# Power Line Filter, 50 V, 15 A

![Product image](https://novapart.co/image/farnell:2494141RL/)

**URL**: https://novapart.co/products/BNX024H01L/power-line-filter-50-v-15-a
**SKU**: BNX024H01L
**Manufacturer**: MURATA
**Category**: Passive Components || EMC / RFI Suppression || Power Line Filters
**Price**: €2.7200
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2494141RL/)

P 1/ 13 

Spec.No.  JENF243H-9101-01 

## Reference Only 

## **SMD Block Type EMIFIL ®** 

**BNX02** □ **H01** □ **Murata Standard Reference Specification [AEC-Q200]** 

## **1.Scope** 

This reference specification applies to Block Type EMIFIL[®] BNX02 □ H01 Series for Automotive Electronics based on AEC-Q200. 

## **2.Part Numbering** 

BN X 024 H 01 L Product ID    Type    Serial No. Category Features Packaging Code 

（ for Automotive Electronics ） (L :Taping(178mm reel) / K :Taping(330mm reel) / B :Bulk) 

## **3.Rating** 

|**3.Rating**|||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|Customer’s<br>Part Number|Part Number|Capacitance|Rated<br>Voltage|Withstanding<br>Voltage|Rated<br>Current<br>|DC<br>Resistance|Insulation<br>Resistance|Insertion<br>Loss|Voltage<br>Drop|ESD<br>Rank<br>2:2kV|
||BNX024H01L|4.7μF<br>±15%|50V<br>(DC)|125V<br>(DC)|15A<br>(DC)|0.43mΩ<br>±0.20mΩ|100MΩ<br>min.|35dB min.<br>(100kHz to<br>1GHz)|45 mV<br>max.|2|
||BNX024H01K||||||||||
||BNX024H01B||||||||||
||BNX025H01L|10μF<br>±15%|25V<br>(DC)|62.5V<br>(DC)|15A<br>(DC)|0.43mΩ<br>±0.20mΩ|50MΩ<br>min.|35dB min.<br>(50 kHz to<br>1GHz)|45mV<br>max.||
||BNX025H01K||||||||||
||BNX025H01B||||||||||
||BNX026H01L|10μF<br>±10<br>20%|50V<br>(DC)|125V<br>(DC)|15A<br>(DC)|0.43mΩ<br>±0.20mΩ|10MΩ<br>min.|35dB min.<br>(50KHz to<br>1GHz)|45mV<br>max.||
||BNX026H01K||||||||||
||BNX026H01B||||||||||
||BNX027H01L|22μF<br>±20<br>40%|16V<br>(DC)|40V<br>(DC)|15A<br>(DC)|0.43mΩ<br>±0.20mΩ|1MΩ<br>min.|35dB min.<br>(40KHz to<br>1GHz)|45mV<br>max.||
||BNX027H01K||||||||||
||BNX027H01B||||||||||



- Rated current is derated according to operating temperature. 

 Operating Temperature : - 55 °C to + 125 °C  Storage Temperature : - 55 °C to + 125 °C 

**==> picture [188 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
15<br>1<br>85 125<br>Operating Temperature (°C)<br>(A)<br>Current<br>Rated<br>**----- End of picture text -----**<br>


## **4.Standard Testing Condition** 

<Unless otherwise specified> <In case of doubt> Temperature : Ordinary Temp. 15 °C to 35 ºC Humidity : Ordinary Humidity  25 %(RH) to 85 %(RH) 

Temperature : 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86kPa to 106kPa 

MURATA MFG.CO.,LTD. 

P 2/ 13 

## Spec.No.  JENF243H-9101-01 

## Reference Only 

## **5.Style and Dimensions** 

**==> picture [398 x 290] intentionally omitted <==**

**----- Start of picture text -----**<br>
12.1±0.2<br>④<br>① ②<br>③ ④<br>BNX024<br>④<br>① ③ ③ ④ ④ ④ ②<br>7.0±0.2 1.55±0.2<br>④<br>③<br>④<br>① ② 電極部Electrode<br>④ （in  ㎜）<br>(in mm)<br>1.0±0.3 2.5±0.2 1.55±0.2<br>9.1±0.2<br>3.5±0.2<br>1.05±0.2 1.6±0.3<br>0.3±0.1<br>(2.45)<br>1..3±0.21.3±0.2<br>4.2±0.3<br>0.3±0.1<br>**----- End of picture text -----**<br>


■ Equivalent Circuit 

**==> picture [180 x 49] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ｌ１ Ｌ３<br>Ｃ２<br>① ②<br>Ｌ２ Ｃ１<br>③ ④<br>**----- End of picture text -----**<br>


① B ： Bias 

② CB ： Circuit + Bias 

③ PSG ： Power Supply Ground ④ CG ： Circuit Ground 

■ Unit Mass(Typical value) 

0.86g 

## **6.Marking** 

Filter shall be marked as follows. 

