BM63574S-VC

## **Inverter for motor control** 

## **600V IGBT Intelligent Power Module (IPM)** 

## **BM63574S-VA  BM63574S-VC** 

## **General Description** 

BM63574S-VA/-VC is an Intelligent Power Module composed of gate drivers, bootstrap diodes, IGBTs, fly wheel diodes. 

## **Features** 

## **Key Specifications** 

   -  IGBT Collector-Emitter Voltage VCESAT: 1.5V(Typ)  FWD Forward Voltage VF: 1.55V(Typ)  FWD Reverse Recovery Time trr: 100ns(Typ)  Module Case Temperature TC: -25 to +115°C  Junction Temperature Tjmax: 150°C 

-  3phase DC/AC Inverter 

-  600V/15A 

**==> picture [495 x 447] intentionally omitted <==**

**----- Start of picture text -----**<br>
 Low Side IGBT Open Emitter  Package  W(Typ) x D(Typ) x H(Typ)<br> Built -in Bootstrap Diode  HSDIP25   38.0mm x 24.0mm x 3.5mm<br> High Side IGBT Gate Driver(HVIC):  HSDIP25VC   38.0mm x 24.0mm x 3.5mm<br>SOI (Silicon On Insulator) Process,<br>Drive Circuit, High Voltage Level Shifting,<br>Current Limit for Bootstrap Diode,<br>Control Supply Under-Voltage Locked Out (UVLO)<br> Low Side IGBT Gate Driver(LVIC):  Low Side IGBT Gate Driver(LVIC):<br>Drive Circuit, Short Circuit Current Protection (SCP),<br>Control Supply Under Voltage Locked Out (UVLO),<br>Temperature Output by Analog Signal (VOT)<br> Fault Signal(LVIC)<br>Corresponding to SCP (Low Side IGBT), UVLO Fault<br> Input Interface 3.3V, 5V Line<br> UL Recognized: UL1557 File E468261<br>HSDIP25<br> AC100 to 240Vrms(DC Voltage: Less Than 400V)  "<br>Class Motor Control<br> Compressor Motor Control for Air Conditioner,<br>Washing Machine, Refrigerator<br>Typical Application Circuit<br>2 VBU<br>+<br>3 VBV<br>+<br>P  24<br>4 VBW<br>+<br>U  23<br>5 HINU<br>ig 6 HINV  V  | 22 M<br>7 HINW<br>8 HVCC  W  21 +<br>9  GND<br>NU  20<br>= 10 LINU  oO]<br>11 LINV<br>12 LINW<br>a 5V  13 LVCC  NV  f 19<br>14  FO<br>Fi 15V  r + s 15 CIN  NW  18 ‘<br>16 GND<br>17 VOT<br>MCU<br>**----- End of picture text -----**<br>


-  Low Side IGBT Gate Driver(LVIC):  Low Side IGBT Gate Driver(LVIC): Drive Circuit, Short Circuit Current Protection (SCP), Control Supply Under Voltage Locked Out (UVLO), Temperature Output by Analog Signal (VOT) 

## **Application** 

## **Typical Application Circuit** 

Figure 1. Example of Application Circuit 

`○` **Product structure: Semiconductor IC** `○` **This product is not designed for protection against radioactive rays .** www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. **1/20** TSZ22111 `・` 14 `・` 001 

**TSQ50501-BM63574S-2 30.Jul.2020 Rev.006** 

**BM63574S-VA  BM63574S-VC** 

## **Pin Configuration** 

TOP VIEW 

**==> picture [309 x 322] intentionally omitted <==**

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17  18<br>GND VOT  : 1819 NW NV<br>CIN<br>20 NU<br>FO  12.6mm<br>LVCC<br>LINW<br>21<br>LINV  — 9.2mm  } W<br>LINU<br>GND<br>22  V<br>HVCC  =<br>Tc detecting point<br>HINW<br>HINV<br>23  U<br>HINU  = [t]<br>VBW  ‘<br>24  P<br>VBV  «<br>VBU  a<br>NC  25 f NC<br>1  25<br>**----- End of picture text -----**<br>


Figure 2. Pin Configuration and Tc Detecting Point 

**Pin Description** 

|Pin No.<br>~~Os~~<br>~~Re~~|Pin Name<br>~~Os~~|Function<br>~~Os~~|Pin No.<br>~~Os~~|Pin Name<br>~~Os~~|Function<br>~~Os~~|
|---|---|---|---|---|---|
|1<br>~~Os~~<br>~~Re~~|NC<br>~~Os~~|No connection(GNDpotential)<br>~~Os~~|14<br>~~Os~~|FO<br>~~Os~~|Alarm output<br>~~Os~~|
|2<br>~~Re~~<br>~~a~~<br>~~ee ee~~|VBU<br>~~a~~<br>~~ee~~|U phase floating control supply|15|CIN|Detecting of short circuit current<br>trip voltage|
|3<br>~~a ~~<br>~~ee ee~~<br>~~ee ee~~|VBV<br> ~~a~~<br>~~ee~~<br>~~ee~~|Vphase floatingcontrol supply|16|GND|Ground(Note 1)|
|4<br>~~ee ee~~<br>~~ee ee~~<br>~~ee ee~~|VBW<br>~~ee~~<br>~~ee~~<br>~~ee~~|Wphase floatingcontrol supply|17|VOT|Temperature output|
|5<br>~~ee ee~~<br>~~ee ee~~|HINU<br>~~ee~~<br>~~ee~~|Uphase high side IGBT control|18|NW|Wphase low side IGBT emitter|
|6<br>~~ee ee~~<br>~~a~~<br>~~ee~~|HINV<br>~~ee~~|Vphase high side IGBT control|19|NV|Vphase low side IGBT emitter|
|7<br>~~a~~<br>~~ee~~<br>~~es~~|HINW|Wphase high side IGBT control|20|NU|Uphase low side IGBT emitter|
|8<br>~~ee~~<br>~~es~~<br>~~es~~|HVCC|Control supplyfor HVIC|21|W|Wphase output|
|9<br>~~es~~<br>~~es~~<br>~~es~~|GND|Ground(Note 1)|22|V|Vphase output|
|10<br>~~es~~<br>~~es~~<br>~~es~~|LINU|Uphase low side IGBT control|23|U|Uphase output|
|11<br>~~es~~<br>~~es~~<br>~~ee~~|LINV|Vphase low side IGBT control|24|P|Inverter supply|
|12<br>~~es~~<br>~~ee~~<br>~~ee~~|LINW|Wphase low side IGBT control|25|NC|No connection(Note 2)|
|13<br>~~ee~~<br>~~ee~~|LVCC|Control supplyfor LVIC||||



