D  = t  p/ T<br>1000 10 [2] 100<br>0.5<br>10 [2] 100 0.2<br>10 µs 10 [1] 10<br>0.1<br>100 µs<br>0.05<br>10 [1] 10<br>1 ms<br>0.02<br>10 ms 10 [0] 1<br>0.01<br>10 [0] 1<br>limited by on-state<br>resistance DC<br>single pulse<br>10 [-1] 0,1<br>10 [-1] 0,1<br>10 [-2] 0,01 10 [-2] 0,01<br>100,1 [-1] 101 [0] 1010 [1] 10100 [2] 100,00001 [-5] 100,0001 [-4] 100,001 [-3] 100,01 [-2] 100,1 [-1] 101 [0] 1010 [1]<br>-V DS [V] t p [s]<br> [W]  [A]<br>tot D<br>P -I<br> [A]D  [K/W]<br>-I thJS<br>Z<br>**----- End of picture text -----**<br>


Rev. 1.3 

page 4 

2010-02-10 

**BSO303P H** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C parameter: _V_ GS 

**==> picture [463 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
60 70<br>-6 V<br>-4.5 V<br>-10 V<br>-4.0 V 60<br>50 ul —<br>-5 V<br>50<br>40<br>-3 V<br>lo 40<br>-3.5 V -3.5 V<br>30<br>30 -4 V<br>— —<br>-4.5 V<br>20 -5 V<br>20 -6 V<br>-3.0 V -8 V<br>-10 V<br>10<br>10<br>-2.5 V<br>0 0<br>0 2 4 6 8 10 0 10 20 30 40<br>-V DS [V] -I D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>=f( V  GS); |); | V  DS|>2||>2| I  D|| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>40<br>30<br>30<br>20<br>20<br>10<br>10<br>150 °C<br>25 °C<br>0 0 Hae<br>0 1 2 3 4 0 10 20 30<br>-V GS [V] -I D [A]<br>]<br>W<br>[m<br> [A]<br>D<br>-I<br>DS(on)<br>R<br> [A]  [S]<br>D fs<br>-I g<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); |); | _V_ DS|>2||>2| _I_ D|| _R_ DS(on)max parameter: _T_ j 

Rev. 1.3 

2010-02-10 

page 5 

**BSO303P H** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=-8.2 A; _V_ GS=-10 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=-100 mA 

**==> picture [465 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
30 2,5<br>28<br>26 2 max.<br>98 %<br>24<br>22 / 1,5 == typ. =<br>20<br>18 1 min.<br>16 typ.<br>14 0,5<br>12<br>| i LS =<br>10 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C] T j [°C]<br>11 Typ. capacitances 12 Forward characteristics of reverse diode<br> =f( V  DS); );  V  GS=0 V; =0 V;  f  =1 MHz I  F=f( V  SD)<br>parameter:  T  j<br>10 [4] 10000 10 [2]<br>= 150 °C, 98%<br>10 [1] 25 °C, typ<br>Ciss<br>10 [3] 1000<br>150 °C, typ<br>Coss<br>10 [0]<br>Crss<br>25 °C, 98%<br>10 [2] 100 ca 10 [-1]<br>0 8 16 24 0 0,5 1 1,5 2 2,5 3<br>-V DS [V] -V SD [V]<br>]<br>W<br> [m  [V]<br>DS(on) GS(th)<br>R -V<br> [A]<br>C  [pF] I F<br>**----- End of picture text -----**<br>


## **11 Typ. capacitances** 

_C_ =f( _V_ DS); ); _V_ GS=0 V; =0 V; _f_ =1 MHz 

Rev. 1.3 

page 6 

2010-02-10 

**BSO303P H** 

## **13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=25 W 

parameter: _T_ j(start) 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=-8.2 A pulsed parameter: _V_ DD 

**==> picture [463 x 611] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [2] 10<br>8<br>10 [1]<br>-6 V -15 V<br>6<br>-24 V<br>25 °C<br>4<br>oS O 77<br>10 [0] 100 °C<br>10 [0] 10 [1] 10 [2] 10 [3]<br>125 °C<br>pte<br>2<br>fo<br>0<br>0 10 20 30 40<br>t AV [µs] -Q gate [nC]<br>15 Drain-source breakdown voltage<br> BR(DSS)=f(=f( T  j); );  I  D=-250 mA=-250 mAmAA<br>35<br>34<br>33<br>32<br>31<br>30<br>29<br>28<br>27<br>26<br>-60 -20 20 60 100 140 180<br>T j [°C]<br> [A]  [V]<br>-I AV -V GS<br> [V]<br>BR(DSS)<br>-V<br>**----- End of picture text -----**<br>


## **15 Drain-source breakdown voltage** 

_V_ BR(DSS)=f(=f( _T_ j); ); _I_ D=-250 mA=-250 mAmAA 

Rev. 1.3 

2010-02-10 

page 7 

**BSO303P H** 

## **Package Outline** 

## **PG-DSO-8: Outline** 

Rev. 1.3 

page 8 

2010-02-10 

**BSO303P H** 

**Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 1.3 

page 9 

2010-02-10 



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- [Supplier page](https://es.farnell.com/en-ES/infineon/bso303phxuma1/mosfet-p-ch-30v-7a-soic-8/dp/2839435)
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