# Power MOSFET, N Channel, 40 V, 100 A, 1600 µohm, TDSON, Surface Mount

![Product image](https://novapart.co/image/farnell:2432701/)

**URL**: https://novapart.co/products/BSC016N04LSGATMA1/power-mosfet-n-channel-40-v-100-a-1600-ohm-tdson
**SKU**: BSC016N04LSGATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.6500
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:100A; Drain Source Voltage Vds:40V; On Resistance Rds(on):0.0013ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2V; Po

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (08-Jul-2021) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 139W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TDSON |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 1600µohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2432701/)

## **BSC016N04LS G** 

## **OptiMOS™3 Power-Transistor** 

## **Features** 

- Fast switching MOSFET for SMPS 

- Optimized technology for DC/DC converters 

- Qualified according to JEDEC[1)] for target applications 

**==> picture [182 x 100] intentionally omitted <==**

**----- Start of picture text -----**<br>
Product Summary<br>V  DS 40 V<br>R  DS(on),max 1.6 mΩ<br>I  D 100 A<br>PG-TDSON-8<br>**----- End of picture text -----**<br>


- N-channel 

- Logic level 

- Excellent gate charge x _R_ DS(on) product (FOM) 

- Very low on-resistance _R_ DS(on) 

- Superior thermal resistance 

- 100% Avalanche tested 

- Pb-free plating; RoHS compliant; 

- •Halogen-free according to IEC61249-2-21 

|**Maximum ratings,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified|=25 °C, unless otherwise specified|||
|---|---|---|---|---|
|**Parameter**|**Symbol **|**Conditions**|**Unit**<br>**Value**|**Unit**|
|Continuous drain current|_I_D|_V_GS=10 V,_T_C=25 °C|100<br>A<br>100<br>100<br>100<br>31<br>400<br>50|A|
|||_V_GS=10 V,_T_C=100 °C|||
|||_V_GS=4.5 V,_T_C=25 °C|||
|||_V_GS=4.5 V,<br>_T_C=100 °C|||
|||_V_GS=10 V,_T_A=25 °C,<br>_R_thJA=50 K/W2)|||
|Pulsed drain current3)|_I_D,pulse|_T_C=25 °C|||
|Avalanche current, single pulse4)|_I_AS|_T_C=25 °C|||
|Avalanche energy, single pulse|_E_AS|_I_D=50 A,_R_GS=25Ω|295<br>mJ|mJ|
|Gate source voltage|_V_GS||±20<br>V|V|



1) J-STD20 and JESD22 

Rev. 2.0 

page 1 

2011-03-23 

**BSC016N04LS G** 

**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

||**Parameter**|**Symbol **|**Conditions**||**Value**|||**Unit**|
|---|---|---|---|---|---|---|---|---|
||Power dissipation|_P_tot|_T_C=25 °C||139|||W|
||||_T_A=25 °C,<br>_R_thJA=50 K/W2)||2.5||||
||Operating and storage temperature|_T_j,_T_stg|||-55 ... 150|||°C|
||IEC climatic category; DIN IEC 68-1||||55/150/56||||
|**Parameter**<br>**Thermal characteristics**<br>~~—~~||**Symbol **|**Conditions**|**min.**|**typ.**<br>**Values**||**max.**|**Unit**|
||Thermal resistance, junction - case|_R_thJC|bottom|-|-||0.9|K/W|
||||top||||20||
||Device on PCB|_R_thJA|6 cm2cooling area2)|-|-||50||