(Note 1) Two GND pins (9 & 16pin) are connected inside IPM, please connect one pin (16pin is recommended) to the 15V power supply GND outside and leave the other open. 

(Note 2) NC pin (25pin) is not electrically connected to any other potential inside. 

www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 `・` 15 `・` 001 

**TSQ50501-BM63574S-2 30.Jul.2020 Rev.006** 

**2/20** 

**BM63574S-VA  BM63574S-VC** 

## **Block Diagram** 

**==> picture [322 x 438] intentionally omitted <==**

**----- Start of picture text -----**<br>
P<br>VBU  24<br>2<br>VBV<br>3 U<br>23<br>VBW<br>4 High Side<br>Gate Driver<br>(HVIC)<br>V<br>22<br>HINU<br>5<br>HINV<br>6<br>HINW<br>7 W<br>HVCC  21<br>8<br>GND<br>9<br>LINU<br>10<br>LINV<br>11<br>LINW<br>12<br>NU<br>LVCC  20<br>13<br>Low Side<br>Gate Driver<br>FO  (LVIC)<br>14  NV<br>19<br>CIN<br>15<br>GND<br>16<br>17 [VOT ] NW<br>18<br>**----- End of picture text -----**<br>


Figure 3. Block Diagram 

## **Description of Block** 

- 1) High Side IGBT Drive (HVIC, Bootstrap Diode) High voltage level shifting circuit drives high side IGBT. Built-in bootstrap diode and current limit function for bootstrap diode enable HVIC to drive high side IGBT without external component (bootstrap diode, resistor). There is under-voltage-locked-out (UVLO) function for floating control power supply. 

- 2) Low Side IGBT Drive (LVIC) LVIC drives low side IGBT. 

   - There is short circuit current protection (SCP), under-voltage locked out (UVLO) for control power supply LVCC function. Alarm signal (FO) will output when these protection circuits work. 

LVIC detects temperature of itself, transform temperature into analog voltage, and output voltage to VOT pin. 

www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 `・` 15 `・` 001 

**TSQ50501-BM63574S-2 30.Jul.2020 Rev.006** 

**3/20** 

**BM63574S-VA  BM63574S-VC** 

## **Absolute Maximum Ratings (Unless otherwise specified, Tj=25°C) Inverter Part** 

|**verter Part**|**verter Part**|||||
|---|---|---|---|---|---|
|Item||Symbol|Ratings|Unit|Conditions|
|SupplyVoltage||VP|450|V|Applied between P-NU,NV,NW|
|SupplyVoltage(Surge)||VP(surge)|500|V|Applied between P-NU,NV,NW|
|Collector-Emitter Voltage||VCES|600|V||
|Collector Current|DC|IC|±15(Note 1)|A|TC=25°C|
||PEAK|ICP|±45(Note 1)|A|TC=25°C, less than 1ms|
|Collector Power Dissipation||PC|41|W|TC=25°C,per 1 chip|
|Junction Temperature||Tjmax|150|°C||



(Note 1) Do not, however exceed PC, ASO. 

## **Control part** 

|**ontrol part**|||||
|---|---|---|---|---|
|Item|Symbol|Ratings|Unit|Conditions|
|Control Power Supply|VCC|20|V|Applied between HVCC-GND, LVCC-GND|
|FloatingControl Power Supply|VBS|20|V|Applied between VBU-U, VBV-V, VBW-W|
|Control Input Voltage|VIN|-0.5 to VCC+0.5|V|Applied between HINX, LINX-GND<br>(X=U,V,W)|
|Fault Output SupplyVoltage|VFO|-0.5 to VCC+0.5|V|Applied between FO-GND|
|Fault Output Current|IFO|1|mA|Sink current at FOpin|
|Current SensingInput Voltage|VCIN|-0.5 to +7.0|V|Applied between CIN-GND|
|Temperature Output Voltage|VOT|-0.5 to +7.0|V|Applied between VOT-GND|
|**ootstrap diode part**|||||
|Item|Symbol|Ratings|Unit|Conditions|
|Reverse Voltage|VRB|600|V||
|Junction Temperature|TjmaxD|150|°C||
|**tal system **|||||
|Item|Symbol|Ratings|Unit|Conditions|
|Self Protection Supply Voltage<br>(SCP Capability)|VP(PROT)|400|V|VCC=13.5 to 16.5V, Inverter part<br>Tj=125°C, non-repetitive, less than 2µs|
|Module Case Temperature|TC|-25 to +115|°C|Measurement point of TCis provided<br>in Figure 2|
|Storage Temperature|Tstg|-40 to +125|°C||
|Isolation Voltage|Viso|1500|Vrms|Sinusoidal, 60Hz, AC 1min,<br>between connected all pins and heat sink<br>plate|



