# Power MOSFET, P Channel, 20 V, 7 A, 0.021 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2839434/)

**URL**: https://novapart.co/products/BSO203SPHXUMA1/power-mosfet-p-channel-20-v-7-a-0021-ohm-soic
**SKU**: BSO203SPHXUMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4650
**Stock**: 500+
**Lead Time**: 78 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-7A; Drain Source Voltage Vds:-20V; On Resistance Rds(on):0.015ohm; ; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | OptiMOS |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 7A |
| Drain Source On State Resistance | 0.021ohm |
| Gate Source Threshold Voltage Max | 900mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2839434/)

**BSO203SP H** 

## **OptiMOS[®] P-Power-Transistor** 

## **Features** 

- single P-Channel in SO8 

- Qualified according JEDEC for target applications 

- 150°C operating temperature 

## **Product Summary** 

|**Product Summary**|**Product Summary**|**Product Summary**|**Product Summary**|
|---|---|---|---|
|||||
|_V_DS||-20|V|
|||||
|_R_DS(on),max|_V_GS=4.5 V|21|mΩ|
|||||
||_V_GS=2.5 V|34||
|||||
|_I_D||-8.9|A|



- Super Logic Level (2.5V rated) 

- Pb-free plating; RoHS compliant, Halogen-free according to IEC61249-2-21 

|**Parameter**|**Symbol **<br>~~i~~|**Conditions**<br>~~i~~|**Value**<br>~~|~~<br>~~eee~~|**Value**<br>~~|~~<br>~~eee~~|**Unit**|
|---|---|---|---|---|---|
||||**10 secs**<br>~~|~~<br>~~eee~~|**steady state**<br>~~|~~<br>~~eee~~||
|Continuous drain current1)|_I_D|_V_GS= -4.5 V,<br>_T_A=25 °C|-8.9<br>~~eee~~|-7.0<br>~~eee~~|A|
|||_V_GS= -4.5 V,<br>_T_A=70 °C<br>~~a~~|-7.1<br>~~a~~|-5.8<br>~~a~~||
|||_V_GS= -2.5 V,<br>_T_A=25 °C<br>~~TT~~|-7.0<br>~~TT~~|-5.7<br>~~TT~~||
|||_V_GS= -2.5 V,<br>_T_A=70 °C<br>~~a~~|-5.6<br>~~a~~|-4.5<br>~~a~~||
|Pulsed drain current2)|_I_D,pulse<br>~~ee~~|_T_A=25 °C<br>~~ee~~|-35.6<br>~~ee~~|||
|Avalanche energy, single pulse|_E_AS<br>~~ee~~|_I_D=--8.9 A,_R_GS=25Ω<br>~~ee~~|97<br>~~ee~~||mJ|
|Gate source voltage|_V_GS<br>~~ee~~|~~ee~~|±12<br>~~ee~~<br>~~ee~~<br>~~ee~~||V|
|Power dissipation1)|_P_tot<br>~~ee~~|_T_A=25 °C<br>~~ee~~|2.5<br>~~ee~~<br>~~ee~~|1.6<br>~~ee~~<br>~~ee~~|W|
|Operating and storage temperature|_T_j,_T_stg<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|-55 ... 150<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~||°C|
|ESD class|~~ee~~|JESD22-A114 HBM<br>~~ee~~|1B (500V - 1 kV)<br>~~ee~~|||
|Soldering temperature|~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ee~~|260<br>~~ee~~<br>~~ee~~<br>~~ee~~||°C|
|IEC climatic category; DIN IEC 68-1|~~ee~~|~~ee~~|55/150/56<br>~~ee~~|||



Rev.1.31 

page 1 

2010-02-10 

|**Thermal characteristics**|||||||
|---|---|---|---|---|---|---|
|Thermal resistance,<br>junction - soldering point|_R_thJS||-|-|35|K/W|
|Thermal resistance,<br>junction - ambient|_R_thJA|minimal footprint,<br>_t_p≤10 s|-|-|110||
|||minimal footprint,<br>steady state|-|-|150||
|||6 cm2cooling area1),<br>_t_p≤10 s|-|-|53||
|||6 cm2cooling area1),<br>steady state|-|-|80||



