# BLUETOOTH STEREO AUDIO MODULE, V5.0 ![Product image](https://novapart.co/image/farnell:3380587/) **URL**: https://novapart.co/products/BM64SPKS1MC1-00M2AA/bluetooth-stereo-audio-module-v50 **SKU**: BM64SPKS1MC1-00M2AA **Manufacturer**: MICROCHIP **Category**: Wireless Modules & Adaptors || Communications & Networking Modules || Bluetooth Modules & Adaptors **Price**: €12.1500 **Stock**: 10+ **Lead Time**: 148 days (indicative) ## Specifications | Parameter | Value | |---|---| | Svhc | No SVHC (04-Feb-2026) | | Interfaces | UART | | Product Range | - | | Certifications | ANATEL, CE, FCC, IC, KC, MIC, NCC, SRRC | | Bluetooth Class | Class 1 | | Bluetooth Version | Bluetooth 5.0 | | Supply Voltage Range | 3.2 V to 4.2 V | | Receiver Sensitivity Rx | -90 dBm | | Operating Temperature Range | -20 °C to 70 °C | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:3380587/) **BM62/64** ## **Bluetooth[®] Stereo Audio Module** ## **Features** - Qualified for Bluetooth v5.0 specification - Supports A2DP 1.3, AVRCP 1.6, HFP 1.6, HSP 1.2 and SPP 1.2 • Supports Serial Copy Management System (SCMS-T) content protection ## **FIGURE 1:** ## **BM62 MODULE** - Supports Bluetooth 5.0 dual-mode (BDR/EDR/ BLE) specifications - Stand-alone module with on-board PCB antenna and Bluetooth stack - Supports high resolution up to 24-bit, 96 kHz audio data format - Supports Bluetooth Low Energy data rate up to 1Mbits/s - Supports connection of two hosts with HFP/A2DP profiles simultaneously - Transparent UART mode for seamless serial data over UART interface - Supports virtual UART communication between host MCU and smartphone applications by Bluetooth SPP or BLE link - Easy to configure with Windows[®] GUI or directly by external MCU **FIGURE 2: BM64 MODULE** - Supports firmware field upgrade - Supports one microphone - Compact surface mount module: - BM62: 29 x 15 x 2.5 mm - BM64: 32 x 15 x 2.5 mm - Castellated surface mount pads for easy and reliable host PCB mounting - RoHS compliant - Ideal for portable battery-operated devices - Internal battery regulator circuitry ## **DSP Audio Processing** - Supports 64 kbps A-Law, -Law PCM format/ Continuous Variable Slope Delta (CVSD) modulation for SCO channel operation - Supports 8/16 kHz noise suppression ## **Audio Codec** - Supports 8/16 kHz echo cancellation - Supports Modified Sub-Band Coding (MSBC) decoder for wide band speech - Built-in High Definition Clean Audio (HCA) algorithms for both narrow band and wide band speech processing - Packet loss concealment (PLC) - Built-in audio effect algorithms to enhance audio streaming - Sub-band Coding (SBC) and optional Advanced Audio Coding (AAC) decoding - 20-bit Digital-to-Analog Converter (DAC) with 98 dB SNR - 16-bit Analog-to-Digital Converter (ADC) with 92 dB SNR - Supports up to 24-bit, 96 kHz I[2] S digital audio (BM64 only) **Advanced** DS60001403E-Page 1  2017-2018 Microchip Technology Inc. ## **BM62/64** ## **Peripherals** - Built-in lithium-ion and lithium-polymer battery charger (up to 350 mA) - Integrated 1.8V and 3V configurable switching regulator and Low-Dropout (LDO) regulator - Built-in ADC for battery monitoring and voltage sense - Built-in ADC for charger thermal protection - Built-in Undervoltage Protection (UVP) - An auxiliary input port for external audio input - Two LED drivers ## **Description** The BM62/64 Stereo Audio module is a fully qualified Bluetooth v5.0 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications to their products. The BM62/64 module is a Bluetooth SIG-certified module that provides a complete wireless solution with a Bluetooth stack, an integrated PCB antenna, and worldwide radio certifications in a compact surface-mount package. The BM62/64 module has several SKUs. The BM62 module is a Class 2 device and the BM64 module is available in both Class 1 and Class 2 versions. - Multiple I/O pins for control and status ## **RF/Analog** - Frequency spectrum: 2.402 GHz to 2.480 GHz - Receive sensitivity: -90 dBm (2 Mbps EDR) - Output Power - BM64 Class 1: +15 dBm typical - BM62/64 Class 2: +2 dBm typical ## **HCI Interface** - High-speed HCI-UART interface (supports up to 921,600 bps) ## **MAC/Baseband Processor** - Supports Bluetooth 5.0 dual-mode - BDR/EDR transport for audio, voice, and SPP data exchange - BLE transport for proprietary transparent service and Apple Notification Center Service (ANCS) data exchange ## **Operating Condition** - Operating voltage: 3.2V to 4.2V - Operating temperature: -20°C to +70°C ## **Compliance** - Bluetooth Special Interest Group (SIG) QDID: 110148 (BM62, BM64 Class 2) and 110159 (BM64 Class 1) - Certified to the United States (FCC), Innovation, Science and Economic Development Canada (ISED), European Economic Area (CE), Korea (KCC), Taiwan (NCC), Japan (MIC), China (SRRC), and Brazil (ANATEL) radio regulations ## **Applications** - Portable speaker - Multiple speakers - Headset **Advanced** DS60001403E-Page 2  2017-2018 Microchip Technology Inc. **BM62/64** ## **Table of Contents** 1.0 Device Overview ....................................................................................................................................................... 5 2.0 Audio....................................................................................................................................................................... 15 3.0 Transceiver ............................................................................................................................................................. 19 4.0 Power Management Unit ........................................................................................................................................ 21 5.0 Application Information .......................................................................................................................................... 25 6.0 Printed Antenna Information .................................................................................................................................. 43 7.0 Physical Dimensions.............................................................................................................................................. 47 8.0 Electrical Characteristics........................................................................................................................................ 51 9.0 Soldering Recommendations................................................................................................................................. 59 10.0 Ordering Information ............................................................................................................................................ 61 Appendix A: Certification Notices................................................................................................................................. 63 Appendix B: Revision History....................................................................................................................................... 73 ## **TO OUR VALUED CUSTOMERS** It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at **docerrorsmicrochip.com** or fax the **Reader Response Form** in the back of this data sheet to (480) 792-4150. We welcome your feedback. ## **Most Current Data Sheet** To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: ## **http://www.microchip.com** You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). ## **Errata** An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: - Microchip’s Worldwide Web site; **http://www.microchip.com** - Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. ## **Customer Notification System** Register on our web site at **www.microchip.com** to receive the most current information on all of our products. **Advanced** DS60001403E-Page 3  2017-2018 Microchip Technology Inc. **BM62/64** ## **NOTES:** **Advanced** DS60001403E-Page 4  2017-2018 Microchip Technology Inc. **BM62/64** ## **1.0 DEVICE OVERVIEW** The BM62 and BM64 Stereo Audio modules are built around Microchip Technology IS2062 and IS2064 SoCs. The IS2062/64 SoC integrates the Bluetooth 5.0 dualmode radio transceiver, Power Management Unit (PMU), a crystal and DSP. Users can configure the BM62/64 module by using the UI tool and DSP tool, a ## Windows-based utility. **Note:** The UI and DSP tools are available for download from the Microchip website at: www.microchip.com/BM62 and www.microchip.com/BM64. Figure 1-1 illustrates a typical example of the BM62 module, which is connected to an external audio amplifier and the MCU. **FIGURE 1-1: SINGLE SPEAKER APPLICATION USING BM62 MODULE** Figure 1-2 illustrates a typical example of the Class 1 BM64 module, which is connected to an external MCU and a DSP/codec. **FIGURE 1-2:** **SINGLE SPEAKER APPLICATION USING BM64 MODULE** **Advanced** DS60001403E-Page 