## **Bootstrap diode part** 

## **Total system** 

## **Thermal resistance** 

|**ermal resistance**|||||||
|---|---|---|---|---|---|---|
|Item|Symbol|Limit|||Unit|Conditions|
|||Min|Typ|Max|||
|Junction to Case Thermal|Rth(j-c)_IGBT|-|-|3.0|°C /W|Inverter IGBT(1/6 module)|
|Resistance(Note 2)|Rth(j-c)_FWD|-|-|3.9|°C /W|Inverter FWD(1/6 module)|



(Note 2) Grease with good conductivity and high reliability should be applied evenly with +100 to +200µm on the contacting surface of IPM and heat sink. Use a torque wrench to fasten up to the specified torque rating. The contacting thermal resistance between IPM case and heat sink is determined by the thickness and the thermal conductivity of the applied grease. 

**Caution:** Operating the IPM over the absolute maximum ratings may damage the IPM. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IPM is operated over the absolute maximum ratings. 

www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 `・` 15 `・` 001 

**TSQ50501-BM63574S-2 30.Jul.2020 Rev.006** 

**4/20** 

**BM63574S-VA  BM63574S-VC** 

**Recommended Operating Conditions** 

|Item|Symbol|Limit|Limit|Limit|Unit|Conditions|
|---|---|---|---|---|---|---|
|||Min|Typ|Max|||
|SupplyVoltage|VP|0|300|400|V|Applied between P-NU,NV,NW|
|Control Power Supply|VCC|13.5|15.0|16.5|V|Applied between<br>HVCC-GND, LVCC-GND|
|Floating Control Power Supply|VBS|13.0|15.0|18.5|V|Applied between<br>VBU-U, VBV-V, VBW-W|
|Control Power Supply Variation|`⊿`VCC<br>`⊿`VBS|-1|-|+1|V/µs||
|Control Input Voltage|VIN|0|-|5.5|V||
|Current SensingInput Voltage|VCIN|0|-|5.5|V||
|Blanking Time for Preventing<br>Arm-short|tdead|1.0|-|-|µs|For each input signal|
|PWM Input Frequency|fPWM|-|-|20|kHz|TC≤ 100°C, Tj≤ 125°C|
|High Side IGBT<br>Minimum Input Pulse Width(Note1)|PWONH|0.8|-|-|µs||
||PWOFFH|0.8|-|-|µs||
|Low Side IGBT<br>Minimum Input Pulse Width(Note1)|PWONL|0.8|-|-|µs||
||PWOFFL|0.8|-|-|µs||
|Voltage Variation Between<br>GND-NU, NV, NW|VN|-5|-|+5|V|Between GND-NU, NV, NW<br>(Including surge voltage)|
|Junction Temperature|Tj|-25|-|+125|°C||



(Note 1) IPM might not respond if the input signal pulse width is less than PWON, PWOFF. 

## **Electrical Characteristics (Unless otherwise specified, Tj=25°C, VCC=VBS=15V, VP=300V) Inverter Part** 

|**verter Part**|||||||
|---|---|---|---|---|---|---|
|Item|Symbol|Limit|||Unit|Conditions|
|||Min|Typ|Max|||
|Collector-Emitter Saturation Voltage|VCESAT|-|1.50|1.90|V|IC=15A|
|||-|0.85|1.15|V|IC=1.5A|
|Collector-Emitter Cut-off Current|ICES|-|-|100|µA|VCE=VCES|
|FWD Forward Voltage|VF|-|1.55|2.00|V|IF=15A|
|FWD Reverse RecoveryTime|trr|-|100|-|ns|Inductive Load, IC=15A|
|High Side IGBT Turn on DelayTime|tonH|0.75|1.25|1.85|µs|Inductive Load, IC=15A|
|High Side IGBT Turn on SwitchingTime|tc(on)H|-|0.30|-|µs|Inductive Load, IC=15A|
|High Side IGBT Turn off DelayTime|toffH|-|1.15|1.75|µs|Inductive Load, IC=15A|
|High Side IGBT Turn off SwitchingTime|tc(off)H|-|0.15|-|µs|Inductive Load, IC=15A|
|Low Side IGBT Turn on DelayTime|tonL|0.75|1.25|1.85|µs|Inductive Load, IC=15A|
|Low Side IGBT Turn on SwitchingTime|tc(on)L|-|0.30|-|µs|Inductive Load, IC=15A|
|Low Side IGBT Turn off DelayTime|toffL|-|1.40|2.00|µs|Inductive Load, IC=15A|
|Low Side IGBT Turn off SwitchingTime|tc(off)L|-|0.15|-|µs|Inductive Load, IC=15A|



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HINX<br>LINX  50%  50%<br>trr<br>toff ton<br>IC tdoff VCE tdon<br>90%  90%<br>tf<br>10%  10%  10%  10%<br>tc(off) tc(on)<br>**----- End of picture text -----**<br>