**Electrical characteristics,** at _T_ j=25 °C, unless otherwise specified 

## **Static characteristics** 

|**Static characteristics**|||||||
|---|---|---|---|---|---|---|
|Drain-source breakdown voltage|_V_(BR)DSS<br>~~ef~~|_V_GS=0 V,_I_D= -<br>0.25 mA<br>~~ef~~|-20<br>~~ef~~|-<br>~~ef~~|-<br>~~ef~~|V|
|Gate threshold voltage|_V_GS(th)<br>~~fo~~|_V_DS=_V_GS,_I_D= -100 µA<br>~~fo~~|-0.6<br>~~fo~~|-0.9<br>~~fo~~|-1.2<br>~~fo~~||
|Zero gate voltage drain current|_I_DSS<br>~~ee~~|_V_DS= -20 V,_V_GS=0 V,<br>_T_j=25 °C<br>~~ee~~|-<br>~~ee~~<br>~~tT~~|-<br>~~ee~~<br>~~tT~~|-1<br>~~ee~~|µA|
|||_V_DS= -20 V,_V_GS=0 V,<br>_T_j=150 °C<br>~~ee~~<br>~~P|~~|-<br>~~ee~~<br>~~P|~~<br>~~tT~~|-<br>~~ee~~<br>~~P|~~<br>~~tT~~|-100<br>~~ee~~<br>~~P|~~||
|Gate-source leakage current|_I_GSS<br>~~et~~|_V_GS= -12 V,_V_DS=0 V<br>~~et~~|-<br>~~tT~~<br>~~et~~|-<br>~~tT~~<br>~~et~~|-100<br>~~et~~|nA|
|Drain-source on-state resistance|_R_DS(on)<br>~~EEE~~<br>~~ee~~|_V_GS=2.5 V,_I_D=-7 A<br>~~EEE~~|-<br>~~EEE~~|22<br>~~EEE~~|34<br>~~EEE~~|mΩ|
|||_V_GS=4.5 V,_I_D=-8.9 A<br>~~EEE~~<br>~~ee~~<br>~~ee~~|-<br>~~EEE~~<br>~~ee~~<br>~~ee~~|15<br>~~EEE~~<br>~~ee~~|21<br>~~EEE~~<br>~~ee~~||
|Gate resistance|_R_G<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ft~~|-<br>~~ee~~<br>~~ee~~<br>~~fttf~~|3.3<br>~~ee~~<br>~~tf~~|-<br>~~ee~~<br>~~tf~~|Ω|
|Transconductance|_g_fs<br>~~ee~~<br>~~Pf~~||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=-7.1 A<br>~~ee~~<br>~~ee ~~<br>~~Pf~~<br>~~ft~~|18<br>~~ee~~<br> ~~ee~~<br>~~Pf~~<br>~~fttf~~|33<br>~~ee~~<br>~~Pf~~<br>~~tf~~|-<br>~~ee~~<br>~~Pf~~<br>~~tf~~|S|



