# Power MOSFET, N Channel, 60 V, 48 A, 8000 µohm, TDSON, Surface Mount

![Product image](https://novapart.co/image/farnell:3267832/)

**URL**: https://novapart.co/products/BSC097N06NSTATMA1/power-mosfet-n-channel-60-v-48-a-8000-ohm-tdson
**SKU**: BSC097N06NSTATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3890
**Stock**: 10+

## Description

Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (27-Jun-2018) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | OptiMOS |
| Qualification | - |
| Power Dissipation | 43W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TDSON |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 48A |
| Drain Source On State Resistance | 8000µohm |
| Gate Source Threshold Voltage Max | 2.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3267832/)

**BSC097N06NS** 

## Type ~~Cin~~ fineon 

## **OptiMOS[TM] Power-Transistor** 

## **Features** 

- Optimized for high performance SMPS, e.g. sync. rec. 

- 100% avalanche tested 

- Superior thermal resistance 

- N-channel 

- Qualified according to JEDEC[1)] for target applications 

## **Product Summary** 

**==> picture [193 x 98] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|V|DS|60|V|
|R|9.7|mW|
|DS(on),max|
|I|D|46|A|
|Q|OSS|14|nC|
|Q|G(0V..10V)|12|nC|

**----- End of picture text -----**<br>


- Pb-free lead  plating; RoHS compliant 

- Halogen-free according to IEC61249-2-21 

**==> picture [63 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
PG-TDSON-8<br>**----- End of picture text -----**<br>


**==> picture [241 x 30] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||
|---|---|---|
|Type|Package|Marking|
|BSC097N06NS|PG-TDSON-8|097N06NS|

**----- End of picture text -----**<br>


**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

**==> picture [464 x 165] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Value|Unit|
|Continuous drain current|I|D|V|GS=10 V,|T|C=25 °C|46|A|
|V|GS=10 V,|T|C=100 °C|29|
|V|GS=10 V,|T|C=25 °C,|
|12|
|R|thJA =50K/W|[2)]|
|Pulsed drain current|[3)]|I D,pulse|T|C=25 °C|184|
|Avalanche energy, single pulse|[4)]|E|AS|I|D=30 A,|R|GS=25 W|13|mJ|
|Gate source voltage|V|GS|±20|V|

**----- End of picture text -----**<br>


- 1) J-STD20 and JESD22 

- 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

- 3) See figure 3 for more detailed information 

- 4) See figure 13 for more detailed information 

Rev.2.0 

page 1 

2013-10-17 

**BSC097N06NS** 

**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

||**Parameter**|**Symbol Conditions**<br>**Value**|**Unit**|
|---|---|---|---|
||Power dissipation|_P_tot<br>_T_C=25 °C<br>36|W|
|||_T_A=25 °C,<br>_R_thJA=50 K/W2)<br>2.5||
||Operating and storage temperature|_T_j,_T_stg<br>-55 ... 150|°C|
||IEC climatic category; DIN IEC 68-1|55/150/56||
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~<br>~~ee~~||||
||**Thermal characteristics**|||
|Thermal resistance, junction - case<br>_R_thJC<br>bottom<br>-<br>-<br>3.5<br>K/W<br>top<br>-<br>-<br>20<br>Device on PCB<br>_R_thJA<br>6 cm2cooling area2)<br>-<br>-<br>50<br>~~——f FF~~||||
||**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified||
||**Static characteristics**|||
||Drain-source breakdown voltage|_V_(BR)DSS _V_GS=0 V,_I_D=1 mA<br>60<br>-<br>-|V|
||Gate threshold voltage<br>Zero gate voltage drain current<br>Gate-source leakage current<br>Gate resistance<br>Drain-source on-state resistance|_V_GS(th)<br>_V_DS=_V_GS,_I_D=14 µA<br>2.1<br>2.8<br>3.3<br>_I_DSS<br>_V_DS=60 V,_V_GS=0 V,<br>_T_j=25 °C<br>-<br>0.1<br>1<br>_V_DS=60 V,_V_GS=0 V,<br>_T_j=125 °C<br>-<br>10<br>100<br>_I_GSS<br>_V_GS=20 V,_V_DS=0 V<br>-<br>10<br>100<br>_R_DS(on)<br>_V_GS=10 V,_I_D=40 A<br>-<br>8.0<br>9.7<br>_V_GS=6 V,_I_D=10 A<br>-<br>12.0<br>14.6<br>_R_G<br>-<br>1.1<br>1.7<br>~~PF=rrr~~<br>~~-_} ff~~<br>~~a~~|µA<br>nA<br>mW<br>W|
||Transconductance|_g_fs<br>|_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=40 A<br>24<br>48<br>-<br>~~CT~~|S|