(1) Murata Mark : 

(2) Part Number : BNX024H01 ：（ ＢＮＸ０２４ ） BNX025H01 ：（ ＢＮＸ０２５ ） BNX026H01 ：（ ＢＮＸ０２６ ） BNX027H01 ：（ ＢＮＸ０２７ ） 

(3) Polarity Marking : ○ 

MURATA MFG.CO.,LTD. 

P 3/ 13 

## Spec.No.  JENF243H-9101-01 

## Reference Only 

## **7.Electrical Performance** 

|No.|Item|Specification||Test Method|
|---|---|---|---|---|
|7.1|Insertion<br>Loss|Meet item 3.|Insertion Loss = -20 log E1/E0(dB)<br>E0: Level without FILTER (short)<br>E1: Level with FILTER<br>MeasuringEquipment : Agilent 8753C or the equivalent<br>50<br>10dB<br>E<br>Method of measurement based on MIL-STD-220<br>～<br>50<br>SG<br>50<br>50<br>10dB<br>Attenuator<br>Balun<br>Specimen<br>Attenuator<br>(1)<br>(2)<br>(3)<br>(4)||
|7.2|Capacitance||Measured by the following condition between<br>Terminal①②and③④.  (see item 5.)<br>Frequency : 1 ± 0.1kHz (except BNX027)<br>120 ± 24kHz (BNX027)<br>Voltage : 1 V(rms) max. (except BNX027)<br>0.5±0.1V(rms) (BNX027)<br>Measuring Equipment :<br>HP 4278A or the equivalent (except BNX027)<br>HP 4284A or the equivalent(BNX027)||
|7.3|DC<br>Resistance||Measured by the way of 4 terminal method between①and<br>②and between③and④. (see item 5.)||
|7.4|Insulation<br>Resistance||Measured at DC rated voltage between terminal<br>①②and③④. (see item 5.)<br>Time : 60 s max<br>Charging current : 50 mA max.<br>MeasuringEquipment : R8340A or the equivalent||
|7.5|Withstanding<br>Voltage|Filter shall be no failure.|Withstanding voltage shall be applied between terminal①<br>②and③④. (see item 5.)<br>Test Voltage : BNX024  125V(DC)<br>BNX025  62.5V(DC)<br>BNX026  125V(DC)<br>BNX027   40V(DC)<br>Time : 5 ± 1 s<br>Chargingcurrent : 50 mA max.||
|7.6|Voltage<br>Drop|Meet item 3.|After soldering the part on the test substrate,  measure<br>the voltage with passing the rated current as shown in the<br>schematic below.<br>Where the terminals of the part shall be connected as<br>follows:<br>Referring to the terminal No. shown in item 5,<br>connect terminal No.②and④by soldering<br>copper wire with diameter more than 1mm /<br>length less than 6mm.<br>Then connect terminal No.①as (1) and terminal<br>No.③as (2) the measurement circuit as<br>mentioned above.<br>The probe for measuring the voltage shall be<br>touched on the solder fillet of①③.<br>A<br>V<br>Specimen<br>(1)<br>(2)||



MURATA MFG.CO.,LTD. 