Figure 4. Switching Time Definition 

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**TSQ50501-BM63574S-2 30.Jul.2020 Rev.006** 

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**BM63574S-VA  BM63574S-VC** 

## **Control part** 

|**ontrolpart**|||||||
|---|---|---|---|---|---|---|
|Item|Symbol|Limit|||Unit|Conditions|
|||Min|Typ|Max|||
|**Whole**|||||||
|VCC Circuit Current 1|ICC1|-|1.20|2.40|mA|VIN=0V|
|VCC Circuit Current 2|ICC2|-|1.40|2.80|mA|VIN=5V|
|VBS Circuit Current 1|IBS1|-|0.06|0.15|mA|VIN=0V|
|VBS Circuit Current 2|IBS2|-|0.06|0.15|mA|VIN=5V|
|**Control Input(HINU,HINV,HINW,LINU,LINV,LINW)**|||||||
|H Level Input Current|IINH|0.7|1.0|1.5|mA|VIN=5V|
|L Level Input Current|IINL|-10|-|-|µA|VIN=0V|
|H Level Input Threshold Voltage|VINH|-|-|2.6|V||
|L Level Input Threshold Voltage|VINL|0.8|-|-|V||
|Input Hysteresis Voltage|VHYS|-|0.25|-|V||
|HINU-GND Resistance(Note 1)|RHINU|35|50|68|kΩ|HVCC=0V, IHINU=2µA|
|HINV-GND Resistance(Note 1)|RHINV|70|100|136|kΩ|HVCC=0V, IHINV=2µA|
|HINW-GND Resistance(Note 1)|RHINW|70|100|136|kΩ|HVCC=0V, IHINW=2µA|
|**Short Circuit Current Protection(SCP)**|||||||
|CIN Input Bias Current|ICIN|-2|-|-|µA|CIN=0V|
|TripVoltage|VSC|0.455|0.480|0.505|V||
|**Under Voltage Locked Out(UVLO)**|||||||
|VCC TripVoltage|VCCUVT|10.5|11.5|12.5|V||
|VCC Release Voltage|VCCUVR|11|12|13|V||
|VBS TripVoltage|VBSUVT|10|11|12|V||
|VBS Release Voltage|VBSUVR|10.5|11.5|12.5|V||
|**Temperature Output(VOT)**|||||||
|VOT Voltage(Note 2)|VOT|2.72|2.77|2.82|V|LVIC temperature = 90°C|
|||0.93|1.13|1.33|V|LVIC temperature = 25°C|
|**Fault Output(FO)**|||||||
|Output low Voltage|VFO|-|-|0.95|V|IFO=1mA|
|Leak Current|IFOLEAK|-|-|10|µA|VFO=5V|
|(Note 3)|tFOSC|45|-|-|µs|DuringSCP Operation|
|Output Pulse Width|tFOUV|90|-|-|µs|DuringVCC UVLO Operation|



(Note 1)  Resistance value when current from the control input pin is flowing through the internal resistor to GND. 

(Note 2)  IPM does not shutdown IGBTs and output fault signal automatically when temperature rises excessively. When temperature exceeds the protective level that user defined, controller (MCU) should stop the IPM. 

(Note 3)  FO pulse width for each protection mode is different. FO will continue to output until recovering from the error condition if the time of error condition exceeds the determined output pulse width depending on the protection mode. 

## **Bootstrap Diode Part** 

|**ootstrap Diode Part**|||||||
|---|---|---|---|---|---|---|
|Item|Symbol|Limit|||Unit|Conditions|
|||Min|Typ|Max|||
|Forward Voltage|VFB1|0.3|0.6|0.9|V|IFB=1mA<br>Voltage drop between<br>HVCC-VBX (X=U,V,W)|
||VFB2|1.1|2.0|2.9|V|IFB=100mA<br>Voltage drop between<br>HVCC-VBX (X=U,V,W)|
|Reverse Current|IRB|-|-|10|µA|VRB=600V|
|Reverse RecoveryTime|trrB|-|80|-|ns|IFB=0.1A|



www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 `・` 15 `・` 001 

**TSQ50501-BM63574S-2 30.Jul.2020 Rev.006** 

**6/20** 

**BM63574S-VA  BM63574S-VC** 

## **Mechanical Characteristics And Ratings** 

|Item|Limit|Limit|Limit|Unit|Following Standard|Conditions|
|---|---|---|---|---|---|---|
||Min|Typ|Max||||
|Mounting Torque|0.59|0.69|0.78|N･m|-|Mounting Screw M3(Note 1)<br>Recommended 0.69N･m(Note 2)|
|Pin Pulling Strength|10|-|-|s|EIAJ-ED-4701/400|Load<br>Control Pin:4.9N<br>Power Pin:9.8N|
|Pin Bending Strength|2|-|-|times|EIAJ-ED-4701/400|Load<br>Control Pin: 2.45N<br>Power Pin:4.9N<br>90deg. Bend|
|Weight|-|10|-|g|-||
|Heat Sink Flatness|0|-|+200|µm|-|Measurement point<br>is providedin Figure 6-1.|



(Note 1) Plain washers of 8mm outside diameter (ISO 7089 to 7094) are recommended. 

