# Stereo Audio Module, Bluetooth 4.1, 3 V to 4.2 V Supply, Class 2, -91 dBm Sensitivity ![Product image](https://novapart.co/image/farnell:2920769/) **URL**: https://novapart.co/products/BM20SPKS1NBC-0001AA/stereo-audio-module-bluetooth-41-3-v-to-42-supply **SKU**: BM20SPKS1NBC-0001AA **Manufacturer**: MICROCHIP **Category**: Wireless Modules & Adaptors || Communications & Networking Modules || Bluetooth Modules & Adaptors **Price**: €8.2400 **Stock**: 50+ **Lead Time**: 127 days (indicative) ## Description Bluetooth Version:Bluetooth 4.1; Supply Voltage Min:3V; Supply Voltage Max:4.2V; Signal Range Max:-; Data Rate:-; Bluetooth Class:Class 2; Receive Sensitivity:-91dBm; Operating T ## Specifications | Parameter | Value | |---|---| | Svhc | No SVHC (04-Feb-2026) | | Interfaces | UART | | Product Range | - | | Certifications | ANATEL, CE, FCC, IC, IFT, KC, MIC, NCC, SRRC | | Bluetooth Class | Class 2 | | Bluetooth Version | Bluetooth 4.1 | | Supply Voltage Range | 3 V to 4.2 V | | Receiver Sensitivity Rx | -91 dBm | | Operating Temperature Range | -20 °C to 70 °C | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:2920769/) **BM20/23** ## **Bluetooth[®] Stereo Audio Module** ## **Introduction** The BM20/23 stereo audio module is a Bluetooth v5.0 (BDR/EDR) audio module for designers to add wireless audio and voice applications to their products. This Bluetooth SIG-certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package. This stereo module contains a built-in Li-Ion charger and a digital audio interface (BM23). It supports HSP, HFP, SPP, A2DP, and AVRCP profiles. Both AAC and SBC Codecs are supported for A2DP. **Note:** The customers must connect their own external analog Codec/DSP/amplifier and MCU for audio output. ## **Figure 1. BM20 and BM23 Module** **==> picture [33 x 10] intentionally omitted <==** **----- Start of picture text -----**
BM20
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**==> picture [33 x 10] intentionally omitted <==** **----- Start of picture text -----**
BM23
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## **Features** - Qualified for Bluetooth v5.0 Specification - HFP v1.6, HSP v1.1, A2DP v1.2, AVRCP v1.5, SPP v1.0, PBAP v1.0 - Bluetooth Classic, Basic Rate/Enhanced Data Rate (BDR/EDR) - On-Board Embedded Bluetooth Stack - Easy to Configure with Windows Graphical User Interface (GUI) or Direct by Microcontroller Unit (MCU) - Compact Surface Mount Module: - 29 x 15 x 2.5 mm - Castellated surface mount pads **Datasheet** DS70005406B-page 1 © 2019 Microchip Technology Inc. **BM20/23** - Integrated 3V and 1.8V Configurable Switching Regulator and LDO - Built-in Lithium-ion Battery Charger (up to 350 mA) - Built-in ADC for Battery Monitor and Voltage Sense - Audio-In/Out - BM23 supports digital audio I[2] S format - BM20 supports analog audio output - Transparent Universal Asynchronous Receiver/Transmitter (UART) Mode for Seamless Serial Data Over UART Interface - Integrated Crystal Oscillator and Matching Circuitry - Secure AES128 Encryption ## **RF/Analog** - Frequency Spectrum: 2.402 GHz to 2.480 GHz - Receive Sensitivity: -91 dB (π/4 DQPSK) - Transmitter Output Power: +4 dBm (maximum) for Class 2 ## **Audio processor** - Support 64 Kbps A-Law, μ-Law PCM format/Continuous Variable Slope Delta Modulation (CVSD) for SCO Channel Operation - Noise Reduction (NR) and Acoustic Echo Cancellation (ACE) - Sub-Band Coding (SBC) and Optional Advanced Audio Coding (AAC) Decoding - Packet Loss Concealment (PLC) - Four Languages (Chinese/ English/ Spanish/ French) Voice Prompts Support (20 events for each language) using the IS20XXS_UI tool - Serial Copy Management System (SCMS-T) Content Protection ## **Audio Codec** - 20-Bit Digital-to-Analog Converter (DAC) and 16-bit Analog-to-Digital Converter (ADC) Codec - 98 dB Signal-to-Noise ratio (SNR) DAC Playback ## **Peripherals** - One Line-in Port for External Audio Input - Two LED Drivers - One UART Interface - Multiple I/O Pins for Control and Status - High-Speed HCI-UART Interface (supports up to 921,600 bps) ## **Antenna** - PCB Antenna ## **Compliance** - Bluetooth Special Interest Group (SIG) Certified: – BM20 QDID: 121137 - BM23 QDID: 121137 **Datasheet** DS70005406B-page 2 © 2019 Microchip Technology Inc. **BM20/23** - BM20/23 modules have been granted modular approval from various countries. For additional details, refer to Certification Notices. - RoHS Compliant ## **Operating Conditions** - Operating Voltage: 3.0V to 4.2V - Temperature Range: -20°C to 70°C ## **Applications** - Bluetooth Sound Bar - Bluetooth Stereo Speaker Phone **Datasheet** DS70005406B-page 3 © 2019 Microchip Technology Inc. **BM20/23** ## **Table of Contents** |Introduction.....................................................................................................................................................1|Introduction.....................................................................................................................................................1| |---|---| |Features......................................................................................................................................................... 1|| ||RF/Analog............................................................................................................................................... 2| ||Audio processor ..................................................................................................................................... 2| ||Audio Codec............................................................................................................................................2| ||Peripherals..............................................................................................................................................2| ||Antenna...................................................................................................................................................2| ||Compliance............................................................................................................................................. 2| ||Operating Conditions.............................................................................................................................. 3| ||Applications.............................................................................................................................................3| |1.|Device Overview..................................................................................................................................... 6| ||1.1.
Interface Description.................................................................................................................... 6| |2.|Application Information..........................................................................................................................13| ||2.1.
Operation with External MCU.....................................................................................................13| ||2.2.
I2S Mode Application..................................................................................................................18| ||2.3.
RESET (RST_N)........................................................................................................................ 19| ||2.4.
Status LED (LED1, LED2)..........................................................................................................19| ||2.5.
External Configuration................................................................................................................19| |3.|Electrical Characteristics.......................................................................................................................21| |4.|Printed Antenna Information................................................................................................................. 26| ||4.1.
Module Radiation Pattern...........................................................................................................26| ||4.2.
Module Placement Rules........................................................................................................... 27| |5.|Reference Circuit.................................................................................................................................. 29| ||5.1.
BM20 Reference Circuit............................................................................................................. 29| ||5.2.