**Electrical characteristics,** at _T_ j=25 °C, unless otherwise specified 

## **Static characteristics** 

|**Static characteristics**|||||||
|---|---|---|---|---|---|---|
|Drain-source breakdown voltage|_V_(BR)DSS <br>~~a~~|_V_GS=0 V,_I_D=1 mA<br>~~ee~~|40|-|-|V|
|Gate threshold voltage|_V_GS(th)<br>~~a~~|_V_DS=_V_GS,_I_D=85 µA<br>~~ee~~|1.2|-|2||
|Zero gate voltage drain current|_I_DSS<br>~~pe~~|_V_DS=40 V,_V_GS=0 V,<br>_T_j=25 °C<br>~~ee~~<br>~~pe~~|-<br>~~pe~~<br>~~|~~|0.1<br>~~pe~~<br>~~|~~|1<br>~~pe~~|µA|
|||_V_DS=40 V,_V_GS=0 V,<br>_T_j=125 °C<br>~~pe~~<br>~~ft~~|-<br>~~pe~~<br>~~ft~~<br>~~|~~|10<br>~~pe~~<br>~~ft~~<br>~~|~~|100<br>~~pe~~<br>~~ft~~||
|Gate-source leakage current|_I_GSS<br>~~ee~~|_V_GS=20 V,_V_DS=0 V<br>~~ee~~|-<br>~~|~~<br>~~ee~~|10<br>~~|~~<br>~~ee~~|100<br>~~ee~~|nA|
|Drain-source on-state resistance|_R_DS(on)<br>~~ee~~<br>~~a~~|_V_GS=4.5 V,_I_D=50 A<br>~~ee~~|-<br>~~ee~~|1.8<br>~~ee~~|2.3<br>~~ee~~|mΩ|
|||_V_GS=10 V,_I_D=50 A<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|1.3<br>~~ee~~|1.6<br>~~ee~~||
|Gate resistance|_R_G<br>~~ee~~<br>~~a~~|~~ee ~~<br>~~ee~~<br>~~LT~~|-<br> ~~ee~~<br>~~LT~~|1.5<br>~~ee ~~<br>~~LT~~|-<br> ~~ee~~|Ω|
|Transconductance|_g_fs<br>~~a~~<br>~~P|~~||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=50 A<br>~~ee~~<br>~~P|~~<br>~~LT~~|95<br>~~P|~~<br>~~LT~~|190<br>~~P|~~<br>~~LT~~|-<br>~~P|~~|S|



2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

- 3) See figure 3 for more detailed information 

- 4) See figure 13 for more detailed information 

Rev. 2.0 

page 2 

2011-03-23 

||||**BSC016N04LS G**|**BSC016N04LS G**|
|---|---|---|---|---|
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~|~~<br>~~|~~|||||
||**Dynamic characteristics**||||
||Input capacitance|_C_iss|-<br>8900<br>12000|pF|
||Output capacitance|_C_oss|-<br>1800<br>2400<br>_V_GS=0 V,_V_DS=20 V,<br>_f_=1 MHz||
||Reverse transfer capacitance|Crss|-<br>100<br>-||
||Turn-on delay time|_t_d(on)|-<br>14<br>-|ns|
||Rise time|_t_r|-<br>7.6<br>-<br>_V_DD=20 V,_V_GS=10 V,||
||Turn-off delay time|_t_d(off)|-<br>56<br>-<br>_I_D=30 A,_R_G=1.6Ω||
||Fall time|_t_f|-<br>9.4<br>-||
||Gate Charge Characteristics5)||||
||Gate to source charge<br>Gate charge at threshold<br>Gate to drain charge<br>Switching charge<br>Gate charge total<br>Gate plateau voltage<br>Gate charge total<br>Gate charge total, sync. FET<br>Output charge<br>**Reverse Diode**|_Q_gs<br>-<br>25<br>-<br>nC<br>_Q_g(th)<br>-<br>14<br>-<br>_Q_gd<br>-<br>11<br>-<br>_Q_sw<br>-<br>23<br>-<br>_Q_g<br>-<br>113<br>150<br>_V_plateau<br>-<br>2.9<br>-<br>V<br>_Q_g<br>_V_DD=20 V,_I_D=30 A,<br>_V_GS=0 to 4.5 V<br>-<br>54<br>-<br>nC<br>_Q_g(sync)<br>_V_DS=0.1 V,<br>_V_GS=0 to 10 V<br>-<br>106<br>-<br>_Q_oss<br>_V_DD=20 V,_V_GS=0 V<br>-<br>69<br>-<br>_V_DD=20 V,_I_D=30 A,<br>_V_GS=0 to 10 V<br>~~iat~~<br>~~S|~~<br>~~Pt~~<br>~~S|~~<br>~~Ff~~<br>~~S|~~<br>~~Pt~~<br>~~S|~~<br>~~Ff~~<br>~~S|~~<br>~~PFtT~~<br>~~ef~~<br>~~eft~~<br>~~|~~<br>~~a ee~~<br>~~ee ee ee~~|||
||Diode continuous forward current|_I_S|-<br>-<br>100|A|
||||_T_C=25 °C||
||Diode pulse current|_I_S,pulse|-<br>-<br>400||
||Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=50 A,<br>_T_j=25 °C<br>-<br>0.8<br>1.2|V|
||Reverse recovery charge|_Q_rr|_V_R=20 V,_I_F=_I_S,<br>d_i_F/d_t_=400 A/µs<br>-<br>125<br>-|nC|