(Note 2) When installing a module to a heat sink, excessive uneven fastening force might apply stress to inside chips or ceramic of heat sink plate, which will break or crack or degrade a module. An example of recommended fastening sequence is shown in Figure 5. The temporary fastening torque is set to 20 to 30% of the maximum torque rating. Evenly apply thermally-conductive grease with 100µm to 200µm thickness over the contact surface between the module and the heat sink. Also, pay attention not to have any dirt left on the contact surface between the module and the heat sink. It is recommended to install a module directly to a heat sink after applying grease. When installing a module to a heat sink, inserting a heat radiation sheet between a module and a heat sink might apply stress depending on thickness and elastic modulus of the sheet to inside chips or ceramic of heat sink plate, which will break or crack or degrade a module. When using a heat radiation sheet, it is needed to prevent IPM from bending into + side of Figure 6-2. 

**==> picture [178 x 67] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>Temporary fastening ： 1 → 2<br>Permanent fastening ： 1 → 2<br>**----- End of picture text -----**<br>


Figure 5. Example of Recommended Fastening Sequence 

TOP VIEW 

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(+)<br>**----- End of picture text -----**<br>


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(+)<br>(+)  Pe Heat Radiation Sheet<br>Heatsink<br>**----- End of picture text -----**<br>


Figure 6-1. Measurement Point of Heat Sink Flatness 

Figure 6-2. Flatness after Installing to a Heat Sink (When Using a Heat Radiation Sheet) 

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**TSQ50501-BM63574S-2 30.Jul.2020 Rev.006** 

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**BM63574S-VA  BM63574S-VC** 

## **Typical Performance Curve** 

**==> picture [490 x 240] intentionally omitted <==**

**----- Start of picture text -----**<br>
500 200<br>Tj=25℃ Tj=25℃<br>VCC=15V 175 V CC =15V<br>400<br>150<br>125<br>300<br>100<br>200<br>75<br>50<br>100<br>25<br>0 0<br>0 3 6 9 12 15 0.0 0.5 1.0 1.5 2.0 2.5 3.0<br>VF[V] VF[V]<br>[mA] [mA]<br>IF IF<br>**----- End of picture text -----**<br>


Figure 7. IF vs VF Characteristic of Bootstrap Diode IF-VF Curve Between HVCC-VBX pin (X=U,V,W) 

Figure 8. Magnification of Figure 7 

**==> picture [239 x 239] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0<br>Tj=25℃<br>VCC=15V<br>0.8<br>0.6<br>0.4<br>0.2<br>0.0<br>0.0 0.2 0.4 0.6 0.8 1.0<br>IFO[mA]<br>[V]<br>FO<br>V<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
4.00<br>VCC=15V<br>3.75<br>3.50<br>3.25<br>3.00<br>2.75<br>2.50<br>2.25<br>2.00<br>60 70 80 90 100 110 120<br>LVIC Tj[℃]<br>[V]<br>OT<br>V<br>**----- End of picture text -----**<br>


Figure 9. VFO vs IFO (Characteristic of FO pin VFO-IFO Curve) 

Figure 10. VOT vs LVIC Tj (Characteristic of VOT pin VOT-Tj Curve) 

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**TSQ50501-BM63574S-2 30.Jul.2020 Rev.006** 

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**BM63574S-VA  BM63574S-VC** 

## **Timing Chart** 

- 1) Short Circuit Current Protection (protection with the external shunt resistor and RC filter) 

- a1. Normal operation: IGBT ON and outputs current IC. 

- a2. Short circuit current detection (SCP trigger) 

It is recommended to set RC time constant of 1.0µs so that IGBT shuts down within 2.0µs when SCP is triggered. 

- a3. All low side IGBT’s gates are shut down (soft turn off). 

- a4. All low side IGBTs turn off. 

- a5. FO outputs for tFO=45µs (Min). 

- a6. LIN=L 

- a7. LIN=H, but all IGBTs keep OFF during SCP=H. 

- a8. FO finishes output , but IGBTs don’t turn on until inputting the next ON signal(LIN=L `→` H) 

IGBT of each phase can return to normal state by inputting ON signal to each phase. 

a9. Normal operation: IGBT ON and outputs current IC. 

**==> picture [381 x 262] intentionally omitted <==**

**----- Start of picture text -----**<br>
LIN  a6  a7  a8<br>SCP  SET  RESET<br>a9<br>a3<br>IGBT Gate<br>a2<br>SCP Trip Current<br>a1  a4<br>Ic<br>SCP Trip Voltage<br>Shunt Resistor Voltage<br>Delay by RC Filter<br>FO  a5<br>**----- End of picture text -----**<br>


Figure 11. SCP Timing Chart 

## Notice 

SCP works only for low side IGBT only. 

In case of SCP trip and FO output, please stop controlling IPM quickly to avoid the abnormal state. 

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- 2) Control Supply (LVCC) Under Voltage Locked Out (UVLO) 

- b1. Control supply(LVCC) voltage exceeds UVLO release level (VCCUVR), but IGBT turns on by the next ON signal (LIN=L `→` H).IGBT of each phase can return to normal state by inputting ON signal to each phase. 

- b2. Normal operation: IGBT ON and outputs current IC. 

- b3. LVCC drops to UVLO trip level (VCCUVT). 

- b4. All low side IGBTs turn off in spite of control input condition. 

- b5. FO outputs for tFO=minimum 90µs, but output is extended while LVCC is below VCCUVR. 

- b6. LVCC reaches VCCUVR. 

- b7. Even if LVCC reaches VCCUVR during LIN=H, IGBTs don’t turn on until inputting the next ON signal (LIN=L `→` H). b8. Normal operation: IGBT ON and outputs current IC. 