BM23 Reference circuit..............................................................................................................31| |6.|Physical Dimensions.............................................................................................................................34| |7.|Reflow Profile........................................................................................................................................38| ||7.1.
Soldering Recommendations..................................................................................................... 38| ||7.2.
Packing and Storage Information...............................................................................................38| |8.|Ordering Information............................................................................................................................. 40| |9.|Certification Notices.............................................................................................................................. 41| ||9.1.
United States..............................................................................................................................41| ||9.2.
Canada.......................................................................................................................................43| ||9.3.
Europe........................................................................................................................................44| ||9.4.
Japan..........................................................................................................................................46| ||9.5.
Korea..........................................................................................................................................47| ||9.6.
Taiwan........................................................................................................................................ 47| ||9.7.
China..........................................................................................................................................48| **Datasheet** DS70005406B-page 4 © 2019 Microchip Technology Inc. **BM20/23** |9.8.
Brazil.......................................................................................................................................... 49| |---| |9.9.
Mexico........................................................................................................................................49| |9.10. Argentina....................................................................................................................................50| |9.11.
Other Regulatory Jurisdictions................................................................................................... 50| |10. Document Revision History...................................................................................................................51| |The Microchip Website.................................................................................................................................52| |Product Change Notification Service............................................................................................................52| |Customer Support........................................................................................................................................ 52| |Microchip Devices Code Protection Feature................................................................................................52| |Legal Notice................................................................................................................................................. 52| |Trademarks.................................................................................................................................................. 53| |Quality Management System....................................................................................................................... 53| |Worldwide Sales and Service.......................................................................................................................54| **Datasheet** DS70005406B-page 5 © 2019 Microchip Technology Inc. **BM20/23 Device Overview** ## **1. Device Overview** The BM20 and BM23 stereo module is built around the IS2020S and IS2023S SoCs, respectively, which integrates the Bluetooth radio transceiver, a Power Management Unit (PMU), and a Digital Signal Processor (DSP). The following figure illustrates a typical example of the BM20 module that operates as an independent system or when connected to an MCU. **Figure 1-1. BM20 Typical Application** The following figure illustrates a typical example of the BM23 module connected to an external MCU and a DSP/ Codec. **Figure 1-2. BM23 Typical Application** ## **1.1 Interface Description** The following figure illustrates the pin diagram of the BM20 module. **Datasheet** DS70005406B-page 6 © 2019 Microchip Technology Inc. **BM20/23 Device Overview** **Figure 1-3. BM20 Module Pin Diagram** The following table provides the pin description of the BM20 module. **Table 1-1. BM20 Module Pin Description** |**Pin**
**No.**|**Name**|**Pin type**|**Description**| |---|---|---|---| |1|P0_0|I/O|I/O pin, default pull-high input(Note 1)
•
Slide switch detector, active-low
•
UART TX_IND, active-low| |2|EAN|I|Embedded ROM/External Flash enable
H: Embedded; L: External Flash| |3|P3_0|I|I/O pin, default pull-high input(Note 1)
Line-in Detector (default), active-low| |4|P2_0|I|I/O pin, default pull-high input
System Configuration,
H: Application L: Base band (Test Mode)| **Datasheet** DS70005406B-page 7 © 2019 Microchip Technology Inc. **BM20/23 Device Overview** |**...........continued**|**...........continued**|**...........continued**|**...........continued**| |---|---|---|---| |**Pin**
**No.**|**Name**|**Pin type**|**Description**| |5|P1_5|I/O|I/O pin, default pull-high input(Note 1)
•
NFC detection pin, active low
•
Out_Ind_0
•
Slide Switch Detector, active low
•
Buzzer Signal Output| |6|P0_4|I/O|I/O pin, default pull-high input(Note 1)
•
NFC detection pin, active low
•
Out_Ind_0| |7|SPKR|O|Right-channel, analog headphone output| |8|AOHPM|O|Headphone common mode output/sense input| |9|SPKL|O|Left-channel, analog headphone output| |10|VDDA|P|Positive power supply/reference voltage for Codec, no need to add power to
this pin| |11|MIC1_P|I|MIC 1 mono differential analog positive input| |12|MIC1_N|I|MIC 1 mono differential analog negative input| |13|MIC_BIAS|P|Electric microphone biasing voltage| |14|AIR|I|Right-channel, single-ended analog input| |15|AIL|I|Left-channel, single-ended analog input| |16|RST|I|System Reset pin, Low: reset| |17|VCC_RF|P|1.28V RF LDO output, no need to add power to this pin| |18|P0_1|I/O|I/O pin, default pull-high input(Note 1)
•
FWD key, when Class 2 RF (default), active-low
•
Class 1 Tx Control signal of external RF T/R switch, active-high| |19|VDD_IO|P|Power output, no need to add power to this pin| |20|ADAP_IN|P|5V Power adapter input| |21|BAT_IN|P|3.0V to 4.2V Li-Ion battery input| |22|NC|-|No connection| |23|GND|P|Ground pin| |24|SYS_PWR|P|System power output