P 4/ 13 

## Spec.No.  JENF243H-9101-01 

## Reference Only 

**8. Q200 Requirement 8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010** 

|**AEC-Q200 Rev.D issued June. 1 2010**|**AEC-Q200 Rev.D issued June. 1 2010**|**AEC-Q200 Rev.D issued June. 1 2010**||
|---|---|---|---|
|AEC-Q200|||Murata Specification / Deviation|
|No.|<br>Stress|Test Method||
|3|High<br>Temperature<br>Exposure<br>(Storage)|1000hours at 125C<br>Set for 24hours<br>at room temperature,<br>then measured.|Meet Table A after testing.|
|4|Temperature<br>Cycling|1000cycles(-55C to 125C)<br>Measurement at 24±2 hours<br>after test conclusion.|Meet Table A after testing.|
|5|Destructive<br>Physical<br>Analysis|Per EIA469<br>No electrical tests|Not Applicable|
|7|Biased<br>Humidity|1000hours 85C/85%RH.<br>Apply Maximum rated Voltage<br>and current.<br>Measurement at 24+/-2 hours<br>after test conclusion.|Meet Table B after testing.|
|8|Operational Life|1000hours at 125C<br>Apply Maximum rated Current.<br>Measurement at 24+/-2 hours<br>after test conclusion.|Meet Table A after testing.|
|9|External Visual|Visual inspection|No abnormalities|
|10|Physical<br>Dimension|Meet ITEM 4<br>(Style and Dimensions)|No defects|
|12|Resistance<br>to Solvents|Per MIL-STD-202 Method 215|Not Applicable|
|13|Mechanical<br>Shock|Per MIL-STD-202 Method 213<br>Figure 1 of Method 213.<br>Condition<br>F(1500g's/0.5ms/Half sine)<br>Three times each 6 direction.|Meet Table C after testing.|
|14|Vibration|5g's for 20 minutes, 12cycles<br>each of 3 oritentations<br>Osscillation Frequency :<br>10-2000Hz.|Meet Table C after testing.|
|15|Resistance<br>to  Soldering<br>Heat|No heating.<br>260C +/- degree C<br>Immersion time 10s|Pre-heating: 150C+/-5C, 60s+/-5s<br>Meet Table D after testing.|
|17|ESD|Per AEC-Q200-002|Meet Table C after testing.<br>ESD Rank: Refer to Item 3. Rating.|
|18|Solderbility|Per J-STD-002|Method b : Not Applicable<br>75%of the terminations is to be soldered.|
|19|Electrical<br>Characterization|Measured :Capacitance|No defects|
|20|Flammability|Per UL-94|Not Applicable|
|21|Board Flex|Epoxy-PCB(1.6mm)<br>Deflection 2mm(min)<br>60s minimum holdingtime|Meet Table D after testing.|
|22|Terminal<br>Strength|Per AEC-Q200-006<br>A force of 17.7N<br>for 60sec|17.7N for 60sec<br>No defects|
|30|Electrical<br>Transient<br>Conduction|Per ISO-7637-2|Not Applicable|



MURATA MFG.CO.,LTD. 

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## Spec.No.  JENF243H-9101-01 

## Reference Only 

## **Table A** 

|**Table A**||
|---|---|
|Appearance|No damaged|
|Capacitance Change|Within +/-12.5%  (BNX024/BNX025)<br>Within+/-15%    (BNX026/BNX027)|
|I.R.|10MΩ min. (BNX024)<br>5M Ω min.  (BNX025)<br>1MΩ min. (BNX024)<br>0.1M Ω min. (BNX025)|



## **Table B** 

|**Table B**||
|---|---|
|Appearance|No damaged|
|Capacitance Change|Within +/-12.5%  (BNX024/BNX025)<br>Within+/-15%    (BNX026/BNX027)|
|I.R.|5MΩ min. (BNX024)<br>2.5M Ω min. (BNX025)<br>1MΩ min. (BNX024)<br>0.1M Ω min. (BNX025)|



## **Table C** 

|**Table C**||
|---|---|
|Appearance|No damaged|
|Capacitance Change|Within +/-15%|
|I.R.|100MΩ min. (BNX024)<br>50M Ω min.  (BNX025)<br>10MΩ min. (BNX024)<br>1M Ω min.   (BNX025)|
|WithstandingVoltage|No damaged|



## **Table D** 

|**Table D**||
|---|---|
|Appearance|No damaged|
|Capacitance Change|Within +/-7.5%  (BNX024/BNX025)<br>Within+/-15%   (BNX026/BNX027)|
|I.R.|100MΩ min. (BNX024)<br>50M Ω min.  (BNX025)<br>10MΩ min. (BNX024)<br>1M Ω min.   (BNX025)|
|WithstandingVoltage|No damaged|



<About BNX026,BNX027> 

**·** Initial values: measured after heat treatment (150±[0] 10[ °C, 1hour) and exposure in the room condition for 24±2 hours. ] **·** Values After Testing:measured after heat treatment (150±[0] 10[ °C, 1hour) and exposure in the room condition for 24±2 hours.] 

MURATA MFG.CO.,LTD. 

