# Dual MOSFET, N Channel, 20 V, 20 V, 880 mA, 880 mA, 0.27 ohm

![Product image](https://novapart.co/image/farnell:4318864/)

**URL**: https://novapart.co/products/BSD840NH6327XTSA1/dual-mosfet-n-channel-20-v-880-ma-027-ohm
**SKU**: BSD840NH6327XTSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.0490
**Stock**: 10+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 6Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Transistor Case Style | SOT-363 |
| Operating Temperature Max | 150°C |
| Power Dissipation N Channel | 500mW |
| Power Dissipation P Channel | 500mW |
| Drain Source Voltage Vds N Channel | 20V |
| Drain Source Voltage Vds P Channel | 20V |
| Continuous Drain Current Id N Channel | 880mA |
| Continuous Drain Current Id P Channel | 880mA |
| Drain Source On State Resistance N Channel | 0.27ohm |
| Drain Source On State Resistance P Channel | 0.27ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4318864/)

**BSD840N** 

## **OptiMOS™2 Small-Signal-Transistor** 

|**OptiMOS™2 Small-Signal-Transistor**|**OptiMOS™2 Small-Signal-Transistor**|**OptiMOS™2 Small-Signal-Transistor**<br>**Product Summary**|||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|**Features**||_V_DS<br>20||||V|||||
|• Dual N-channel||_R_DS(on),max<br>_V_GS=2.5 V<br>400||||mW|||W||
|• Enhancement mode||_V_GS=1.8 V<br>560|||||||||
|• Ultra Logic level (1.8V rated)||_I_D<br>0.88||||A|||||
|• Avalanche rated|||||||||||
|||PG-SOT-363||PG-SOT-363|PG-SOT-363||||||
|• Qualified according to AEC Q101<br>• 100% lead-free; RoHS compliant<br>• Halogen-free according to IEC61249-2-21<br>3<br>2<br>1<br>6<br>5<br>4<br>En~~el~~<br>wat S/ (Gp Halogen-Free<br>|<br>,|||||||||||
||||||||||||
|**Type**<br>**Package**|**Tape and Reel Information**<br>**Marking**<br>**Lead Free**<br>**Packing**|||**Packing**|**Packing**||||||
||||||||||||
|BSD840N<br>PG-SOT-363|H6327: 3000 pcs/ reel|H6327: 3000 pcs/ reel<br>XBs<br>Yes<br>Non dry|Non dry||||||||
|**Maximum ratings,**at_T_j=25 °C, unless otherwise specified|||||||||||
|**Parameter1)**<br>Continuous drain current||**Symbol Conditions**<br>_I_D<br>_T_A=25 °C<br>0.88<br>_T_A=70 °C<br>0.71<br>**Value**<br>~~PPEE~~<br>~~rr~~||**Unit**<br>A|||||||
|Pulsed drain current||_I_D,pulse<br>_T_A=25 °C<br>3.5|||||||||
|Avalanche energy, single pulse||_E_AS<br>_I_D=0.88 A,_R_GS=16W<br>1.6<br>~~a~~||mJ|||||||
|||_I_D=0.88 A,_V_DS=16 V,|||||||||
|Reverse diode d_v_/d_t_||d_v_/d_t_<br>d_i_/d_t_=200 A/µs,<br>6||kV/µs|||||||
|||_T_j,max=150 °C|||||||||
|Gate source voltage||_V_GS<br>±8<br>~~rr~~||V|||||||
|Power dissipation2)||_P_tot<br>_T_A=25 °C<br>0.5<br>~~rr~~||W|||||||
|Operating and storage temperature||_T_j,_T_stg<br>-55 ... 150<br>~~rr~~||°C|||||||
|ESD Class||JESD22-A114 -HBM<br>0 (<250V)<br>~~rr~~|||||||||
|Soldering Temperature||260 °C<br>~~rr~~|||||||||
|IEC climatic category; DIN IEC 68-1||55/150/56<br>~~rr~~|||||||||



1) Remark: only one of both transistors in operation. 