BAT mode: 3.0 to 4.2V
Adapter mode: 4.0V| |25|BK_OUT|P|1.8V Buck output, no need to add power to this pin| |26|MFB|I|•
Power key in off mode
•
UART_RX_IND: MCU used to wake-up Bluetooth(Note 1)| |27|LED1|I|LED driver 1| |28|LED2|I|LED driver 2| **Datasheet** DS70005406B-page 8 © 2019 Microchip Technology Inc. **BM20/23 Device Overview** |**...........continued**|**...........continued**|**...........continued**|**...........continued**| |---|---|---|---| |**Pin**
**No.**|**Name**|**Pin type**|**Description**| |29|P2_4|I|I/O pin, default pull-high input
System Configuration
L: Boot Mode with P2_0 low combination| |30|P0_2|I|I/O pin, default pull-high input(Note 1)
Play/Pause key (default), active-low| |31|P0_3|I/O|I/O pin, default pull-high input(Note 1)
•
REV key (default), active low
•
Buzzer Signal Output
•
Out_Ind_1
•
Class1 Rx control signal of external RF T/R switch, active-high| |32|HCI_TXD|O|HCI-UART data output| |33|HCI_RXD|I|HCI-UART data input| |34|P0_5|I|I/O pin, default pull-high input(Note 1)
Volume down (default), active-low| |35|P2_7|I|I/O pin, default pull-high input(Note 1)
Volume up key (default), active-low| |36|P2_4|I|I/O pin, default pull-high input
System Configuration,
L: Boot Mode with P2_0 low combination| |37|GND|P|Ground pin| |38|NC|-|No Connection| |39|NC|-|No Connection| |40|NC|-|No Connection| - I: Input pin - O: Output pin - I/O: Input/Output pin - P: Power pin **Note:** All I/O pins can be configured using the IS20XXS_UI tool. The following figure illustrates the pin diagram of the BM23 module. **Datasheet** DS70005406B-page 9 © 2019 Microchip Technology Inc. **BM20/23 Device Overview** **Figure 1-4. BM23 Module Pin Diagram** **Table 1-2. BM23 Pin Description** |**Pin**
**No.**|**Name**|**Pin Type**|**Description**| |---|---|---|---| |1|P0_0|I/O|•
I/O pin, default pull-high input(Note 1)
•
UART TX_IND| |2|RFS0|I/O|I2S interface: DAC Left/Right clock| |3|TFS0|I/O|I2S interface: ADC Left/Right clock| |4|SLK0|I/O|I2S interface: Bit clock| |5|DR0|I|I2S interface: DAC Digital Left/Right data| |6|DT0|O|I2S interface: ADC Digital Left/Right data| |7|P0_4|I/O|I/O pin, default pull-high input| **Datasheet** DS70005406B-page 10 © 2019 Microchip Technology Inc. **BM20/23 Device Overview** |**...........continued**|**...........continued**|**...........continued**|**...........continued**| |---|---|---|---| |**Pin**
**No.**|**Name**|**Pin Type**|**Description**| |8|EAN|I|Embedded ROM/External Flash enable
High: ROM mode;
Low: External Flash mode| |9|MIC1_P|I|MIC 1 mono differential analog positive input| |10|MIC1_N|I|MIC 1 mono differential analog negative input| |11|MIC_BIAS|P|Power output, microphone biasing voltage| |12|VDDA|P|Power output, reserve for external capacitance to fine tune audio frequency| |13|AIR|I|Right-channel, stereo analog line-in| |14|AIL|I|Left-channel, stereo analog line-in| |15|GND|P|Ground| |16|RST|I|System Reset pin, active when rising edge| |17|NC|-|-| |18|NC|-|-| |19|VDDIO|P|Power output, VDDIO pin, no need to add power to this pin| |20|P1_5|I/O|I/O pin, default pull-high input| |21|P0_1|I/O|I/O pin, default pull-high input| |22|ADAP_IN|P|5V power adapter input| |23|BAT_IN|P|3.3V to 4.2V Li-Ion battery input| |24|NC|-|-| |25|SYS_PWR|P|System Power Output
BAT mode: 3.3 to 4.2V
Adapter mode: 4.0V| |26|BK_OUT|P|1.8V power output, no need to add power to this pin| |27|MFB|P|•
Power key, when in Off mode
•
UART_RX_IND: MCU used to wake up Bluetooth| |28|LED1|P|LED driver 1 and maximum 4 mA| |29|LED2|P|LED driver 2 and maximum 4 mA| |30|P2_4|I|I/O pin, default pull-high input
System Configuration,
L– Boot Mode with P2_0 low combination| |31|P0_2|I/O|I/O pin, default pull-high input| |32|P0_3|I/O|I/O pin, default pull-high input| |33|HCI_TXD|O|HCI-UART data output| |34|HCI_RXD|I|HCI-UART data input| **Datasheet** DS70005406B-page 11 © 2019 Microchip Technology Inc. **BM20/23 Device Overview** |**...........continued**|**...........continued**|**...........continued**|**...........continued**| |---|---|---|---| |**Pin**
**No.**|**Name**|**Pin Type**|**Description**| |35|P0_5|I/O|I/O pin, default pull-high input| |36|P2_7|I/O|I/O pin, default pull-high input| |37|P2_0|I/O|I/O pin, default pull-high input| |38|P3_0|I/O|I/O pin, default pull-high input| |39|P2_0|I|I/O pin, default pull-high input
System Configuration,
H: Application L: Base band (Test Mode)| |40|GND|P|Ground| |41|NC|-|-| |42|NC|-|-| |43|NC|-|-| - I: Input pin - O: Output pin - I/O: Input/Output pin - P: Power pin **Note:** All I/O pins can be configured using the IS20XXS_UI tool. **Datasheet** DS70005406B-page 12 © 2019 Microchip Technology Inc. **BM20/23** **Application Information** ## **2. Application Information** ## **2.1 Operation with External MCU** The BM20/23 stereo module supports a UART command set to make an external MCU control the module. The following figure illustrates the interface between the BM20/23 module and an external MCU. **Figure 2-1. Interface between MCU and BM20/23 Module** The MCU controls the module by the UART interface and wakes up the module by the PWR pin. The stereo module provides a wake-up MCU function that connects to P0_0 pin of the module. Refer to the _UART Command Set_ document for a list of functions the BM20/23 module supports and how to use the UI tool to configure the UART and UART Command Set tool. For a more detailed description, refer to the _UART_CommandSet_v154_ document and the IS20XXS_UI tool. A UART control signal timing sequence is illustrated in the following figure. **Datasheet** DS70005406B-page 13 © 2019 Microchip Technology Inc. **BM20/23 Application Information** ~~Te Ny)fs~~ **Datasheet** DS70005406B-page 14 © 2019 Microchip Technology Inc. **BM20/23** **Application Information** A timing sequence of Rx indication after power-on is illustrated in the following figure. **Figure 2-3. Timing Sequence of Rx Indication After Power-On** A timing sequence of Rx indication after power-off is illustrated in the following figure. **Figure 2-4. Timing Sequence of Rx Indication After Power-Off** A timing sequence of power-on (Nack) is illustrated in the following figure. **Datasheet** DS70005406B-page 15 © 2019 Microchip Technology Inc. **BM20/23 Application Information** **==> picture [361 x 603] intentionally omitted <==** **----- Start of picture text -----**
HAH
ACK
UART
Command
any
Maximum: 5 times (1s)
Retry, if ACK is not received
Power-on ACK
Wait
200 ms
Power-on
NACK
20 ms
10 ms
400 ms
Set “Power-on Directly” boot
idle
Power- on/initial
1 ms
Figure 2-5. Timing Sequence of Power-On (Nack) BAT_IN SYS_PWR MCU state MFB (PWR) BK_OUT/LDO31_VO RST_N MCU sends UART command (BM2x RT_RX) BM62/64 response UART state (BM2x UART_TX)
≈ ≈ ≈ ≈ ≈ ≈ ≈ ≈
≈ ≈ ≈ ≈ ≈ ≈ ≈ ≈