5  2017-2018 Microchip Technology Inc. **BM62/64** Figure 1-3 illustrates the multi-speaker application using the BM64 module. **FIGURE 1-3: MULTI-SPEAKER APPLICATION USING BM64 MODULE** **Advanced** DS60001403E-Page 6  2017-2018 Microchip Technology Inc. **BM62/64** Table 1-1 provides the key features of the BM62/64 module. ## **TABLE 1-1: BM62/64 KEY FEATURES** |**TABLE 1-1:**
**BM62/64 KEY FEATURES**|||| |---|---|---|---| |**Feature**|**BM62 CLASS 2**|**BM64 CLASS 2**|**BM64 CLASS 1**| |Application|Headset/Speaker|Multi-Speaker/Soundbar|| |Stereo/mono|Stereo|Stereo|Stereo| |Pin count|37|43|43| |Dimensions(mm2)|15 x 29|15 x 32|15 x 32| |PCB antenna|Yes|Yes|Yes| |Tx power(typical)|2 dBm|2 dBm|15 dBm| |Audio DAC output|2-channel|2-channel|2-channel| |DAC(single-ended)SNR at 2.8V(dB)|-98|-98|-98| |DAC(capless)SNR at 2.8V(dB)|-98|-98|-98| |ADC SNR at 2.8V(dB)|-92|-92|-92| |I2S digital output|No|Yes|Yes| |AnalogAuxiliary-Input|Yes|Yes|Yes| |Mono microphone|1|1|1| |External audio amplifier interface|Yes|Yes|Yes| |UART|Yes|Yes|Yes| |Full-speed USB 1.1|No|Yes|Yes| |LED driver|2|2|2| |Internal DC-DC step down regulator|Yes|Yes|Yes| |DC 5V adapter input|Yes|Yes|Yes| |Batterycharger(350 mA max)|Yes|Yes|Yes| |ADC for thermal charger protection|Yes|Yes|Yes| |Under voltageprotection(UVP)|Yes|Yes|Yes| |GPIO|10|12|12| |Button support|6|6|6| |EEPROM|Yes|Yes|Yes| |Customized voice prompt|8K Sampling Rate, Stored in EEPROM with approximately
800 bytes/second||| |Multitone|Yes|Yes|Yes| |DSP functions(audioplayback and voice call)|Yes|Yes|Yes| |BLE|Yes|Yes|Yes| |**Bluetoothprofiles**|||| |A2DP|1.3|1.3|1.3| |AVRCP|1.6|1.6|1.6| |HFP|1.6|1.6|1.6| |HSP|1.2|1.2|1.2| |SPP|1.2|1.2|1.2| **Advanced** DS60001403E-Page 7  2017-2018 Microchip Technology Inc. **BM62/64** Figure 1-4 illustrates the pin diagram of the BM62 module. ## **FIGURE 1-4:** ## **BM62 MODULE PIN DIAGRAM** **Advanced** DS60001403E-Page 8  2017-2018 Microchip Technology Inc. **BM62/64** Table 1-2 provides the pin description of the BM62 module. **TABLE 1-2: BM62 MODULE PIN DESCRIPTION** |**Pin No**|**Pin Type**|**Pin Name**|**Description**| |---|---|---|---| |1|I/O|P0_0|Configurable control or indication pin
(Internally pulled up, if configured as an input)
• Slide switch detector, active-high
• UART TX_IND, active-low (used by Bluetooth sys-
tem to wakeupthe host MCU)| |2|I|EAN|External address bus negative
System configuration pin along with the P2_0 and
P2_4 pins, used to set the module in any one of the fol-
lowing three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to load a new firmware into the
module), refer toTable 5-1
Flash type module already installed internal pull down
resistor 4.7 kOhm to GND| |3|I/O|P3_0|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Auxiliaryinput detector, active-low| |4|I/O|P2_0|System configuration pin along with P2_4 and EAN
pins used to set the module in any one of the following
three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to load a new firmware into the
module), refer toTable 5-1| |5|I/O|P1_5|Configurable control or indication pin
(Internally pulled up, if configured as an input)
• NFC detection pin, active-low
• Out_Ind_1
• Slide switch detector, active-high| |6|I/O|P0_4|Configurable control or indication pin
(Internally pulled up, if configured as an input)
• NFC detection pin, active-low
• Out_Ind_1| |7|O|SPKR|Right-channel, analogheadphone output| |8|O|AOHPM|Headphone common mode output/sense input| |9|O|SPKL|Left-channel, analogheadphone output| |10|P|VDDA|Analog reference voltage. Do not connect, for internal
use only| |11|I|MIC1_P|MIC1 mono differential analogpositive input| |12|I|MIC1_N|MIC1 mono differential analognegative input| |13|P|MIC1_BIAS|Electric microphone biasingvoltage| |14|I|AIR|Right-channel, single-ended analoginput| |15|I|AIL|Left-channel,single-ended analoginput| |**Legend:**
I= Input pin
O= Output pin
I/O= Input/Output pin
P= Power pin
**Note:**
All I/O pins can be configured using the UI tool, a Windows utility.|||| **Advanced** DS60001403E-Page 9  2017-2018 Microchip Technology Inc. **BM62/64** **TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED)** |**Pin No**|**Pin Type**|**Pin Name**|**Description**| |---|---|---|---| |16|I|RST_N|System Reset(active-low)| |17|-|NC|No connection| |18|I/O|P0_1|Configurable control or indication pin
(Internally pulled up, if configured as an input)
• FWD key when Class 2 RF (default), active-low
• Class 1 Tx control signal for external RF Tx/Rx
switch, active-high| |19|P|VDD_IO|I/O positive supply. Do not connect, for internal use
only| |20|P|ADAP_IN|5V power adapter input, used to charge the battery in
the Li-Ion battery power applications| |21|P|BAT_IN|Power Supply input.
Voltage range: 3.2V to 4.2V. Source can either be a
Li-Ion batteryor anyotherpower rail on the host board| |22|P|AMB_DET|Analoginput for ambient temperature detection| |23|P|GND|Ground reference| |24|P|SYS_PWR|System power output derived from ADAP_IN or
BAT_IN. Refer to reference schematic for external con-
nection.| |25|P|BK_OUT|1.8V buck regulator output. Do not connect to other
devices. For internal use only| |26|I|MFB|• Multi-Function Button and power-on key
• UART RX_IND, active-high (used by host MCU to
wakeupthe Bluetooth system)| |27|O|LED1|LED driver 1| |28|O|LED2|LED driver 2| |29|I/O|P2_4|System configuration pin along with P2_0 and EAN
pins used to set the module in any one of the following
three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to load a new firmware into the
module), refer toTable 5-1| |30|I/O|P0_2|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Play/Pause key (default), active-low| |31|I/O|P0_3|Configurable control or indication pin
(Internally pulled up, if configured as an input)
• REV key (default), active-low
• Buzzer signal output
• Out_Ind_2
• Class 1 Rx Control signal of external RF Tx/Rx
switch, active-high| |32|I/O|HCI_TXD|HCI UART data output| |33|I/O|HCI_RXD|HCI UART data input| |**Legend:**
I= Input pin
O= Output pin
I/O= Input/Output pin
P= Power pin
**Note:**
All I/O pins can be configured using the UI tool, a Windows utility.|||| **Advanced** DS60001403E-Page 10  2017-2018 Microchip Technology Inc. **BM62/64** **TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED)** |**Pin No**|**Pin Type**|**Pin Name**|**Description**| |---|---|---|---| |34|I/O|P0_5|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Volume-down key (default), active-low| |35|I/O|P2_7|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Volume-up key (default), active-low| |36|-|NC|No connection| |37|P|GND|Ground reference| |38|-|NC|No connection| |39|-|NC|No connection| |40|-|NC|No connection| |**Legend:**
I= Input pin
O= Output pin
I/O= Input/Output pin
P= Power pin
**Note:**
All I/O pins can be configured using the UI tool, a Windows utility.|||| **Advanced** DS60001403E-Page 11  2017-2018 Microchip Technology Inc. **BM62/64** Figure 1-5 illustrates the pin diagram of the BM64 module. **FIGURE 1-5:** **BM64 MODULE PIN DIAGRAM** **Advanced** DS60001403E-Page 12  2017-2018 Microchip Technology Inc. **BM62/64** Table 1-3 provides the pin description of the BM64 Module. **TABLE 1-3: BM64 MODULE PIN DESCRIPTION** |**Pin No**|**Pin Type**|**Pin Name**|**Description**| |---|---|---|---| |1|I/O|DR0|I2S interface: digital left/right data| |2|I/O|RFS0|I2S interface: left/right clock| |3|I/O|SCLK0|I2S interface: bit clock| |4|I/O|DT0|I2S interface: digital left/right data| |5|O|AOHPR|Right-channel, analogheadphone output| |6|O|AOHPM|Headphone common mode output/sense input| |7|O|AOHPL|Left-channel, analogheadphone output| |8|I|MIC_N1|MIC1 mono differential analognegative input| |9|I|MIC_P1|MIC1 mono differential analog positive input| |10|P|MIC_BIAS|Electric microphone biasingvoltage| |11|I|AIR|Right-channel, single-ended analoginput| |12|I|AIL|Left-channel, single-ended analoginput| |13|I|RST_N|System Reset(active-low)| |14|P|GND|Ground reference| |15|I/O|P1_2|EEPROM clock SCL| |16|I/O|P1_3|EEPROM data SDA| |17|I/O|P0_4|Configurable control or indication pin
(Internally pulled up, if configured as an input)
• NFC detection pin, active-low
• Out_Ind_1| |18|I/O|P1_5|Configurable control or indication pin
(Internally pulled up, if configured as an input)
• NFC detection pin, active-low
• Slide switch detector, active-high
• Out_Ind_1
• Multi-SPK Master/Slave mode control (firmware depen-
dent)| |19|I|HCI_RXD|HCI-UART data input| |20|O|HCI_TXD|HCI-UART data output| |21|P|VDD_IO|I/Opositive supply. Do not connect, for internal use only| |22|P|BAT_IN|Power Supply input.
Voltage range: 3.2V to 4.2V. Source can either be a Li-Ion bat-
teryor anyotherpower rail on the host board| |23|P|ADAP_IN|5V power adapter input, used to charge the battery in the
Li-Ion batterypower applications| |24|P|SYS_PWR|System power output derived from ADAP_IN or BAT_IN.