Spec.No.  JENF243H-9101-01 

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## Reference Only 

## **9.Insertion Loss Characteristics (I.L.) (Typ.)** 

**==> picture [265 x 86] intentionally omitted <==**

**----- Start of picture text -----**<br>
BNX024H01<br>- a ee<br>BNX025H01 ／ BNX026H01<br>S T eel FIT<br>_39 W<br>19 Sa BNX027H01<br>nso FT<br>**----- End of picture text -----**<br>


## **10. Specification of Packaging** 

**10.1 Appearance and Dimensions (24mm-wide plastic tape)** (1) plastic tape 

**==> picture [389 x 194] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.04.0×10 × 10pitch=40.0pich=40.0±0.2 ± 0.2<br>2.0±0.1 Cavity<br>Sprocket Hole<br>4.0±0.1 0.1 0.5<br>1.5± 0 1.5± 0 0.3±0.1<br>iesLEILOILOTro \.<br>— LIL |<br>3.3±0.1<br>3.6±0.1<br>9.4±0.1 12.0±0.1 —><br>Direction of feed (in:mm)<br>1.75±0.1<br>11.5±0.1<br>24.0±0.2<br>12.4±0.1<br>**----- End of picture text -----**<br>


*Dimension of the Cavity is measured at the bottom side. 

MURATA MFG.CO.,LTD. 

Spec.No.  JENF243H-9101-01 

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## Reference Only 

(2)Direction of the product 

**==> picture [239 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
2 2 2<br>2 2 2<br>0 0 0<br>X X X<br>N N N<br>B B B<br>MURATA logo mark<br>BNX024  BNX024  BNX024<br>**----- End of picture text -----**<br>


## **10.2 Specification of Taping** 

- (1) Packing quantity (standard quantity) 

- 178mm reel :  400 pcs. / reel 

- 330mm reel : 1500 pcs. / reel 

- (2) Packing Method 

Products shall be packaged in the cavity of the plastic tape and sealed with cover tape. 

- (3) Spliced point 

The cover tape have no spliced point. 

## (4) Sprocket Hole 

The sprocket holes are to the right as the tape is pulled toward the user. 

- (5) Missing components number 

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 

## **10.3 Pull Strength of Plastic Tape and Cover Tape** 

Plastic tape Cover tape 10N min. 165 to 180 degree F Cover tape Plastic tape 

## **10.4 Peeling off force of Cover tape** 

- 0.2N to 0.7N (minimum value is typical) 

-  Speed of Peeling off : 300 mm / min 

## **10.5 Dimensions of Leader-tape, Trailer and Reel** 

There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. 

## [ Packaging Code:L (178mm reel) ] 

**==> picture [423 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
Trailer Leader<br>160 min.<br>2.0±0.5 Label 190 min . 210 min .<br>Empty tape Cover tape<br>62± 13.0±0.2<br>0.5<br>21.0±0.8<br>Direction of feed<br>2.2±0.1<br>24.8 ～ 26.5 178±0.5 (in:mm)<br>**----- End of picture text -----**<br>


MURATA MFG.CO.,LTD. 

Spec.No.  JENF243H-9101-01 

P 8/ 13 

## Reference Only 

## [ Packaging Code:K (330mm reel) ] 

**==> picture [423 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
Trailer Leader<br>160 min.<br>2.0±0.5 Label 190 min . 210 min .<br>Empty tape Cover tape<br>100± 13.0±0.2<br>1.0<br>21.0±0.8<br>Direction of feed<br>2±0.2<br>25.5±0.5 330±2.0 (in:mm)<br>**----- End of picture text -----**<br>


## **10.6 Marking for reel** 

Customer part number, MURATA part number, Inspection number(・1), RoHS marking(・2), Quantity, etc 

・1) « Expression of Inspection No. » □□ OOOO  

(1)     (2)     (3) 

(1) Factory Code (2) Date First digit : Year  / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day 

(3) Serial No. 

・2) « Expression of RoHS marking » ROHS – Y ( △ ) 

(1) (2) 

(1) RoHS regulation conformity parts. 

(2) MURATA classification number 

## **10.7 Marking for Outside package (corrugated paper box)** 

Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS discrimination(・2) , Quantity , etc 

## **10.8 Specification of Outer Case** 

||||||
|---|---|---|---|---|
|Reel|Outer Case Dimensions<br>(mm)|||Standard Reel Quantity<br>in Outer Case (Reel)|
||W|D|H||
|178mm|186|186|93|3|
|330mm|340|340|85|2|



Above Outer Case size is typical. It depends on a quantity of an order. 

## **11.  !  Caution** 

## **11.1 Operating Environment** 

Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. 

- (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) 

- (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 

- (3) in the atmosphere where dust rises. 

