# Bluetooth Module, BLE 5.0, Class 2, 3 Mbps, -90 dBm, 3.2 V to 4.2 V, -20 °C to 70 °C

![Product image](https://novapart.co/image/farnell:3604420/)

**URL**: https://novapart.co/products/BM64SPKS1MC2-00M3AA/bluetooth-module-ble-50-class-2-3-mbps-90-dbm-32-v
**SKU**: BM64SPKS1MC2-00M3AA
**Manufacturer**: MICROCHIP
**Category**: Wireless Modules & Adaptors || Communications & Networking Modules || Bluetooth Modules & Adaptors
**Price**: €9.9500
**Stock**: 200+
**Lead Time**: 148 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (04-Feb-2026) |
| Interfaces | UART |
| Product Range | - |
| Certifications | ANATEL, CE, FCC, IC, KC, MIC, NCC, SRRC |
| Bluetooth Class | Class 2 |
| Bluetooth Version | Bluetooth LE 5.0 |
| Supply Voltage Range | 3.2 V to 4.2 V |
| Receiver Sensitivity Rx | -90 dBm |
| Operating Temperature Range | -20 °C to 70 °C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3604420/)

- samme Bluetooth™®) Stereo Audioe Module 

- | Features ¢ Supports Serial Copy Management System ; oo. (SCMS-T) content protection 

- * Qualified for Bluetooth v5.0 specification * Supports A2DP 1.3, AVRCP 1.6, HFP 1.6, HSP FIGURE 1: BM62 MODULE 1.2 and SPP 1.2 

- * Supports Bluetooth 5.0 dual-mode (BDR/EDR/ See 4~ 4~~ BLE) specifications . 

- * onan anetaninele tS Stand-alone module with on-board PCB antenna oe © Pe and Bluetooth stack PCBA: 5S. 0405.11 5S. 0405.11 0405.1111 PeBArSS, OFOSHiM.11 OFOSHiM.11 

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FIGURE 1: BM62 MODULE<br>See 4~ 4~~<br>onan anetaninele tS<br>oe © Pe<br>PCBA: 5S. 0405.11 5S. 0405.11 0405.1111 PeBArSS, OFOSHiM.11 OFOSHiM.11<br>FS RRR - ——— at,<br>ame “ial be om A<br>ie =e<br>: a .<br>f Re ascoak |<br>Lal<br>er | Ea > 7<br>fe xe | ’<br>= = i} ; Ne<br>—————— ee<br>FIGURE 2: BM64 MODULE<br>on Rene BNC4 RoHS<br>. ) .<br>PEC. Cpls PER Pes<br>1 mea hed ee |<br>AleaWououndaceeieee “| det ees |kt ) |<br>jE zp)<br>44 fe i_ |i : |<br>1 eal a: !<br>uy ae ete '<br>| ee<br>feel |, |<br>el ———<br>**----- End of picture text -----**<br>


- Supports high resolution up to 24-bit, 96 KHz audio data format 

- ¢ Supports Bluetooth Low Energy data rate up to 1Mbits/s 

- * Supports connection of two hosts with HEP/A2DP profiles simultaneously 

- ¢ Transparent UART mode for seamless serial data over UART interface 

- ¢ Supports virtual VART communication between host MCU and smartphone applications by Bluetooth SPP or BLE link 

- ¢ Easy to configure with Windows® GUI or directly by external MCU 

- Supports firmware field upgrade 

- Supports one microphone 

- * Compact surface mount module: - BM62: 29x 15x 2.5mm 

- * BM64: 32 x 15 x 2.5mm reliableCastellated hostsurface PCB mountingmount pads for easy and 

- ¢ RoHS compliant ¢ ldeal for portable battery-operated devices 

- Internal battery regulator circuitry 

- DSP Audio Processing * Supports 64 kbps A-Law, pt-Law PCM format/ Continuous Variable Slope Delta (CVSD) modulation for SCO channel operation 

- ¢ Supports 8/16 kHz noise suppression ¢ Supports 8/16 kHz echo cancellation * Supports Modified Sub-Band Coding (MSBC) decoder for wide band speech 

## Audio. Codec 

   - Sub-band Coding (SBC) and optional Advanced Audio Coding (AAC) decoding 

- Built-in High Definition Clean Audio (HCA) algorithms for both narrow band and wide band speech processing 

   - 20-bit Digital-to-Analog Converter (DAC) with 98 dB SNR 

   - * 16-bit Analog-to-Digital Converter (ADC) with 92 dB SNR 

- « Packet loss concealment (PLC) 

- Built-in audio effect algorithms to enhance audio streaming 

- Supports up to 24-bit, 96 kHz I?S digital audio (BM64 only) 

© 2017-2020 Microchip Technology Inc. 

## Advanced 

DS60001403F-Page 1 

## serene 

## Peripherals 

- ¢ Built-in lithium-ion and lithium-polymer battery charger (up to 350 mA) 

- * Integrated 1.8V and 3V configurable switching 

- Built-in ADC for battery monitoring and voltage Sense 

- « BUinAWe ten dhamerihematpisisetian 

- Built-in Undervoltage Protection (UVP) 

- . A iliary input port f t | audio inout — leanne pases ake bee 

- * Two LED drivers ¢ Multiple I/O pins for control and status 

## Description 

The BM62/64 Stereo Audio module is a fully qualified Bluetooth v5.0 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications SIG-certified module that provides a complete wireless solution with a Bluetooth stack, an integrated PCB antenna, and worldwide radio certifications in a compact surface-mount package. 

The BM62/64 module has several SKUs. The BM62 module is a Class 2 device and the BM64 module is available in both Class 1 and Class 2 versions. 

## RF/Analog 

- ¢ Frequency spectrum: 2.402 GHz to 2.480 GHz 

- Receive sensitivity: -90 dBm (2 Mbps EDR) 

- Output Power - BM64 Class 1: +15 dBm typical - BM62/64 Class 2: +2 dBm typical 

## HCI Interface 

- ¢ High-speed HCI-UART interface (supports up to 921,600 bps) 

## MAC/Baseband Processor 

- ¢ Supports Bluetooth 5.0 dual-mode - BDR/EDR transport for audio, voice, and SPP data exchange 

- - BLE transport for proprietary transparent service and Apple Notification Center Service (ANCS) data exchange 

## Operating Condition 

- Operating voltage: 3.2V to 4.2V 

- Operating temperature: -20°C to +70°C 

## Compliance 

- Bluetooth Special Interest Group (SIG) QDID: 110148 (BM62, BM64 Class 2) and 110159 (BM64 Class 1) 

- Certified to the United States (FCC), Innovation, Science and Economic Development Canada (ISED), European Economic Area (CE), Korea (KCC), Taiwan (NCC), Japan (MIC), China (SRRC), and Brazil (ANATEL) radio regulations 

## Applications 

- Portable speaker 

- ¢ Multiple speakers 

- « Headset 

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- Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com 

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e€.g., DS30000000A is version A of document DS30000000). 

## Errata 

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. 

To determine if an errata sheet exists for a particular device, please check with one of the following: ¢ Microchip’s Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. 

## Customer Notification System 

Register on our web site at www.microchip.com to receive the most current information on all of our products. 

eee reer eerence eee eee eeeeee © 2017-2020 Microchip Technology Inc. Advanced DS60001403F-Page 3 

## serene 

## 1.0 DEVICE OVERVIEW 

## Windows-based utility. 

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The BM62 and BM64 Stereo Audio modules are built Note: The UI and DSP tools are available for<br>around Microchip Technology 1S2062 and IS2064 download from the Microchip website at:<br>SoCs. www.microchip.com/BM62 and<br>The IS2062/64 SoC .integrates the Bluetooth 5.0 dual- www.microchip.com/BM64.<br>mode radio transceiver, Power Management Unit Figure 1-1 illustrates a typical example of the BM62<br>(PMU), a crystal and DSP. Users can configure the module, which is connected to an external audio<br>BM62/64 module by using the UI tool and DSP tool, a amplifier and the MCU.<br>FIGURE 1-1: SINGLE SPEAKER APPLICATION USING BM62 MODULE<br>dereaien Cor i<br>|Po |<br>BM62<br>AMP<br>Audio Qutput<br>z Microghone IS2062GM cabs f<br>Crystal |<br>_—— |<br>Aux_in =XUART|”Mcu |<br>|Option |<br>Figure 1-2 illustrates a typical example of the Class 1<br>BM64 module, which is connected to an external MCU<br>and a DSP/codec.<br>FIGURE 1-2: SINGLE SPEAKER APPLICATION USING BM64 MODULE<br>BM64 éif=~>.<br>il Microphone<br>16 MHz ———<br>de Aux_in bo<br>**----- End of picture text -----**<br>


ener reereee eee eee eee DS60001403F-Page 4 Advanced © 2017-2020 Microchip Technology Inc. 

Figure 1-3 illustrates the multi-speaker application using the BM64 module. 

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FIGURE 1-3: MULTI-SPEAKER APPLICATION USING BM64 MODULE<br>**----- End of picture text -----**<br>


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© 2017-2020 Microchip Technology Inc. 

Advanced 

DS60001403F-Page 5 

BM62/64 — 

Table 1-1 provides the key features of the BM62/64 module. 

TABLE 1-1: BM62/64 KEY FEATURES 

|[Feature|_|_BMezclass2 | BME4CLASS2 | BM64CLASS1 ||
|---|---|
|[DAC (single-endes) SNRatZAV(B)<br>[DAG (capless)SNRat2V(dB)|«|Ss—iSSC~dSSC“‘**C**éS#!OO~Cd**Y**SCO**C**‘a<br>——SC«~Y~=SC<‘“‘!!SC~*dr COC~C“‘O!OC O~O~ ~‘CS|
|[Butonsuppoh——S=~=“‘*‘“*S*S*~*~*~‘“SC“‘(N’SCONC#CNNSC“‘#SCNSCOC“‘#*SNN#§SCNCC‘(S||
||800bytes/second|



SS DS60001403F-Page 6 Advanced © 2017-2020 Microchip Technology Inc. 

Figure 1-4 illustrates the pin diagram of the BM62 module. 

FIGURE 1-4: BM62 MODULE PIN DIAGRAM 

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NC 38<br>NC 40 Y<br>oF<br>POLO 1 37 GND<br>EAN 2 36 NC<br>P30 3 35 P2_7<br>P2.0 4 34 P0O_5<br>P15 65 33 HCI_RXD<br>PO4 6 32 HCI_TXD<br>SPKR 7 31 PO_3<br>AOHPM 8 30 PO_2<br>SPKL 9 29 P2_4<br>VDDA 10 28 LED2<br>MIC1_P 11 27 LED1<br>MIC1_N 12 26 MFB<br>MIC_BIAS 13 25 BK_OUT<br>AIR 14 24 SYS_PWR<br>wowoOon~onmnorn<br>rrrr TN NNN<br>2zoroezerf S<br>——s Palat' AG<br>« a<dan<br>>aga s<br>* <2<br>**----- End of picture text -----**<br>


© 2017-2020 Microchip Technology Inc. 

Advanced 

DS60001403F-Page 7 

## serene 

Table 1-2 provides the pin description of the BM62 module. 

|TABLE|1-2:|1-2:|BM62 MODULE PIN DESCRIPTION|BM62 MODULE PIN DESCRIPTION|BM62 MODULE PIN DESCRIPTION|BM62 MODULE PIN DESCRIPTION|||
|---|---|---|---|---|---|---|---|---|
||1||VO|||||Configurable control or indication pin|
|||||||||(Internally pulled up, if configured as an input)|
|||||||||*<br>Slide switch detector, active-high|
|||||||||¢ UARTTX_IND, active-low (used by Bluetooth sys-|
|||||||||tem to wakeup the host MCU)|
||2|||||EAN||External address bus negative|
|||||||||System configuration pin along with the P2_0 and|
|||||||||P2_4 pins, used to set the module in any one of the fol-|
|||||||||lowing three modes:|
|||||||||*<br>Application mode (for normal operation)|
|||||||||*<br>Test mode (to change EEPROM values)|
|||||||||¢<br>Write Flash mode (to load a new firmware into the|
|||||||||module), refer to Table 5-1|
|||||||||Flash type module already installed internal pull down|
|||||||||resistor 4.7 kKOhm to GND|
||3||0|||P3_0||Configurable control or indication pin|
|||||||||(Internally pulled up, if configured as an input)|
|||||||||Auxiliary input detector, active-low|
||4||0|||P2_0||System configuration pin along with P2_4 and EAN|
|||||||||pins used to setthe module in any oneofthe following|
|||||||||three modes:|
|||||||||¢<br>Application mode (for normal operation)|
|||||||||¢<br>Test mode (to change EEPROM values)|
|||||||||¢ Write Flash mode (to load a new firmware into the|
|||||||||module), refer to Table 5-1|
||3)||V0|||P19||Configurable control or indication pin|
|||||||||(Internally pulled up, if configured as an input)|
|||||||||¢ NFC detection pin, active-low|
|||||||||*<br>Out_Ind_1|
|||||||||¢<br>Slide switch detector, active-high|
||||0|||PO_4||Configurable control or indication pin|
|||||||||(Internally pulled up, if configured as an input)|
|||||||||¢ NFC detection pin, active-low|
|||||||||*<br>Out_Ind_1|
|a<br>ee <br>a||eee<br> ee|ee<br>ee<br>ee|||SPKR<br>AOHPM<br>SPKL||Right-channel, analogheadphoneoutput<br>Headphone common modeoutput/sense input<br>Left-channel, analog headphone output|
||10|||||VDDA||Analog reference voltage. Do not connect, for internal|
|||||||||use only|
|ee<br>ee<br>ee<br>P12<br>ee<br>ee<br>ee||||||MIC1_P<br>MICi_N<br>MIC1_BIAS||MIC1 mono differential analog positive input<br>MIC1 mono differential analog negative input<br>Electricmicrophone biasing voltage|
|pt<br>A||||||||___[Left-channe', single-ended analog input|
|Legend:|||l= Input pin|||O= Output pin||1/O= Input/Output pin<br>P= Power pin|
|Note:||AllI/O|pinscan|be|configuredusingtheUltool,||a|Windowsutility.|



— DS60001403F-Page 8 Advanced © 2017-2020 Microchip Technology Inc. 