Refer to reference schematic for external connection.| |25|P|AMB_DET|Analoginput for ambient temperature detection| |26|I|MFB|• Multi-Function Button and power-on key
• UART RX_IND, active-high (used by host MCU to
wakeupthe Bluetooth system)| |27|O|LED2|LED driver 2| |28|O|LED1|LED driver 1| **Legend:** I= Input pin O= Output pin I/O= Input/Output pin P= Power pin **Note:** All I/O pins can be configured using the UI tool, a Windows utility. **Advanced** DS60001403E-Page 13  2017-2018 Microchip Technology Inc. **BM62/64** **TABLE 1-3: BM64 MODULE PIN DESCRIPTION (CONTINUED)** |**Pin No**|**Pin Type**|**Pin Name**|**Description**| |---|---|---|---| |29|I/O|P3_7|Configurable control or indication pin
(Internally pulled up, if configured as an input)
UART TX_IND, active-low (used by Bluetooth system to
wakeupthe host MCU)| |30|I/O|P3_5|Configurable control or indication pin
(Internally pulled low, if configured as an input)
• Slide switch detector, active-high| |31|I/O|P0_0|Configurable control or indication pin
(Internally pulled up, if configured as an input)
• Slide switch detector, active-high, Out_Ind_0| |32|I|EAN|External address bus negative
System configuration pin along with the P2_0 pins used to set
the module in any one of these modes:
• Application mode (for normal operation)
• Test mode (to change FW and EEPROM values)
• Mode setting, refer toTable 5-1
Flash type module already installed internal pull down resistor
4.7 kOhm to GND| |33|I/O|DM|Differential data-minus USB| |34|I/O|DP|Differential data-plus USB| |35|I/O|P0_5|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Volume-down key (default), active-low| |36|I/O|P3_0|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Auxiliaryinput detector, active-low| |37|I/O|P3_1|Configurable control or indication pin
(Internally pulled up, if configured as an input)
REV key (default), active-low| |38|I/O|P3_3|Configurable control or indication pin
(Internally pulled up, if configured as an input)
FWD key (default), active-low| |39|I/O|P3_6|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Multi-SPK Master/Slave mode control(firmware dependent)| |40|I/O|P0_2|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Play/Pause key (default)| |41|I/O|P2_0|System configuration pin along with EAN pins used to set the
module in any one of the following modes:
• Application mode (for normal operation)
• Test mode (to change FW and EEPROM values)
• Mode setting, refer toTable 5-1| |42|I/O|P2_7|Configurable control or indication pin
(Internally pulled up, if configured as an input)
Volume-upkey (default), active-low| |43|P|GND|Ground reference| |**Legend:**
I= Input pin
O= Output pin
I/O= Input/Output pin
P= Power pin
**Note:**
All I/O pins can be configured using the UI tool, a Windows utility.|||| **Advanced** DS60001403E-Page 14  2017-2018 Microchip Technology Inc. **BM62/64** ## **2.0 AUDIO** The input and output audios have different stages and each stage can be programmed to vary the gain response characteristics. For microphone, both single-ended inputs and differential inputs are supported. To maintain a high quality signal, a stable bias voltage source to the condenser microphone’s FET is provided. The DC blocking capacitors can be used at both positive and negative sides of an input. Internally, this analog signal is converted to 16-bit, 8/16 kHz linear PCM data. ## **2.1 Digital Signal Processor** A Digital Signal Processor (DSP) is used to perform speech and audio processing. The advanced speech features, such as acoustic echo cancellation and noise reduction are inbuilt. To reduce nonlinear distortion and to help echo cancellation, an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of speaker output or microphone input. Adaptive filtering is also applied to track the echo path impulse in response to provide echo free and full-duplex user experience. The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs captured by the microphones and improves mutual understanding in communication. The advanced audio features, such as multi-band dynamic range control, parametric multi-band equalizer, audio widening and virtual bass are inbuilt. The audio effect algorithms improve the user’s audio listening experience in terms of better audio quality after audio signal processing. Figure 2-1 and Figure 2-2 illustrate the processing flow of speakerphone applications for speech and audio signal processing. ## **FIGURE 2-1: SPEECH SIGNAL PROCESSING** ## **FIGURE 2-2: AUDIO SIGNAL PROCESSING** **Advanced** DS60001403E-Page 15  2017-2018 Microchip Technology Inc. ## **BM62/64** The DSP parameters can be configured using the DSP tool. For additional information on the DSP tool, refer to the “ _IS206X DSP Application Note_ ”. **Note:** The DSP tool and “ _IS206X DSP Application Note_ ” document, are available for download from the Microchip website at: www.microchip.com/BM62 and www.microchip.com/BM64. ## **2.2 Codec** The built-in codec has a high signal-to-noise ratio (SNR) performance and it consists of an ADC, a DAC and an additional analog circuitry. **Note:** The internal codec supports 16-bit resolution; by adding trailing zeros in LSBs 24-bit I[2] S port requirements can be met. Figure 2-3 through Figure 2-6 illustrate the dynamic range and frequency response of the codec. ## **FIGURE 2-3: CODEC DAC DYNAMIC RANGE** **Note:** The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25°C room temperature. ## **FIGURE 2-4: CODEC DAC THD+N VERSUS INPUT POWER** **Note:** The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25°C room temperature. **Advanced** DS60001403E-Page 16  2017-2018 Microchip Technology Inc. **BM62/64** **FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE)** **FIGURE 2-6: CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE)** **Note:** The DAC frequency response corresponds to Single-ended mode with a 47 μF DC block capacitor. **Advanced** DS60001403E-Page 17  2017-2018 Microchip Technology Inc. ## **BM62/64** ## **2.3 Auxiliary Port** The BM62/64 module supports one analog (line-in) signal from the external audio source. The analog (line-in) signal can be processed by the DSP to generate different sound effects (multi-band dynamic range compression and audio widening), which can be configured by using the DSP tool. ## **2.4 Analog Speaker Output** The BM62/64 module supports the following analog speaker output modes: - Capless mode — Recommended for headphone applications in which capless output connection helps to save the BOM cost by avoiding a large DC blocking capacitor. Figure 2-7 illustrates the analog speaker output capless mode. - Single-ended mode — Used for driving an external audio amplifier where a DC blocking capacitor is required. Figure 2-8 illustrates the analog speaker output single-ended mode. ## **FIGURE 2-7:** ## **ANALOG SPEAKER OUTPUT CAPLESS MODE** **FIGURE 2-8:** **ANALOG SPEAKER OUTPUT SINGLE-ENDED MODE** **Advanced** DS60001403E-Page 18  2017-2018 Microchip Technology Inc. **BM62/64** ## **3.0 TRANSCEIVER** The BM62/64 module is designed and optimized for the Bluetooth 2.4 GHz system. It contains a complete radio frequency transmitter/receiver section. An internal synthesizer generates a stable clock for synchronizing with another device. ## **3.1 Transmitter** The internal power amplifier (PA) has a maximum output power of +4 dBm. This is applied for Class 2 or Class 3 radios without an external RF PA. BDR, symbol 1 represents 1-bit. However, each symbol in the payload part of EDR packet represents 2/3 bits. This is achieved by using two different modulations, π/4 DQPSK and 8 DPSK. ## **3.5 Adaptive Frequency Hopping (AFH)** The BM62/64 module has an AFH function to avoid RF interference. It has an algorithm to check the nearby interference and to choose clear channel for transceiver Bluetooth signal. The transmitter performs the IQ conversion to minimize the frequency drift. ## **3.2 Receiver** The Low-Noise Amplifier (LNA) operates with TR-combined mode for single port application. It can save a pin on the package without having an external Tx/Rx switch. The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysis. A channel filter has been integrated into the receiver channel before the ADC, which is used to reduce the external component count and increase the anti-interference capability. The image rejection filter is used to reject the image frequency for low-IF architecture. This filter for low-IF architecture is intended to reduce external Band Pass Filter (BPF) component for a super heterodyne architecture. The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF output power to make a good trade-off for effective distance and current consumption. ## **3.3 Synthesizer** A synthesizer generates a clock for radio transceiver operation. There is a VCO inside with a tunable internal LC tank that can reduce variation for components. A crystal oscillator with an internal digital trimming circuit provides a stable clock for the synthesizer. ## **3.4 Modem** For Bluetooth 1.2 specification and below, 1 Mbps was the standard data rate based on the Gaussian Frequency Shift Keying (GFSK) modulation scheme. This basic rate modem meets Basic Data Rate (BDR) requirements of Bluetooth 2.0 with Enhanced Data Rate (EDR) specifications. For Bluetooth 2.0 and above specifications, EDR has been introduced to provide the data rates of 1/2/3 Mbps. For baseband, both BDR and EDR utilize the same 1 MHz symbol rate and 1.6 kHz slot rate. For **Advanced** DS60001403E-Page 19  2017-2018 Microchip Technology Inc. **BM62/64** ## **NOTES:** **Advanced** DS60001403E-Page 20  2017-2018 Microchip Technology Inc. **BM62/64** ## **4.0 POWER MANAGEMENT UNIT** The on-chip Power Management Unit (PMU) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulator. A power switch is used to switch over the power source between the battery and an adapter. Also, the PMU provides current to drive two LEDs. ## **4.1 Charging a Battery** The BM62/64 module has a built-in battery charger, which is optimized for lithium-ion and lithium-polymer batteries. The battery charger includes a current sensor for charging control, user-programmable current regulation, and high accuracy voltage regulation. The charging current parameters are configured by the UI tool. Reviving, pre-charging, constant current and constant voltage modes, and re-charging functions are included. The maximum charging current is 350 mA. Figure 4-1 illustrates the charging curve of a battery. ## **FIGURE 4-1: BATTERY CHARGING CURVE** ## **4.2 Voltage Monitoring** A 10-bit, successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage level detection. The warning level can be programmed by using the UI tool. The ADC provides a granular resolution to enable the external MCU to take control over the charging process. ## **4.3 LED Drivers** Two dedicated LED drivers control the LEDs.They provide enough sink current (16 step control and 0.35 mA for each step), thus LEDs can be connected directly