**==> picture [370 x 181] intentionally omitted <==**

**----- Start of picture text -----**<br>
LIN  b7<br>UVLO  RESET  SET  RESET<br>b1  b3  b6<br>VCCUVR<br>LVCC<br>VCCUVT<br>b2  b8<br>b4<br>Ic<br>b5<br>FO<br>**----- End of picture text -----**<br>


Figure 12. LVCC UVLO Timing Chart 

- 3) Control supply (VBS) Under Voltage Locked Out (UVLO) 

- c1. Control supply(VBS) voltage exceeds UVLO release level (VBSUVR), but IGBT turns on by the next ON signal (HIN=L `→` H). 

- c2. Normal operation: IGBT ON and outputs current IC. 

- c3. VBS drops to UVLO trip level (VBSUVT). 

- c4. Only IGBT of the corresponding phase turns off in spite of control input signal, there is no FO signal output. c5. VBS reaches VBSUVR. 

- c6. Even if VBS reaches VBSUVR during HIN=H, IGBTs don’t turn on until inputting the next ON signal (HIN=L `→` H). 

- c7. Normal operation: IGBT ON and outputs current IC. 

**==> picture [370 x 181] intentionally omitted <==**

**----- Start of picture text -----**<br>
HIN  c6<br>UVLO  RESET  SET  RESET<br>c1  c3  c5<br>VBSUVR<br>VBS<br>VBSUVT<br>c2  c7<br>c4<br>Ic<br>FO  FO=H<br>**----- End of picture text -----**<br>


Figure 13. VBS UVLO Timing Chart 

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## **Application Example (one shunt resistor drive)** 

**==> picture [184 x 55] intentionally omitted <==**

**----- Start of picture text -----**<br>
Bootstrap negative electrodes should be<br>connected to U, V, W pins directly and<br>separated from the main output wires.<br>**----- End of picture text -----**<br>


**==> picture [495 x 556] intentionally omitted <==**

**----- Start of picture text -----**<br>
P<br>C1 D1 C2  VBU  24<br>2<br>+<br>VBV<br>+  3 U  23<br>VBW<br>+  4 High Side<br>Gate Driver<br>(HVIC)<br>V<br>22<br>M<br>HINU<br>5<br>6 HINV  +<br>HINW<br>7 W  C4<br>HVCC  21<br>8<br>GND<br>C2  9<br>LINU<br>10 Long wiring here might<br>LINV  cause short circuit failure.<br>11<br>LINW<br>12<br>NU<br>LVCC  20<br>13 C<br>5V<br>C2<br>Low Side<br>Gate Driver  Shunt<br>R1  FO  (LVIC)  Resistor<br>14  NV<br>19<br>15V<br>C3  D  N<br>+  CIN<br>15<br>D1  GND<br>16<br>17 [VOT ] NW<br>18<br>B  R2<br>C5<br>A<br>Long wiring here might cause SCP level fluctuation<br>and malfunction.<br>MCU<br>**----- End of picture text -----**<br>


Figure 14. Example of Application Circuit 

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## **Selection of Components Externally Connected (Refer to Figure 14)** 

- 1) VBU, VBV, VBW pin 

- `・` The bypass capacitor(good temperature, frequency characteristic electrolytic type C1: 22µF to 100µF) should be mounted as close as possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply ripple. In addition, for the purpose of reducing of the power supply’s impedance in wide frequency bandwidth, ceramic capacitor (good temperature, frequency and DC bias characteristic ceramic type C2: 0.1µF to 0.22µF) should also be mounted. 

- `・` Zenner diode D1(1W) should be mounted between each pair of control supply pins to prevent surge destruction. 

- `・` Line ripple voltage should meet dV/dt ≤1V/µs, Vripple ≤ 2Vp-p. 

- `・` The wiring from U, V, W pin should be as thick and as short as possible. They should be connected directly and separated from the main output wires. 

## 2) HVCC, LVCC pin 

- `・` The bypass capacitor(good temperature, frequency characteristic electrolytic type C3) should be mounted as close as possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply ripple. In addition, for the purpose of reducing of the power supply’s impedance in wide frequency bandwidth, ceramic capacitor (good temperature, frequency and DC bias characteristic ceramic type C2: 0.1µF to 0.22µF) should also be mounted. 

- `・` Zenner diode D1(1W) should be mounted between each pair of control supply pins to prevent surge destruction. 

- `・` Line ripple voltage should meet dV/dt ≤ 1V/µs, Vripple ≤ 2Vp-p. 

## 3) P pin 

- `・` To prevent surge destruction, the wiring between the smoothing capacitor and P, N pins should be as short as possible. `・` Snubber capacitor(C4: 0.1µF to 0.22µF) should be mounted between the P-N pin. 

- 4) Control Input pin (HINU, HINV, HINW, LINU, LINV, LINW) 

- `・` The wiring should be as short as possible to prevent malfunction. 

- `・` Input drive is active-high type. There is a 3.3kΩ(Min) pull-down resistor in the input circuit of IPM. When using RC coupling circuit, make sure the input signal level meet the input threshold voltage. 

- `・` Dead time of input signal should be more than specified value. 

- `・` The pull-down resistors in Control Input pins become effective when voltage supplied into LVCC and HVCC pins are in the range of recommended operating condition. Control Input pins have high impedance when power supply to LVCC and HVCC pins are off. When power supply to HVCC pin is off, the pull-down resistance of HINU, HINV, HINW pins is the value written on Page 6. 