Rev 2.4 

page 1 

2014-09-19 

**BSD840N** 

|**BSD840N**|**BSD840N**|**BSD840N**|**BSD840N**|**BSD840N**|**BSD840N**|**BSD840N**|**BSD840N**|
|---|---|---|---|---|---|---|---|
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~eel~~||||||||
|**Thermal characteristics**||||||||
|Thermal resistance,<br>junction - ambient<br>_R_thJA<br>minimal footprint2)<br>-<br>-<br>250<br>K/W<br>~~ee~~||||||||
|**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified||=25 °C, unless otherwise specified|||||
|**Static characteristics**||||||||
|Drain-source breakdown voltage||_V_(BR)DSS|_V_GS=0 V,_I_D=250 µA|20|-|-|V|
|Gate threshold voltage||_V_GS(th)|_V_DS=VGS,_I_D=1.6 µA|0.3|0.55|0.75||
|Drain-source leakage current||_I_DSS|_V_DS=20 V,_V_GS=0 V,<br>_T_j=25 °C|-|-|1|mA|
||||_V_DS=20 V,_V_GS=0 V,<br>_T_j=150 °C|-|-|100||
|Gate-source leakage current||_I_GSS|_V_GS=8 V,_V_DS=0 V|-|-|100|nA|
|Drain-source on-state resistance||_R_DS(on)|_V_GS=1.8 V,_I_D=0.19 A|-|373|560|mW|
||||_V_GS=2.5 V,_I_D=0.88 A|-|270|400||
|Transconductance||_g_fs||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=0.71 A||2.5|-|S|



> 2) Performed on 40 mm2 FR4 PCB. The traces are 1mm wide, 70 μ m thick and 20mm long; they are present on both sides of the PCB 

Rev 2.4 

page 2 

2014-09-19 

||||||**BSD840N**|**BSD840N**|
|---|---|---|---|---|---|---|
||||||||
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~Lee~~|||||||
|**Dynamic characteristics**|||||||
|Input capacitance|_C_iss||-|55|78|pF|
|Output capacitance|_C_oss|_V_GS=0 V,_V_DS=10 V,<br>_f_=1 MHz|-|25|36||
|Reverse transfer capacitance|Crss||-|3.5|-||
|Turn-on delay time|_t_d(on)||-|1.9|-|ns|
|Rise time|_t_r|_V_DD=10 V,_V_GS=2.5 V,|-<br>=2.5 V,|2.2|-||
|Turn-off delay time|_t_d(off)|_I_D=0.88 A,_R_G,ext=6W|-|7.8|-||
|Fall time|_t_f||-|0.9|-||
|Gate Charge Characteristics|||||||
|Gate to source charge|_Q_gs||-|0.10|-|nC|
|Gate to drain charge|_Q_gd|_V_DD=10 V,_I_D=0.88 A,|-|0.10|-||
|Gate charge total|_Q_g|_V_GS=0 to 2.5 V|-|0.26|-||
|Gate plateau voltage|_V_plateau||-|1.7|-|V|
|**Reverse Diode**|||||||
|Diode continous forward current|_I_S||-|-|0.5|A|
|||_T_A=25 °C|||||
|Diode pulse current|_I_S,pulse||-|-|3.5||
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=0.88 A,<br>_T_j=25 °C|-|0.94|1.1|V|
|Reverse recovery time|_t_rr|_V_R=10 V,_I_F=0.88 A,|-|5.3|-|ns|
|Reverse recovery charge|_Q_rr|d_i_F/d_t_=100 A/µs|-|0.82|-|nC|



Rev 2.4 

page 3 

2014-09-19 

**BSD840N** 

## **1 Power dissipation** 

_P_ tot=f( _T_ A) 

## **2 Drain current** 

_I_ D=f( _T_ A); _V_ GS≥2.5 V 

**==> picture [466 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.6 1<br>0.5<br>0.8<br>0.4<br>0.6<br>0.3<br>0.4<br>0.2<br>0.2<br>0.1<br>0 0<br>0 40 80 120 160 0 40 80 120 160<br>T A [°C]  T A [°C]<br> [W]<br> [A]<br>P tot I D<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS); _T_ A=25 °C; _D_ =0 parameter: _t_ p 

## **4 Max. transient thermal impedance** 

_Z_ thJA=f( _t_ p) parameter: _D_ = _t_ p/ _T_ 

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**----- Start of picture text -----**<br>
10 [1 ] 10 [3 ]<br>1 µs<br>10 µs<br>10 [0 ] 100 µs  0.5<br>1 ms  10 [2 ]<br>0.2<br>10 ms<br>DC<br>0.1<br>10 [-1 ]<br>0.05<br>0.01<br>10 [1 ]<br>single pulse<br>10 [-2 ]<br>10 [-3 ] /\ 10 [0 ]<br>10 [-2 ] 10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ] 10 [-5 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ]<br>V DS [V]  t p [s]<br> [A]   [K/W]<br>I D<br>thJA<br>Z<br>**----- End of picture text -----**<br>