with the BM62/64 module. The LED settings can be configured using the UI tool. **Advanced** DS60001403E-Page 21  2017-2018 Microchip Technology Inc. ## **BM62/64** Figure 4-2 illustrates the LED drivers in the BM62/64 module. ## **FIGURE 4-2: LED DRIVERS** ## **4.4 Under Voltage Protection (Software Dependent UVP)** When the input voltage of the BAT_IN is below 2.9V, the system will not be able to start up, in order to protect the system. ## **4.5 Ambient Detection** The BM62/64 module has a built-in ADC for charger thermal protection. Figure 4-3 illustrates the suggested circuit and thermistor, Murata NCP15WF104F. The charger thermal protection can avoid battery charge in restricted temperature range. The upper and lower limits for temperature values can be configured by using the UI tool. **Note:** Thermistor must be placed close to the battery in the user application for accurate temperature measurements and to enable the thermal shutdown feature. **Advanced** DS60001403E-Page 22  2017-2018 Microchip Technology Inc. **BM62/64** ## **FIGURE 4-3: AMBIENT DETECTION** **Advanced** DS60001403E-Page 23  2017-2018 Microchip Technology Inc. **BM62/64** ## **NOTES:** **Advanced** DS60001403E-Page 24  2017-2018 Microchip Technology Inc. **BM62/64** ## **5.0 APPLICATION INFORMATION** ## **5.1 Power Supply** The IS2062/64 SoC is powered through the BAT_IN input pin. The external 5V power adapter can be connected to ADAP_IN in order to charge the battery. The following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of the IS2062/64 SoC. ## **FIGURE 5-1: POWER TREE DIAGRAM** ## **5.2 Host MCU Interface** The BM62/64 module supports UART commands. The UART commands enable an external MCU to control the BM62/64 module. Figure 5-2 illustrates the UART interface between the BM62/64 module and an external MCU. **FIGURE 5-2:** **HOST MCU INTERFACE OVER UART** An external MCU can control the BM62/64 module over the UART interface and wake-up the module with the MFB, P0_0 (BM62) and P3_7 (BM64) pins. **Advanced** DS60001403E-Page 25  2017-2018 Microchip Technology Inc. **BM62/64** Refer to the “ _UART_CommandSet_ ” document for a list of functions the BM62/64 module supports and how to use the UI tool to configure the UART and UART Command Set tool. **Note:** The UART Command set tool (SPKCommandSetTool v160.xx) and “ _UART_CommandSet_ ” document are available for download from the Microchip website at: www.microchip.com/BM62 and www.microchip.com/BM64. **Advanced** DS60001403E-Page 26  2017-2018 Microchip Technology Inc. - Figure 5-3 through Figure 5-8 illustrate the timing sequences of various UART control signals. ## **FIGURE 5-3: POWER-ON/OFF SEQUENCE** ## **BM62/64** **FIGURE 5-4:** **TIMING SEQUENCE OF RX INDICATION AFTER POWER-ON STATE** ## **FIGURE 5-5: TIMING SEQUENCE OF POWER-OFF STATE** **Note 1:** EEPROM clock = 100 kHz. - **2:** For a byte write: 0.01 ms x 32 clock x 2 = 640 μs. - **3:** It is recommended to have ramp-down time more than 640 μs during the power-off sequence to ensure safe operation of the device. **Advanced** DS60001403E-Page 28  2017-2018 Microchip Technology Inc. **BM62/64** **FIGURE 5-6: TIMING SEQUENCE OF POWER-ON (NACK)** **FIGURE 5-7: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU** **Note:** When the host MCU sends the UART command and the BM62/64 module does not respond, the MCU resends the UART command. If the BM62/64 module does not respond within 5 secs, the MCU will force the system to Reset. **Advanced** DS60001403E-Page 29  2017-2018 Microchip Technology Inc. **BM62/64** ## **FIGURE 5-8:** **TIMING SEQUENCE OF POWER DROP PROTECTION** **Note 1:** It is recommended to use the battery to provide the power supply at BAT_IN in to the module. - **2:** If an external power source or a power adapter is utilized to provide power to the module (BAT_IN), it is recommended to use a voltage supervisor IC. - **3:** The Reset IC output pin, RST_N, must be “Open drain” type and threshold voltage as 2.93V. - **4:** The RST_N signal must be fully pulled low before BAT_IN power drop to 2.7V ## 5.2.1 DEVICE FW UPGRADE (DFU) After receiving all the images and storing in local memory, such as SPI flash/USB thumb drive, the MCU conducts the DFU for BT Module. ## 5.2.1.1 Enter BT Module/MCU DFU mode To upgrade the flash through UART, first select the module in “ROM TEST” mode. The timing for BM64 to enter “ROM TEST” mode is illustrated in following figure (P20 low and EAN high). ## **FIGURE 5-9: Timing Diagram of Application Mode to DFU Mode** Be sure to switch back from “ROM TEST/DFU” mode to Application mode, after the DFU, as illustrated in following figure. **Advanced** DS60001403E-Page 30  2017-2018 Microchip Technology Inc. **BM62/64** **FIGURE 5-10: Timing Diagram of DFU Mode to Application Mode** ## **5.3 I[2] S Mode Application** The BM64 module provides an I[2] S digital audio output interface to connect with an external codec/DSP. It provides 8, 16, 44.1, 48, 88.2, and 96 kHz sampling rates for 16-bit and 24-bit data formats. The I[2] S setting can be configured by using the UI and DSP tools. Figure 5-11 and Figure 5-12 illustrate the I[2] S signal connection between the BM64 module and an external DSP. Use the DSP tool to configure the BM64 module as a master/slave. For additional information on timing specifications, refer to **8.1 “Timing specifications”** . **FIGURE 5-11: BM64 MODULE IN I[2] S MASTER MODE** **Advanced** DS60001403E-Page 31  2017-2018 Microchip Technology Inc. ## **BM62/64** **FIGURE 5-12:** **BM64 MODULE IN I[2] S SLAVE MODE** ## **5.4 Reset** The BM62/64 module provides a Watchdog Timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known power-on state. This action can be driven by an external reset signal, which is used to control the device externally by forcing it into a POR state. The RST_N signal input is active-low and no connection is required in most applications. **Advanced** DS60001403E-Page 32  2017-2018 Microchip Technology Inc. **BM62/64** ## **5.5 External Configuration and Programming** The BM62/64 module can be configured by using an external configuration tool (EEPROM tool) and the firmware is programmed by using a programming tool (Flash tool). **Note:** The EEPROM and Flash tools are available for download from the Microchip web site at: www.microchip.com/BM62 and www.microchip.com/BM64. Figure 5-13 illustrates the configuration and firmware programming interface on the BM62 module. It is recommended to include a header pin on the main PCB for development. **FIGURE 5-13:** **==> picture [258 x 8] intentionally omitted <==** **----- Start of picture text -----**
EXTERNAL PROGRAMMING HEADER CONNECTIONS
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**Advanced** DS60001403E-Page 33  2017-2018 Microchip Technology Inc. ## **BM62/64** The Configuration and Firmware programming modes are entered according to the system configuration I/O pins. Table 5-1 provides the system configuration settings. ## **TABLE 5-1: SYSTEM CONFIGURATION I/O PIN SETTINGS** |**Pins**|**Pins**|**Pins**|**Bluetooth Mode**| |---|---|---|---| |**P2_0**|**EAN**|**P2_4**|| |High|Low|High|Flash Application| |High|High|High|ROM Application| |Low|Low|High|Flash IBDK| |Low|High|High|ROM IBDK| |Low|High|Low|Boot| - **Note 1:** The P2_0, P2_4 and EAN pins have internal pull high. - **2:** Boot mode is not supported in the BM64 module, as the P2_4 pin does not exist on the module. **Advanced** DS60001403E-Page 34  2017-2018 Microchip Technology Inc. ## **5.6 Reference Circuit** Figure 5-14 through Figure 5-17 illustrate the BM62 module reference circuit for a stereo headset applications. ## **FIGURE 5-14: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION** ## **FIGURE 5-15: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION** **BM62/64** ## **FIGURE 5-16: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION** **==> picture [374 x 9] intentionally omitted <==** **----- Start of picture text -----**
Note: The section “NFC (Optional)” contains built-in rectifier circuit of NXP 203F NFC type.
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 2017-2018 Microchip Technology Inc. **Advanced** DS60001403E-Page 37 **BM62/64** **FIGURE 5-17: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION** **Note:** All ESD diodes in the schematics are reserved for testing. **Advanced** DS60001403E-Page 38  2017-2018 Microchip Technology Inc. Figure 5-18 through Figure 5-21 illustrate the BM64 reference circuit for a stereo headset applications. ## **FIGURE 5-18:** ## **BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION** ## **FIGURE 5-19:** ## **BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION** **BM62/64** ## **FIGURE 5-20: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION** **Advanced** DS60001403E-Page 41  2017-2018 Microchip Technology Inc. ## **BM62/64** ## **FIGURE 5-21: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION** **Advanced** DS60001403E-Page 42  2017-2018 Microchip Technology Inc. **BM62/64** ## **6.0 PRINTED ANTENNA INFORMATION** ## **6.1 Antenna Radiation Pattern** The BM62/64 module is integrated with one PCB printed antenna, see Figure 6-1. ## **FIGURE 6-1: RECOMMENDED KEEPOUT AREA FOR PCB ANTENNA** **Advanced** DS60001403E-Page 43  2017-2018 Microchip Technology Inc. ## **BM62/64** Figure 6-2 illustrates the 3D radiation pattern of the PCB printed antenna at 2441 MHZ. ## **FIGURE 6-2: PCB ANTENNA 3D RADIATION PATTERN AT 2441 MHZ** Table 6-1 provides the PCB Antenna characteristics of the BM62/64 module. noise reduction. For the best range performance, keep all external metal at least 15 mm away from the on-board PCB trace antenna. **TABLE 6-1: BM62/64 PCB ANTENNA CHARACTERISTICS** |**Parameter**|**Values**| |---|---| |Frequency|2400 MHz to 2480 MHz| |Peak Gain|1.927 dBi| |Efficiency|73.41%| ## **6.2 Module Placement Guidelines** For a Bluetooth-enabled product, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it must not be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB must not contain copper on the top, inner, or bottom layers, as illustrated in Figure 6-1. A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommendation, as required for the main PCB EMC **Advanced** DS60001403E-Page 44  2017-2018 Microchip Technology Inc. **BM62/64** Figure 6-3 and Figure 6-4 illustrate the examples of good and poor placement of the BM62/64 module on a host board with GND plane. **FIGURE 6-3: MODULE PLACEMENT GUIDELINES** ## **FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD** **Advanced** DS60001403E-Page 45  2017-2018 Microchip Technology Inc. **BM62/64** ## **NOTES:** **Advanced** DS60001403E-Page 46  2017-2018 Microchip Technology Inc. **BM62/64** ## **7.0 PHYSICAL DIMENSIONS** Figure 7-1 illustrates the PCB dimension of the BM62 module. **FIGURE 7-1: BM62 MODULE PCB DIMENSION** **==> picture [311 x 9] intentionally omitted <==** **----- Start of picture text -----**
Note: PCB dimensions: X: 15.0 mm, Y: 29.0 mm and tolerances: 0.25 mm.