5) See figure 16 for gate charge parameter definition 

Rev. 2.0 

page 3 

2011-03-23 

**BSC016N04LS G** 

**==> picture [87 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 Power dissipation<br>**----- End of picture text -----**<br>


_P_ tot=f( _T_ C) 

## **2 Drain current** 

_I_ D=f( _T_ C); _V_ GS≥10 V 

**==> picture [440 x 602] intentionally omitted <==**

**----- Start of picture text -----**<br>
160 120<br>140<br>100<br>120<br>80<br>100<br>80 60<br>60<br>40<br>40<br>20<br>20<br>0 All 0<br>0 40 80 120 160 0 40 80 120 160<br>T  C [°C] T  C [°C]<br>3 Safe operating area 4 Max. transient thermal impedance<br>I  D=f( V  DS);  T  C=25 °C;  D  =0 Z  thJC=f( t  p)<br>parameter:  t  p parameter:  D  = t  p/ T<br>10 [3] 10<br>limited by on-state<br>resistance 1 µs<br>10 µs<br>10 [2] 100 µs<br>DC<br>1<br>1 ms 0.5<br>10 [1]<br>10 ms<br>0.2<br>0.1 0.1<br>10 [0] 0.05<br>0.02<br>0.01<br>10 [-1] Ne 0.01 0 single pulse 0 0 0 0 0 1<br>10 [-1] 10 [0] 10 [1] 10 [2] 10 [-6] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0]<br>V  DS [V] t  p [s]<br>page 4<br> [W]  [A]<br>P  tot I  D<br> [A]  [K/W]<br>I  D<br> thJC<br>Z<br>**----- End of picture text -----**<br>


Rev. 2.0 

2011-03-23 

**BSC016N04LS G** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C 

parameter: _V_ GS 

**==> picture [464 x 602] intentionally omitted <==**

**----- Start of picture text -----**<br>
600 3.5<br>4.5 V<br>5 V 3<br>500 3.5 V<br>10 V 2.5<br>400<br>4 V<br>4 V 2<br>4.5 V<br>300<br>5 V<br>1.5<br>10 V<br>200<br>3.5 V 1<br>100<br>3.2 V 0.5<br>3 V<br>2.8 V<br>0 0<br>0 1 2 3 0 10 20 30 40 50<br>V  DS [V] I  D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>=f( V  GS); |); | V  DS|>2||>2| I  D|| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>300 300<br>250 250<br>200 200<br>150 150<br>100 100<br>50 150 °C 25 °C 50<br>0 Pe 0<br>0 1 2 3 4 5 0 40 80 120 160<br>V  GS [V] I  D [A]<br>page 5 2011-03-23<br>]<br>Ω<br> [m<br> [A]<br>I  D<br> DS(on)<br>R<br> [A]  [S]<br>I  D g  fs<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); |); | _V_ DS|>2||>2| _I_ D|| _R_ DS(on)max 

parameter: _T_ j 

Rev. 2.0 

**BSC016N04LS G** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=50 A; _V_ GS=10 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=85 µA 