Rev 2.4 

page 4 

2014-09-19 

**BSD840N** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C parameter: _V_ GS 

**==> picture [462 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
2 900<br>800 1.3 V<br>1.4 V<br>1.6<br>700 1.5 V<br>1.6 V<br>600<br>1.2<br>/ 500 ozeecaneee<br>1.8 V<br>2 V  1.8 V  400<br>0.8 2.5 V<br>2 V<br>300<br>2.5 V<br>1.6 V<br>200<br>0.4<br>1.5 V<br>1.4 V  100<br>1.3 V<br>1.2 V<br>[ee]<br>0 0<br>0 0.2 0.4 0.6 0.8 1 0 0.2 0.4 0.6 0.8 1<br>| [a] [e]<br>V DS [V]  I D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>=f( V  GS); |); | V  DS|>2||>2| I  D|| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>2 5<br>1.6 4<br>oo Se<br>1.2 Baer 3 elueerce<br>0.8 FECHA 2 EACEEE<br>0.4 FEE 1 HEEEEE<br>150 °C<br>25 °C<br>p ox foe<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 0 1 1 2 2 3 3<br>V GS [V]  I D [A]<br>]<br>W<br> [A]   [m<br>I D<br>DS(on)<br>R<br>[A]   [S]<br>I D g fs<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); |); | _V_ DS|>2||>2| _I_ D|| _R_ DS(on)max 

Rev 2.4 

2014-09-19 

page 5 

**BSD840N** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=0.88 A; _V_ GS=2.5 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ DS=VGS; _I_ D=1.6 µA parameter: _I_ D 

**==> picture [466 x 645] intentionally omitted <==**

**----- Start of picture text -----**<br>
700 1.2<br>600<br>0.8<br>500 98 %<br>98 %<br>400 typ<br>0.4<br>300 2 %<br>typ<br>200<br>0<br>100<br>0 -0.4<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C]  T j [°C]<br>11 Typ. capacitances 12 Forward characteristics of reverse diode<br> =f( V  DS); );  V  GS=0 V; =0 V;  f  =1 MHz; Tj=25°Cj=25°C=25°C I  F=f( V  SD)<br>parameter:  T  j<br>10 [2 ] 10 [1 ]<br>Ciss<br>10 [0 ]<br>Coss<br>10 [1 ] 10 [-1 ]<br>150 °C<br>Crss<br>10 [-2 ] 25 °C<br>150 °C, 98%<br>25 °C, 98%<br>10 [0 ] Si 10 [-3 ] g<br>0 5 10 15 20 0 0.4 0.8 1.2 1.6<br>V DS [V]  V SD [V]<br>page 6<br>]<br>W<br>[m  [V]<br>DS(on) GS(th)<br>R V<br>C  [pF]   [A]  I F<br>**----- End of picture text -----**<br>


## **11 Typ. capacitances** 

_C_ =f( _V_ DS); ); _V_ GS=0 V; =0 V; _f_ =1 MHz; Tj=25°Cj=25°C=25°C 

Rev 2.4 

2014-09-19 

**BSD840N** 

## **13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=16 W 

parameter: _T_ j(start) 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=0.88 A pulsed parameter: _V_ DD 

**==> picture [483 x 642] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [0 ] 5<br>25 °C  4<br>10 [-1 ] 10 V<br>3<br>100 °C<br>4 V<br>16 V<br>125 °C<br>2<br>10 [-2 ]<br>10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ] 10 [4 ]<br>1<br>0<br>0 0.1 0.2 0.3 0.4 0.5<br>t AV [µs]  Q gate [nC]<br>15 Drain-source breakdown voltage 16 Gate charge waveforms<br>V  BR(DSS)=f( T  j);  I  D=250 µA<br>25<br>V  GS<br>24<br>Q g<br>23<br>22<br>21<br>20<br>V  gs(th)<br>19<br>18<br>17 Q  g(th) Q  sw Q gate<br>16 Q  gs Q  gd<br>-60 A -20 20 60 100 le 140<br>T j [°C]<br>Rev 2.4 2014-09-19<br> [A]   [V]<br>I AV V GS<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>


Rev 2.4 

page 7 

**BSD840N** 

## **SOT-363** 

## **Package Outline:** 

**==> picture [255 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Footprint: Packing:<br>**----- End of picture text -----**<br>


**==> picture [78 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Reflow soldering:<br>**----- End of picture text -----**<br>


**Note: For symmetric types there is no defined Pin 1 orientation in the reel.** 

Dimensions in mm 

Rev 2.4 

page 8 

2014-09-19 

**BSD840N** 

## **Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev 2.4 

page 9 

2014-09-19 



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- [Supplier page](https://es.farnell.com/infineon/bsd840nh6327xtsa1/mosfet-n-ch-20v-0-88a-sot-363/dp/4318864)
---

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