**----- End of picture text -----**
**Datasheet** DS70005406B-page 16 © 2019 Microchip Technology Inc. **BM20/23** **Application Information** If the module is hanged, the reset timing sequence must be as illustrated in the following figure. **Figure 2-6. Reset Timing Sequence if Module is Hanged** If the MCU sends a UART Command and Bluetooth does not respond within X-ms, then the MCU sends a reset signal to BT to perform the hardware reset. A timing sequence of power drop protection is illustrated in the following figure. **Figure 2-7. Timing Sequence of Power Drop Protection** If the Bluetooth BAT uses an adapter that translates voltage by LDO, it is recommended to use “Reset IC” to avoid power-off suddenly. The Rest IC output pin must be “Open Drain” with a delay time ≦ 10 ms and the recommended part is TCM809SVNB713 or G691L263T73. **Datasheet** DS70005406B-page 17 © 2019 Microchip Technology Inc. **BM20/23 Application Information** ## **2.2 I[2] S Mode Application** The BM23 module provides an I[2] S digital audio signal interface to connect with an external Codec/DSP. It provides 8, 44.1 and 48 kHz sampling rates for 16-bit and 24-bit data formats. The I[2] S setting can be configured by using the UI and DSP tools. The external Codec/DSP is connected to SLK0, RFS0, TFS0, DR0, and DT0 (pins 4, 2, 3, 5, and 6 respectively). The I[2] S signal connection between the BM23 and external DSP is illustrated in the following figure. **Figure 2-8. Master Mode Reference Connection** The Slave mode reference connection is shown in the following figure. **Figure 2-9. Slave Mode Reference Connection** ## **Note:** 1. For 002 version chip or module, the system must connect line 1 in the above figure. 2. For other version chip or module, the system must connect line 2 in the above figure. For Master or Slave mode setting, use the DSP Configuration Tool to set up the system. The following figures illustrate the clock and data timing diagram. **Datasheet** DS70005406B-page 18 © 2019 Microchip Technology Inc. **BM20/23 Application Information** **Figure 2-10. Timing for I[2] S Modes (both Master and Slave)** The following figures illustrate the timing diagram in the PCM modes. **Figure 2-11. Timing Diagram for PCM Modes (Master/Slave)** ## **2.3 RESET (RST_N)** RST is the module reset pin, which is in Active-Low state. To reset the module, the RST_N pin must hold LOW for at least 63 ns. ## **2.4 Status LED (LED1, LED2)** The status LED provides the following status indications: - Standby - Inquiry - Link - Link Back - Low Battery - Page - Battery Charging **Note:** Each LED flashing sequence and brightness status indications are configurable by the UI tool. ## **2.5** ## **External Configuration** The BM20/23 stereo module can be configured and the firmware programmed using an external configuration and programming tool available from Microchip. The following figure illustrates the configuration and firmware programming interface on BM23. It is recommended to include a pin header on the main PCB for development. **Datasheet** DS70005406B-page 19 © 2019 Microchip Technology Inc. **BM20/23 Application Information** **Figure 2-12. External Programming Header Connections** Configuration and firmware programming modes are entered according to the system configuration I/O pins as shown in the following table. Pins P20, P24 and EAN contain internal pull-up. **Table 2-1. System Configuration Settings** |**P20**|**P24**|**EAN**|**Operational Mode**| |---|---|---|---| |High|High|High|APP mode (Normal operation)| |Low|High|High|APP mode (Normal operation)| |Low|Low|High|Write Flash (Firmware programming, if flash build-in in chip)| **Datasheet** DS70005406B-page 20 © 2019 Microchip Technology Inc. **BM20/23 Electrical Characteristics** ## **3. Electrical Characteristics** The following table provides the absolute maximum specification conditions of the BM20/23 module. **Table 3-1. Absolute Maximum Specification** |**Symbol**|**Parameter**|**Min.**|**Max.**|**Unit**| |---|---|---|---|---| |BAT_IN|Input voltage for battery|0|4.3|V| |ADAP_IN|Input voltage for adapter|0|7.0|V| |TSTORE|Storage temperature|-65|+150|ºC| |TOPERATION|Operation temperature|-20|+70|ºC| The following table provides the recommended operating condition of the BM20/23 module. **Table 3-2. Recommended Operating Condition** |**Symbol**|**Parameter**|**Min.**|**Typical**|**Max.**|**Unit**| |---|---|---|---|---|---| |BAT_IN|Input voltage for battery|3|3.7|4.2|V| |ADAP_IN|Input voltage for adapter|4.5|5|5.5|V| |TOPERATION|Operation temperature|-20|+25|+70|ºC| **Note:** The absolute and recommended operating condition tables reflect typical usage for device. Stresses listed under Absolute Maximum Ratings cause permanent damage to the device. This is a stress **CAUTION** rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods affects the device reliability. The parameters of the I/O and reset level are shown in the following table. ## **Table 3-3. I/O and Reset Level** |**Parameter**|**Min.**|**Typ.**|**Max.**|**Units**| |---|---|---|---|---| |I/O supply voltage (VDD_IO)|2.7|-|3.3|V| |**I/O Voltage Levels**||||| |VILinput logic levels low|‐0.3|-|0.8|V| |VIHinput logic levels high|2.0|-|3.6|V| |VOLoutput logic levels low|-|-|0.4|V| |VOHoutput logic levels high|2.4|-|-|V| |**RESET**||||| |VTH,RESthreshold voltage|-|1.6|-|V| ## **Note:** 1. VDD_IO voltage is programmable by EEPROM parameters. 2. These parameters are characterized but not tested in manufacturing. The parameters of the battery charger are shown in the following table. **Datasheet** DS70005406B-page 21 © 2019 Microchip Technology Inc. **BM20/23 Electrical Characteristics** ## **Table 3-4. Battery Charger** |**Parameter**||**Min**|**Typical**|**Max**|**Unit**| |---|---|---|---|---|---| |ADAP_IN input voltage||4.5|5.0|5.5|V| |Supply current to charger only||-|3|4.5|mA| |Maximum battery
Fast charge current|Headroom > 0.7V
(ADAP_IN=5V)|170|200|240|mA| |Note: ENX2=0|Headroom = 0.3V
(ADAP_IN=4.5V)|160|180|240|mA| |Maximum battery
Fast charge current|Headroom > 0.7V
(ADAP_IN=5V)|330|350|420|mA| |Note: ENX2=1|Headroom = 0.3V
(ADAP_IN=4.5V)|180|220|270|mA| |Trickle charge voltage threshold||-|3|-|V| |Battery charge termination current,
(% of fast charge current)||-|10|-|%| ## **Note:** 1. Headroom = VADAP_IN – VBAT 2. ENX2 is not allowed to be enabled, when VADAP_IN – VBAT > 2V 3. These parameters are characterized but not tested in manufacturing The parameters of the LED driver are shown in the following table. ## **Table 3-5. LED driver** |**Parameter**|**Min**|**Typical**|**Max**|**Unit**| |---|---|---|---|---| |Open-drain voltage|-|-|3.6|V| |Programmable current range|0|-|5.25|mA| |Intensity control|-|16|-|Step| |Current step|-|0.35|-|mA| |Power down open-drain current|-|-|1|μA| |Shutdown current|-|-|1|μA| ## **Note:** 1. Test condition: SAR_VDD = 1.8V, temperature = 25 ºC. 2. These parameters are characterized but not tested in manufacturing. The parameters of the audio Codec ADC are provided in the following table. T= 25ºC, Vdd = 3.0V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz. ## **Table 3-6. Audio Codec ADC** |**Parameter (Condition)**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---| |Resolution|-|-|16|Bits| |Output sample rate|8|-|48|kHz| **Datasheet** DS70005406B-page 22 © 2019 Microchip Technology Inc. **BM20/23** **Electrical Characteristics** |**...........continued**|**...........continued**|**...........continued**|**...........continued**|**...........continued**| |---|---|---|---|---| |**Parameter (Condition)**|**Min.**|**Typ.**|**Max.**|**Unit**| |Signal-to-Noise Ratio**Note: 1**