Rev.2.0 

page 2 

2013-10-17 

**BSC097N06NS** 

|**Parameter**<br>~~ee~~|**Symbol **<br>~~ee~~|**Conditions**<br>~~ee~~|~~ee~~|**min.**<br>~~ee~~|**typ.**<br>**Values**<br>~~ee~~|**typ.**<br>**Values**<br>~~ee~~|**max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|---|---|
|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|
|**Dynamic characteristics**|||||||||
|Input capacitance|_C_iss|||-||860|1075|pF|
|Output capacitance|_C_oss|_V_GS=0 V,_V_DS=30 V,<br>_f_=1 MHz||-||210|263||
|Reverse transfer capacitance|Crss|||-||16|32||
|Turn-on delay time|_t_d(on)|||-||6|-|ns|
|Rise time|_t_r|_V_DD=30 V,_V_GS=10 V,|=10 V,|-||2|-||
|||_I_D=40 A,|||||||
|Turn-off delay time|_t_d(off)|_R_G,ext,ext=1.6W||-||10|-||
|Fall time|_t_f|||-||2|-||
|Gate Charge Characteristics5)|||||||||
|Gate to source charge<br>Gate charge at threshold<br>Gate to drain charge<br>Switching charge<br>Gate charge total<br>Gate plateau voltage|_Q_gs<br>-<br>4.5<br>-<br>_Q_g(th)<br>-<br>2.4<br>-<br>_Q_gd<br>-<br>2.6<br>3.7<br>_Q_sw<br>-<br>4.7<br>-<br>_Q_g<br>-<br>12<br>15<br>_V_plateau<br>-<br>5.2<br>-<br>_V_DD=30 V,_I_D=40 A,<br>_V_GS=0 to 10 V<br>~~re~~<br>~~—~~<br>~~o>~~<br>~~—~~<br>~~o>~~|||||||nC<br>V|
|Gate charge total, sync. FET<br>Output charge|_Q_g(sync)<br>_Q_oss<br>~~|~~<br>~~a~~|_V_DS=0.1 V,<br>_V_GS=0 to 10 V<br>-<br>_V_DD=30 V,_V_GS=0 V<br>-<br>~~tT~~||||10<br>14|-<br>-|nC|
|**Reverse Diode**|||||||||
|Diode continuous forward current|_I_S|||-||-|30|A|
|||_T_C=25 °C|||||||
|Diode pulse current|_I_S,pulse|||-||-|184||
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=30 A,<br>_T_j=25 °C||-||1.0|1.2|V|
|Reverse recovery time|_t_rr|_V_R=30 V,_I_F=30 A,|=30 A,|-||33|53|ns|
|Reverse recovery charge|_Q_rr|d_i_F/d_t_=100 A/µs||-||30|-|nC|



5) See figure 16 for gate charge parameter definition 

Rev.2.0 

page 3 

2013-10-17 

**BSC097N06NS** 

## **1 Power dissipation** 

_P_ tot=f( _T_ C) 

## **2 Drain current** 

_I_ D=f( _T_ C); _V_ GS≥10 V 

**==> picture [466 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
40 60<br>40<br>20<br>20<br>0 0<br>0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175<br>T C [°C] T C [°C]<br> [W]<br> [A]<br>P tot I D<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 parameter: _t_ p 

## **4 Max. transient thermal impedance** 

_Z_ thJC=f( _t_ p) 

parameter: _D_ = _t_ p/ _T_ 

**==> picture [465 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [3 ] 10<br>limited by on-state<br>resistance<br>10 [2 ] 0.5<br>1 µs<br>1<br>10 µs  0.2<br>0.1<br>100 µs<br>10 [1 ] 0.05<br>0.02<br>1 ms<br>0.01<br>10 ms  0.1<br>DC  single pulse<br>10 [0 ]<br>10 [-1 ] 0.01<br>10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ] 0.000001 0.00001 0.0001 0.001 0.01 0.1<br>V DS [V]  t p [s]<br> [A]   [K/W]<br>I D<br>thJC<br>Z<br>**----- End of picture text -----**<br>