|samme||samme||samme||samme||
|---|---|---|---|
|TABLE 1-2:|BM62 MODULE PIN|DESCRIPTION|(CONTINUED)|
|Pe TT<br>CRST_N_|<br>SystemReset(active-iow)<br>dC<br>—*([Noconnection,——SSCS~S||||
|18|V0|PO_1|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||¢« FWD keywhen Class 2 RF (default), active-low|
||||¢<br>Class 1 Tx control signal for external RF Tx/Rx|
||||switch, active-high|
|19||VDD_IO|I/O positive supply. Do not connect, for internal use|
||||only|
|20||ADAP_IN|5V poweradapter input, used to charge the battery in|
||||the Li-lon battery power applications|
|21||BAT_IN|Power Supply input.|
||||Voltage range: 3.2V to 4.2V. Source can either be a|
||||Li-lon battery or any other power rail on the host board|
|| 22 <br>ps <br>24|sf PY<br>AMB_DET<br>Analog inputforambienttemperature detection<br> ~|SOSSSC*dSCS*C*«SND:~SC~*dCGroundreference<br>=<br>SSC*d<br>SYS_PWR<br>System power output derived fromADAP_IN or|||
||||BAT_IN. Refer to reference schematic for external con-|
||||nection.|
|25||BK_OUT|1.8V buck regulator output. Do not connect to other|
||||devices. For internal use only|
|26||MFB|¢<br>Multi-Function Button and power-on key|
||||¢« UART RX_IND, active-high (used by host MCU to|
||||wakeup the Bluetooth system)|
|a]SSCOS~*dYSCSC*«D_—=LED river?<br>29<br>V0<br>P2_4<br>System configuration pin along with P2_0 and EAN||||
||||pins used to set the module in any oneofthe following|
||||three modes:|
||||¢<br>Application mode (for normal operation)|
||||¢<br>Test mode (to change EEPROM values)|
||||¢ Write Flash mode (to load a new firmware into the|
||||module), refer to Table 5-1|
|30|0|PO_2|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||Play/Pause key (default), active-low|
|31|VO|PO_3|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||¢« REV key (default), active-low|
||||¢<br>Buzzer signal output|
||||*<br>Out_Ind_2|
||||¢<br>Class 1 Rx Control signal of external RF Tx/Rx|
||||switch, active-high|
|||HCILRXD___[HCI UART data input||
|Legend:|l=Inputpin|O=Outputpin|/O=Input/Outputpin<br>P=Powerpin|



Note: All I/O pins can be configured using the Ul tool, a Windows utility. 

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## serene 

## TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED) 

|34<br>ie)<br>P0O_5<br>Configurablecontrolorindicationpin|
|---|
|(Internally pulled up, if configured as an input)|
|Volume-down key (default), active-low|
|35<br>We)<br>P27<br>Configurable control or indication pin|
|(Internally pulled up, if configured as an input)|
|Volume-upkey(default),active-low<br>p36<br>SC*dSSSCSCSWNG—[Noconnietion ——SSCSC~C~*<br>a7 [P| G**N**D |Gr**o**undreference——SSSOSC~SCS<br>p38 «PS<br>SSC*dSSCSC* G<br>[Noc nnection<br>——SSOSC~“—~*~*~*~S~SCS<br>pe df<br>SC*dCSSSCSNG_—[Novconnection<br>SOS<br>p40 [|<br>- |_NC___|Noconneston——SSSSOSOS—~—SCS<br>Legend:<br>l= Input pin<br>O= Output pin<br>1/O= Input/Output pin<br>P= Power pin|
|Note:<br>AllI/OpinscanbeconfiguredusingtheUltool,<br>aWindowsutility.|



ener reereee eee eee eee DS60001403F-Page 10 Advanced © 2017-2020 Microchip Technology Inc. 

ee 

Figure 1-5 illustrates the pin diagram of the BM64 module. 

FIGURE 1-5: BM64 MODULE PIN DIAGRAM 

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G4|re7,<br>DRO 1 43 GND<br>RFSO 2 42 P27<br>SCLKO 3 41 P20<br>DTO 4 40 PO_2<br>AOHPR 5 39 P36<br>AOHPM 6 38 P33<br>AOHPL 7 37 P31<br>MIC_N1 8 36 P3_0<br>MIC_P1 9 35 P05<br>MIC_BIAS 10 34 DP<br>AIR 14 33 DM<br>AIL 12 32 EAN<br>RST_N 13 31 PO0_O<br>GND 14 30 P35<br>P1_2 15 29 P3_7<br>P1_3 16 28 LED1<br>P0_4 17 27 LED2<br>AMRDOrTANMTN OO<br>TTNNNNNAN NS<br>VZQgSzzZ2eue<br>aetFraraaoe<br>—~=~occ la<br>OSs%Oes5<br>nt<br>**----- End of picture text -----**<br>


ee © 2017-2020 Microchip Technology Inc. Advanced DS60001403F-Page 11 

## BM62/64 — 

Table 1-3 provides the pin description of the BM64 Module. 

|TABLE 1-3:<br>BM64 MODULE PIN DESCRIPTION<br>[Pino | PinType | PinNeme |<br>~~ eaeripion<br>Pt]<br>10 | DRO _|PSinterace:cigtallefirightdata|
|---|
|p85 | 0 | AOHPR [Right-channel, analogheadphone output ———S—=S<br>- 6 | © | AOHPM [Headphone commonmodeoutputisense input =<br>[7 | © | AOHPL_|Leftchannel, analogheadphoneoutput<br>[8 | 1 | _MIG_Ni |MIC1mone diferentalanalognegativeinput<br>[9<br>| 1 | MiG_P1 [MIC mono diferentilanalog positiveinput<br>p10 | P| MIG_BIAS [Electricmicrophone<br>biasingvotage—SSC—*S<br>[| 1 | AR |Rightchannel, single-ended analoginput<br>[2 | 1 | Al<br>|Leftchannel,single-ended analoginput<br>p13<br>| 1 |_RSTIN |SystemReset(ectvelo<br>ss SSCSC**~**S**~**S<br>4 | P| GND _|Groundreference<br>—SCSC~=“~*~*~*~“~*~*~* * *|
|17<br>ie)<br>PO_4<br>Configurable control or indication pin|
|(Internally pulled up, if configured as an input)|
|¢ NFC detection pin, active-low|
|18<br>ie)<br>P1_5<br>Configurable control or indication pin|
|(Internally pulled up, if configured as an input)|
|¢ NFC detection pin, active-low|
|*<br>Slide switch detector, active-high|
|* Out_Ind_1|
|dent)<br>- 8<br>| 1 | HOLRXO [HOrUARTdstamputSSSC~=~—~—SCS<br>p20<br>(CTX<br>HCIUARTdataoutput<br>—SSSSCS~S<br>21 | P|VDD10_|W0 positive supply. Donot connect,ferinternal use only |<br>AEEE<br>Voltage range: 3.2V to 4.2V. Source can either be a Li-lon bat-<br>tery or any other power rail on the host board<br>| FEN [Teton goverapictone<br>|<br>Li-lon battery power applications<br>P|<br>| OS |eetofetcreneacenactorenemaicomeston|<br>Refertoreferenceschematicforexternalconnection.<br>25 | P| AMB6_DET [Analog<br>inputforambienttemperature<br>detection —_—s<br>26<br>MFB<br>¢ Multi-FunctionButtonand power-onkey<br>|<br>ee<br>wakeup the Bluetooth system)<br>aio<br>—*d~CiD d**D**a**ve**r?<br>SSCSC~C~—S<br>«| SSO SS~«YSCi «i<br>e r?<br>OSC~“—*~S*~*~“‘—S~S~*~*~S~SCS<br>Legend:<br>l= Input pin<br>O= Output pin<br>1/O= Input/Output pin<br>P= Power pin|
|Note:<br>All I/O pins can be configured using the UI tool,<br>a Windows utility.|
|SS|
|DS60001403F-Page12<br>Advanced<br>©2017-2020MicrochipTechnologyInc.|



## samme| 

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TABLE 1-3: BM64 MODULE PIN DESCRIPTION (CONTINUED)<br>**----- End of picture text -----**<br>


|29|Vie)|P3_7|Configurable control or indication pin|
|---|---|---|---|
||||(Internally pulled up, if configured as an input)|
||||UARTTX_IND, active-low (used by Bluetooth system to|
||||wakeup the host MCU)|
|30|0|P3_5|Configurable control or indication pin|
||||(Internally pulled low, if configured as an input)|
||||*<br>Slide switch detector, active-high|
|31|We)||Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||*<br>Slide switch detector, active-high, Out_Ind_0O|
|32||EAN|External address bus negative|
||||System configuration pin along with the P2_0 pins used to set|
||||the module in any one of these modes:|
||||¢ Application mode (for normal operation)|
||||* Test mode (to change FW and EEPROM values)|
||||¢ Mode setting, refer to Table 5-1|
||||Flash type module already installed internal pull down resistor|
||||4.7 kOhm to GND|
|35|VO|PO_5|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||Volume-down key (default), active-low|
|36|Vie)|P3_0|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||Auxiliary input detector, active-low|
|37|VO|P3_1|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||REV key (default), active-low|
|38|V0|P33|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||FWD key (default), active-low|
|39|Vie)|P36|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||Multi-SPK Master/Slave mode control (firmware dependent)|
|40|VO|PO_2|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
||||Play/Pause key (default)|
|41|0|P2_0|System configuration pin along with EAN pins used to set the|
||||module in any one of the following modes:|
||||¢ Application mode (for normal operation)|
||||¢ Test mode (to change FW and EEPROM values)|
||||¢ Mode setting, refer to Table 5-1|
|42|ie)|P2_7|Configurable control or indication pin|
||||(Internally pulled up, if configured as an input)|
|| P| <br>Legend:<br>l= Input pin||Volume-up key (default), active-low<br> GND _|roundreference<br>SS<br>SC=“~*‘“*~*~*~*<br>O= Output pin<br>1/O= Input/Output pin<br>P= Power pin||
|Note:|AllI/Opinscanbeconfigured|usingtheUltool,<br>aWindowsutility.||



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## NOTES: 

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## samme| 

## 2.0 AUDIO 

The ;input and output audios; have different; stages and each stage can be programmed to vary the gain response characteristics. For microphone, both sinGleandedlinpuis and diffe neninel Imps: ete Bupiesired To maintain a high quality signal, a stable bias voltage source to the condenser microphone’s FET is provided. The DC blocking capacitors can be used at both positive and negative sides of an input. Internally, this analog signal is converted to 16-bit, 8/16 kHz linear PCM data. 

## 2.1 Digital+e Signal. Processor 

A Digital Signal Processor (DSP) is used to perform speech and audio processing. The advanced speech features,reduction such as acoustic echo cancellation and noise are inbuilt. To reduce nonlinear distortion and to help echo cancellation, an outgoing signal level to 

the speaker is monitored and adjusted to avoid saturation of speaker output or microphone input. Adaptive filtering is also applied to track the echo path impulse in response to provide echo free and full-duplex user experience. The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs seavhared by die nieonhonss and immoves mutual cate ites in ns see P 9 ; : ; The advanced audio features, such aS multi-band dynamic range control, parametric multi-band equalizer, audio widening and virtual bass are inbuilt. The audiolisteningeffectexperiencealgorithmsin termsimproveof betterthe user’saudio qualityaudio after audio signal processing. Figure 2-1 and Figure 2-2 illustrate the processing flow of speakerphone applications for speech and audio signal processing. 

FIGURE 2-1: SPEECH SIGNAL PROCESSING 

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BM62/64<br>DSP<br>Antenna CVSD/A-Law/ny Pater Aas —r<br>Decoders Amplifier Speaker<br>MCU CVSD/A-Law/ MicDigitalGain noo]<br>Ls ox IR/EQ eee AEC HPF ADC}+—C)<br>Additive si<br>Background<br>Noise<br>FIGURE 2-2: AUDIO SIGNAL PROCESSING<br>BM62/64<br>V<br>MCU SBC/AAC Audio DAC Audio |—r/<br>-peaker<br>**----- End of picture text -----**<br>


FIGURE 2-2: AUDIO SIGNAL PROCESSING 

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## serene 

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The DSP parameters can be configured using the DSP 22 Codec<br>tool. For additional information on the DSP tool, refer to<br>the “IS206X DSP Application Note’. The built-in codec has a high signal-to-noise ratio<br>Note: 7 - (SNR) performance and it consists of an ADC, a DAC<br>The DSP tool and “/S206X DSP Applica- and an additional analog circuitry.<br>tion Note” document, are available for<br>download from the Microchip website at: Note: The internal codec supports 16-bit resolu-<br>www.microchip.com/BM62 and tion; by adding trailing zeros in LSBs<br>www.microchip.com/BM64. 24-bit I2S port requirements can be met.<br>Figure 2-3 through Figure 2-6 illustrate the dynamic<br>range and frequency response of the codec.<br>FIGURE 2-3: CODEC DAC DYNAMIC RANGE<br>10<br>0 al =<br>-20 i" _<br>ro i<br>= AQ - F ——=Single160_CH1<br>= -50 —<br>a en r == Single16Q_CH2<br>© 4 -. gl _ «=== Caplessi6Q_CH1<br>= a ——Capless160_CH2<br>-100 al T T T T T 1<br>-100 -90 -80 -70 -60 -50 -40 -30 -20 -10 O<br>Input power (dBFS)<br>Note: The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25°C room temperature.<br>FIGURE 2-4: CODEC DAC THD+N VERSUS INPUT POWER<br>-10ce<br>-20fo<br>pg<br>= 49 he, ——=Single16Q_CH1<br>A 720 ——Single16Q_CH2<br>= -60 =<br>a ye ——=Caplesspless160_|CH2<br>-60 -55 -50 -45 -40 -35 -30-25 -20-15-10 -5 O<br>Input power (dBFS)<br>Note: The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25°C room temperature.<br>**----- End of picture text -----**<br>