1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

- 2) See figure 3 for more detailed information 

- 3) See figure 13 for more detailed information 

Rev.1.31 

page 2 

2010-02-10 

|||||||**BSO203SP H**|**BSO203SP H**|
|---|---|---|---|---|---|---|---|
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~rd~~||||||||
||**Dynamic characteristics**|||||||
||Input capacitance|_C_iss||-|2500|3750|pF|
||Output capacitance|_C_oss|_V_GS=0 V,_V_DS=15 V,<br>_f_=1 MHz|-|820|1230||
||Reverse transfer capacitance|Crss||-|680|1020||
||Turn-on delay time|_t_d(on)||-|16|24|ns|
||Rise time|_t_r|_V_DD= -10 V,_V_GS=-|-|55|83||
||||4.5 V,_I_D=-8.9 A,_R_G=|||||
||Turn-off delay time|_t_d(off)|6Ω|-|45|68||
||Fall time|_t_f||-|74|111||
||Gate Charge Characteristics4)|||||||
||Gate to source charge|_Q_gs||-|-4|-6|nC|
||Gate charge at threshold|_Q_g(th)||-|-4|-6||
||Gate to drain charge|_Q_gd|_V_DD= -10 V,_I_D=-8.9 A,|-<br>=-8.9 A,|-11|-17||
||Switching charge|_Q_sw|_V_GS=0 to 4.5 V|-|-12|-18||
||Gate charge total|_Q_g||-|-26|-39||
||Gate plateau voltage|_V_plateau||-|-1.6|-|V|
||Output charge|_Q_oss|_V_DD= -10 V,_V_GS=0 V|-|16|21|nC|
||**Reverse Diode**|||||||
||Diode continuous forward current|_I_S||-|-|-3|A|
||||_T_A=25 °C|||||
||Diode pulse current|_I_S,pulse||-|-|-35.6||
||Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=-8.9 A,<br>_T_j=25 °C|-|-|1.1|V|
||Reverse recovery time|_t_rr|_V_R=10 V,_I_F=_I_S,<br>d_i_F/d_t_=100 A/µs|-|26|39|ns|
||Reverse recovery charge|_Q_rr|_V_R=10 V,_I_F=_I_D,<br>d_i_F/d_t_=100 A/µs|-|14|21|nC|



4) See figure 16 for gate charge parameter definition 

Rev.1.31 

page 3 

2010-02-10 

**BSO203SP H** 

## **1 Power dissipation** 

_P_ tot=f( _T_ A); _t_ p≤10 s 

## **2 Drain current** 

_I_ D=f( _T_ A); _t_ p≤10 s parameter: _V_ GS 

**==> picture [465 x 600] intentionally omitted <==**

**----- Start of picture text -----**<br>
3 10<br>9<br>2.5<br>8<br>7<br>2<br>6<br>4.5 V<br>1.5 5<br>4<br>1<br>3<br>2<br>0.5<br>1<br>0 0<br>0 40 80 120 160 0 40 80 120 160<br>T  A [°C] T  A [°C]<br>3 Safe operating area 4 Max. transient thermal impedance<br>=f( V  DS); );  T  A=25 °C=25 °C [[1)]] ;  D  =0 Z  thJA=f( t  p) [1)]<br>parameter:  t  p parameter:  D  = t  p/ T<br>10 [2] 10 [2]<br>limited by on-state<br>resistance 0.5<br>10 µs<br>100 µs<br>0.2<br>10 [1]<br>0.1<br>1 ms<br>10 [1]<br>0.05<br>0.02<br>10 ms 10 [0] 0.01<br>single pulse<br>10 [0] DC 100 ms<br>10 [-1]<br>10 [-1] 10 [-2] t<br>10 [-1] 10 [0] 10 [1] 10 [2] 10 [-6] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1] 10 [2]<br>V  DS [V] t  p [s]<br>2010-02-10<br> [W]  [A]<br>P  tot -I  D<br> [A]  [K/W]<br>I  D<br> thJA<br>Z<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS); ); _T_ A=25 °C=25 °C[[1)]] ; _D_ =0 parameter: _t_ p 