- (4) in the atmosphere where rapidly thermal change occurs. 

MURATA MFG.CO.,LTD. 

Spec.No.  JENF243H-9101-01 

P 9/ 13 

## Reference Only 

## **11.2.Direction of mounting** 

Please make sure of the direction of mounting and connect to the circuit properly. 

As shown in the equivalent circuit shown in item 5, this product has a directionality. 

Wrong connection to the circuit may cause open/short circuit of the part, burnout and serious accidents. 

## **11.3.Caution (Rating)** 

**<** Self-heating > 

Though this product has a large rated current,following attention should be paid. 

- (1) Do not use this product beyond the ratings such as rated voltage and rated current/derating condition. Then burnout may occurred by self-heating. 

(2)After installing this product in your product, please make sure of the self-heating with the rated current. 

## **11.4. Attention regarding product's lay out** 

< Attention regarding the heat generated by other products > 

Please provide special attention when mounting products in close proximity to other products that radiate heat. 

Failure to follow the above cautions may result, worst case, in a short circuit and cause fuming or firing when the product is used. 

## **11.5. Fail-safe** 

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 

## **11.6.ESD** 

ESD to this product, exceeding condition of IEC61000-4-2 with 30kV, may cause short circuit and fuming or firing. 

## **11.7.Limitation of Applications** 

Please contact us before using our products for the applications listed below which require especially high 

reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property. 

(1)Aircraft equipment   (2)Aerospace equipment  (3)Undersea equipment  (4)Power plant control equipment 

(5)Medical equipment  (6)Transportation equipment(trains,ships,etc.) (7)Traffic signal equipment 

(8)Disaster prevention / crime prevention equipment  (9)Data-processing equipment 

(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 

## **12.Notice** 

Products can only be soldered with reflow. 

This product is designed for solder mounting. 

Please consult us in advance for applying other mounting method such as conductive adhesive. 

## **12.1. Flux and Solder** 

|Flux|Use rosin-based flux, Do not use highly acidic flux (with chlorine content<br>exceeding 0.2(wt)%).<br>Do not use water soluble flux.|
|---|---|
|Solder|Use Sn-3.0Ag-0.5Cu solder|



Other flux (except above) Please contact us for details, then use. 

MURATA MFG.CO.,LTD. 

Spec.No.  JENF243H-9101-01 

P 10/ 13 

## Reference Only 

## **12.2. Note for Assembling** 

<Exclusive Use of Reflow Soldering> 

When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs. Products can only be soldered with reflow. 

The use in flow soldering be reserved. 

- < Thermal Shock > 

Pre-heating should be in such a way that the temperature difference between solder and products 

surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 °C max. 

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. 

## **12.3. Attention Regarding P.C.B. Bending** 

The following shall be considered when designing P.C.B.'s and laying out products. 

- (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. 

## 〔 Products direction 〕 

**==> picture [167 x 49] intentionally omitted <==**

**----- Start of picture text -----**<br>
a<br>b<br>〈 Poor example 〉 〈 Good example 〉<br>**----- End of picture text -----**<br>


Products shall be locatedin the sideways 

direction (Length:ab) to the mechanical stress. 

- (2) Products location on P.C.B. near seam for separation. 

Products (A,B,C,D) shall be located carefully so that products are not subjected to the mechanical stress due to warping the board. Because they may be subjecte the mechanical stress in order of A > C > B  D. 

## **12.4. Attention Regarding P.C.B. Design** 

## < The Arrangement of Products > 

- P.C.B. shall be designed so that products are far from the portion of perforation. 

The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. 

Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. 

(Because the stress concentrate on the line of holes.) 

## < Products Placing > 

Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. 

**==> picture [157 x 358] intentionally omitted <==**

**----- Start of picture text -----**<br>
C<br>Seam B<br>D<br>b A<br>Slit<br>Lengh:a<b<br>a<br>Portion of<br>Perforation<br>×<br>P.C.B .<br>○<br>○<br>Product<br>Portion of ×<br>Perforation<br>P.C.B . ○ ×<br>Product<br>Hole<br>Pick up nozzle<br>P.C.B.<br>Support pin<br>**----- End of picture text -----**<br>


MURATA MFG.CO.,LTD. 

Spec.No.  JENF243H-9101-01 

P 11/ 13 

## Reference Only 

## < P.C.B. Separation > 

P.C.B. shall not be separated with hand. 

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. 