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samme|<br>FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE)<br>Generator Config FAISIES|] Numeric Display Biss<br>Instrument [125 Board =| 4]) RMS Level RMS Input Pesk Frequency<br>Syne To Ext Wordelk *<br>SampleWordaLength Ee[32 ra<br>BCk Freq = |43 kHz ~ | ae Ae los el a<br>MOK ™ = kHz 4.55 y 4.55 r<br> Ratio [258 ~] ve fe |<br>Format Standard 125 | -) Fy 465 165 Fy for 3]<br>STs = 0) se am oc | [om +]<br>Z Axis oft val] & -175 B-175 5 for3]<br>Frequency | 2 “18 “18 2 fort >]<br>Spacing flogPontsJ) | cis ae Loi | |<br>Start 200000 Hz 19 | “1.8 show|<br>a froc000 He 1.95 e 10D yp oF<br>Fonte ot ae 100 1k 10k <2 [ek ><br>Voltage 1.20000 «BFS Scan! lo64 Frequency! Hz frie Vincent 2 7]<br>Fitter Off =] =| [rs =<br>=] Trace | Autoseale a| Cursor Marker Aniri TerminatedZoom pee‘estartLim ticViolationMinMaxted Gen|  Running: Sweep| Config Wating |<br>FIGURE 2-6: CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE)<br>MM Rohde & Schwarz Audio Analyzer UPY Screen 1 BEE<br>Generator Config Jobd| ier -/oh><br>Instrument ‘(12S Board ¥| Is RMS Level RMS input Peak Frequency<br>Syne To Ext Wordclk -<br>Word Length |32 bt =]<br>Sample Freq = [48 kHz * Om —S —— === fas =i]<br>BCk Freq [arabe kHz 2 LI | eee hae 2 r<br>MCkRatio = [255 | , }<br>.<br>Format af 4 Li d -4 [ato SC=<br>potonderd 125 x] i= o 6 Ma 6 Fa |<br>Z Generator Function (jofx/) = § am v1 1 n00i| om iin -° g for<br> Axis oft wi] G6 -10 ; + — Ss} for<br>Frequency -2)? aay om ~6 fort a<br>Spacing Log Points =] Be2-14 j as -14 Lo fort >]<br>Start 20000 Hr aie? “16 r  stow|<br>.<br>Fonts 201 -20 100 1k 10k -20 [ek =]<br>Vokage 120000 dors Scan!° lesa Frequency / Hz rte Vincent 2+ j<br>Fiter oft Ix 2 [nes ly<br>[aed — Anil Terminated  Ank2 Terminated Gen Running Sweep Wating<br>Trate | Autoscale | Cursor | Marker Zoom eneLim Violation | Contig |<br>Note: |The DAC frequency response corresponds to Single-ended mode with a 47 uF DC block capacitor.<br>eee reer eerence eee eee eeeeee<br>© 2017-2020 Microchip Technology Inc. Advanced DS60001403F-Page 17<br>**----- End of picture text -----**<br>


## serene 

## 2.3. Auxiliary Port 

The BM62/64 module supports one analog (line-in) sig - nal from the external audio source. The analog (line-in) signal can be processed by the DSP to generate different sound effects (multiband dynamic range compression and audio widening), which can be configured by using the DSP tool. 

## 2.4 Analog Speaker Output The BM62/64 module supports the following analog speaker output modes: 

- Capless mode — Recommended for headphone applications in which capless output connection helps to save the BOM cost by avoiding a large DC blocking capacitor. Figure 2-7 illustrates the analog speaker output capless mode. 

- ¢ Single-ended mode — Used for driving an external audio amplifier where a DC blocking capacitor is required. Figure 2-8 illustrates the analog speaker output single-ended mode. 

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FIGURE 2-7: ANALOG SPEAKER OUTPUT CAPLESS MODE<br>BM62/64<br>in AOHPR<br>AOHPL<br>y. - AOHPM<br>16/32 Ohm Speaker<br>FIGURE 2-8: ANALOG SPEAKER OUTPUT SINGLE-ENDED MODE<br>BM62/64<br>| AOHPR<br>Audio Amplifier<br>7 AOHPL<br>**----- End of picture text -----**<br>


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FIGURE 2-8: ANALOG SPEAKER OUTPUT SINGLE-ENDED MODE<br>**----- End of picture text -----**<br>


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NOTES: 

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## serene 3.0 TRANSCEIVER BDR, symbol 1 represents 1-bit. However, each sym- 

BDR, symbol 1 represents 1-bit. However, each symbol in the payload part of EDR packet represents 2/3 bits. This is achieved by using two different modulations, 1/4 DQPSK and 8 DPSK. 

The BM62/64 module ;is designed; and optimized_ for the Bluetooth 2.4 GHz system. It contains a complete radio frequency transmitter/receiver section. An internal synthesizer generates a stable clock for synchronizing with another device. 

3.5 Adaptive Frequency Hoppin . P a y pping (AFH) The BM62/64 module has an AFH function to avoid RF interference.interference Itandhas anto algorithmchoose toclearcheckchannelthe nearbyfor transceiver Bluetooth signal. 

## 3.1. Transmitter 

; _ : The internal power amplifier (PA) has a maximum output power of +4 dBm. This is applied for Class 2 or Class 3 radios without an external RF PA. 

The transmitter performs the IQ conversion to minimize the frequency drift. 

## 3.2 Receiver 

The Low-Noise Amplifier (LNA) operates with TR-com - bined mode for single port application. It can save a pin on the package without having an external Tx/Rx switch. The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysis. A channel filter has been integrated into the receiver channel before the ADC, which is used to reduce the external component count and increase the anti-interference capability. The image rejection filter is used to reject the image frequency for low-IF architecture. This filter for low-IF architecture is intended to reduce external Band Pass Filter (BPF) component for a super heterodyne architecture. The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF output power to make a good trade-off for effective distance and current consumption. 

## 3.3 Synthesizer 

A synthesizer generates a clock for radio transceiver operation. There is a VCO inside with a tunable internal LC tank that can reduce variation for components. A crystal oscillator with an internal digital trimming circuit provides a stable clock for the synthesizer. 

## 3.4 Modem 

For Bluetooth 1.2 specification and below, 1 Mbps was the standard data rate based on the Gaussian Frequency Shift Keying (GFSK) modulation scheme. This basic rate modem meets Basic Data Rate (BDR) requirements of Bluetooth 2.0 with Enhanced Data Rate (EDR) specifications. 

For Bluetooth 2.0 and above specifications, EDR has been introduced to provide the data rates of 1/2/3 Mbps. For baseband, both BDR and EDR utilize the same 1 MHz symbol rate and 1.6 kHz slot rate. For 

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NOTES: 

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## serene 4.0 POWER MANAGEMENT UNIT 4.1 Charging a Battery 

The on-chip Power Management Unit (PMU) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulator. A power switch is used to switch over the power source between the battery and an adapter. Also, the PMU provides current to drive two LEDs. 

The BM62/64 module has a built-in battery charger, which is optimized for lithium-ion and lithium-polymer batteries. 

The battery charger includes a current sensor for charging control, user-programmable current regulation, and high accuracy voltage regulation. 

The charging current parameters are configured by the UI tool. Reviving, pre-charging, constant current and constant voltage modes, and re-charging functions are included. The maximum charging current is 350 mA. Figure 4-1 illustrates the charging curve of a battery. 

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FIGURE 4-1: BATTERY CHARGING CURVE<br>**----- End of picture text -----**<br>


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Reviving re che Recharge<br>hg ae Constant Current Mode Constant Voltage Mode Mode<br>es |<br>Recharge Voltage<br>4.1v<br>=<]<br>Recharge current Pieler<br>0.25¢<br>Precharge2.5vVoltage i asteiestateatetetatentiad—,, cstastesastenteseteeeteeeieteteteten<br>Precharge Current<br>0.1¢<br>Reviving Current —_ |<br>2mA<br>**----- End of picture text -----**<br>


## 4.2 Voltage Monitoring 

A 10-bit, successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage level detection. The warning level can be programmed by using the UI tool. The ADC provides a granular resolution to enable the external MCU to take control over the charging process. 

## 4.3 LED Drivers 

Two dedicated LED drivers control the LEDs.They provide enough sink current (16 step control and 0.35 mA for each step), thus LEDs can be connected directly with the BM62/64 module. The LED settings can be configured using the UI tool. 

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## samme| 

Figure 4-2 illustrates the LED drivers in the BM62/64 module. 

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FIGURE 4-2: LED DRIVERS<br>BM62/64<br>SYS PWR<br>$4<br>—>}—— LED1<br>Si LED2<br>**----- End of picture text -----**<br>


## 4.4 Under Voltage Protection (Software Dependent UVP) 

When the input voltage of the BAT_IN is below 2.9V, the system will not be able to start up, in order to protect the system. 

## 4.5 Ambient Detection 

The BM62/64 module has a built-in ADC for charger thermal protection. Figure 4-3 illustrates the suggested circuit and thermistor, Murata NCP15WF104F. The charger thermal protection can avoid battery charge in restricted temperature range. The upper and lower limits for temperature values can be configured by using the UI tool. 

Note: Thermistor must be placed close to the battery in the user application for accurate temperature measurements and to enable the thermal shutdown feature. 

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FIGURE 4-3: AMBIENT DETECTION<br>VDD_1IO<br>R1<br>1M/1%<br>AMB_DET<br>C1 R2<br>1 -F,16Vvy 86.6K/1%<br>TR1<br>100K<br>Thermistor: Murata NCP15WF104F<br>**----- End of picture text -----**<br>


DS60001403F-Page 24 

Advanced 

© 2017-2020 Microchip Technology Inc. 

## samme| 

## 5.0 APPLICATION INFORMATION 

## 54 Power Supply 

The IS2062/64 SoC is powered through the BAT_IN input pin. The external 5V power adapter can be connected to ADAP_IN in order to charge the battery. 

The following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of the 1S2062/64 SoC. 

FIGURE 5-1: POWER TREE DIAGRAM 

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**----- Start of picture text -----**<br>
= (3.0t02.7V) | yopay |<br>— —| LDO31_VIN  CODEC_vo >| Flash<br>(3.2 to 4.2V) 3V LDO VDDAO Flash |<br>>| BAT_IN<br>56mn! 145t055V) SwitchP SYS_PWR CROsNO ated VDD_IO—~ }———->| EEPROM<br>| ADAP_IN (4.2 to 3.2V)<br>BK_O<br>5V 1.8V Buck =<br>Adapter BRNOP Regulator BK Lx oats pwicn — cip0.0 |"™,) vop_core<br>us 1.2V LDO (1.28V)<br>RFLDO_O }—— VCC_RF<br>>| SAR_VDD<br>**----- End of picture text -----**<br>


## 5.2 Host MCU Interface 

The BM62/64 module supports UART commands. The UART commands enable an external MCU to control the BM62/64 module. Figure 5-2 illustrates the UART interface between the BM62/64 module and an external MCU. 

FIGURE 5-2: HOST MCU INTERFACE OVER UART 

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**----- Start of picture text -----**<br>
MCU BM62/64<br>MCU_WAKE PO_0 (for BM62)<br>UP P3_7 (for BM64)<br>UART_RX UART Interface HCI_TXD<br>UART_TX SIRT ICR HCI_RXD<br>BT_WAKE UP | }-——______ MFB<br>**----- End of picture text -----**<br>


An external MCU can control the BM62/64 module over the UART interface and wake-up the module with the MFB, PO_0 (BM62) and P3_7 (BM64) pins. 

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## serene 

Refer to the “UART_CommandSe?’ document for a list of functions the BM62/64 module supports and how to use the UI tool to configure the UART and UART Command Set tool. 

Note: |The UART Command set tool (SPKCommandSetTool v160.xx) and “UART_CommandSet’ document are available for download from the Microchip website at: www.microchip.com/BM62 and www.microchip.com/BM64. 

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FIGURE 5-4: TIMING SEQUENCE OF RX INDICATION AFTER POWER-ON STATE 

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Wake-up Bluetooth® leave 32 kHz<br>mode MFB pulse must be longer than the<br>| UART command slot time<br>MFB _ 150ms —<br>(PWR) , | | $$<br>MCU sends UART command —t<br>fof UART<br>i | Command<br>1ms<br>5-5: TIMING SEQUENCE OF POWER-OFF STATE<br>BM62/64 sends power-off ACK __ _<br>BAT_IN +4V |<br>MFB (PWR)<br>MCU sends RST_N<br>LDO31_VOTO |<br>UART bus | |<br>i 28 j1s!<br>**----- End of picture text -----**<br>


FIGURE 5-5: TIMING SEQUENCE OF POWER-OFF STATE 

Note 1: EEPROM clock = 100 kHz. 

- 2: For a byte write: 0.01 ms x 32 clock x 2 = 640 us. 

- 3: It is recommended to have ramp-down time more than 640 us during the power-off sequence to ensure safe operation of the device. 

© 2017-2020 Microchip Technology Inc. 

DS60001403F-Page 28 

Advanced 

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samme|<br>FIGURE 5-6: TIMING SEQUENCE OF POWER-ON (NACKk)<br>1 ms<br>BAT_IN gf i i 4<br>SYS_PWR | | | fi<br>MCU state on/initialpower Zz | Power-on H:<br>" 400 ms , , 200 ms , —» any «—<br>MFB (PWR). _»— | a<br>BK_OUT/LDO31_VO if _y? 10 ms<br>RST_N » s <— 20 ms<br>MCU sends UART command it y—- ——_}3 ___ | _ae)<br>BM62/64 (BM62/64response UARTUART_RX)state i' a| — | NACK 7J ‘Power'phay DAN ACKa ; T| ACK | a<br>(BM62/64 UART_TX) a +<br>H | { Wait )<br>H NN” |: Retry, if ACK is not received<br>Set “Power-on Directly” boot Maximum: 5 times (1s)<br>FIGURE 5-7: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU<br>MFB (PWR) | |<br>MCU sends UART command t : { t<br>UART<br>Command<br>If no<br>response<br>BM62/64 UART ~s rr<br>\UART- ale<br>Cofayand Pst<br>Reset : : { '<br>it ><br>5000 ms < ><br>5000 ms-——<br>< H<br>5000 ms<br>5000 ms 5000 ms<br>Note: | When the host MCU sends the UART command and the BM62/64 module does not respond, the<br>MCU resends the UART command. If the BM62/64 module does not respond within 5 secs, the MCU<br>will force the system to Reset.<br>**----- End of picture text -----**<br>


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serene<br>FIGURE 5-8: TIMING SEQUENCE OF POWER DROP PROTECTION<br>**----- End of picture text -----**<br>


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Power<br>BAT_IN +4V <= zt<br>~ 4 20<br>a ol BAT_IN<br>'Hi<br>1H _ *<br>PoP NS BM62/64<br>1 i ot Reset IC<br>|: GND<br>‘4 MCU Reset<br>**----- End of picture text -----**<br>


- Note 1: It is recommended to use the battery to provide the power supply at BAT_IN in to the module. 