- 5) FO pin 

- `・` FO output is open drain type. It should be pulled up to control power supply(e.g. 5V, 15V) by a resistor that makes IFO up to 1mA.IFO is estimated roughly by the formula of control power supply voltage divided by pull-up resistance(R1). In the case of pulled up to 5V, R1=10kΩ is recommended. 

## 6) CIN pin 

- `・` RC filter(R2, C5) should be mounted as close as possible to the pin in order to prevent malfunction by recovery current or switching noise. It is recommended to select tight tolerance, temp-compensated type for RC filter (R2, C5). The time constant R2C5 (1.0µs is recommended) should be set so that SCP current is shut down within 2µs. Please confirm operation on the actual application since SCP shutdown time changes depending on the PCB wiring pattern. 

- `・` The point D at which the wiring to CIN filter is divided should be near the pin of shunt resistor. NU, NV, NW pin should be connected at near NU, NV, NW pin. 

- `・` To prevent malfunction, the wiring of B should be as short as possible. 

- 7) VOT pin (Refer to Fugure 15) 

- `・` It is recommended to insert 5.1kΩ pull down resistor for getting linear output characteristics at lower temperature than room temperature. When the pull down resistor is inserted between VOT and GND (control GND), the extra current calculated by VOT output voltage divided by pull down resistance flows as LVIC circuit current continuously. In the case of only using VOT for detecting higher temperature than room temperature, it isn't necessary to insert the pull down resistor. 

- `・` In the case of using VOT with low voltage controller (e.g. 3.3V MCU), VOT output might exceed control supply voltage 3.3V when temperature rises excessively. If system uses low voltage controller, it is recommended to insert a clamp diode between control supply of the controller and VOT for preventing over voltage. 

- `・` In the case of using low voltage controller like 3.3V MCU, if it is necessary to set the trip VOT level to control supply voltage (e.g. 3.3V) or more, there is the method of dividing the VOT output by resistance voltage divider circuit and then inputting to A/D converter on MCU. In that case, sum of the resistances of divider circuit should be as much as 5kΩ. 

- `・` When VOT pin is not used, please do not connect VOT pin to any other nodes. 

- `・` Please refer the application note for this product about the usage of VOT output. 

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**----- Start of picture text -----**<br>
LVIC<br>Temperature<br>－<br>Signal<br>VOT<br>MCU<br>Ref  ＋<br>GND<br>**----- End of picture text -----**<br>


Figure 15. Example of VOT External Circuit 

## 8) GND pin 

- `・` Two GND pins (9 & 16 pin) are connected inside IPM. Please connect one pin (16 pin is recommended.) to the 15V power supply GND outside and leave the other open. 

- `・` If control GND is connected with power GND by common broad pattern, it may cause malfunction by power GND fluctuation. It is recommended to connect control GND and power GND at only a point N (near the pin of shunt resistor). 

- `・` To prevent malfunction, the wiring of A should be as short as possible. 

- 9) NU, NV, NW pin 

- `・` When operating with one-shunt resistor, please short the three pins(NU, NV, NW). In addition, to prevent malfunction, the wiring of C should be as short as possible. 

- 10) One-shunt Resistor Drive 

**==> picture [428 x 148] intentionally omitted <==**

**----- Start of picture text -----**<br>
NU, NV, NW should be all connected each other at nearest pins.<br>Wiring inductance should be less than 10nH.<br>IPM  (Inductance of a copper pattern with length=17mm, width=3mm is about 10nH.)<br>NU<br>N<br>NV<br>GND  NW<br>Wiring from GND pin should be connected close<br>RC filter  to the pin of shunt resistor.<br>Wiring from shunt resistor to RC filter should be connected<br>near the pin of shunt resistor.<br>**----- End of picture text -----**<br>


Low inductance shunt resistor like surface mounted (SMD) type is recommended. 

Figure 16. Wiring Pattern around the Shunt Resistor when Operating with One-shunt Resistor 

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- 11) Three-shunt Resistors Drive 

- `・` It is not recommended to input the voltage of each shunt resistor directly to the CIN pin when IPM is operated with three shunt resistor. In that case, it is necessary to use the external protection circuit as below. 

- `・` It is necessary to set the time constant Ruff(1.0µs is recommended) of external comparator input so that IGBT stops within 2µs when short circuit occurs. Please confirm operation on the actual application since SCP shutdown time changes depending on the PCB wiring pattern. 

- `・` It is recommended for the threshold voltage VREF to be set to the same rating of short circuit trip level(VSC=0.48V(Typ)) 

- `・` To prevent malfunction, the wiring of A, B, C should be as short as possible. 

- `・` OR output high level when protection works should be 0.505V(maximum VSC rating) to 7V(CIN absolute maximum rating). 