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**Advanced** DS60001403E-Page 47  2017-2018 Microchip Technology Inc. **BM62/64** Figure 7-2 illustrates the PCB dimension of the BM64 module. **==> picture [245 x 8] intentionally omitted <==** **----- Start of picture text -----**
FIGURE 7-2: BM64 MODULE PCB DIMENSION
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**==> picture [310 x 9] intentionally omitted <==** **----- Start of picture text -----**
Note: PCB dimensions: X: 15.0 mm, Y: 32.0 mm and tolerances: 0.25 mm.
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**Advanced** DS60001403E-Page 48  2017-2018 Microchip Technology Inc. **BM62/64** Figure 7-3 illustrates the recommended PCB footprint of the BM62 module. **FIGURE 7-3:** ## **RECOMMENDED BM62 MODULE PCB FOOTPRINT** **Note 1:** The keep-out area is reserved to keep the RF test point away from GND plane. - **2:** All metal keep-out is used to isolate the PCB antenna. **Advanced** DS60001403E-Page 49  2017-2018 Microchip Technology Inc. **BM62/64** Figure 7-4 illustrates the recommended PCB footprint of the BM64 module. ## **FIGURE 7-4: RECOMMENDED BM64 MODULE PCB FOOTPRINT** **Note 1:** The keep-out area is reserved to keep the RF test point away from GND plane. - **2:** All metal keep-out is used to isolate the PCB antenna. **Advanced** DS60001403E-Page 50  2017-2018 Microchip Technology Inc. **BM62/64** ## **8.0 ELECTRICAL CHARACTERISTICS** This section provides an overview of the BM62/64 Stereo Audio module electrical characteristics. Additional information will be provided in future revisions of this document, as it becomes available. Absolute maximum ratings for the BM62/64 module are listed below. **Absolute Maximum Ratings** Ambient temperature under bias...............................................................................................................-20°C to +70°C Storage temperature ...............................................................................................................................-40°C to +125°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V Maximum output current sink by any I/O pin..........................................................................................................12 mA Maximum output current sourced by any I/O pin....................................................................................................12 mA **Note:** Stresses listed under **“Absolute Maximum Ratings”** may cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. **Advanced** DS60001403E-Page 51  2017-2018 Microchip Technology Inc. ## **BM62/64** Table 8-1 through Table 8-9 provide the recommended operating conditions and the electrical specifications of the BM62/64 module. ## **TABLE 8-1: RECOMMENDED OPERATING CONDITION** |**Symbol**|**Parameter**|**Min.**|**Typical**|**Max.**|**Unit**| |---|---|---|---|---|---| |BAT_IN|Input voltage for battery|3.2|3.8|4.2|V| |ADAP_IN|Input voltage for adapter|4.5|5|5.5|V| |TOPERATION|Operation temperature|-20|+25|+70|ºC| **Note:** The absolute and recommended operating condition tables reflect a typical voltage usage for the device. ## **TABLE 8-2: I/O AND RESET LEVEL** |**TABLE 8-2:**
**I/O AND RESET LEVEL**|**TABLE 8-2:**
**I/O AND RESET LEVEL**||||| |---|---|---|---|---|---| |**Parameter**||**Min.**|**Typical**|**Max.**|**Unit**| |I/O SupplyVoltage(VDD_IO)||3.0|3.3|3.6|V| |I/O Voltage Levels|||||| |VILinput logic levels low||0|—|0.8|V| |VIHinput logic levels high||2.0|—|3.6|V| |VOLoutput logic levels low||—|—|0.4|V| |VOHoutput logic levels high||2.4|—|—|V| |RST_N|Input Low to High
Threshold Point|—|—|1.87|V| ||Input High to Low
Threshold Point|1.25|—|—|V| |Threshold voltage||—|1.6|—|V| **Note:** These parameters are characterized, but not tested in manufacturing. ## **TABLE 8-3: BATTERY CHARGER** |**TABLE 8-3:**
**BATTERY CHARGER**|**TABLE 8-3:**
**BATTERY CHARGER**||||| |---|---|---|---|---|---| |**Parameter**||**Min.**|**Typical**|**Max.**|**Unit**| |ADAP_IN Input Voltage||4.5|5.0|5.5|V| |Supplycurrent to charger only||—|3|4.5|mA| |Maximum Battery
Fast Charge Current|Headroom > 0.7V
(ADAP_IN = 5V)|—|350|—|mA| ||Headroom = 0.3V to 0.7V
(ADAP_IN = 4.5V)|—|175**(2)**|—|mA| |Trickle Charge Voltage Threshold||—|3|—|V| |Battery Charge Termination Current,
(% of Fast Charge Current)||—|10|—|%| - **Note 1:** Headroom = VADAP_IN – VBAT - **2:** When VADAP_IN – VBAT > 2V, the maximum fast charge current is 175 mA for thermal protection. - **3:** These parameters are characterized, but not tested in manufacturing. **Advanced** DS60001403E-Page 52  2017-2018 Microchip Technology Inc. **BM62/64** ## **TABLE 8-4: LED DRIVER** |**TABLE 8-4:**
**LED DRIVER**||||| |---|---|---|---|---| |**Parameter**|**Min.**|**Typical**|**Max.**|**Unit**| |Open-drain Voltage|—|—|3.6|V| |Programmable Current Range|0|—|5.25|mA| |IntensityControl|—|16|—|step| |Current Step|—|0.35|—|mA| |Power-Down Open-drain Current|—|—|1|μA| |Shutdown Current|—|—|1|μA| **Note 1:** Test condition: BK_OUT = 1.8V with +25ºC temperature. - **2:** These parameters are characterized, but not tested in manufacturing. ## **TABLE 8-5: AUDIO CODEC ANALOG TO DIGITAL CONVERTER** T = 25[o] C, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz |**TABLE 8-5:**
**AUDIO CODEC ANALOG TO DIGITAL CONVERTER**|**TABLE 8-5:**
**AUDIO CODEC ANALOG TO DIGITAL CONVERTER**|**TABLE 8-5:**
**AUDIO CODEC ANALOG TO DIGITAL CONVERTER**|**TABLE 8-5:**
**AUDIO CODEC ANALOG TO DIGITAL CONVERTER**|**TABLE 8-5:**
**AUDIO CODEC ANALOG TO DIGITAL CONVERTER**| |---|---|---|---|---| |T = 25oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz||||| |**Parameter (Condition)**|**Min.**|**Typical**|**Max.**|**Unit**| |Resolution|—|—|16|Bit| |Output Sample Rate|8|—|48|kHz| |Signal-to-Noise Ratio**(Note 1)**
(SNR at MIC or Line-in mode)|—|92|—|dB| |Digital Gain|-54|—|4.85|dB| |Digital Gain Resolution|—|2 to 6|—|dB| |MIC Boost Gain|—|20|—|dB| |AnalogGain|—|—|60|dB| |AnalogGain Resolution|—|2.0||dB| |Input full-scale at maximumgain(differential)|—|4|—|mV/rms| |Input full-scale at minimumgain(differential)|—|800|—|mV/rms| |3 dB bandwidth|—|20|—|kHz| |Microphone mode(input impedance)|—|24|—|kOhm| |THD+N(microphone input)at 30 mV/rms input|—|0.02|—|%| **Note 1:** fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 1%, 150 mVPP input. - **2:** These parameters are characterized, but not tested in manufacturing. **Advanced** DS60001403E-Page 53  2017-2018 Microchip Technology Inc. ## **BM62/64** ## **TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER** |**TABLE 8-6:**
**AUDIO CODEC DIGITAL TO ANALOG CONVERTER**|**TABLE 8-6:**
**AUDIO CODEC DIGITAL TO ANALOG CONVERTER**|**TABLE 8-6:**
**AUDIO CODEC DIGITAL TO ANALOG CONVERTER**|**TABLE 8-6:**
**AUDIO CODEC DIGITAL TO ANALOG CONVERTER**|**TABLE 8-6:**
**AUDIO CODEC DIGITAL TO ANALOG CONVERTER**|**TABLE 8-6:**
**AUDIO CODEC DIGITAL TO ANALOG CONVERTER**| |---|---|---|---|---|---| ||||||| |T = 25oC, VDD= 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz|||||| |**Parameter (Condition)**||**Min.**|**Typical**|**Max.**|**Unit**| |Over-samplingrate||—|128|—|_f_s| |Resolution||16|—|20|Bit| |Output Sample Rate||8|—|48|kHz| |Signal-to-Noise Ratio**(Note 1)**
(SNR at capless mode)for 48 kHz||—|98|—|dB| |Signal-to-Noise Ratio**(Note 1)**
(SNR at single-ended mode)for 48 kHz||—|98|—|dB| |Digital Gain||-54|—|4.85|dB| |Digital Gain Resolution||—|2 to 6|—|dB| |AnalogGain||-28|—|3|dB| |AnalogGain Resolution||—|1|—|dB| |Output Voltage Full-scale Swing (AVDD= 2.8V)||495|742.5|—|mV/rms| |Maximum Output Power(16 Ohm load)||—|34.5|—|mW| |Maximum Output Power(32 Ohm load)||—|17.2|—|mW| |Allowed Load|Resistive|—|16|O.C.|Ohm| ||Capacitive|—|—|500|pF| |THD+N(16 Ohm load) **(Note 2)**||—|0.05|—|%| |Signal-to-Noise Ratio(SNR at 16 Ohm load) **(Note 3)**||—|98|—|dB| - **Note 1:** fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 0.01%, 0 dBFS signal, Load = 100 kOhm - **2:** fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, -1 dBFS signal, Load =16 Ohm - **3:** fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 0.05%, 0 dBFS signal, Load = 16 Ohm - **4:** These parameters are characterized, but not tested in manufacturing. ## **TABLE 8-7: TRANSMITTER SECTION FOR BDR AND EDR** |**Parameter**|**Parameter**|**Min.**|**Typical**|**Max.**|**Bluetooth**