(SNR at MIC or Line-in mode)||88|-|dB| |Digital gain|-54||4.85|dB| |Digital gain resolution|-|2 to 6|-|dB| |MIC boost gain|-|20|-|dB| |Analog gain|-|-|60|dB| |Analog gain resolution|-|2.0|-|dB| |Input full-scale at maximum gain (differential)|-|4|-|mV rms| |Input full-scale at minimum gain (differential)|-|800|-|mV rms| |3 dB bandwidth|-|20|-|kHz| |Microphone mode (input impedance)|-|24|-|kOhm| |THD+N (microphone input) at 30 mV/rms input|-|0.02|-|%| ## **Note:** 1. fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 1%, 150 mVpp input. 2. These parameters are characterized but not tested in manufacturing. The parameters of the audio Codec DAC are provided in the following table. T = 25 ℃ , Vdd = 3.0V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz ## **Table 3-7. Audio Codec DAC** |**Parameter**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---| |Over-sampling rate|-|128|-|fs| |Resolution|16|-|20|Bits| |Output sample rate|8|-|48|kHz| |Signal-to-Noise Ratio (**Note: 1**)
(SNR at Capless mode) for 48
kHz|-|96|-|dB| |Signal-to-Noise Ratio (**Note: 1**)
(SNR at Single-Ended mode)
for 48 kHz|-|98|-|dB| |Digital gain|-54|-|4.85|dB| |Digital gain resolution|-|2 to 6|-|dB| |Analog gain|-28|-|3|dB| |Analog gain resolution|-|1|-|dB| |Output voltage full-scale swing
(AVDD=2.8V) (**Note: 3**)|-|742.5|-|mV/rms| |Maximum output power (16
Ohm load)|-|34.5|-|mW| **Datasheet** DS70005406B-page 23 © 2019 Microchip Technology Inc. **BM20/23** **Electrical Characteristics** |**...........continued**|**...........continued**|**...........continued**|**...........continued**|**...........continued**|**...........continued**|**...........continued**|**...........continued**|**...........continued**|**...........continued**| |---|---|---|---|---|---|---|---|---|---| |**Parameter**||**Min.**||**Typ.**||**Max.**||**Unit**|| |Maximum output power (32
Ohm load)||-||17.2||-||mW|| |Allowed load (Resistive)||8||16||O.C.||Ω|| |Allowed load (Capacitive)||-||-||500||pF|| |THD+N (16 Ohm load)||-||-||0.05||%|| |Signal-to-Noise Ratio (SNR at
16 Ohm load)||-||-||96||dB|| |**Note:**
1.
fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 0.01%, 0 dBFS signal, Load = 100 kOhm.
2.
These parameters are characterized but not tested in manufacturing.
3.
Vddand AVDD are generated by internal LDO.
The parameters of the transmitter section for BDR and EDR are shown in the following table.
Test condition: VCC_RF= 1.28V, temperature=25ºC.
**Table 3-8. Transmitter section for BDR and EDR**|||||||||| |**Parameter**|**Min.**||**Typ.**||**Max.**||**Bluetooth**
**specifications**||**Unit**| |Maximum RF
transmit power
(BM20|-||-||-||-6 to 4||dB| |Maximum RF
transmit power
(BM23)|-||2||-||-6 to 4||-| |EDR/BDR
Relative transmit
power|-4||-1.2||1||-4 to 1||dB| **Note:** The RF Transmit power is calibrated during production using MP Tool software and MT8852 Bluetooth Test equipment. The parameters of the receiver section for BDR and EDR are shown in the following table. Test condition: VCC_RF = 1.28V, temperature = 25ºC. **Table 3-9. Receiver Section for BDR and EDR** |**Parameters**|**Modulation**|**Min.**|**Typ.**|**Max.**|**Bluetooth**
**Specification**|**Unit**| |---|---|---|---|---|---|---| |Sensitivity at
0.1% BER|GFSK|-|-90|-|≤-70|dBm| |Sensitivity at
|π/4 DQPSK|-|-91|-|≤-70|dBm| |0.01% BER|8DPSK|-|-82|-|≤-70|dBm| **Note:** These parameters are characterized but not tested in manufacturing. The parameters of system current consumption of analog audio output are shown in the following table. Test condition: BAT_IN = 3.8V, link with HTC EYE cell phone; distance between cell phone and EVB is 30 cm. **Datasheet** DS70005406B-page 24 © 2019 Microchip Technology Inc. **BM20/23 Electrical Characteristics** **Table 3-10. System Current Consumption of Analog Audio Output** |**System Status**|**Typ.**|**Max.**|**Unit**| |---|---|---|---| |System off mode|2|5|µA| |Standby mode|0.8|-|mA| |Linked mode|0.4|-|mA| |SCO link|7.8|-|mA| |A2DP link (Vp-p= 200 mV;
1k tone signal)|10.7|-|mA| **Note:** Use BM20 EVB as a test platform. The parameters of system current consumption of digital audio output are shown in the following table. Test condition: BAT_IN = 3.8V, link with HTC M8 cell phone; distance between cell phone and EVB is 30 cm; I[2] S signal link with YAMAHA YDA174 EVB. **Table 3-11. System Current Consumption of Digital Audio Output** |**System status**|**Typ**|**Max**|**Unit**| |---|---|---|---| |System Off mode|2|5|µA| |Standby mode|0.4|-|mA| |Linked mode|0.4|-|mA| |SCO link|9.3|-|mA| |A2DP link (1k tone signal)|11.7|-|mA| **Note:** Use BM23 EVB as a test platform. **Datasheet** DS70005406B-page 25 © 2019 Microchip Technology Inc. **BM20/23 Printed Antenna Information** ## **4. Printed Antenna Information** ## **4.1 Module Radiation Pattern** The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is illustrated in the following figure. **Figure 4-1. Antenna Keep Out Area Examples** **Datasheet** DS70005406B-page 26 © 2019 Microchip Technology Inc. **BM20/23 Printed Antenna Information** **Figure 4-2. PCB Antenna 3D Radiation Pattern at 2441 MHZ** The following table provides the details of BM2X PCB Antenna characteristics. **Table 4-1. BM2x PCB Antenna Characteristics** |**Parameter**||**Values**| |---|---|---| |Frequency|2400 MHz to 2480 MHz|| |Peak Gain|1.927 dBi|| |Efficiency|73.41%|| ## **4.2 Module Placement Rules** On the main PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in ‐ the below figure. A low impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommended as needed for the main PCB EMC noise reduction. For the best range performance, keep all external metal at least 15 mm away from the ceramic chip antenna. **Datasheet** DS70005406B-page 27 © 2019 Microchip Technology Inc. **BM20/23 Printed Antenna Information** **==> picture [174 x 9] intentionally omitted <==** **----- Start of picture text -----**
Figure 4-3. Module Placement Examples
**----- End of picture text -----**
**Figure 4-4. GND Plane on Main Application Board** **Datasheet** DS70005406B-page 28 © 2019 Microchip Technology Inc. **BM20/23 Reference Circuit** ## **5. Reference Circuit** This section provides the reference schematics of BM20 and BM23 modules. ## **5.1 BM20 Reference Circuit** The following figures illustrate the reference schematics of the BM20 module. **Datasheet** DS70005406B-page 29 © 2019 Microchip Technology Inc. **BM20/23 Reference Circuit** ## **Figure 5-1. BM20 Reference Circuit** **Datasheet** DS70005406B-page 30 © 2019 Microchip Technology Inc. **BM20/23 Reference Circuit** **Figure 5-2. BM20 Reference Circuit** ## **5.2 BM23 Reference circuit** The following figures illustrate the reference circuit of the BM23 module. **Datasheet** DS70005406B-page 31 © 2019 Microchip Technology Inc. **BM20/23 Reference Circuit** **==> picture [9 x 150] intentionally omitted <==** **----- Start of picture text -----**
Figure 5-3. BM23 Reference circuit