**==> picture [471 x 602] intentionally omitted <==**

**----- Start of picture text -----**<br>
3 2.5<br>2.5<br>2<br>2<br>1.5<br>98 %<br>1.5<br>typ<br>1<br>1<br>0.5<br>0.5<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T  j [°C] T  j [°C]<br>11 Typ. capacitances 12 Forward characteristics of reverse diode<br>C  =f( V  DS);  V  GS=0 V;  f  =1 MHz I  F=f( V  SD)<br>parameter:  T  j<br>10 [5] 1000<br>25 °C<br>10 [4] 150 °C, 98%<br>Ciss<br>100<br>Coss<br>150 °C<br>10 [3]<br>25 °C, 98%<br>10<br>Crss<br>10 [2]<br>10 [1] Sf 1<br>0 10 20 30 40 0.0 0.5 1.0 1.5 2.0<br>V  DS [V] V  SD [V]<br>page 6 2011-03-23<br>]<br>Ω<br>[m  [V]<br>R  DS(on) V  GS(th)<br>C   [pF]  [A] I  F<br>**----- End of picture text -----**<br>


Rev. 2.0 

**==> picture [444 x 675] intentionally omitted <==**

**----- Start of picture text -----**<br>
BSC016N04LS G<br>13 Avalanche characteristics 14 Typ. gate charge<br>I  AS=f( t  AV);  R  GS=25 Ω V  GS=f( Q  gate);  I  D=30 A pulsed<br>parameter:  T  j(start) parameter:  V  DD<br>100 12<br>20 V<br>10<br>25 °C 8 V<br>100 °C 32 V<br>8<br>125 °C<br>10 6<br>4<br>2<br>NV 1 0<br>1 10 100 1000 0 40 80 120<br>t  AV [µs] Q  gate [nC]<br>15 Drain-source breakdown voltage 16 Gate charge waveforms<br>V  BR(DSS)=f( T  j);  I  D=1 mA<br>45<br>V GS<br>Q g<br>40<br>35<br>30 V gs(th)<br>25<br>Q g(th) Q sw Q gate<br>20 Q  gs Q  gd<br>-60 -20 20 60 100 140 180<br>T  j [°C]<br> [A]  [V]<br>I  AV V  GS<br> [V]<br> BR(DSS)<br>V<br>**----- End of picture text -----**<br>


Rev. 2.0 

2011-03-23 

page 7 

**BSC016N04LS G** 

**Package Outline** 

## **PG-TDSON-8** 

**==> picture [194 x 599] intentionally omitted <==**

**----- Start of picture text -----**<br>
PG-TDSON-8: Outline / D<br>ann<br>nd<br>i J<br>ees coe et oss<br>iE) ] b =<br>ll aha<br>|<br>Fi<br>for)iL el tes F7 Ss -<br>ml a<br>=<br>9 Ios oe<br>iN 4 , ee<br>:<br>Om MILLIMETERS<br>A MING MAX<br>ee<br>oebt OSoa 8K |<br>CBee495<br>esee©<br>er| 505 a5<br>= De © +<br>es ©<br>A<br>ee |<br>ee = So<br>eee ><br>_<br>FBS |B 2<br>ec<br>Fe | so |<br>retO<br>Footprint<br>FM | os480| os |<br>Dimensions in mm<br>**----- End of picture text -----**<br>


Rev. 2.0 

page 8 

2011-03-23 

**BSC016N04LS G** 

**Package Outline** 

**PG-TDSON-8: Tape** 

Dimensions in mm 

Rev. 2.0 

page 9 

2011-03-23 

**BSC016N04LS G** 

## **Published by** 

**Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 2.0 

page 10 

2011-03-23 



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- [Supplier page](https://es.farnell.com/infineon/bsc016n04lsgatma1/mosfet-n-ch-40v-100a-tdson-8/dp/2432701)
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