**specification**|**Unit**| |---|---|---|---|---|---|---| |RF transmit power|Class 1|—|15.0**(3)**|—|< 20|dBm| ||Class 2|—|2**(3)**|—|-6 to 4|dBm| |EDR/BDR Relative transmit power||-4|-1.8|1|-4 to 1|dB| - **Note 1:** The RF Tx power is modulation value. - **2:** The RF Transmit power is calibrated during the production by using the MP tool software and MT8852 Bluetooth test equipment. - **3:** Test condition: VCC_RF = 1.28V, temperature +25ºC. **Advanced** DS60001403E-Page 54  2017-2018 Microchip Technology Inc. **BM62/64** ## **TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR** ||**Modulation**|**Min.**|**Typical**|**Max.**|**Bluetooth**
**specification**|**Unit**| |---|---|---|---|---|---|---| |Sensitivityat 0.1% BER|GFSK|—|-89|—|≤-70|dBm| |Sensitivity at 0.01% BER|π/4 DQPSK|—|-90|—|≤-70|dBm| ||8 DPSK|—|-83|—|≤-70|dBm| **Note 1:** Test condition: VCC_RF = 1.28V with temperature +25ºC. - **2:** These parameters are characterized, but not tested in manufacturing. ## **TABLE 8-9: BM62 SYSTEM CURRENT CONSUMPTION** |**TABLE 8-9:**
**BM62 SYSTEM CURRENT CONSUMPTION**|||| |---|---|---|---| |**System Status**|**Typical(1)**|**Max.**|**Unit**| |System-Off mode|—|10|μA| |Stopadvertising (SamsungS5(SM-G900I)/Android™4.4.2)|||| |Standbymode|0.57|—|mA| |Link mode|0.5|—|mA| |ESCO link|15.1|—|mA| |A2DP link|14.3|—|mA| |Stop advertising (iPhone®6/iOS 8.4)|||| |Standbymode|0.6|—|mA| |Link mode|0.6|—|mA| |SCO link|15.3|—|mA| |A2DP link|15.4|—|mA| **Note 1:** The measurement data corresponds to Firmware v1.0. - **2:** Mode definition: Standby mode: Power-on without Bluetooth link; Link mode: With Bluetooth link in Low-power mode. - **3:** The current consumption values are measured with the BM62 EVB as test platform, with BAT_IN = 3.8V. The distance between the smartphone and BM62 EVB is 30 cm, and the speaker is without loading. **Advanced** DS60001403E-Page 55  2017-2018 Microchip Technology Inc. **BM62/64** ## **8.1 Timing specifications** Figure 8-1 and Figure 8-2 illustrate the timing diagram . of the BM62/64 module in I[2] S and PCM modes. **==> picture [345 x 12] intentionally omitted <==** **----- Start of picture text -----**
FIGURE 8-1: TIMING DIAGRAM FOR I [2] S MODES (MASTER/SLAVE)
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**FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE)** sexo!UUUULe SUUe SU UU RFSO PL > ~— Left channel > Right channel —: DRO/DTO Bat Baz B, |B, Be. By.2 Bi| Bn | t— Word length— » | **Note 1:** fs: 8,16, 32, 44.1, 48, 88.2 and 96 kHz. **2:** SCLK0: 64*fs/256*fs. **3:** Word Length: 16-bit and 24-bit. **Advanced** DS60001403E-Page 56  2017-2018 Microchip Technology Inc. **BM62/64** Figure 8-3 illustrates the timing diagram of the audio interface. ## **FIGURE 8-3: AUDIO INTERFACE TIMING DIAGRAM** Table 8-10 provides the timing specifications of the audio interface. ## **TABLE 8-10: AUDIO INTERFACE TIMING SPECIFICATIONS** |**PARAMETER**|**SYMBOL**|**MIN**|**TYP**|**MAX**|**UNIT**| |---|---|---|---|---|---| |SCLK0 dutyratio
~~GO~~|dSCLK
~~GO~~|—
~~GO~~
~~GG~~|50
~~GO~~
~~GG~~|—
~~GO~~
~~GG~~|%
~~GO~~| |SCLK0 cycle time
~~GO~~
~~Ge~~|tSCLKCY
~~GO~~
~~Ge~~|50
~~GO~~
~~Ge~~
~~GG~~|—
~~GO~~
~~Ge~~
~~GG~~|—
~~GO~~
~~Ge~~
~~GG~~|ns
~~GO~~
~~Ge~~| |SCLK0 pulse width high
~~es~~|tSCLKCH
~~es~~|20
~~GG~~
~~es~~|—
~~GG~~
~~es~~|—
~~GG~~
~~es~~|ns
~~es~~| |SCLK0pulse width low
~~es~~
~~GO~~|tSCLKCL
~~es~~
~~GO~~|20
~~es~~
~~GO~~
~~GG~~|—
~~es~~
~~GO~~
~~GG~~|—
~~es~~
~~GO~~
~~GG~~|ns
~~es~~
~~GO~~| |RFS0 setuptime to SCLK0 risingedge
~~GO~~
~~Ge~~|tRFSSU
~~GO~~
~~Ge~~|10
~~GO~~
~~Ge~~
~~GG~~|—
~~GO~~
~~Ge~~
~~GG~~|—
~~GO~~
~~Ge~~
~~GG~~|ns
~~GO~~
~~Ge~~| |RFS0 hold time from SCLK0 risingedge
~~es~~|tRFSH
~~es~~|10
~~GG~~
~~es~~|—
~~GG~~
~~es~~|—
~~GG~~
~~es~~|ns
~~es~~| |DR0 hold time from SCLK0 risingedge
~~es~~
~~GO~~|tDH
~~es~~
~~GO~~|10
~~es~~
~~GO~~|—
~~es~~
~~GO~~|—
~~es~~
~~GO~~|ns
~~es~~
~~GO~~| **Advanced** DS60001403E-Page 57  2017-2018 Microchip Technology Inc. **BM62/64** ## **NOTES:** **Advanced** DS60001403E-Page 58  2017-2018 Microchip Technology Inc. **BM62/64** ## **9.0 SOLDERING RECOMMENDATIONS** The BM62/64 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM62/64 module can be soldered to the main PCB using standard leaded and lead-free solder reflow profiles. To avoid the damage to the module, follow these recommendations: - Do not exceed peak temperature (TP) of +260ºC. - Refer to the “Solder Paste” data sheet for specific reflow profile recommendations. - Use no-clean flux solder paste. - Do not wash the module, as moisture can be trapped under the shield. - Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. Figure 9-1 illustrates the reflow profile of the BM62/64 module. - Refer to Microchip Technology Application Note _“AN233 Solder Reflow Recommendation_ _**”**_ (DS00233) for the soldering reflow recommendations. ## **FIGURE 9-1: REFLOW PROFILE** **Advanced** DS60001403E-Page 59  2017-2018 Microchip Technology Inc. **BM62/64** ## **NOTES:** **Advanced** DS60001403E-Page 60  2017-2018 Microchip Technology Inc. **BM62/64** ## **10.0 ORDERING INFORMATION** Table 10-1 provides ordering information for the BM62/64 module. **TABLE 10-1: BM62/64 MODULE ORDERING INFORMATION** |**Module **|**Microchip IC**|**Description**|**Shield**|**Regulatory Certification**|**Part No.**| |---|---|---|---|---|---| |BM62|IS2062GM|Bluetooth 5.0 Stereo Audio module,
Class 2 with RF shield|Yes|FCC, ISED, CE, MIC, KCC,
NCC, SRRC, ANATEL|BM62SPKS1MC2| |BM62|IS2062GM|Bluetooth 5.0 Stereo Audio module,
Class 2 without RF shield|No|CE|BM62SPKA1MC2| |BM64|IS2064GM|Bluetooth 5.0 Stereo Audio module,
Class 2 with RF shield|Yes|FCC, ISED, CE, MIC, KCC,
NCC, SRRC, ANATEL|BM64SPKS1MC2| |BM64|IS2064GM|Bluetooth 5.0 Stereo Audio module,
Class 2 without RF shield|No|CE|BM64SPKA1MC2| |BM64|IS2064GM|Bluetooth 5.0 Stereo Audio module,
Class 1 with RF shield|Yes|FCC, ISED, CE, MIC, KCC,
NCC, SRRC|BM64SPKS1MC1| |BM64|IS2064GM|Bluetooth 5.0 Stereo Audio module,
Class 1 without RF shield|No|CE|BM64SPKA1MC1| **Note:** The BM62/64 module can be purchased through a Microchip representative. Visit www.microchip.com for the current pricing and a list of distributors for the product. **Advanced** DS60001403E-Page 61  2017-2018 Microchip Technology Inc. **BM62/64** ## **NOTES:** **Advanced** DS60001403E-Page 62  2017-2018 Microchip Technology Inc. **BM62/64** ## **APPENDIX A: CERTIFICATION NOTICES** - Japan - Korea - Taiwan The **BM62** module (BM62SPKS1MC2) has received regulatory approval for the following countries: - BT SIG/QDID: 110148 - United States/FCC ID: A8TBM62S2 - Canada/ISED - IC: 12246A-BM62S2 - HVIN: BM62SPKS1MC2 - Europe/CE - Japan/MIC: 005-101204 - Korea/KCC: MSIP-CRM-mcp-BM62SPKS1MC2 - Taiwan/NCC No: CCAN16LP0270T5 - China/SRRC: CMIIT ID: 2016DJ2656 - Brazil/ANATEL: 00633-17-03464 The **BM64C1 (Class 1)** module (BM64SPKS1MC1) has received regulatory approval for the following countries: - BT SIG/QDID: 110159 - United States/FCC ID: A8TBM64S1 - Canada/ISED - IC: 12246A-BM64S1 - HVIN: BM64SPKS1MC1 - Europe/CE - Japan/MIC: 005-101206 - Korea/KCC: MSIP-CRM-mcp-BM64SPKS1MC1 - Taiwan/NCC No: CCAN16LP0300T1 - China/SRRC: CMIIT ID: 2016DJ2453 The **BM64C2 (Class 2)** module (BM64SPKS1MC2) has received regulatory approval for the following countries: - BT SIG/QDID: 110148 - United States/FCC ID: A8TBM64S2 - Canada/ISED - IC: 12246A-BM64S2 - HVIN: BM64SPKS1MC2 - Europe/CE - Japan/MIC: 005-101205 - Korea/KCC: MSIP-CRM-mcp-BM64SPKS1MC2 - Taiwan/NCC No: CCAN16LP0280T8 - China/SRRC: CMIIT ID: 2016DJ2356 - Brazil/ANATEL: 03822-18-08759 ## **A.1 REGULATORY APPROVAL** This section outlines the regulatory information of the BM62/BM64C1/BM64C2 Stereo Audio modules for the following countries: - China - Brazil - Other Regulatory Jurisdictions ## A.1.1 UNITED STATES The BM62/BM64C1/BM64C2 Stereo Audio module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product, or host device) by the grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The host product itself is required to comply with all other applicable FCC equipment authorizations regulations, requirements and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions). ## A.1.2 LABELING AND USER INFORMATION REQUIREMENTS The BM62/BM64C1/BM64C2 Stereo Audio module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: - United States - Canada - Europe **Advanced** DS60001403E-Page 63  2017-2018 Microchip Technology Inc. **BM62/64** For the BM62: Contains Transmitter Module FCC ID: A8TBM62S2 or Contains FCC ID: A8TBM62S2 **This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation** For the BM64C1: Contains Transmitter Module FCC ID: A8TBM64S1 or Contains FCC ID: A8TBM64S1 **This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation** For the BM64C2: Contains Transmitter Module FCC ID: A8TBM64S2 or Contains FCC ID: A8TBM64S2 **This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation** A user’s manual for the product must include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna - Increase the separation between the equipment and receiver - • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected - Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) https://apps.fcc.gov/oetcf/kdb/index.cfm ## A.1.3 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. BM62 and BM64C2: These modules are approved for installation into mobile or/and portable host platforms. BM64C1:The installation of the transmitter must ensure that the antenna has a separation distance of at least 30 mm from all persons or compliance, and it must be demonstrated according to the FCC SAR procedures. **Advanced** DS60001403E-Page 64  2017-2018 Microchip Technology Inc. **BM62/64** ## A.1.4 HELPFUL WEB SITES Federal Communications Commission (FCC): https://www.fcc.gov/ FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): https://apps.fcc.gov/oetcf/kdb/index.cfm tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: **This device complies with Industry Canada’s license-exempt RSS standard(s). Operation is subject to the following two conditions:** **(1) This device may not cause interference, and** ## **A.2 Canada** The BM62/BM64C1/BM64C2 Stereo Audio module has been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. ## A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements (from RSP-100, Issue 11, Section 3): The host product shall be properly labeled to identify the module within the host device. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product, otherwise the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains”, or similar word expressing the same meaning, as follows: For the BM62: ## Contains IC: 12246A-BM62S2 For the BM64C1: Contains IC: 12246A-BM64S1 For the BM64C2: Contains IC: 12246A-BM64S2 User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio appara- **(2) This device must accept any interference, including interference that may cause undesired operation of the device.** **Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:** **(1) l'appareil ne doit pas produire de brouillage, et** **(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.** Guidelines on Transmitter Antenna for License Exempt Radio Apparatus: **Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain must be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.** **Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.** **Advanced** DS60001403E-Page 65  2017-2018 Microchip Technology Inc. **BM62/64** ## A.2.2 RF EXPOSURE All transmitters regulated by the Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands). This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters, except in accordance with Innovation, Science and Economic Development Canada multi-transmitter guidelines. BM62 and BM64C2: The device operates at an output power level which is within the ISED SAR test exemption limits at any user distance. BM64C1:The installation of the transmitter must ensure that the antenna has a separation distance of at least 30 mm from all persons or compliance must be demonstrated according to the ISED SAR procedures. _and non-radio equipment_ ” document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/20 3367/01.01.01_60/eg_203367v010101p.pdf . **Note:** To maintain conformance to the testing listed in Table A-1/Table A-2/Table A-3, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED. ## A.3.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM62/BM64C1/BM64C2 Stereo Audio module must follow CE marking requirements. ## A.2.3 HELPFUL WEBSITES Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/ ## **A.3 Europe** The BM62/BM64C1/BM64C2 Stereo Audio module is an Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM62/BM64C1/BM64C2 Stereo Audio module has been tested to RED 2014/53/EU Essential Requirements for Health and Safety (Article (3.1(a)), Electro Magnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table A-1/Table A-2/Table A-3. The ETSI provides guidance on modular devices in “ _Guide to the application of harmonised standards covering Article 3.1(b) and Article 3.2 of the Directive 2014/53/EU RED to multi-radio and combined radio_ **Advanced** DS60001403E-Page 66  2017-2018 Microchip Technology Inc. **BM62/64** **TABLE A-1: EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2)** |**Certification**|**Standards**|**Article**|**Laboratory**|**Report Number**|**Date**| |---|---|---|---|---|---| |Safety|EN 60950-1:2006+A11:2009+A1:
2010+A12:2011+A2:2013|[3.1(a)]|TUV,
Rheinland,
Taiwan|10055923 001|2016-04-20| |Health|EN 300 328 V1.9.1
EN 62479:2010|||10055775 001
(BDR/EDR)|2016-05-05| |||||10055772 001(BLE)|| |EMC|EN 301 489-1 V1.9.2
EN 301 489-17 V2.2.1|[3.1(b)]||10055205 001
(BM62SPKS1MC2)|2016-05-19| |||||10055207 001
(BM62SPKA1MC2)|| ||EN 301 489-1 V2.1.1
EN 301 489-1 V2.2.0
EN 301 489-17 V3.1.1
EN 301 489-17 V3.2.0|||10055205 002
(BM62SPKS1MC2)|2017-05-26| |||||10055207 002
(BM62SPKA1MC2)|| |Radio|EN 300 328 V1.9.1|(3.2)||10055775 001
(BDR/EDR)|2016-05-05| |||||10055772 001
(BLE)|| ||EN 300 328 V2.1.1|||10055775 002
(BDR/EDR)|2017-05-26| |||||10055772 002
(BLE)|| ## **TABLE A-2: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC1/BM64SPKA1MC1)** |**Certification**|**Standards**|**Article**|**Laboratory**|**Report Number**|**Date**| |---|---|---|---|---|---| |Safety|EN 60950-1:2006+A11:2009+
A1:2010+A12:2011+A2:2013|[3.1(a)]|TUV,
Rheinland,
Taiwan|10055924 001
50041199 001
(BDR/EDR)
50041198 001
(BLE)
50041199 002
(BDR/EDR)
10055194 001
(Shield)
10055196 001
(No shield)
10055194 002
(Shield)
10055196 002
(No shield)
50041199 001
(BDR/EDR)
50041198 001
(BLE)
50041199 002
(BDR/EDR)
50041198 002
(BLE)|2016-04-20| |Health|EN 300 328 V1.9.1
EN 62479:2010||||2016-07-05| ||EN 300 328 V2.1.1
EN 62311||||2017-05-26| |EMC|EN 301 489-1 V1.9.2
EN 301 489-17 V2.2.1|[3.1(b)]|||2016-05-19| ||EN 301 489-1 V2.1.1
EN 301 489-1 V2.2.0
EN 301 489-17 V3.1.1
EN 301 489-17 V3.2.0||||2017-05-26| |Radio|EN 300 328 V1.9.1|(3.2)|||2016-07-05| ||EN 300 328 V2.1.1||||2017-05-26| **Advanced** DS60001403E-Page 67  2017-2018 Microchip Technology Inc. **BM62/64** **TABLE A-3: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC2/BM64SPKA1MC2)** |**Certification**|**Standards**|**Article**|**Laboratory**|**Report Number**|**Date**| |---|---|---|---|---|---| |Safety|EN 60950-1:2006+A11:2009+A1:
2010+A12:2011+A2:2013|[3.1(a)]|TUV,
Rheinland,
Taiwan|10055925 001|2016-04-20| |Health|EN 300 328 V1.9.1
EN 62479:2010|||10055788 001
(BDR/EDR)|2016-04-29| |||||10055787 001
(BLE)|| |EMC|EN 301 489-1 V1.9.2
EN 301 489-17 V2.2.1|[3.1(b)]||10055200 001
(Shield)|2016-05-19| |||||10055202 001
(No shield)|| ||EN 301 489-1 V2.1.1
EN 301 489-1 V2.2.0
EN 301 489-17 V3.1.1
EN 301 489-17 V3.2.0|||10055202 002
(No shield)|2017-05-26| |||||10055200 002
(Shield)|| |Radio|EN 300 328 V1.9.1|(3.2)||10055788 001
(BDR/EDR)|2016-04-29| |||||10055787 001
(BLE)|| ||EN 300 328 V2.1.1|||10055788 002
(BDR/EDR)|2017-05-26| |||||10055787 002
(BLE)|| ## A.3.2 CONFORMITY ASSESSMENT From ETSI Guidance Note EG 203367, section 6.1 Non-radio products are combined with a radio product: If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required. The European Compliance Testing listed in Table A-1, Table A-2 and Table A-3 was performed using the Integral PCB antenna ## A.3.3 SIMPLIFIED EU DECLARATION OF CONFORMITY Hereby, Microchip Technology Inc. declares that the radio equipment type BM62/BM64C1/BM64C2 is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity, for this product, is available at: http://www.microchip.com/design-centers/wireless-con nectivity ## A.3.4 HELPFUL WEBSITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communications Committee (ECC) at: http://www.ecodocdb.dk/ Additional helpful web sites are: - Radio Equipment Directive (2014/53/EU): https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en - European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org - European Telecommunications Standards Institute (ETSI): http://www.etsi.org - The Radio Equipment Directive Compliance Association (REDCA): http://www.redca.eu/ ## **A.4 Japan** The BM62/BM64C1/BM64C2 Stereo Audio module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. **Advanced** DS60001403E-Page 68  2017-2018 Microchip Technology Inc. **BM62/64** Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: - If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator must contact their conformance laboratory to determine if this testing is required - There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html ## A.4.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM62/BM64C1/BM64C2 Stereo Audio module must follow Japan marking requirements. The integrator of the module must refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. For the BM62 Stereo Audio module, due to a limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside: not be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside: ## A.4.2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ ## **A.5 Korea** The BM62/BM64C1/BM64C2 Stereo Audio module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. ## A.