   - 2: If an external power source or a power adapter is utilized to provide power to the module (BAT_IN), itis recommended to use a voltage supervisor IC. 

   - 3: The Reset IC output pin, RST_N, must be “Open drain” type and threshold voltage as 2.93V. 

   - 4: The RST_N signal must be fully pulled low before BAT_IN power drop to 2.7V 

5.2.1 DEVICE FW UPGRADE (DFU) 5.2.1.1 Enter BT Module/MCU DFU mode After receiving all the images and storing in local To upgrade the flash through UART, first select the memory, such as SPI flash/USB thumb drive, the MCU module in “ROM TEST” mode. conducts the DFU for BT Module. The timing for BM64 to enter “ROM TEST” mode is illustrated in following figure (P20 low and EAN high). 

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FIGURE 5-9: Timing Diagram of Application Mode to DFU Mode<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
MFB<br>RSTN | :<br>EAN | !<br>| 5 ms | 500 ms 500 ms | Start communicate<br>**----- End of picture text -----**<br>


Be sure to switch back from “ROM TEST/DFU” mode to Application mode, after the DFU, as illustrated in following figure. 

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## samme| 

FIGURE 5-10: Timing Diagram of DFU Mode to Application Mode 

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**----- Start of picture text -----**<br>
RSTN |<br>| | Sms | 500 ms ‘Wait shutdown<br>**----- End of picture text -----**<br>


5.3 I2s Mode Application Figure 5-11 and Figure 5-12 illustrate the 2s signal The ; Be ate ; connection between the BM64 module and an external BM64 module provides an I*S digital audio output DSP. Use the DSP tool to configure the BM64 module interface to connect with an external codec/DSP. It proas a master/slave. vides 8, 16, 44.1, 48, 88.2, and 96 kHz sampling rates F dditi | ink . , ificati for 16-bit and 24-bit data formats. The I?S setting can A . ee 2 et - oming Speniicalions, be configured by using the UI and DSP tools. ri nee ane SES eee - 

FIGURE 5-11: BM64 MODULE IN I2S MASTER MODE 

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**----- Start of picture text -----**<br>
External DSP/ BM64<br>Codec<br>BCLK | SCLKO<br>DACLRC RFSO<br>Sieivele lena<br>DACDAT DTO<br>**----- End of picture text -----**<br>


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## serene 

FIGURE 5-12: BM64 MODULE IN I2S SLAVE MODE 

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**----- Start of picture text -----**<br>
External DSP/ BM64<br>Codec<br>BCLK | > SCLKO<br>DACLRC | > RFSO<br>ADCDAT | > DRO<br>DACDAT « | DTO<br>**----- End of picture text -----**<br>


## 5.4 Reset 

The BM62/64 module provides a Watchdog Timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known power-on state. This action can be driven by an external reset signal, which is used to control the device externally by forcing it into a POR state. The RST_N signal input is active-low and no connection is required in most applications. 

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## 5.5 External Configuration and Programming 

The BM62/64 module can be configured by using an external configuration tool (EEPROM tool) and the firm - ware is programmed by using a programming tool (Flash tool). 

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**----- Start of picture text -----**<br>
Note: The EEPROM and Flash tools are avail-<br>able for download from the Microchip web<br>site at: www.microchip.com/BM62 and<br>www.microchip.com/BM64.<br>Figure 5-13 illustrates the configuration and firmware<br>programming interface on the BM62 module. It is<br>recommended to include a header pin on the main PCB<br>for development.<br>FIGURE 5-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS<br>LLM<br>=. P20<br>EAN | EAN<br>P20 | ov<br>—_oe | HCl_RXD HCI_RXD<br>| "ACL1XD ~HcL_TXD<br>| BM62 —_ GND<br>| a P24<br>}<br>|<br>a<br>| GND<br>BAT_IN<br>5<br>**----- End of picture text -----**<br>


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The Configuration and Firmware programming modes are entered according to the system configuration I/O pins. Table 5-1 provides the system configuration settings. 

TABLE 5-1: SYSTEM CONFIGURATION I/O PIN SETTINGS 

|pms|sluetoothMode|
|---|---|
|[High] stows<br>Sigh S|SSCs|SSCs Application<br>ROMApplication|



Note 1: The P2_0, P2_4 and EAN pins have internal pull high. 

2: Boot mode is not supported in the BM64 module, as the P2_4 pin does not exist on the module. 

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FIGURE 5-16: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION<br>EXT POWER TREELian(OPTIONAL) SLIDE SWITCH(OPTIONAL)<br>i R3 0 i a] +<br>BAT_IN t ! 2 LoamP_PWR Swi<br>cai© (iia. ana PT-5501G id u Sw2 2 oSYS_PWR<br>Bh oe (a) Be i SW-1BIT<br>4 , R7<br>” _ i 10K<br>Bok (ora) : ‘ 100K ie<br>: UY aK iy -<br>ADAP_IN 2 L $TS2306<br>o D3 = = = al -<br>! : SOAMP_POW<br>4<br>R11 =<br>4 sailC72 CDBM240-HF 100K<br>SWITCH AMB_DET<br>Reset PLAY/PAUSE po? . MFB voDIO<br> (OPTIONAL) ee PF re:pwre —3 4<br>= RETR 4 3 a rEg MFB 1 2 7 =<br>Bt oa SW-TACT ae<br>1ui16V MMBT3904 = AMB_DETK<br>ADAP_iINo——| = a 7 R26<br>be REV POS yyp9 3 FWD PO S00 1 ca aves<br>“ 4 3 ca2 4 3 ces ee %<br>= — 2 4 15p/50V 2 ‘ 15p/50V i TR j<br>SW-TACT = SW-TACT = G i<br>Reset IC (OPTIONAL) NepTSWwEToArOS<br>VOL_DN POS Syp0 5 VOL_UP P2SP27<br>RSTN 2|—vec © BAT_IN 4 3 C95 4 3 c96<br>RST 15p/50V 15p/50V<br>G691L293 0.1u/16V<br>Us Tet 2 SW-TACT : 2 SW-TACT 2<br>LED NFC<br>LED-B LED1 (OPTIONAL)<br>LED1 2 1<br>~ b Po 4 pp 0.4<br>=ene_ LED-HR: LED2: Sve wis Di4D15 D1i6 R27 Q5<br>a P23 a 1 CDSU400Ba4 CDSU400Ba4 120/1% 2 1s$TS2301D<br>a ial 3 MFB<br>R28 Q6<br>1K/1% nyR29 ‘i s<br>a STS 2306<br>ba SYS_PWR<br>R32 R33.<br>NP-0805 1M<br>qP25 Fi<br>Note: |The section “NFC (Optional) contains built-in rectifier circuit of NXP 203F NFC type.<br>**----- End of picture text -----**<br>


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## samme| 

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**----- Start of picture text -----**<br>
FIGURE 5-20: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION<br>AMB_DET MFB RESET<br>wesie ty 3 SYS_PWR RSTN<br>= 4 Swi 2 = MFB ‘| E sw2 4 lI bi-| DP2Dp-4<br>SW-TACT R13 SW-TACT o<br>R23 1KHM1%<br>1M/1% Qi<br>AMB_DET ss aae C55tu/16Vv MMBT3904<br>= ADAP_INo——| “<br>c10; R26 PLAY/PAUS Po R14<br>tu/ievAid ~ a6K6/1% z sw3 3 C58 a _<br>i Z TRI - =<br>Hl 100K | SW-TACT a<br>= REV Pa FWD a<br>NCP15WF104F03 sw sw5<br>4 3 CT 4 3 C56<br>3 5 15p/50V . 15p/50V<br>SW-TACT at SW-TACT aL.<br>VOL- pos VOL+ eae<br>sw6 Sw7<br>4 3 cag 4 3 C57<br>z 4 15p/50V ; : 15p/50V<br>SW-TACT aE SW-TACT sss<br>STEREO AUX LINE INPUT<br>*P30 Low Active : SPEOST2 =2  aR S7oprs0v STEREObs  SPK JACK<br>Line In Detect R10 La co PJ-2001-5K 2<br>1 II Ty, 1 yy NOWI16V =<br>4 1 2 AIL AL = ~ SPKR<br>_<br>Pt = : RW1K Riz] C1010u/16v<br>PJ-3894D-S125SPE0572D2 aL= ci 1u16V D3SPE0572 4, 10K“[ itoisovO12 MIC INPUT<br>Le, 3V le...<br>RESET IC R6 1K R7 1K<br>: Z u 2<br>MIC_BIAS<br>MIC P41<br>Tete. 1d<br>| , TP-4 c3<br>RST_N GND | 3 c4 0.1u/16V<br>2 vec OBAT_IN Rg 1 220p/50V —"<br>RST .. | MIC<br>U3 C32 1 2 C6<br>G691L293 [owe= R8 2K Ir 0.1u/16V<br>**----- End of picture text -----**<br>


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**==> picture [473 x 538] intentionally omitted <==**

**----- Start of picture text -----**<br>
ee<br>FIGURE 5-21: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION<br>SYS_PWR LED<br>SLIDE o LED1 SYS_PWR<br>SWITCH Pe x LED-B o<br>BLUE seDl 2 kh<br>swe LED2<br>SW-1BIT VDD_IO no LED-HR C13<br>= fo} RED £02 2 kh “T==otutev<br>ag *<br>$782301_s,2 SLIDE SW aio UART CONTROL<br>STS2306<br>MFB " R75<br>oe 1 2 ae<br>¢ 3 an E | 7<br>C60 100K al P15 UARTUART TXDRXD HCI_RXDHCI_TXD 43 a<br>tutev | R76 RESET n RST_N Bile<br>=> : Audio AMP Enable AMP_EN 6|°<br>== S 100K R77 RX IND MFB rails<br>P| 10K TX_IND P37 a5<br>oS 3<br>atl P1_5 1 2 JP2<br>= i JP 1x8<br>NP1 NP-4<br>BLUETOOTHDEBUG cane<br>=<br>NFC P04 ai<br>m SPK MODE P15 Z|"<br>P2_0 gi SPK MODE P36 : =<br>BAT_INO-EaN 3 a Be me S5)/%<br>ADAP_IN 5 ale I2c P13 o| 2<br>Oper exp 5) 2 CHG/AUX-IN_Ind. P37 cai<br>HCI_TXD callie = AMB_DET 6 | ©<br>a a —<br>a o JP6<br>i JP 1x8<br>JP3<br>JP 1x8<br>DC POWER SOURCE BATTERY CONNECTOR<br>BAT_IN<br>* OUCB02SB3021-99R,ADAP_INa=<br>aea DM C16 ==Ci7<br>nes DP all “T otunev | tu/tev<br>astp 4 se= “T C20otutev | C18tutev = 4 3 i |<br>oO At. IL. = = =<br>= a — JP4 SIP 1x2<br>ol Ss<br>:<br>125 INTERFACE R233R133 JP1an=<br>R533 i=<br>R4 33, aah3<br>Receive frame synchronization RFSO 1 Apr2 ~ Q<br>Transmit frameSerialsynchronizationSerialdata receiveclock TOROSCLK' 175" 2‘ ;7 OS<br>Serial data transmit —bT0 1" An 2 BiG<br>=a<br>**----- End of picture text -----**<br>


ee DS60001403F-Page 42 Advanced © 2017-2020 Microchip Technology Inc. 

## 6.0 PRINTED ANTENNA INFORMATION 

## 6.1 Antenna Radiation Pattem 

The BM62/64 module is integrated with one PCB printed antenna, see Figure 6-1. 

**==> picture [342 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIGURE 6-1: RECOMMENDED KEEPOUT AREA FOR PCB ANTENNA<br>**----- End of picture text -----**<br>


**==> picture [419 x 279] intentionally omitted <==**

**----- Start of picture text -----**<br>
ha<br>Z<br>1~5: Keep out of metal >15mm<br>© :<br>Xx<br>f ” Si~<br>**----- End of picture text -----**<br>


© 2017-2020 Microchip Technology Inc. 

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## serene 

Figure 6-2 illustrates the 3D radiation pattern of the PCB printed antenna at 2441 MHZ. 

FIGURE 6-2: PCB ANTENNA 3D RADIATION PATTERN AT 2441 MHz 

**==> picture [428 x 261] intentionally omitted <==**

**----- Start of picture text -----**<br>
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Table 6-1 provides the PCB Antenna characteristics of the BM62/64 module. 

noise reduction. For the best range performance, keep all external metal at least 15 mm away from the on-board PCB trace antenna. 

TABLE 6-1: BM62/64 PCB ANTENNA CHARACTERISTICS 

|2400|MHz to 2480 MHz|
|---|---|
||73.41%|



## 6.2 Module Placement Guidelines 

For a Bluetooth-enabled product, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it must not be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB must not contain copper on the top, inner, or bottom layers, as illustrated in Figure 6-1. 

A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommendation, as required for the main PCB EMC 

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Figure 6-3 and Figure 6-4 illustrate the examples of good and poor placement of the BM62/64 module on a host board with GND plane. 

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**----- Start of picture text -----**<br>
FIGURE 6-3: MODULE PLACEMENT GUIDELINES<br>;<br>ii<br>**----- End of picture text -----**<br>


FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD 

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**----- Start of picture text -----**<br>
Keep-out area<br>No copper<br>No component<br>No PCB area<br>Cock Nene Module i<br>uy 16 mm Antenna area<br>oe<br>= x = “? = 1<br>= atl<br>I—<br>==<br>==<br>==<br>Lealellelelayalele=)<br>The coordinates please refer to footprint<br>**----- End of picture text -----**<br>


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## ee 

## 7.0 PHYSICAL DIMENSIONS 

Figure 7-1 illustrates the PCB dimension of the BM62 module. 