Rev.2.0 

page 4 

2013-10-17 

**BSC097N06NS** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C parameter: _V_ GS 

**==> picture [465 x 643] intentionally omitted <==**

**----- Start of picture text -----**<br>
180 20<br>5 V<br>150 5.5 V<br>16<br>6 V<br>10 V<br>7 V<br>120<br>7 V<br>12<br>90<br>6 V  8 10 V<br>60 Fe | ieEe<br>5.5 V<br>4<br>30<br>5 V<br>0 0<br>0.0 0.5 1.0 1.5 2.0 0 30 60 90 120 150 180<br>V DS [V]  I D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>=f( V  GS); |); | V  DS|>2||>2| I  D|| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>180 80<br>150<br>60<br>120<br>90 40<br>60<br>20<br>30<br>150 °C  25 °C<br>0 Z|a f 0 {| ;<br>0 2 4 6 8 0 20 40 60 80<br>V GS [V]  I D [A]<br>page 5<br>]<br>W<br> [m<br> [A]<br>I D<br>DS(on)<br>R<br> [A]   [S]<br>I D g fs<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); |); | _V_ DS|>2||>2| _I_ D|| _R_ DS(on)max parameter: _T_ j 

Rev.2.0 

2013-10-17 

**BSC097N06NS** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=40 A; _V_ GS=10 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS 

**==> picture [466 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
20 5<br>18<br>16 4<br>14<br>12 3<br>max  140 mA<br>10<br>14 µA<br>ep ati<br>8 typ  2<br>6<br>4 1<br>2<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C] T j [°C]<br>11 Typ. capacitances 12 Forward characteristics of reverse diode<br> =f( V  DS); );  V  GS=0 V; =0 V;  f  =1 MHz I  F=f( V  SD)<br>parameter:  T  j<br>10 [4 ] 10000 10 [3 ]<br>10 [3 ] 1000 eo 10 [2 ]<br>Ciss<br>Coss<br>10 [2 ] 100 10 [1 ]<br>25 °C<br>150 °C<br>N E<br>Crss<br>10 [1 ] 10 10 [0 ]<br>0 Es 20 se 40 s 60 0 0.5 1 1.5 2<br>V DS [V]  V SD [V]<br>]<br>W<br>[m  [V]<br>DS(on) GS(th)<br>R V<br>C  [pF]   [A]  I F<br>**----- End of picture text -----**<br>


## **11 Typ. capacitances** 

_C_ =f( _V_ DS); ); _V_ GS=0 V; =0 V; _f_ =1 MHz 

Rev.2.0 

page 6 

2013-10-17 

**BSC097N06NS** 

## **13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=25 W 

parameter: _T_ j(start) 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=40 A pulsed parameter: _V_ DD 

**==> picture [472 x 612] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 12<br>30 V<br>10<br>12 V<br>48 V<br>10 8<br>125 °C  100 °C  25 °C<br>6<br>1<br>4<br>2<br>0.1<br>0<br>1 10 100 1000<br>0 5 10 15<br>t AV [µs]  Q gate [nC]<br>15 Drain-source breakdown voltage 16 Gate charge waveforms<br>V  BR(DSS)=f( T  j);  I  D=1 mA<br>70<br>V  GS<br>Q g<br>66<br>62<br>58 V  gs(th)<br>54<br>Q  g(th) Q  sw Q gate<br>50 Q  gs Q  gd<br>-60 m -20 20 60 100 ag 140 180<br>T j [°C]<br> [A]   [V]<br>I AV V GS<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>


Rev.2.0 

2013-10-17 

page 7 

**BSC097N06NS** 

**Package Outline** 

## **PG-TDSON-8** 

## **PG-TDSON-8: Outline** 

Rev.2.0 

page 8 

2013-10-17 

**BSC097N06NS** 

**Package Footprint** 

## **PG-TDSON-8** 

## **PG-TDSON-8: Footprint** 

Rev.2.0 

page 9 

2013-10-17 

**BSC097N06NS** 

**Published by Infineon Technologies AG 81726 Munich, Germany © 2013 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev.2.0 

page 10 

2013-10-17 



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- [Supplier page](https://es.farnell.com/infineon/bsc097n06nstatma1/mosfet-n-ch-60v-48a-175deg-c-43w/dp/3267832)
---

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