**==> picture [451 x 251] intentionally omitted <==**

**----- Start of picture text -----**<br>
Wiring inductance should be less than 10nH.<br>(Inductance of a copper pattern with length=17mm, width=3mm is about 10nH.)<br>IPM  External protection circuit<br>C<br>NU<br>CIN  N  Wiring from GND pin should be connected close<br>NV  to the pin of shunt resistor.<br>GND  NW<br>A  Rf<br>B<br>-  5V<br>Cf +<br>Wiring from shunt resistor to  -<br>RC filter should be connected  +  OR output<br>closet to the pin of shunt<br>resistor.<br>-<br>VREF  +<br>Comparator<br>(Open collector type)<br>**----- End of picture text -----**<br>


Figure 17. Wiring Pattern around the Shunt Resistor when operating with Three-shunt Resistors 

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## **I/O Equivalence Circuit** 

**==> picture [432 x 558] intentionally omitted <==**

**----- Start of picture text -----**<br>
HINX<br>5kΩ<br>VOT<br>LVCC<br>LVCC<br>LINU<br>LINV<br>5kΩ  FO<br>LVCC<br>HVCC<br>LINW<br>5kΩ<br>VBX<br>P<br>X<br>CIN<br>LVCC<br>NX<br>GND<br>**----- End of picture text -----**<br>


Figure 18. Input / Output Equivalent Circuit (X=U, V, W) 

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## **Operational Notes** 

## **1. Reverse Connection of Power Supply** 

- Connecting the power supply in reverse polarity can damage the IPM. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IPM’s power supply pins. 

## **2. Power Supply Lines** 

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 

## **3. Ground Voltage** 

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IPM and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 

**4. Ground Wiring Pattern** 

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 

## **5. Thermal Consideration** 

- Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. 

## **6. Recommended Operating Conditions** 

- These conditions represent a range within which the expected characteristics of the IPM can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 

## **7. Inrush Current** 

When power is first supplied to the IPM, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IPM has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 

## **8. Testing on Application Boards** 

When testing the IPM on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IPM to stress. Always discharge capacitors completely after each process or step. The IPM’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IPM during assembly and use similar precautions during transport and storage. 

## **9. Inter-pin Short and Mounting Errors** 

Ensure that the direction and position are correct when mounting the IPM on the PCB. Incorrect mounting may result in damaging the IPM. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 

## **10. Unused Input Pins** 

Input pins of an IPM are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IPM. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 

## **11. Area of Safe Operation (ASO)** 

Operate the IPM such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 

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## **Ordering Information** 

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**----- Start of picture text -----**<br>
B  M  6  3  5  7  4  S  -  xx<br>Part Number  Package  Packaging and Forming Specification<br>S:HSDIP25  -VA: Tube, Long pin type<br>  HSDIP25VC  -VC: Tube, Staggered type(control side)<br>**----- End of picture text -----**<br>


## **Marking Diagram** 

**==> picture [279 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
BOTTOM VIEW<br>Part Number Marking<br>LOT Number<br>QR Code<br>**----- End of picture text -----**<br>


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## **Physical Dimension, Tape and Reel Information** 

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**----- Start of picture text -----**<br>
Package Name  HSDIP25<br>**----- End of picture text -----**<br>


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**Physical Dimension, Tape and Reel Information – continued** 

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**----- Start of picture text -----**<br>
Package Name  HSDIP25VC<br>**----- End of picture text -----**<br>


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## **Revision History** 

|**vision History**|||
|---|---|---|
|Date|Revision|Changes|
|30.Jul.2020|001|New Release|



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## **Notice** 

## **Precaution on using ROHM Products** 

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.).  If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment[(Note 1)] , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 

|(Note1) Medical Equipment Classification of the Specific Applications|(Note1) Medical Equipment Classification of the Specific Applications|(Note1) Medical Equipment Classification of the Specific Applications|(Note1) Medical Equipment Classification of the Specific Applications|
|---|---|---|---|
|JAPAN|USA|EU|CHINA|
|CLASS`Ⅲ`|CLASS`Ⅲ`|CLASS`Ⅱ`b|CLASS`Ⅲ`|
|CLASS`Ⅳ`||CLASS`Ⅲ`||



2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: 

   - [a] Installation of protection circuits or other protective devices to improve system safety 

   - [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 

3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions.  If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: 

   - [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents 

   - [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust 

   - [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 

   - [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves 

   - [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items 

   - [f] Sealing or coating our Products with resin or other coating materials 

   - [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering 

   - [h] Use of the Products in places subject to dew condensation 

4. The Products are not subject to radiation-proof design. 

5. Please verify and confirm characteristics of the final or mounted products in using the Products. 

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 

8. Confirm that operation temperature is within the specified range described in the product specification. 

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. 

## **Precaution for Mounting / Circuit board design** 

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. 

For details, please refer to ROHM Mounting specification 

> **[Notice-PGA-E ]** © 2015 ROHM Co., Ltd. All rights reserved. 

**Rev.004** 

## **Precautions Regarding Application Examples and External Circuits** 

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 

2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use.  Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document.  ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. 

## **Precaution for Electrostatic** 

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). 

## **Precaution for Storage / Transportation** 

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 

   - [b] the temperature or humidity exceeds those recommended by ROHM 

   - [c] the Products are exposed to direct sunshine or condensation 

   - [d] the Products are exposed to high Electrostatic 

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 

3.  Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 

4.  Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. 

## **Precaution for Product Label** 

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. 

## **Precaution for Disposition** 

When disposing Products please dispose them properly using an authorized industry waste company. 

## **Precaution for Foreign Exchange and Foreign Trade act** 

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. 

## **Precaution Regarding Intellectual Property Rights** 

1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. 

## **Other Precaution** 

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 

4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. 

> **[Notice-PGA-E ]** © 2015 ROHM Co., Ltd. All rights reserved. 

**Rev.004** 

Datasheet 

## **General Precaution** 

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 

2. All information contained in this docume nt is current as  of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this  document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 

> **[Notice – WE ]** © 2015 ROHM Co., Ltd. All rights reserved. 

**Rev.001**