**==> picture [447 x 449] intentionally omitted <==**

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FIGURE 7-1: BM62 MODULE PCB DIMENSION<br>Top View Side View Bottom View<br>co<br>oo<br>29.0 —_ PCB ANT | _— 29.0<br>28.2. — Ee — 26.2<br>NPTH<br>25.8 —— Y cl —— 25.8<br>23.0 —— Lip & —— 23.0<br>190 ‘immmanimmmma 20.1 —— | <— 1.2mm<br>17.2 —— [A)|4 37 47.9 -— mi YOvGQ) Cc _—— 17.2<br>16.0 —— 16.7: Co) c< —— 16.0<br>14.8 — 1 [< —— 14.8<br>13.6 — _ ct —— 13.6<br>12.4 — 7m ct —— 124<br>44.2.10.0 ———— 0.76mm = )al| [¢[< ——— 11.210.0<br>76 — Tes e 7.6<br>64 —_ 7 € § re 64<br>Ga = 4.2mm = = * é it -<br>4.0 — im ct — 4.<br>‘6s — 7? a-ak alk S—2<br>wn — 08 — HAAHAAAAHA — 90<br>o tTrowWwnoawonmo o o oo o OoOnMnNOCOnwWorst o<br>Ss HNONneaKNER NE RO BOO EeTR 6= a oo 6- S oePTHQREenmocaghCe seme<br>EE<br>Dimensions are in millimeters 2s<br>Tolerances: +t<br>PCB Thickness:+0.06mm =e 7<br>Hi bas 4.2mm<br>Pad Detail<br>Note: PCB dimensions: X: 15.0 mm, Y: 29.0 mm and tolerances: 0.25 mm.<br>**----- End of picture text -----**<br>


ee DS60001403F-Page 46 Advanced © 2017-2020 Microchip Technology Inc. 

## ee 

Figure 7-2 illustrates the PCB dimension of the BM64 module. 

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**----- Start of picture text -----**<br>
FIGURE 7-2: BM64 MODULE PCB DIMENSION<br>Top View Side View Bottom View<br>-2 9a19 +“ Otaero |YN 2HIM<br>o tw - eS > oe owt<br>| || | ran VII te<br>32.0 — — 32.0<br>Widfp NPTH<br><i — LZ — 26.55 26.55 — __— en<br>! 25.45 25.45 shield mounting hole<br>22.0 — (ramanananaranrra}AC(iY 23.1 — AA 1.0mm<br>20.9 — BF 7, 4 — 22.0<br>19.7 ———— 20.9 —— ufn@®Y OY crcr —— 20919.7<br>18.5 — 18.7 — > wy cr — 185<br>17.316.1 ——— 0.7mm = 7_ cxci —— 17.316.1<br>149 — mt — 149<br>13.712.55 —— biseae0  ie [FF] -— pb was cri ——— 13.712.5<br>11.310.14 —— , 1.0 :-—- omOD 47 crcm —— 11.310.1<br>8.9 —— TJ cr — 89<br>77 — 7 E rm — 77<br>65 —— 6.2 — 2 & @46 iC —— 6.5<br>563 -— 5.3 — a @44 rc -— 5.3<br>41 — 0 rm — 41<br>2.917—— T]I 4 b cxct —— 1.729<br>6) —<br>— 08 — shield « ARARAAARAAR — oo<br> TIEIITTT | | AL mountingtrate | OT TTT LTTE |<br>So RArMHeaAne © ™ ©o0 SF MHEAhHRTKAN OC<br>GMD Bh sO “ N OO pe SF ee ae Se o<br>E:<br>Dimensions BE<br>Tolerances: are in millimeters 6 6 4<br>PCB +4 ET<br> Thickness:+0.06mm TH >| o- “<br>EA | 1.0mm<br>Pad Detail<br>Note: PCB dimensions: X: 15.0 mm, Y: 32.0 mm and tolerances: 0.25 mm.<br>**----- End of picture text -----**<br>


ee © 2017-2020 Microchip Technology Inc. Advanced DS60001403F-Page 47 

Figure 7-3 illustrates the recommended PCB footprint of the BM62 module. 

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**----- Start of picture text -----**<br>
FIGURE 7-3: RECOMMENDED BM62 MODULE PCB FOOTPRINT<br>o<br>6v =<br>v Top view +A<br>TN 44.0<br>All metal keepoutXN<br>Ng :<br>29.0<br>23.0<br>0.5mm<br>1.7mm<br>J14816.0 [[ RY‘> CJJ 15.5<br>YP 19.0<br>124 t J<br>oo"4 — [ =gsilkscreenk=* ] — o 26mm<br>| area<br>64 he ok 1.2en<br>3 EK XK KET<br>eo — LJUUUUUUUUS<br>Ss AgggR8298 3<br>4 sj<br>EE<br>g [=]<br>a a<br>Copper Area<br>Note 1: The keep-out area is reserved to keep the RF test point away from GND plane.<br>2: All metal keep-out is used to isolate the PCB antenna.<br>**----- End of picture text -----**<br>


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© 2017-2020 Microchip Technology Inc. 

Figure 7-4 illustrates the recommended PCB footprint of the BM64 module. 

FIGURE 7-4: 

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RECOMMENDED BM64 MODULE PCB FOOTPRINT<br>oe °<br>re*5<br>v<br>Top view A<br>NN 44.0<br>All metal keepout<br>e es<br>$ ‘ ac<br>32.0<br>260 |<br>0.6mm<br>22.0<br>——<br>18.5 [ } 18.0<br>16.1 = J<br>17.3 [ & & | }<br>11.3or —c silkscreen: fk}<br>65 =<br>oo —t p area<br>af c J<br>. ——a<br>+--+ ke OO”<br>3 E<br>5 [&] bt<br>.<br>Copper Area<br>**----- End of picture text -----**<br>


Note 1: The keep-out area is reserved to keep the RF test point away from GND plane. 2: All metal keep-out is used to isolate the PCB antenna. 

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## 8.0 ELECTRICAL CHARACTERISTICS 

This section provides an overview of the BM62/64 Stereo Audio module electrical characteristics. Additional information will be provided in future revisions of this document, as it becomes available. Absolute maximum ratings for the BM62/64 module are listed below. 

Absolute Maximum Ratings 

Ambient temperature Under DIAS... ee cccccccceeseseceessssaceecssseeeescessseecscessseceecessesseeecesssssseceesssseessseseeeeee20°C to +70°C Storage temperature ......... oe cecceeeeeseeecceceeeeeceeeseseseeeeeueseeeaeeeeeseesseieesaaeeeaeceeeeeeceeesesesesssettsseteeseessseeessss40°C to +125°C Voltage on VDD with respect to VSS oo... ccccccccceescncesssseseeeeeeceeeeeeeesssssssssssessseeeseseeeettseeesstesststeeee “O.3V to +3.6V Maximum output current sink by any I/O Pine... cece ececceeeeceenececesece cence ceceee cence seaeeeeeeceeeeeeeeeneeeteeetteteesttteeeeeeeeee12 MA Maximum output current sourced by any I/O Pine... cece ecccccececeesssceeeecesesesecceesseseeeescesseeeeesesseseeeessteteseestteeeeeee12 MA 

Note: Stresses listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 

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BM62/64 

—— 

Table 8-1 through Table 8-9 provide the recommended operating conditions and the electrical specifications of the BM62/64 module. 

|TABLE 8-1:<br>RECOMMENDED OPERATING CONDITION<br>_symbot|<br>Parameter<br>| in“| typ (| Mex | unt_—||
|---|
|Note:<br>The absolute and recommended operating condition tables reflect a typical voltage usage for the device.|
|TABLE 8-2:<br>1/0 AND RESET LEVEL<br>Parameter<br>Swim | ye «|W | ne|
|Vuinputlogclevesiow—S~C~—“‘~*~*~*~“‘“‘~;~‘irY:SC‘OCSC*drTSC“‘“<br>SSC«dzrYSCi TSC C*'<br>Visinputlogiolevelshigh<br>——=S~C~‘“‘~é~idCSC<br>SCT<br>CC(| CY<br>Vor<br>outputlogicievelsiow——=—S~C~—SC—CSC~iTS<br>Sd SS<br>CY<br>Vou<br>outputlogiclevelshigh—=S=~—“~*~“~*~*~‘sYS:~SC*dCSC‘(SSSCdSS<br>OTC C*'<br>ThresholdPoint<br>0<br>eS<br>Threshold Point<br>FThresholdvotage——SSC=dYSC“‘(SCW!O!CY<br>US YO.©<br>— | VI<br>Note:<br>These parameters are characterized, but not tested in manufacturing.|
|TABLE 8-3:<br>BATTERY CHARGER<br>Parameter——SSSSC*«wCSms«SC (|e|
|[Supply currenttochargerony—=S=~“~*~*~*~“‘—‘—‘—*~sSCSC*idYSiC|
|Fast Charge Current<br>(ADAP_IN = 5V)|
|vss”<br>| |OT |<br>(ADAP_IN<br>= 4.5V)<br>[TrickleChargeVoltageThreshold=|<br>| S| =<br>a —<br>ol<br>De<br>(%<br>of Fast Charge Current)<br>Note 1:<br>Headroom = VADAP_IN — VBAT|
|2:<br>When VADAP_IN —VBAT > 2V, the maximum fast charge current is 175 mA for thermal protection.|
|3:<br>Theseparametersarecharacterized,butnottestedinmanufacturing.|



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|TABLE 8-4:<br>LED DRIVER|
|---|
|parameter<br>| min | typ | Max | nit<br>fOpen-crainVotage—SSCSC“—~—rCSCSSCSdGCSC<br>‘CY TO<br>[Programmable<br>CurentRange—=S~=~—~—~—~s~sYSCSCYSSCSC*dY~C*<br>Ym<br>[intensity Control<br>——SSCSC~“~‘“~*“‘“~*S*S*~é~sSC‘<br>SC*SSC‘“‘CGS™~~*«dTSO—~*(CstOD<br>[cunentStep<br>SSSSC~—SCSCSsS<br>SYSi<br>Cd| **d**m<br>[PowerDown OpenrainCurent ———SS=~=~“~*‘“*é*dCSCSSC*i SC“‘éS<br>SY<br>7]~—<dY~S_<br>[Shutdown Curent<br>——SSSCSC~—~sSCSCS<br>SY SC CdSd!<br>Note 1:<br>Test condition: BK_OUT = 1.8V with +25°C temperature.|
|2:<br>These parameters are characterized, but not tested in manufacturing.|
|TABLE 8-5:<br>AUDIO CODEC ANALOG TO DIGITAL CONVERTER|
|[_____Parameter(Conditon) ___————=«sMin~(| yp —«;SCMax=<=n<br>Reson<br>SCSC—C—CSSCSsSC<br>CdS Sh<br>fOutputSampleRate——SCSC~—“~*~*~“‘“‘~;*~*drYSC‘SC*dYSC*é‘“SC*dTCSC‘<br>Ce CY<br>feumsraestmemes)<br>(SNR at MIC or Line-in mode)<br>DitslGanSCSC*~“‘*‘“*~*~*~*~‘~‘~SCSSC‘“*S*SC“‘“‘(RSCS*d;SC(C<br>SL<br>[DigitalGain<br>Rescion—=S~=~“‘*~*~*=‘“‘“‘“~*S*SCCSC‘“S“‘wHSCSS™CSCN<br>~'YT|=SCC'<br>fwicBoostGain—SSSCSCS~<“—*~*~*~‘“‘—‘—‘“‘“‘~;~;S*rSSCdY<br>Si TS Cd!<br>jAnaiogGain<br>SSSCSC~“—~sS*~—~—~—“‘“‘—‘“‘~;~;*~*~CCSSCdY<br>SC SCC]!<br>[Analog Gain<br>Resoliion——=S~C~C“C~sYSSCdYsSCid|SCC*‘dYC=C(i<br>inputfull-scale at maximum gain(iferentia)<br>———=«|=~<br>—*(| SA<br>Sd|S|sme |<br>Tnput full-scale atminimum gain afferenta)<br>‘|_— | 600_| — | mvirms_<br>sdBbandwth SS<br>SSSCSC~“—~*~*é*srSCSSC‘“SC“‘<br>OCT (iC CY<br>[Microphonem**o**de(nputimpedance) ——SSCSC~sSCi‘CSiS]S|<br>[THON (mior phone input) at 30mVimsimput_——+d|_——<br>| 002 | — | % |<br>Note 1:<br>fin= 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 1%, 150 mVpp input.|
|2:<br>Theseparametersarecharacterized,butnottestedinmanufacturing.|



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BM62/64 

## —— 

## TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER 

| ___ Parameter (Condition) |i, =| typ, | Max. | unit_| fOversampingrateSSCSC~—“—~*sé~*sSCSCd(YSC(‘ OCT oO | OY SO [OutputSampleRate seeat capless mode) for 48 kHz (SNR | T= (SNR at single-ended mode) for 48 kHz psarseeett—SC<“‘*‘“*S*S*~*~é~*YSC‘te | | = [= |e Dit Gain Resouon—=S=~=“‘;CS;™!™!COCOCOC~*SC‘“S*S“C‘éYSCdYCC' [Digital Gain STS TSC~«dSC‘ ST AndogGanSSCS~=<“~*~—~—*—‘—‘—*—*—‘—s—‘—‘—sSC‘“‘—~‘~*é‘dTS Resohiion———S~S~C~—S—‘“‘—~S~*~C—S~é~iTSSSdY [Analog[Output GainVoltage Fullscale Swing(AVOD=28V)_——=«|~—a8S~—«;S~SCLSSTCSCd **C** raS! (16Ohmload)———SSS~idCSC [Maximum Output Power | —*:Cmviims | Ohmload)———=S~—~—tY [Maximum Output Power (2 SSCS«dT SC]YS|«dC ————————— THD+N (16 Ohmioad (Note2) Capacive|| —|[| os— [500| | pF [Signal-to-Noise Ratio (SNR at 16 Ohmicad) (Notes) | = — | ss | | Note 1: fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 0.01%, 0 dBFS signal, Load = 100 kOhm 2: fin= 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, -1 dBFS signal, Load =16 Ohm 3: fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 0.05%, 0 dBFS signal, Load = 16 Ohm 4: These parameters are characterized, but not tested in manufacturing. TABLE 8-7: TRANSMITTER SECTION FOR BDR AND EDR ee ee eee ee vansmitpower—=S=~=~wS=C JEDRIBDRNote 1: RelatveThe RF Tx power is modulation value. S| S| tT CTY 

- 2: The RF Transmit power is calibrated during the production by using the MP tool software and MT8852 Bluetooth test equipment. 