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM62/BM64C1/BM64C2 Stereo Audio module must follow KC marking requirements. The integrator of the module must refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM62 Stereo Audio module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: For the BM64C1 Stereo Audio module, due to limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside: The BM64C1 Stereo Audio module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: For the BM64C2 Stereo Audio module, due to limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and can- **Advanced** DS60001403E-Page 69  2017-2018 Microchip Technology Inc. **BM62/64** The BM64C2 Stereo Audio module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: ~~[Cesrtnsromara~~ ## A.5.2 HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research Agency (RRA): http://rra.go.kr ## **A.6 Taiwan** The BM62/BM64C1/BM64C2 Stereo Audio module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product must contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. ## A.6.1 LABELING AND USER INFORMATION REQUIREMENTS For the BM62 Stereo Audio module, due to limited module size, the NCC mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the module label. For the BM64C2 Stereo Audio module, due to limited module size, the NCC Mark and ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. ## (ES16LP0280T8 The user's manual must contain below warning (for RF device) in traditional Chinese: 注意 ! 依據 低功率電波輻射性電機管理辦法 第十二條 經型式認證合格之低功率射頻電機，非經許 可， 公司、商號或使用者均不得擅自變更頻率、加大功率或 變更原設計 之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及 干擾合法通信； 經發現有干擾現象時，應立即停用，並改善至無干擾時 方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用 電波輻射性 電機設備之干擾。 ## A.6.2 HELPFUL WEB SITES National Communications Commission (NCC): http://www.ncc.gov.tw ## **A.7 China** For the BM64C1 Stereo Audio module, due to limited module size, the NCC Mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the module label. The BM62/BM64C1/BM64C2 Stereo Audio module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. ## A.7.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 Stereo Audio module is labeled with its own CMIIT ID as follows: When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2016DJ2656”. **Advanced** DS60001403E-Page 70  2017-2018 Microchip Technology Inc. **BM62/64** The BM64C1 Stereo Audio module is labeled with its own CMIIT ID as follows: When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2016DJ2453”. The BM64C2 Stereo Audio module is labeled with its own CMIIT ID as follows: Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. ## A.8.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 module does not carry the Homologation ID, due to the limited space. “Este produto esta homologado pela ANATEL, de acordo com os procedimentos regulamentados pela Resolucao 242/2000, e atende aos requisitos tecnicos aplicados”. Para maiores informacoes, consulte o site da ANATEL: www.anatel.gov.br When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2016DJ2356”. ## **A.8 Brazil** The BM62SPKS1MC2/BM64SPKS1MC2 Stereo Audio module has received compliance approval in accordance with the Telecommunications Act of the Federal Republic of Brazil National Telecommunications Agency (ANATEL). Customers seeking to use the compliance approval in their product must contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. **Advanced** DS60001403E-Page 71  2017-2018 Microchip Technology Inc. **BM62/64** The End product (Host) manual must include the following statement: For BM62SPKS1MC2: Este product contém a placa BM62SPKS1MC2 código de homologação ANATEL 00633-17-03464. For BM64SPKS1MC2: Este product contém a placa BM64SPKS1MC2 código de homologação ANATEL 03822-18-08759. ## **A.9 Other Regulatory Jurisdictions** - For information on the other countries jurisdictions covered, refer to the http://www.microchip.com/design-centers/wireless-connectivity/certifications. - Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, contact Microchip for the required utilities and documentation. **Advanced** DS60001403E-Page 72  2017-2018 Microchip Technology Inc. **BM62/64** ## **APPENDIX B: REVISION HISTORY** ## **Revision A (May 2016)** This is the initial released version of this document. ## **Revision B (December 2016)** This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. ## **TABLE B-1: MAJOR SECTION UPDATES** |**Section**|**Update Description**| |---|---| |**“Audio Codec”**|Updated the I2S digital audio applicability and SNR details of 20-bit
DAC and 16-bit ADC.| |**“Compliance”**|Updated the certification information.| |**1.0“Device Overview”**|Added USB and BLE and updated the Customized voice prompt
details inTable 1-1.
UpdatedFigure 1-4andTable 1-2with correct pin names for
pins 11 and 12.
Deleted the ROM details and updatedTable 1-2,Table 1-3.| |**2.2“Codec”**|Added a note for internal codec support and addition of trailing
zeros.| |**5.0“Application Information”**|UpdatedFigure 5-19andFigure 5-21.| |**8.0“Electrical Characteristics”**|Added the storage temperature details.| |**10.0“Ordering Information”**|UpdatedTable 10-1with regulatorycertification information.| |**Appendix A:“Certification Notices”**|Added Certification IDs and updated associated sections.| ## **Revision C (October 2017)** This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. ## **TABLE C-1: MAJOR SECTION UPDATES** |**Section**|**Update Description**| |---|---| |**“Compliance”**|Added Brazil certification information.
Updated Canada certification information.| |**1.0“Device Overview”**|UpdatedFigure 1-1,Figure 1-2, andFigure 1-5.
DeletedFigure 1-3andFigure 1-4.
UpdatedTable 1-1.
Updated pin description for pins ADAP_IN, BAT_IN and SYS_PWR
inTable 1-2andTable 1-3.| |**10.0“Ordering Information”**|UpdatedTable 10-1with Brazil and Canada regulatory certification
information.| |**Appendix A:“Certification Notices”**|Updated the United States, Canada and Europe certification informa-
tion.
Updated KDB and ECC URL links.
Added Brazil regulatorycertification details.| **Advanced** DS60001403E-Page 73  2017-2018 Microchip Technology Inc. **BM62/64** ## **Revision D (March 2018)** This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. ## **TABLE D-1: MAJOR SECTION UPDATES** |**Section**|**Update Description**| |---|---| |**1.0“Device Overview”**|Updated pin type for LED pins inTable 1-2andTable 1-3| |**4.4“Under Voltage Protection (Software**
**Dependent UVP)”**|Updated the section| |**5.0“Application Information”**|Added**5.1 “Power Supply”**,**5.2.1 “Device FW Upgrade (DFU)”**
and**5.2.1.1 “Enter BT Module/MCU DFU mode”**.
AddedFigure 5-1,Figure 5-9andFigure 5-10.
UpdatedFigure 5-4,Figure 5-8,Figure 5-20andTable 5-1.| |**8.0“Electrical Characteristics”**|UpdatedTable 8-2.| ## **Revision E (September 2018)** This revision includes the following changes, which were incorporated throughout the document. ## **TABLE E-1: MAJOR SECTION UPDATES** |**Section**|**Update Description**| |---|---| |Document|Updated Bluetooth version 4.2 to 5.0| |**A.8“Brazil”**|Updated with the certification for BM64SPKS1MC2 module| |Figure 5-8|• Updated with 2.7V information in figure.
• Updated figure footnotes.| **Advanced** DS60001403E-Page 74  2017-2018 Microchip Technology Inc. **BM62/64** ## **THE MICROCHIP WEBSITE** Microchip provides online support via our WWW site at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: - **Product Support** – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software - **General Technical Support** – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing ## **CUSTOMER SUPPORT** Users of Microchip products can receive assistance through several channels: - Distributor or Representative - Local Sales Office - Field Application Engineer (FAE) - Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. 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DS60001403E-page 75  2015-2018 Microchip Technology Inc. **BM62/64** ## **NOTES:** DS60001403E-page 76  2015-2018 Microchip Technology Inc. **Note the following details of the code protection feature on Microchip devices:** - Microchip products meet the specification contained in their particular Microchip Data Sheet. - Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. - There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. - Microchip is willing to work with the customer who is concerned about the integrity of their code. - Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE **.** Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. _Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC[®] MCUs and dsPIC[®] DSCs, KEELOQ[®] code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified._ ## **QUALITY MANAGEMENT SYSTEM** ## **CERTIFIED BY DNV** ## **Trademarks** The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. - © 2018, Microchip Technology Incorporated, All Rights Reserved. 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