**----- End of picture text -----**
**==> picture [325 x 70] intentionally omitted <==** **----- Start of picture text -----**
-_
:
Be
**----- End of picture text -----**
**Datasheet** DS70005406B-page 32 © 2019 Microchip Technology Inc. **BM20/23 Reference Circuit** **==> picture [9 x 151] intentionally omitted <==** **----- Start of picture text -----**
Figure 5-4. BM23 Reference circuit
**----- End of picture text -----**
~~S.SS...80. 8... 000k... _ °°Qqq0—_~~ **Datasheet** DS70005406B-page 33 © 2019 Microchip Technology Inc. **BM20/23 Physical Dimensions** ## **6. Physical Dimensions** The following figure shows the PCB dimension of BM20 module. **Figure 6-1. BM20 Module PCB dimension** **==> picture [318 x 16] intentionally omitted <==** **----- Start of picture text -----**
Top View Side View Bottom View
**----- End of picture text -----**
## PCB dimension: - X: 15.0 mm - Y: 29.0 mm - Tolerances: 0.25 mm The following figure shows the PCB dimension of BM23 module. **Datasheet** DS70005406B-page 34 © 2019 Microchip Technology Inc. **BM20/23 Physical Dimensions** **Figure 6-2. BM23 Module PCB dimension** **==> picture [353 x 18] intentionally omitted <==** **----- Start of picture text -----**
Top View Side View Bottom View
**----- End of picture text -----**
## PCB dimension: - X: 15.0 mm - Y: 29.0 mm - Tolerances: 0.25 mm The following figure provides the recommended PCB footprint of the BM20 module. **Datasheet** DS70005406B-page 35 © 2019 Microchip Technology Inc. **BM20/23 Physical Dimensions** ## **Figure 6-3. BM20 module PCB Footprint** **==> picture [218 x 39] intentionally omitted <==** **----- Start of picture text -----**
Top View
<-15.0 >+30.0
**----- End of picture text -----**
**Note 1** :The keep-out area is reserved to keep the RF test point away from GND plane. **2** : All metal keep-out is used to isolate the PCB antenna. The following figure provides the recommended PCB footprint of the BM23 module. **Datasheet** DS70005406B-page 36 © 2019 Microchip Technology Inc. **BM20/23 Physical Dimensions** ## **Figure 6-4. BM23 module PCB Footprint** **==> picture [218 x 39] intentionally omitted <==** **----- Start of picture text -----**
Top View
<-15.0 >+30.0
**----- End of picture text -----**
- **Note 1** :The keep-out area is reserved to keep the RF test point away from GND plane. **2** : All metal keep-out is used to isolate the PCB antenna. **Datasheet** DS70005406B-page 37 © 2019 Microchip Technology Inc. **BM20/23 Reflow Profile** ## **7. Reflow Profile** The following figure illustrates the reflow profile of the BM20/23 module. ## **Figure 7-1. Reflow Profile** ## **7.1 Soldering Recommendations** The BM20/23 module is assembled using a standard lead ‐ free reflow profile IPC/JEDEC J ‐ STD ‐ 020. The BM20/23 ‐ module can be soldered to the main PCB using standard leaded and lead free solder reflow profiles. To avoid the damage to the module, follow these recommendations: - Refer to Microchip Technology Application Note _AN233 Solder Reflow Recommendation_ (DS00233) for the soldering reflow recommendations - Do not exceed peak temperature (TP) of +250 ℃ - Refer to the Solder Paste data sheet for specific reflow profile recommendations - Use no ‐ clean flux solder paste - Do not wash the module, as moisture can be trapped under the shield - Use only one flow. If the PCB requires multiple flows, apply the module on the final flow ## **7.2 Packing and Storage Information** The module is packaged into trays of sixty-three (63) modules in a 7 x 9 format (see the following figure). These trays are then sealed into bags. 10 sealed bags are then placed in a box of 630 pieces with a dimension of 36 x 16 x 9.5 cm[3] . The shelf life of each module in a sealed bag is 12 months at <40°C and <90% relative humidity. After a bag is opened, devices that will be subjected to reflow solder or other high temperature processes must be mounted within 168 hours (7 days) at factory conditions of <30°C and <60% relative humidity. **Datasheet** DS70005406B-page 38 © 2019 Microchip Technology Inc. **BM20/23 Reflow Profile** ## **Figure 7-2. Packing and Storage Information** **Datasheet** DS70005406B-page 39 © 2019 Microchip Technology Inc. **BM20/23 Ordering Information** ## **8. Ordering Information** The following table provides the ordering information of the BM20/23 module. ## **Table 8-1. Module Ordering Information** |**Part Number**|**Description**| |---|---| |BM20SPKS1NBC|Bluetooth 5.0 BDR/EDR, Class 2 Surface Mount module
with integrated antenna and shield.| |BM23SPKS1NB9|Bluetooth 5.0 BDR/EDR, Class 2 Surface Mount module
with integrated antenna and shield.| ## **Note:** 1. The module can only be purchased through a Microchip representative. 2. Go to http://www.microchip.com/ for current pricing and a list of distributors carrying Microchip products. **Datasheet** DS70005406B-page 40 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** ## **9. Certification Notices** BM20 module (BM20SPKS1NBC) has received the regulatory approval for the following: - BT SIG/QDID: 121137 - United States: FCC ID: A8TBM20SPKXYNBZ - Canada - IC: 12246A-BM20SPKS1 - HVIN: BM20SPKS1 - Europe/CE - Japan/MIC: 202-SMD048 - Korea/KCC: MSIP-CRM-mcp-BM20SPKS1NBC - Taiwan/NCC: CCAN15LP0460T2 - China/SRRC: CMIIT ID: 2015DJ7134 - Brazil/ANATEL: 01888-19-08759 - Mexico/IFT: RCPMIBM19-0454 - Argentina/CNC ID: C-22800 BM23 module (BM23SPKS1NB9) has received the regulatory approval for the following: - BT SIG/QDID: 121137 - United States/ FCC ID: A8TBM23SPKXYC2A - Canada – IC: 12246A-BM23SPKXYC2 - HVIN: BM23SPKXY - Europe/CE - Japan/MIC: 202-SMC067 - Korea/KCC: MSIP-CRM-S9S-BM23SPKXY - Taiwan – NCC: CCAL15LP0270T3 - M/N: BM23SPK - China/SRRC: CMIIT ID: 2016DJ3553 ## **9.1 United States** The BM20/23 stereo audio module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product, or host device) by the grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The host product itself is required to comply with all other applicable FCC equipment authorizations regulations, requirements and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions). **Datasheet** DS70005406B-page 41 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** ## **9.1.1 Labeling and User Information Requirements** The BM20/23 module has been labeled with its own FCC ID number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. These exterior labels use the following wording: For BM20 Module: Contains Transmitter Module FCC ID: A8TBM20SPKXYNBZ or Contains FCC ID: A8TBM20SPKXYNBZ **This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation** For BM23 Module: Contains Transmitter Module FCC ID: A8TBM23SPKXYC2A or Contains FCC ID: A8TBM23SPKXYC2A **This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation** A user’s manual for the product must include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna - Increase the separation between the equipment and receiver - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected - Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) https://apps.fcc.gov/oetcf/kdb/index.cfm. ## **9.1.2 RF Exposure** All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). For the BM20 Module: - Output power listed is conducted. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with the FCC multi-transmitter product procedures. End-users must be provided with specific operating instructions for satisfying RF exposure compliance. - This module is approved for installation into mobile or/and portable host platforms. For the BM23 Module: **Datasheet** DS70005406B-page 42 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** - Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. - This module is approved for installation into mobile or/and portable host platforms. ## **9.1.3** ## **Helpful Websites** Federal Communications Commission (FCC): http://www.fcc.gov. FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): https:// apps.fcc.gov/oetcf/kdb/index.cfm ## **9.2 Canada** The BM20/23 module has been certified for use in Canada under Innovation, Science, and Economic Development (ISED, formerly Industry Canada), Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. ## **9.2.1 Labeling and User Information Requirements** Labeling Requirements (from RSP-100, Issue 11, Section 3): The host product shall be properly labeled to identify the module within the host device. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product. Otherwise, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains”, or similar word expressing the same meaning, as follows: For BM20 Module: ## **Contains IC: 12246A-BM20SPKS1** For BM23 Module: ## **Contains IC: 12246A-BM23SPKXYC2** User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual, on the device or both: **This device complies with Industry Canada’s license-exempt RSS standard(s). Operation is subject to the following two conditions:** ## **(1) This device may not cause interference, and** **(2) This device must accept any interference, including interference that may cause undesired operation of the device.** **Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:** ## **(1) l'appareil ne doit pas produire de brouillage, et** **(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.** Guidelines on Transmitter Antenna for License Exempt Radio Apparatus: **Datasheet** DS70005406B-page 43 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** **Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain must be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.** **Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.** ## **9.2.2** ## **RF Exposure** All transmitters regulated by the Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio Communication Apparatus (All Frequency Bands). This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters, except in accordance with Innovation, Science and Economic Development Canada multi-transmitter guidelines. The device operates at an output power level which is within the ISED SAR test exemption limits at any user distance. ## **9.2.3** ## **Helpful Websites** Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/Intro.html. ## **9.3 Europe** The BM20/23 module is a Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM20/23 module has been tested to RED 2014/53/EU Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2), which is summarized in the Table 9-1 and Table 9-2 European Compliance Testing tables. The ETSI provides guidance on modular devices in the _“Guide to the application of harmonised standards covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and nonradio equipment”_ document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/203367/01.01.01_60/ eg_203367v010101p.pdf. **Note:** To maintain conformance to the testing listed in Table 9-1 and Table 9-2, the modules shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED. ## **9.3.1 Labeling and User Information Requirements** The label on the final product which contains the BM20/23 module must follow CE marking requirements. The European Compliance Testing listed in the following tables was performed using the integral PCB antenna. **Datasheet** DS70005406B-page 44 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** **Table 9-1. European Compliance Testing (BM20)** |**Certification**|**Standards**|**Article**|**Laboratory**|**Report Number**|**Date**| |---|---|---|---|---|---| |Safety|EN 60950-1:2006 / A11:2009 /
A1:2010 / A12:2011 / A2:2013|(3.1(a))|TUV
Rheinland,
|10050720 002|15 Sep 2015| |Health|EN 300 328 V1.9.1 / EN
62479:2010||Taiwan|10050932 002|09 Sep 2015| |EMC|EN 301 489-1 V1.9.2|(3.1(b))||10050691 002|16 Sep 2015| ||EN 301 489-17 V2.2.1||||| ||EN 301 489-1 V2.1.1
EN 301 489-1 V2.2.0|||10050691 003|26 May 2017| ||EN 301 489-17 V3.1.1
EN 301 489-17 V3.2.0||||| |Radio|EN 300 328 V1.9.1|(3.2)||10050932 002|09 Sep 2015| ||EN 300 328 V2.1.1|||10050932 003|26 May 2017| **Table 9-2. European Compliance Testing (BM23)** |**Certification**|**Standards**|**Article**|**Laboratory**|**Report Number**|**Date**| |---|---|---|---|---|---| |Safety|EN 60950-1:2006 /
A11:2009 / A1:2010 /
A12:2011 / A2:2013|(3.1(a))|TUV
Rheinland,
Taiwan|10047732 002|26 May 2017| |Health|EN 300 328 V1.9.1 / EN
62479:2010|||10048076 001 &
10048076 002|15 Sep 2014 & 26
Oct 2015| |EMC|EN 301 489-1 V1.9.2|(3.1(b))||10047659 001|23 Sep 2014| ||EN 301 489-17 V2.2.1||||| ||EN 301 489-1 V2.1.1
EN 301 489-1 V2.2.0|||10047659 002|26 May 2017| ||EN 301 489-17 V3.1.1
EN 301 489-17 V3.2.0||||| |Radio|EN 300 328 V1.9.1|(3.2)||10048076 001 &
10048076 002|15 Sep 2014 & 26
Oct 2015| ||EN 300 328 V2.1.1|||10048076 003|26 May 2017| ## **9.3.2 Conformity Assessment** From ETSI Guidance Note EG 203367, section 6.1 Non-radio products are combined with a radio product: If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required. The European Compliance Testing listed in Table 9-1 and Table 9-2 was performed using the integral PCB antenna. ## **9.3.3 Simplified EU Declaration of Conformity** Hereby, Microchip Technology Inc. declares that the radio equipment type BM20/23 module is in compliance with Directive 2014/53/EU. **Datasheet** DS70005406B-page 45 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** The full text of the EU declaration of conformity, for this product, is available at http://www.microchip.com/designcenters/wireless-connectivity. ## **9.3.4** ## **Helpful Websites** A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communications Committee (ECC): http://www.ecodocdb.dk/. Additional helpful websites are: - Radio Equipment Directive (2014/53/EU): https://ec.europa.eu/growth/single-market/european-standards/ harmonised-standards/red_en. - European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org. - European Telecommunications Standards Institute (ETSI): http://www.etsi.org. - The Radio Equipment Directive Compliance Association (REDCA): http://www.redca.eu/. ## **9.4 Japan** The BM20/23 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: - If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. - There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http:// www.vcci.jp/vcci_e/index.html. ## **9.4.1** ## **Labeling and User Information Requirements** The label on the final product which contains the BM20/23 module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. The BM20/23 module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type of certified module inside: ## **Figure 9-1. BM20 Module** **Datasheet** DS70005406B-page 46 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** ## **Figure 9-2. BM23 Module** ## **9.4.2 Helpful Websites** Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm. Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/. ## **9.5 Korea** The BM20/23 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. ## **9.5.1 Labeling and User Information Requirements** The label on the final product that contains the BM20/23 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM20/23 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: **Figure 9-3. BM20 Module** **Figure 9-4. BM23 Module** ## **9.5.2 Helpful Websites** Korea Communications Commission (KCC): http://www.kcc.go.kr. National Radio Research Agency (RRA): http://rra.go.kr. ## **9.6 Taiwan** The BM20/23 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact the Microchip Technology Inc. sales office or distribution partners to obtain a Letter of Authority. **Datasheet** DS70005406B-page 47 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. ## **9.6.1 Labeling and User information Requirements** The BM20/23 module is labeled with its own NCC mark and certificate number as below: ## **Figure 9-5. BM20 Module** **Figure 9-6. BM23 Module** The user’s manual should contain below warning (for RF device) in traditional Chinese: ## **9.6.2 Helpful Websites** National Communications Commission (NCC): http://www.ncc.gov.tw. ## **9.7 China** The BM20/23 module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. ## **9.7.1 Labeling and User Information Requirements** The BM20 module is labeled with its own CMIIT ID as follows: ## **Figure 9-7. BM20 CMIIT ID** When Host system is using an approved Full Modular Approval (FMA) radio: The host should bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2015DJ7134”. The BM23 module is labeled with its own CMIIT ID as follows: **Datasheet** DS70005406B-page 48 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** **Figure 9-8. BM23 CMIIT ID** When Host system is using an approved Full Modular Approval (FMA) radio: The host should bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2016DJ3553”. ## **9.8 Brazil** The BM20 received compliance approval in accordance with the Telecommunications Act of the Federal Republic of Brazil National Telecommunications Agency (ANATEL). Customers seeking to use the compliance approval in their product must contact Microchip Technology Inc. sales or distribution partners to obtain a Letter of Authority. ## Modelo: BM20SPKS1NBC ## 01888-19-08759 Este equipamento opera em caráter secundário, isto é, não tem direito a proteção contra interferência prejudicial, mesmo de estações do mesmo tipo, e não pode causar interferência a sistemas operando em caráter primário The End product (Host) manual must include the following statement: Este product contém a placa Modelo BM20SPKS1NBC código de homologação ANATEL 01888-19-08759. ## **9.9 Mexico** The BM20 module has received compliance approval in accordance with the IFT (IFETEL) of Mexico. Customers seeking to use the compliance approval in their product must contact Microchip Technology Inc. sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Operation of this equipment is subject to the following two conditions: (1) this device or device may not cause harmful interference, and (2) this device or device must accept any interference, including interference that may cause undesired operation. La operación de este equipo está sujeta a las siguientes dos condiciones: (1) es posible que este equipo o dispositivo no cause interferencia perjudicial y (2) este equipo o dispositivo debe aceptar cualquier interferencia, incluyendo la que pueda causar su operación no deseada. ## **9.9.1 Labeling and User Information Requirements** The BM20 module, due to limited module size, the IFT mark and ID are displayed in the data sheet and/or packaging label and cannot be displayed on the module label. ## IFT: RCPMIBM19-0454 **Datasheet** DS70005406B-page 49 © 2019 Microchip Technology Inc. **BM20/23 Certification Notices** ## **9.10 Argentina** The BM20 module has received compliance approval in accordance with the Argentine NATIONAL ENTITY OF COMMUNICATIONS (ENACOM). Customers seeking to use the compliance approval in their product must contact Microchip Technology Inc. sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. ## **9.10.1 Labeling and User Information Requirements** BM20 module, due to limited module size, the CNC mark and Certificate number are displayed in the data sheet and/or packaging label and cannot be displayed on the module label **==> picture [47 x 10] intentionally omitted <==** **----- Start of picture text -----**
C-22800
**----- End of picture text -----**
When Host (End Product) system is using an approved radio: The external label must be composed of the module CNC Registration Number, preceded by the legend: “Contiene Módulo CNC ID” or “Contiene CNC ID” sentence, as shown below: Contiene Módulo CNC ID: C-22800 ## **9.11 Other Regulatory Jurisdictions** - For information on the other countries’ jurisdictions covered, refer to https://www.microchip.com/design-centers/ wireless-connectivity/certifications. - Should other regulatory jurisdiction certifications be required by the customer, or the customer needs to recertify the module for other reasons, contact Microchip for the required utilities and documentation. **Datasheet** DS70005406B-page 50 © 2019 Microchip Technology Inc. **BM20/23 Document Revision History** ## **10. Document Revision History** **Table 10-1. Document Revision History** |**Revision**|**Date**|**Section**|**Description**| |---|---|---|---| |B|08/2019|Document|Removed “Preliminary”| ||||from document footer.| |A|08/2019|Document|Initial release.| **Datasheet** DS70005406B-page 51 © 2019 Microchip Technology Inc. **BM20/23** ## **The Microchip Website** Microchip provides online support via our website at http://www.microchip.com/. This website is used to make files and information easily available to customers. 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Technical support is available through the website at: http://www.microchip.com/support ## **Microchip Devices Code Protection Feature** Note the following details of the code protection feature on Microchip devices: - Microchip products meet the specification contained in their particular Microchip Data Sheet. - Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. - There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. - Microchip is willing to work with the customer who is concerned about the integrity of their code. - Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. ## **Legal Notice** Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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