- 3: Test condition: VCC_RF = 1.28V, temperature +25°C. 

SS © 2017-2020 Microchip Technology Inc. Advanced DS60001403F-Page 53 

BM62/64 — TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR | [Sensiiviyat te GER | testerFSR [|— |e]om | ome=| |#70 **|** aim a ee Note 1: Test condition: VCC_RF = 1.28V with temperature +25°C. 2: These parameters are characterized, but not tested in manufacturing. 

TABLE 8-9: BM62 SYSTEM CURRENT CONSUMPTION CS Systemstaus Tomo CY SystemOfmede |u| StandbymodeTs sm linkme | ml l|escolingtat tm agp ms Standbymode| s **t** inkmode Tm tz scotnk | Tm ta AgPling ms Note 1: The measurement data corresponds to Firmware v1.0. | = mf 2: Mode definition: Standby mode: Power-on without Bluetooth link; 

   - Link mode: With Bluetooth link in Low-power mode. 

- 3: The current consumption values are measured with the BM62 EVB as test platform, with BAT_IN = 3.8V. The distance between the smartphone and BM62 EVB is 30 cm, and the speaker is without loading. 

TABLE 8-10: BM64SPKS1MC2 EMBEDDED MODE (WITHOUT EXTERNAL MCU) SYSTEM CURRENT CONSUMPTION SeemPs Ofmede Modersystem status ————=SSSS~«dYSCe|e, umit Standbymodeow tm Pairingmode | Tm luinkmodeiscooT= Tm ts agp SSSCSC~C~—SCSsSSSCSdSC tw Note 1: The current consumption values are measured with the BM64 EVB (in standalone|mode withoutmfMCU) as test platform, with BAT_IN = 3.8V. The distance between the smartphone and BM64 EVB is 30 cm, and the speaker is without loading. 

- 2: The measurement data corresponds to Firmware package: BM64 Software & Tools (DSPK v2.1), which is available in https://www.microchip.com/wwwproducts/en/BM64. 

- 3: LED and Bluetooth Low Energy advertising is turned off in Ul setting. 

- 4: iPhone6+, iOS 11.4. 

SS DS60001403F-Page 54 Advanced © 2017-2020 Microchip Technology Inc. 

## samme| 

## TABLE 8-11: BM64SPKS1MC2 HOST MCU MODE SYSTEM CURRENT CONSUMPTION 

**==> picture [457 x 116] intentionally omitted <==**

**----- Start of picture text -----**<br>
Mode/System Status Typ. | Max. | Unit |<br>[System-OffmodeSCSC~—“—~S*~*~*~S~SCSYSC‘ KPCiYYS<br>Standby mode ee<br>8<br>Pairingmode ee ee<br>SSC—C—sSCSsSCSCSsSS<br>linkme ts maTm<br>SCO link | tes | — | om<br>ADP link | 7s | = | im _|<br>**----- End of picture text -----**<br>


- Note 1: The current consumption values are measured with the BM64 EVB (with MCU: PIC18F85J10) as test platform, with BAT_IN = 3.3V. The distance between the smartphone and BM64 EVB is 30 cm, and the speaker is without loading. 

   - 2: Audio: I2S Digital Audio output to External Codec Yamaha YDA174. 

   - 3: The measurement data corresponds to Firmware package: BM64 Software & Tools (DSPK v2.1), which is available in https://www.microchip.com/wwwproducts/en/BM64. 

   - 4: Bluetooth Low Energy advertising is turned off. 

## 8.1 Timing specifications 

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Figure 8-1 and Figure 8-2 illustrate the timing diagram .<br>of the BM62/64 module in IS and PCM modes.<br>FIGURE 8-1: TIMING DIAGRAM FOR I?S MODES (MASTER/SLAVE)<br>saxo UU< SUtif, Moun><br>a Left channel Right channel<br>DRO/DTO BrBn2 B:| Bo Bu Bn2 B:| Bs<br><—— Word length ——»<br>**----- End of picture text -----**<br>


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serene<br>FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE)<br>3 1S —————_—_____________><br>sexo!UU UU Le SU UU UU UU $k<br>RFSO 7 I ><br><— Left channel ria Right channel ——><br>DRO/DTO Bna|Bn.2 By | By [By-s|Bn-2 B, B, |<br><— Word length - ><br>Note 1: f,: 8,16, 32, 44.1, 48, 88.2 and 96 kHz.<br>2: SCLKO: 64*f,/256*f,.<br>3: Word Length: 16-bit and 24-bit.<br>**----- End of picture text -----**<br>


Figure 8-3 illustrates the timing diagram of the audio interface. 

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FIGURE 8-3: AUDIO INTERFACE TIMING DIAGRAM<br>tscikcH tsciKcL<br>SCLKO at |<br>RFSO a<br>DRO CT ——e<br>**----- End of picture text -----**<br>


Table 8-12 provides the timing specifications of the audio interface. 

TABLE 8-12: AUDIO INTERFACE TIMING SPECIFICATIONS 

SCLKO duty ratio Pdsox | — | so | — | % | Note: Test Conditions: Slave mode, f, = 48 kHz, 24-bit data and SLKO period = 256 f.. 

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NOTES: 

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## serene 

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9.0 SOLDERING<br>RECOMMENDATIONS<br>**----- End of picture text -----**<br>


The BM62/64 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM62/64 module can be soldered to the main PCB using standard leaded and lead-free solder reflow profiles. ie avold thedamage tothe modile.ddllew tieserepommendations: ¢ Refer to Microchip Technology Application Note ‘AN233 Solder Reflow Recommendation” (DS00233) for the soldering reflow recommendations. 

- Do not exceed peak temperature (Tp) of +260°C. 

- * Refer to the “Solder Paste” data sheet for specific reflow profile recommendations. 

- ¢ Use no-clean flux solder paste. ¢ Do not wash the module, as moisture can be trapped under the shield. 

- + Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. 

- Figure 9-1 illustrates the reflow profile of the BM62/64 raoallile 

FIGURE 9-1: REFLOW PROFILE 

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Peak: +260°C (+5/0°C tolerance)<br>Slope:<br>+1 to +2°C/sec max.<br>(+217°C to peak) frre<br>Ps % ‘ Ramp down rate:<br># \ +3°C/sec max.<br>Preheat : +150 to +200°C= \<br>/ 20 to 40 sec \<br>+25°C / 60 to 180 sec 60 to 150 sec<br>Time (sec)<br>**----- End of picture text -----**<br>


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## 10.0 ORDERING INFORMATION 

Table 10-1 provides ordering information for the BM62/64 module. 

TABLE 10-1: BM62/64 MODULE ORDERING INFORMATION 

|BM62|||IS2062GM|||Bluetooth 5.0 StereoAudiomodule, | Yes|Bluetooth 5.0 StereoAudiomodule, | Yes||FCC,ISED,CE,MIC,KCC,||BM62SPKS1MC2|
|---|---|---|---|---|---|---|---|
|||||Class 2 with RF shield||NCC, SRRC||
|BM62|||IS2062GM|||Bluetooth 5.0 StereoAudiomodule,|No||CE|BM62SPKA1MC2|
|||||Class 2 without RF shield||||
|BM64|||IS2064GM|||Bluetooth 5.0 StereoAudiomodule, | Yes|||FCC,ISED,CE,MIC,KCC,||BM64SPKS1MC2|
|||||Class 2 with RF shield||NCC, SRRC, ANATEL||
|BM64|||IS2064GM|||Bluetooth 5.0 StereoAudiomodule,|No||CE|BM64SPKA1MC2|
|||||Class 2 without RF shield||||
|BM64|||IS2064GM|||Bluetooth 5.0 StereoAudiomodule, | Yes|||FCC,ISED,CE,MIC,KCC,||BM64SPKS1MC1|
|||||Class 1 with RF shield||NCC, SRRC, ANATEL||
|BM64|||IS2064GM|||Bluetooth 5.0 StereoAudiomodule,|No||CE|BM64SPKA1MC1|
|||||Class1withoutRFshield||||



Note: The BM62/64 module can be purchased through a Microchip representative. Visit www.microchip.com for the current pricing anda list of distributors for the product. 

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## serene 

APPENDIX A: CERTIFICATION * Japan NOTICES * Korea * Taiwan The BM62 module (BM62SPKS1MC2) has received « (has regulatory approval for the following countries: ¢ BrazilBrazi ° mien sheeon ¢ Other Regulatory Jurisdictions « United States/FCC ID: ASTBM62S2 * Canada/ISED A.1.1 UNITED STATES - IC: 12246A-BM62S2 The BM62/BM64C1/BM64C2 Stereo Audio module has - HVIN: BM62SPKS1MC2 received Federal Communications Commission (FCC) * Europe/CE CFR47 Telecommunications, Part 15 Subpart C “Inten+ Japan/MIC: 005-101204 tional Radiators” single-modular approval in accor» Korea/KCC: MSIP-CRM-mep-BM62SPKS1MC2 dance with Part 15.212 Modular Transmitter approval. . Single-modular transmitter approval is defined as a * Taiwan/NCC No: CCAN16LP0270T5 complete RF transmission sub-assembly, designed to * China/SRRC: CMIIT ID: 2016DJ2656 be incorporated into another device, that must The BM64C1 (Class 1) module (BM64SPKS1MC1) demonstrate compliance with FCC rules and policies has received regulatory approval for the following independent of any host. countries: grant can be installed inA transmitterdifferent end-usewith a modularproducts . Bil SUSHI:; 110159 the(referred granteeto oras othera host, equipmenthost product,manufacturer,or host device)then theby * United States/FCC ID: ASTBM64S1 host product may not require additional testing or * Canada/ISED equipment authorization for the transmitter function - IC: 12246A-BM648S1 provided by that specific module or limited module - HVIN: BM64SPKS1MC1 device. * Europe/CE The user must comply with all of the instructions pro+ Japan/MIC: 005-101206 vided by the Grantee, which indicate installation and/or » Korea/KCC: MSIP-CRM-mep-BM64SPKS1MC1 operating conditions necessary for compliance. . ae No: CCAN16LP0300T1 The host product itself is required to comply with all other . ChinaeRAC:. nentGMAIL:. ZOMG HERES applicablerequirementsFCCandequipmentequipmentauthorizationsfunctions thatregulations,are not * Brazil/ANATEL: 05784-19-08759 associated with the transmitter module portion. For The BM64C2 (Class 2) module (BM64SPKS1MC2) example, compliance must be demonstrated:to regulahas received regulatory approval for the following tions for other transmitter components within a host countries: product; to requirements for unintentional radiators * BT SIG/QDID:: 110148 (Part 15 Subpart B), such as digital devices, computer » United. States/FCC ID:; ASTBM64S2 authorizationperipherals, radiorequirementsreceivers, for theetc.; non-transmitterand to additional func* Canada/ISED tions on the transmitter module (i.e., Verification, or - IC: 12246A-BM64S2 Declaration of Conformity) as appropriate (e.g., BlueHVIN: BM64SPKS1MC2 tooth and Wi-Fi transmitter modules may also contain + Europe/CE digital logic functions). * HapaniiaNe: OBS 10205 A.1.2 LABELING AND USER *« Korea/KCC: MSIP-CRM-mcp-BM64SPKS1MC2 INFORMATION REQUIREMENTS * Eee Fle CAAEE PRES O The BM62/BM64C1/BM64C2 Stereo Audio module has * China/SRRC: CMIIT ID: 2016DJ2356 been labeled with its own FCC ID number, and if the ¢ Brazil/ANATEL: 03822-18-08759 FCC ID is not visible when the module is installed inside another device, then the outside of the finished product A.1 REGULATORY APPROVAL into which the module is installed must also display a . ; ; ; : This label referring to the enclosed module. This exterior section outlines the regulatory information of the label can use wording as follows: BM62/BM64C1/BM64C2 Stereo Audio modules for the following countries: « United States * Canada ¢ Europe ener reereee eee eee eee DS60001403F-Page 5 Advanced © 2017-2020 Microchip Technology Inc. 

samme| For the BM62: A.user’s manual for the product must include the followContains Transmitter Module FCC ID: A8TBM62S2 npSeECMene or This equipment has been tested and found to comply Contains with the limits for a Class B digital device, pursuant to FCC ID: A8STBM62S2 part 15 of the FCC Rules. These limits are designed This device complies with Part 15 of the FCC to provide reasonable protection against harmful Rules. Operation is subject to the following two interference in a residential installation. This equipconditions: (1) this device may not cause harmful ment generates, uses and can radiate radio freinterference, and (2) this device must accept any quency energy, and if not installed and used in interference received, including interference that accordance with the instructions, may cause harmful may cause undesired operation interference to radio communications. However, For there is no guarantee that interference will not occur the BM64C1: in a particular installation. If this equipment does Contains Transmitter Module FCC ID: ASTBM6481 cause harmful interference to radio or television al reception, which can be determined by turning the equipment off and on, the user is encouraged to try to Contains FCC ID: A8TBM64S1 correct the interference by one or more of the followThis device complies with Part 15 of the FCC Ingimeasures: Rules. Operation is subject to the following two * Reorient or relocate the receiving antenna conditions: (1) this device may not cause harmful - Increase the separation between the equipment interference, and (2) this device must accept any and receiver interference received, including interference that aed ties eral tint tlet ircuit ina . : quipment into an outlet on a circui Ganse Bee Siee Ope renen different from that to which the receiver is conFor the BM64C2: nected Contains Transmitter Module FCC ID: A8TBM64S2 » Consult the dealer or an expenianped radiosTV technician for help ° . Contains Additional information on labeling and user information FCC ID: A8TBM64S2 requirements for Part 15 devices can be found in KDB This device complies with Part 15 of the FCC Publication 784748, which is available at the FCC Rules. Operation is subject to the following two Office of Engineering and Technology (OET) Laboraconditions: (1) this device may not cause harmful tory Division Knowledge Database (KDB) interference, and (2) this device must accept any https://apps.fcc.gov/oetcf/kdb/index.cfm interference received, including interference that may cause undesired operation A.1.3 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). 