## **12.5. Standard Land Dimensions** 

**==> picture [405 x 210] intentionally omitted <==**

**----- Start of picture text -----**<br>
12.5<br>CG<br>10.2<br>9.9<br>9.6<br>B CB<br>7.1<br>6.2<br>5.3<br>PSG CG Copper foil pattern<br>2.8<br>2.3<br>Copper foil pattern+Resist<br>CG<br>0<br>Etchedarea<br>Through hole<br>（in ： mm）<br>0 3.8 5.8 10.3 13.2 13.7 17.5<br>**----- End of picture text -----**<br>


- (1)Design the land pads for this part as shown above on both side printed circuit board ( or a multiple layered substrate ). 

- (2) This product is designed to meet large current. 

Please design PCB pattern which is connected to this product not to become too hot  by applied large current. (3)Ground area of CG should be connected to ground layer on the other side (or ground layer of multiple layered substrate) with through holes as shown above. 

It is recommended to take the ground area as wide as possible. 

- (4)It is recommended to use the connection to the ground layer with through holes and the ground layer to be circuit board wide. 

(5)Even in case that it isn't possible to use a both side printed circuit board ( or a multiple layered substrate ), the land pads for CG should be designed as wide as possible. 

## **12.6. Reflow Soldering** 

- 1) Solder paste printing for reflow soldering 

   - Standard thickness of solder paste should be 150 to 200 µm. 

Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up the terminal, being possible to lead to not enough connection between terminals and lands on the circuit board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual use condition. 

- For the solder paste printing pattern, use standard land dimensions. 

- For the resist and copper foil pattern, use standard land dimensions. 

- Use Sn-3.0Ag-0.5Cu solder 

MURATA MFG.CO.,LTD. 

P 12/ 13 

## Spec.No.  JENF243H ~~a~~ -9101-01 

## ~~a~~ 

## Reference Only 

- 2) Soldering Conditions 

Standard soldering profile and the limit soldering profile is as follows. 

The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. 

**==> picture [327 x 216] intentionally omitted <==**

**----- Start of picture text -----**<br>
Temp. 260°C<br>(°C)<br>245°C±3°C<br>230°C<br>220°C<br>Limit Profile<br>180<br>150<br>30s ～ 60s Standard Profile<br>60s max.<br>Y _ |os=<br>LS 90s±30s Time.(s)<br>Standard Profile Limit Profile<br>Pre-heating 150°C ~ 180°C , 90s ± 30s<br>Heating above 220°C , 30s ~ 60s above 230°C , 60s max.<br>Peak temperature 250°C ± 3°C 260°C , 10s<br>Cycle of reflow  2 times 2 times<br>**----- End of picture text -----**<br>


## **12.7. Reworking with Soldering iron** 

- The following conditions shall be strictly followed when using a soldering iron. 

- Soldering iron :  100W  max. 

Tip temperature/ Soldering time :  450°C ± 5°C, 5s 

Note : Do not touch the products directly with the tip of the soldering iron. 

## **12.8. Cleaning Conditions** 

Avoid cleaning product due to non-waterproof construction. 

Please contact us for details, then use. 

## **12.9** ． **Moisture-proof coat material** 

Moisture–proof coating is made on inner parts of this product. 

The Moisture–proof coat material might appear on the surface of product,which doesn’t affect on the product performance. 

## **12.10. Resin coating** 

The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 

## **1211. Handling of a substrate** 

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. 

Excessive mechanical stress may cause cracking in the product. 

Bending                                Twisting 

MURATA MFG.CO.,LTD. 

P 13/ 13 

Spec.No.  JENF243H-9101-01 

## Reference Only 

## **12.12 Storage condition** 

- (1) Storage period 

Use the products within 12 months after delivered. 

Solderability should be checked if this period is exceeded. 

- (2) Storage environment condition 

   - Products should be stored in the warehouse on the following conditions. 

Temperature  :  - 10 °C to + 40 °C 

Humidity      :  15 % to 85% relative humidity   No rapid change on temperature and humidity 

   - Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. 

   - Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. 

   - Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. 

   - Products should be stored under the airtight packaged condition. 

- (3) Delivery 

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 

## **10.  !  Note** 

- (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 

- (2)You are requested not to use our product deviating from the agreed specifications. 

- (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. 

MURATA MFG.CO.,LTD. 



## Links

- [View this product on Novapart](https://novapart.co/products/BNX024H01L/power-line-filter-50-v-15-a)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/murata/bnx024h01l/filter-power-line-50v-15a/dp/2494141RL)
---

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