Rev.1.31 

page 4 

## **BSO203SP H** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C parameter: _V_ GS 

**==> picture [438 x 574] intentionally omitted <==**

**----- Start of picture text -----**<br>
60 50<br>10 V<br>3 V<br>2.5V<br>45<br>4.5V<br>50<br>40<br>35 2.5 V<br>40<br>30<br>30 2V 25<br>aa 3.0 V<br>i 20 = 3.5V<br>20 4.5 V<br>15<br>10 V<br>10<br>10<br>1.5V<br>Hn 5 ee<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60<br>10 V<br>fait) | Eeieeite<br>-V  DS [V] -I  D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>I  D=f( V  GS); | V  DS|>2| I  D| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>35 60<br>30<br>25<br>40<br>20<br>15<br>150 °C 20<br>10 PO<br>25°C<br>5<br>0 e/Poa 0 fi<br>0.0 0.5 1.0 1.5 2.0 2.5<br>0 5 10 15 20 25 30 35 40<br>-V  GS [V] I  D [A]<br>]<br>Ω<br> [m<br> [A]<br> D<br>-I<br> DS(on)<br>R<br> [A]  [S]<br>-I  D g  fs<br>**----- End of picture text -----**<br>


Rev.1.31 

2010-02-10 

page 5 

**BSO203SP H** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=-8.9 A; _V_ GS= -4.5 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D= -100 µA 

**==> picture [466 x 602] intentionally omitted <==**

**----- Start of picture text -----**<br>
30<br>1.4<br>25<br>1.2<br>ae<br>98 %<br>20 1<br>typ<br>0.8<br>15<br>0.6<br>10<br>0.4<br>5<br>0.2<br>0 0<br>-60 -20 20 60 100 140 -60 -20 20 60 100 140<br>T  j [°C] T  j [°C]<br>11 Typ. capacitances 12 Forward characteristics of reverse diode<br> =f( V  DS); );  V  GS=0 V; =0 V;  f  =1 MHz I  F=f( V  SD)<br>parameter:  T  j<br>10 [4] 10 [2]<br>25 °C<br>Ciss 150 °C<br>10 [1]<br>25 °C, 98%<br>150 °C, 98%<br>10 [3]<br>Coss<br>Crss<br>10 [0]<br>10 [2] le 10 [-1] |<br>0 10 20 30 0 0.5 1 1.5 2<br>-V  DS [V] V  SD [V]<br>page 6 2010-02-10<br>]<br>Ω<br>[m  [V]<br> DS(on)  GS(th)<br>R -V<br>C   [pF]  [A] I  F<br>**----- End of picture text -----**<br>


## **11 Typ. capacitances** 

_C_ =f( _V_ DS); ); _V_ GS=0 V; =0 V; _f_ =1 MHz 

Rev.1.31 

**BSO203SP H** 

## **13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=25 Ω parameter: _T_ j(start) 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=-8.9 A pulsed parameter: _V_ DD 

**==> picture [471 x 599] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 10<br>9<br>8<br>7 4 V 10V<br>10<br>16 V<br>25 °C<br>6<br>100 °C<br>125 °C 5<br>4<br>1<br>3<br>2<br>1<br>0.1 ae 0<br>1 10 100 1000<br>0 20 40 60<br>t  AV [µs] -Q  gate [nC]<br>15 Drain-source breakdown voltage 16 Gate charge waveforms<br>V  BR(DSS)=f( T  j);  I  D=1 mA<br>23<br>V GS<br>22.5<br>Q g<br>22<br>21.5<br>21<br>20.5<br>20 V gs(th)<br>19.5<br>19<br>Q g(th) Q sw Q gate<br>18.5<br>18 Q  gs Q  gd<br>-60 /\ -20 20 60 100 140 180 g<br>T  j [°C]<br>2010-02-10<br> [A]  [V]<br>I  AV V  GS<br> [V]<br> BR(DSS)<br>-V<br>**----- End of picture text -----**<br>


Rev.1.31 

page 7 

**BSO203SP H** 

## **Package Outline** 

## **PG-DSO-8: Outline** 

**==> picture [305 x 29] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>Footprint<br>Dimensions in mm [ FoFs 085tat |tat075 | 0.0220.088 |0.08560.030]<br>**----- End of picture text -----**<br>


Rev.1.31 

page 8 

2010-02-10 

**BSO203SP H** 

**Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev.1.31 

page 9 

2010-02-10 



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