From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. 

BM62 and BM64C2: These modules are approved for installation into mobile or/and portable host platforms. BM64C1:The installation of the transmitter must ensure that the antenna has a separation distance of at least 30 mm from all persons or compliance, and it must be demonstrated according to the FCC SAR procedures. 

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serene A.1.4 HELPFUL WEB SITES tus shall contain the following or equivalent notice in a Federal Communications Commission (FCC): conspicuous location in the user manual or alternahitbeet!ps://www.fcc.gov.fi / tively on the device or both: FCC Office of Engineering and Technology (OET) LabThis device complies with Industry Canada’s oratory Division Knowledge Database (KDB): license-exempt RSS standard(s). Operation is https://apps.fcc.gov/oetcf/kdb/index.cfm subject to the following two conditions: (1) This device may not cause interference, and A.2 Canada (2) This device must accept any interference, The BM62/BM64C1/BM64C2 Stereo Audio module including interference that may cause undesired has been certified for use in Canada under Innovation, operation of the device. Science and Economic Development Canada (ISED, Le présent appareil est conforme aux CNR formerly Industry Canada) Radio Standards Procedure d'Industrie Canada applicables aux appareils (RSP) RSP-100, Radio Standards Specification (RSS) radio exempts de licence. L'exploitation est RSS-Gen and RSS-247. Modular approval permits the autorisée aux deux conditions suivantes: installation of a module in a host device without the (4) l'appareil ne doit pas produire de brouillage, et need to recertify the device. (2) l'utilisateur de l'appareil doit accepter tout A.2.1 LABELING AND USER brouillage radioélectrique subi, méme si le brouilINFORMATION REQUIREMENTS lage est susceptible d'en compromettre le fonctionnement. 

Labeling. Requirements: (from RSP-100, Issue 11, Section 3): The host product shall be properly labeled to identify the module within the host device. 

The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product, otherwise the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains”, or similar word expressing the same meaning, as follows: For the BM62: 

For the BM64C1: 

: , : 

For the BM64C2: 

User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio appara- 

Guidelines on Transmitter Antenna for License Exempt Radio Apparatus: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain must be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformément a la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour I'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique a I'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire a I'établissement d'une communication satisfaisante. 

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samme| A.2.2 RF EXPOSURE and non-radio equipment’ document available at All transmitters regulated by the Innovation, Science a eee and Economic Development Canada (ISED) must icihiileii i iia comply with RF exposure requirements listed in Note: To maintain conformance to the testing RSS-102 - Radio Frequency (RF) Exposure Complilisted in Table A-1/Table A-2/Table A-3, ance of Radio communication Apparatus (All Frethe module shall be installed in accorquency Bands). dance with the installation instructions in This transmitter is restricted for use with a specific this data sheet and shall not be modified. antenna tested in this application for certification, and When integrating a radio module into a must not be co-located or operating in conjunction with completed product the integrator any other antenna or transmitters, except in becomes the manufacturer of the final accordance with Innovation, Science and Economic product and is therefore responsiblefor Development Canada multi-transmitter guidelines. demonstrating compliance of the final ; BM62 . product with the essential requirements power andlevel BM64C2:which is withinThe devicethe ISED operatesSAR attest anexemp- output against the RED. BM64C1:The installation of the transmitter must ensure INFORMATION REQUIREMENTS ace ncaa ai sai se oto The label on the final product which contains the strated accordinghal to the ISED SARe procedures. BM62/BM64C1/BM64C2: : Stereo Audio module must follow CE marking requirements. 

A.2.3 HELPFUL WEBSITES Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/ 

## A.3. Europe 

The BM62/BM64C1/BM64C2 Stereo Audio module is an Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. 

The BM62/BM64C1/BM64C2 Stereo Audio module has been tested to RED 2014/53/EU Essential Requirements for Health and Safety (Article (3.1(a)), Electro Magnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table A-1/Table A-2/Table A-3. 

The ETSI provides guidance on modular devices in “Guide to the application of harmonised standards covering Article 3.1(b) and Article 3.2 of the Directive 2014/53/EU RED to multi-radio and combined radio 

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|TABLE A-1:|EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2)|EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2)|EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2)|EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2)|EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2)|
|---|---|---|---|---|---|
|Certification|Standards||Laboratory||ReportNumber | Date |||
|Safety|EN 60950-1:2006+A11:2009+A1:| [3.1(a)]|||TUV,|10055923 001|2016-04-20|
||2010+A12:2011+A2:2013||Rheinland,|||
|Health|EN 300 328 V1.9.1||Taiwan|10055775 001|2016-05-05|
||EN 62479:2010|||(BDR/EDR)||
|||||10055772 001(BLE)||
|EMC|EN 301 489-1 V1.9.2|[3.1(b)]||10055205 001|2016-05-19|
||EN 301 489-17 V2.2.1|||(BM62SPKS1MC2)||
|||||10055207 001||
|||||(BM62SPKA1MC2)||
||EN 301 489-1 V2.1.1|||10055205 002|2017-05-26|
||EN 301 489-1 V2.2.0|||(BM62SPKS1MC2)||
||EN 301 489-17 V3.1.1|||10055207 002||
||EN 301 489-17 V3.2.0|||(BM62SPKA1MC2)||
|Radio|EN 300 328 V1.9.1|(3.2)||10055775 001|2016-05-05|
|||||(BDR/EDR)||
|||||10055772 001||
|||||(BLE)||
||EN 300 328 V2.1.1|||10055775 002|2017-05-26|
|||||(BDR/EDR)||
|||||10055772 002||
|||||(BLE)||
|TABLE A-2:|EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC1/BM64SPKA1MC1)|||||
|Certification|Standards||Laboratory|| ReportNumber | Date |||
|Safety|EN 60950-1:2006+A11:2009+|[3.1(a)]||TUV,|10055924 001|2016-04-20|
||A1:2010+A12:2011+A2:2013||Rheinland,|||
|Health|EN 300 328 V1.9.1||Taiwan|50041199 001|2016-07-05|
||EN 62479:2010|||(BDR/EDR)||
|||||50041198 001||
|||||(BLE)||
||EN 300 328 V2.1.1|||50041199 002|2017-05-26|
||EN 62311|||(BDR/EDR)||
|EMC|EN 301 489-1 V1.9.2|[3.1(b)]||10055194 001|2016-05-19|
||EN 301 489-17 V2.2.1|||(Shield)||
|||||10055196 001||
|||||(No shield)||
||EN 301 489-1 V2.1.1|||10055194 002|2017-05-26|
||EN 301 489-1 V2.2.0|||(Shield)||
||EN 301 489-17 V3.1.1|||10055196 002||
||EN 301 489-17 V3.2.0|||(No shield)||
|Radio|EN 300 328 V1.9.1|(3.2)||50041199 001|2016-07-05|
|||||(BDR/EDR)||
|||||50041198 001||
|||||(BLE)||
||EN 300 328 V2.1.1|||50041199 002|2017-05-26|
|||||(BDR/EDR)||
|||||50041198 002||
|||||(BLE)||



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samme|<br>TABLE A-3: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC2/BM64SPKA1MC2)<br>Certification Standards Laboratory| Report Number | Date |<br>Safety EN 60950-1:2006+A11:2009+A1: |[3.1(a)] |TUV, 10055925 001 2016-04-20<br>2010+A12:2011+A2:2013 Rheinland,<br>Health EN 300 328 V1.9.1 Taiwan 10055788 001 2016-04-29<br>EN 62479:2010 (BDR/EDR)<br>10055787 001<br>(BLE)<br>EMC EN 301 489-1 V1.9.2 [3.1(b)] 10055200 001 2016-05-19<br>EN 301 489-17 V2.2.1 (Shield)<br>10055202 001<br>(No shield)<br>EN 301 489-1 V2.1.1 10055202 002 2017-05-26<br>EN 301 489-1 V2.2.0 (No shield)<br>EN 301 489-17 V3.1.1 10055200 002<br>EN 301 489-17 V3.2.0 (Shield)<br>Radio EN 300 328 V1.9.1 (3.2) 10055788 001 2016-04-29<br>(BDR/EDR)<br>10055787 001<br>(BLE)<br>EN 300 328 V2.1.1 10055788 002 2017-05-26<br>(BDR/EDR)<br>10055787 002<br>(BLE)<br>**----- End of picture text -----**<br>


A.3.2 CONFORMITY ASSESSMENT A.3.4 HELPFUL WEBSITES From ETSI Guidance Note EG 203367, section 6.1 A document that can be used as a starting point in Non-radio products are combined with a radio product: understanding the use of Short Range Devices (SRD) If the manufacturer of the combined equipment installs in Europe is the European Radio Communications the radio product in a host non-radio product in equivaCommittee (ERC) Recommendation 70-03 E, which lent assessment conditions (i.e. host equivalent to the can be downloaded ipomnt fire Earepean Communica - one used for the assessment of the radio product) and tions Committee (ECC) at: http:/www.ecodocdb.dk/ according to the installation instructions for the radio Additional helpful web sites are: product, then no additional assessment of the com+ Radio Equipment Directive (2014/53/EU): bined equipment against article 3.2 of the RED is https://ec.europa.eu/growth/single-market/euro - required. pean-standards/harmonised-standards/red_en The European Compliance Testing listed in Table A-1, ° European Conference of Postal Postal and TelecommuTable A-2 and Table A-3 was performed using the Intenications Administrations (CEPT): gral PCB antenna http:/www.cept.org A33 SIMPLIFIED EU DECLARATION OF tute (ETSI): http://www.etsi.org CONFORMITY * European Telecommunications Telecommunications Standards Insti- 

product, then no additional assessment of the com+ Radio Equipment Directive (2014/53/EU): bined equipment against article 3.2 of the RED is https://ec.europa.eu/growth/single-market/euro - required. pean-standards/harmonised-standards/red_en The European Compliance Testing listed in Table A-1, ° European Conference of Postal Postal and TelecommuTable A-2 and Table A-3 was performed using the Intenications Administrations (CEPT): gral PCB antenna http:/www.cept.org A33 SIMPLIFIED EU DECLARATION OF tute (ETSI): http://www.etsi.org CONFORMITY * European Telecommunications Telecommunications Standards Insti¢ The Radio Equipment Directive Compliance Hereby, Microchip Technology Inc. declares that the Association (REDCA): http://www.redca.eu/ radio equipment type BM62/BM64C1/BM64C2 is in compliance with Directive 2014/53/EU. AA Japan The full text of the EU declaration of conformity, for this The BM62/BM64C1/BM64C2 Stereo Audio module produat, is avallable al: ; : has received type certification and is labeled with its http://www.microchip.com/design-centers/wireless-con own technical conformity mark and certification number nectivity as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. eee reer eerence eee eee eeeeee © 2017-2020 Microchip Technology Inc. Advanced DS60001403F-Page 10 

serene Integration of this module into a final product does not not be displayed on the module label. The final product require additional radio certification provided installain which this module is being used must have a label tion instructions are followed and no modifications of referring to the type certified module inside: the module are allowed. Additional testing may be required: ¢ If the host product is subject to electrical appliance safety (for example, powered from an AC = 005- 1 0 1 205 mains), the host product may require Product = Safety Electrical Appliance and Material (PSE) testing. The integrator must contact their conformance laboratory to determine if this testing is A42 HELPFUL WEB SITES required _ — ¢ There is an voluntary Electromagnetic Compatibilseller a naka sical irae alma pee ity (EMC) test for the host product administered pa WW Lele Soumu:go: |p eungex un by VCCI: http://Awww.vcci.jp/vcci_e/index.html Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ A.4.1 LABELING AND USER INFORMATION REQUIREMENTS A.5 Korea The label on the final product which contains the The BM62/BM64C1/BM64C2 Stereo Audio module BM62/BM64C1/BM64C2 Stereo Audio module cart has received certification of conformity in accordance follow Japan marking he quire MEE: The integearan of with the Radio Waves Act. Integration of this module the module must refer to the labeling nequirements for into a final product does not require additional radio een Se te oat of Intensal riffaine and certification provided installation instructions are folAMT canenS PME Bet: lowed and no modifications of the module are allowed. For the BM62 Stereo Audio module, due to a limited module size, the technical conformity logo and ID is A.5.1 LABELING AND USER displayed in the data sheet and/or packaging and canINFORMATION REQUIREMENTS not be displayed on the module label. The final product The label on the final product which contains the in which this module is being used must have a label BM62/BM64C1/BM64C2 Stereo Audio module must heterring teinedypercerined meeule ifsicie: follow KC marking requirements. The integrator of the module must refer to the labeling requirements for Korea available on the Korea Communications Com— ~ The BM62 Stereo Audio module is labeled with its own = KC mark. The final product requires the KC mark and certificate number of the module: For the BM64C1 Stereo Audio module, due to limited displayedmodule size,in thethe datatechnical sheet and/orconformity packaginglogo andand can-ID is Cisip-crm-mcp-BM62SPKS1 Mc2 not be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside: The BM64C1 Stereo Audio module is labeled with its own KC mark. The final product requires the KC mark aie [RJoos- 01206 and certificate number of the module: —— Cusip-crm-mcp-BM64SPKS1MC1 For the BM64C2 Stereo Audio module, due to limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and can- 

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The BM64C2 Stereo Audio module is labeled with its For the BM64C2 Stereo Audio module, due to limited own KC mark. The final product requires the KC mark module size, the NCC Mark and ID is displayed in the and certificate number of the module: data sheet and/or packaging and cannot be displayed | on the module label. GEvecninsoansanc (coan 6LP0280T8 A.5.2 HELPFUL WEB SITES Korea Communications Commission (KCC): The user's manual must contain below warning (for RF http://www.kcc.go.kr device) in traditional Chinese: National Radio Research Agency (RRA): 3S | http://rra.go.kee Hie (ETD EE serABS SES 2 ok‘ A6 Taiwan Stok CPABBARZLEWSHAEM, Jet Fy, The BM62/BM64C1/BM64C2 Stereo Audio module . thehas receivedTelecommunicationscompliance approvalAct. Customersin accordanceseeking withto CeANF aiaePe a 4) AN 48 EB ES Se MADERTha use the compliance approval in their product must conZIFtTE RDB. tact Microchip Technology sales or distribution partners S+OE SW SHRERZHERATSELARMZER to obtain a Letter of Authority. FSi :; requireIntegrationadditionalof this moduleradio certificationinto a final providedproduct doesinstalla-not MIsiBASE.AT HBIRS, EA, rks Seree tion instructions are followed and no modifications of ai ze _—— —— the module are allowed. AAA AH, fatk BERETS CRB ELE. WSN A SRAR LE ALR. PSRERA A.6.1 LABELING AND USER Bee stte INFORMATION REQUIREMENTS SHEL TE. For the BM62 Stereo Audio module, due to limited module size, the NCC mark and ID are displayed in the A6.2 HELPFUL WEB SITES data sheet and/or packaging and cannot be displayed National Communications Commission (NCC): on the module label. http:/Avww.ncc.gov.tw A.7 ~~ China CCAN16LP0270T5 The BM62/BM64C1/BM64C2 Stereo Audio module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. For the BM64C1 Stereo Audio module, due to limited Integration of this module into a final product does not module size, the NCC Mark and ID are displayed in the require additional radio certification, provided installadata sheet and/or packaging and cannot be displayed tion instructions are followed and no modifications of on the module label. the module are allowed. 

CCAN16LP03007T1 

A.7.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 Stereo Audio module is labeled with its own CMIIT ID as follows: 

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2016DJ2656”. 

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## serene 

The BM64C1 Stereo Audio module is labeled with its own CMIIT ID as follows: 

## CMIIT ID: 201 6DJ2453 

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2016DJ2453”. The BM64C2 Stereo Audio module is labeled with its eva OMIT IG as follows: 

## CMIIT ID: 2016DJ2356 

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2016DJ2356”. 

Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 

A.8.1 LABELING AND USER INFORMATION REQUIREMENTS 7 ane PROBL) sid sae a ee ia one -s acordo com os proceaimentos regulamentados pela Resolucao 242/2000, e atende aos requisitos tecnicos aplicados”. Para maiores informacoes, consulte o site da ANATEL: ccna For Homologation Validity refer to the Certification and Approval Management System - SCH, available on www.anatel.gov.br 

## A.B Brazil 

The BM64SPKS1MC1/BM64SPKS1MC2 Stereo Audio module has_ received compliance approval in accordance with the Telecommunications Act of the Federal Republic of Brazil National Telecommunications Agency (ANATEL). Customers seeking to use the compliance approval in their product must contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. 

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Agéncia Nacional de Telecomunicacées<br>"Este equipamento nao tem direito a protegao contra<br>interferéncia prejudicial e nao pode causar interferéncia<br>em sistemas devidamente autorizados".<br>**----- End of picture text -----**<br>


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## Agéncia Nacional de Telecomunicacées 

"Este equipamento nao tem direito a protegao contra interferéncia prejudicial e nao pode causar interferéncia em sistemas devidamente autorizados". 

The End product (Host) manual must include the AY Other Regulatory Jurisdictions following statement: ; For ¢ For information on the other countries jurisdictions BM64SPKS1MC1: covered, refer to the http://www.microEste producto contém a placa Modelo chip.com/design-centers/wireless-connectivBM64SPKS1MC1 codigo de homologag¢ao ANATEL ity/certifications. 05784-19-08759. ¢ Should other regulatory jurisdiction certification be For BM64SPKS1MC2: required by the customer, or the customer need to recertify the module for other reasons, contact Este producto contém a _ placa Modelo Microchip for the required utilities and documentaBM64SPKS1MC2 cédigo de homologagao ANATEL tion. 03822-18-08759. 

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## serene 

## APPENDIX B: REVISION HISTORY 

## Revision A (May 2016) 

This is the initial released version of this document. 

## Revision B (December 2016) 

This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. 

TABLE B-1: MAJOR SECTION UPDATES 

|“Audio Codec”|Updated thes digital audio applicabilityand SNR details of 20-bit|
|---|---|
||DAC and 16-bit<br>ADC.|
||Updated the certification information.|
|1.0“Device Overview”|Added USB and BLE and updated the Customized voice prompt|
||details in Table 1-1.|
||Updated Figure 1-4 and Table 1-2 with correct pin names for|
||pins 11 and 12.|
||Deleted the ROM details and updated Table 1-2, Table 1-3.|
|2.2“Codec”|Added a note for internal codec support and addition of trailing|
||zeros.|
|5.0“Application Information”|Updated Figure 5-19 and Figure 5-21.|
|8.0“Electrical Characteristics”|Added the storage temperature details.|
|10.0“Ordering Information”|Updated Table 10-1 with regulatory certification information.|
|AppendixA:“CertificationNotices”|AddedCertificationIDsandupdatedassociatedsections.|



## Revision C (October 2017) 

This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. 

TABLE C-1: MAJOR SECTION UPDATES 

|“Compliance”|Added Brazil certification information.|
|---|---|
||Updated Canada certification information.|
|1.0“Device Overview”|Updated Figure 1-1, Figure 1-2, and Figure 1-5.|
||Deleted Figure 1-3 and Figure 1-4.|
||Updated Table 1-1.|
||Updated pin description for pinsADAP_IN, BAT_IN and SYS_PWR|
||in Table 1-2 and Table 1-3.|
|10.0“Ordering Information”|Updated Table 10-1 with Brazil and Canada regulatory certification|
||information.|
|Appendix A:“Certification Notices”|Updated the United States, Canada and Europe certification informa-|
||tion.|
||Updated KDB and ECC URL links.|
||AddedBrazilregulatorycertificationdetails.|



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## samme| 

## Revision D (March 2018) 

This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. 

## TABLE D-1: |MAJOR SECTION UPDATES 

|1.0“Device Overview”|Updated pin type for LED pins in Table 1-2 and Table 1-3|
|---|---|
|4.4“Under Voltage Protection (Software|Updated the section|
|Dependent UVP)”||
|5.0“Application Information”|Added 5.1 “Power Supply”, 5.2.1 “Device FW Upgrade (DFU)”|
||and 5.2.1.1 “Enter BT Module/MCU DFU mode”.|
||Added Figure 5-1, Figure 5-9 and Figure 5-10.|
||Updated Figure 5-4, Figure 5-8, Figure 5-20 and Table 5-1.|
|8.0“ElectricalCharacteristics”|UpdatedTable8-2.|



## Revision E (September 2018) 

This revision includes the following changes, which were incorporated throughout the document. 

## TABLE E-1: MAJOR SECTION UPDATES 

||Updated Bluetooth version 4.2 to 5.0|
|---|---|
|A.8“Brazil”|Updated with the certification forBM64SPKS1MC2 module|
|Figure 5-8|¢<br>Updated with 2.7V information in figure.|
||¢<br>Updatedfigurefootnotes.|



## Revision F (June 2020) 

This revision includes the following changes, which were incorporated throughout the document. 

## TABLE F-1: MAJOR SECTION UPDATES 

|8.0 “Electrical Characteristics”|Added Table 8-10 and Table 8-11.|
|---|---|
|A.8“Brazil”|UpdatedwiththeBM64SPKS1MC1modulecertificationdetails.|



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## serene 

## THE MICROCHIP WEB SITE 

## CUSTOMER SUPPORT 

Microchip provides online support via our WWW site at Users of Microchip products can receive assistance www.microchip.com. This web site is used as a means through several channels: to make files and information easily available to * Distributor or Representative customers. Accessible by using your favorite Internet . ; ; : browser, the web site contains the following * Local. SalesvnOffice ; information: ¢ Field Application Engineer (FAE) « Techni Supper ¢« Product Support — Data sheets and errata, application notes and sample programs, design Customers should contact their distributor, resources, user’s guides and hardware support representative or Field Application Engineer (FAE) for documents, latest software releases and archived support. Local sales offices are also available to help software customers. A listing of sales offices and locations is * General Technical Support — — Frequently Asked Asked included in the back of this document. 

- General Technical Support — — Frequently Asked Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing 

Technical support is available through the web site at: http://microchip.com/support 

- ¢ Business of Microchip — Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives 

## CUSTOMER CHANGE NOTIFICATION SERVICE 

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. 

To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 

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## samme| 

Note the following details of the code protection feature on Microchip devices: 

- . Microchip products meet the specification contained in their particular Microchip Data Sheet. . Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. 

- . There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. 

- . Microchip is willing to work with the customer who is concerned about the integrity of their code. . Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” 

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may havea right to sue for relief under that Act. 

Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, Adaptec, and may be superseded by updates. It is your responsibility to AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, ensure that your application meets with your specifications. chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, ena a NO a enn OR flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, WARRANTIES LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, OF ANY KIND WHETHER EXPRESS OR Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, IMPLIED, WRITTEN OR ORAL, STATUTORY OR PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, OTHERWISE, RELATED TO THE INFORMATION, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, QUALITY,INCLUDING BUT NOT LIMITED TO ITS CONDITION : TempTrackr,SST Logo, SuperFlash, TimeSource,Symmetricom,tinyAVR, UNI/O,SyncServer, Vectron, andTachyon, XMEGA FITNESS FOR|PERFORMANCE,PURPOSE. Microchip; MERCHANTABILITYdisclaims all liabilityOR theare registeredU.S.A. and trademarksother countries. of Microchip Technology Incorporated in arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at APT, ClockWorks, The Embedded Control Solutions Company, the buyer's risk, and the buyer agrees to defend, indemnify and EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, holdiharmless: Nicrochio fiom “any. and allidamaaes: claims IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision , Pp! y ges, , Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, suits, or expenses resulting from such use. No licenses are SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, conveyed, implicitly or otherwise, under any Microchip TimePictra, TimeProvider, Vite, WinPath, and ZL are registered intellectual property rights unless otherwise stated. trademarks of Microchip Technology Incorporated in the U.S.A. 

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany Il GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. 

© 2017-2020, Microchip Technology Incorporated, All Rights Reserved. 

For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality. 

ISBN: 978-1-5224-6273-6 

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xX a Worldwide Sales and Service Dn AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office Australia - Sydney India - Bangalore Austria - Wels 2355 West Chandler Blvd. Tel: 61-2-9868-6733 Tel: 91-80-3090-4444 Tel: 43-7242-2244-39 Chandler, AZ 85224-6199 China - Beijing India - New Delhi Fax: 43-7242-2244-393 Tel: 480-792-7200 Tel: 86-10-8569-7000 Tel: 91-11-4160-8631 Denmark - Copenhagen re eer China - Chengdu India - Pune Tel: 45-4485-5910 Se ie ten Tel: 86-28-8665-5511 Tel: 91-20-4121-0141 Fax: 45-4485-2829 http://www. microchip.com/ . support China - Chongqing Japan - Osaka tit aS:i www.microchip.comWeb Address: Tel:China86-23-8980-9588- Dongguan Tel:Japan81-6-6152-7160- Tokyo Franceel: raParis‘ Aatlanta Tel:; 86-769-8702-9880 Tel: 81-3-6880- 3770 Tel:Fax:33-1-69-53-63-2033-1-69-30-90-79 Duluth, GA China - Guangzhou Korea - Daegu ; Tel: 678-957-9614 Tel: 86-20-8755-8029 Tel: 82-53-744-4301 Germany - Garching Fax: 678-957-1455 China -Fangzhow ee Tel: 49-8931-9700 Austin, TX Tel: 86-571-8792-8115 Tel: 82-2-554-7200 Germany - Haan Rag P ? Tel: 49-2129-3766400 Tel:Boston512-257-3370 Tel:China852-2943-5100Hong Kong SAR MalaysiaTel: 60-3-7651-7906Kuala Lumpur Germany- Heilbronn: Westborough, MA Chinai - Nanjingé Malaysia7 - Penang Tel: 49-7131-72400 Tel: 774-760-0087 Tel: 86-25-8473-2460 Tel: 60-4-227-8870 Germany - Karlsruhe Fax: 774-760-0088 China - Qingdao Philippines - Manila Teer e25a70 Chicago Tel: 86-532-8502-7355 Tel: 63-2-634-9065 Germany - Munich Itasca, IL China - Shanghai Singapore Ten te-Sp cei Tet Tel: 630-285-0071 Tel: 86-21-3326-8000 Tel: 65-6334-8870 Pa eee Fane eee nOrs China - Shenyang Taiwan - Hsin Chu cern meni ra Dallas Tel: 86-24-2334-2829 Tel: 886-3-577-8366 Shas a ‘ Addison, TX . . Israel - Ra’anana . tet China - Shenzhen Taiwan - Kaohsiung i Se 08-7 Tel: 86-755-8864-2200 Tel: 886-7-213-7830 th al . DetroitNovi,[MI] Tel:China 86-186-6233-1526- Suzhou TaiwanTel: 886-2-2508-8600- Taipei TFax:eb a5Se39-0331-466781 0331-742611eeeTh Tel: 248-848-4000 —_seleca aSN ae-_ Tel: 86-27-5980-5300 Tel: 66-2-694-1351 Italy - Padova Houston, TX —_ = wo Paces BO Tel: 39-049-7625286 Tel: 281-894-5983 Ina - Alan letnam - ho Min Tel: 86-29-8833-7252 Tel: 84-28-5448-2100 Netherlands - Drunen Indianapolis . . Tel: 31-416-690399 Noblesville, IN eeae Fax: 31-416-690340 Fax: 317-773-5453 China - Zhuhai Tel: 47-7288-4388 Tel: 317-536-2380 Tel: 86-756-3210040 Poland - Warsaw Los Angeles Tel: 48-22-3325737 peuple ole Romania - Bucharest Tel: 949-462-9523 Tel: 40-21-407-87-50 Tel:Fax:951-273-7800949-462-9608 Spain - Madrid: Raleigh,; NC Tel:Fax:34-91-708-08-9034-91-708-08-91 Tel: 919-844-7510 Rew vers NY Tel:Sweden46-31-704-60-40- Gothenberg Tel: 631-435-6000 Sweden - Stockholm San Jose, CA Tel: 46-8-5090-4654 Tel:Tel: 408-735-9110408-436-4270 OR Wokmnybeant: Tel: 44-118-921-5800 Canada - Toronto Fax: 44-118-921-5820 Tel: 905-695-1980 Fax: 905-695-2078 

DS60001403F-page 74 

© 2017-2020 Microchip Technology Inc. 

02/28/20 



## Links

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---

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