# Bluetooth® Smart v4.2 + NFC Module, 2.402 to 2.48GHz, -96Dbm
**URL**: https://novapart.co/products/BL652-SA-01/bluetooth-smart-v42-nfc-module-2402-to-248ghz
**SKU**: BL652-SA-01
**Manufacturer**: EZURIO
**Category**: Wireless Modules & Adaptors || Communications & Networking Modules || Bluetooth Modules & Adaptors
**Price**: €7.4700
**Stock**: 500+
**Lead Time**: 190 days (indicative)
## Description
Bluetooth Version:Bluetooth 4.2; Supply Voltage Min:1.8V; Supply Voltage Max:3.6V; Signal Range Max:100m; Data Rate:1Mbps; Bluetooth Class:-; Receive Sensitivity:-96dBm; Operating T
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (19-Jan-2021) |
| Interfaces | I2C, SPI, UART |
| Product Range | BL652 Series |
| Certifications | CE, FCC, IC, MIC |
| Bluetooth Class | - |
| Bluetooth Version | Bluetooth 5.0 |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Receiver Sensitivity Rx | -96 dBm |
| Operating Temperature Range | -40 °C to 85 °C |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2664536/)
A
## Datasheet BL652-SA and BL652-SC
_Version 1.3_
**BL652** Datasheet
## REVISION HISTORY
|**Version**
**Date**
**Notes**
**Approver**
1.0
20 July2016
Initial Release
Jonathan Kaye
~~a a~~
~~es~~
~~ee~~|**Version**
**Date**
**Notes**
**Approver**
1.0
20 July2016
Initial Release
Jonathan Kaye
~~a a~~
~~es~~
~~ee~~|**Version**
**Date**
**Notes**
**Approver**
1.0
20 July2016
Initial Release
Jonathan Kaye
~~a a~~
~~es~~
~~ee~~|**Version**
**Date**
**Notes**
**Approver**
1.0
20 July2016
Initial Release
Jonathan Kaye
~~a a~~
~~es~~
~~ee~~|**Version**
**Date**
**Notes**
**Approver**
1.0
20 July2016
Initial Release
Jonathan Kaye
~~a a~~
~~es~~
~~ee~~|
|---|---|---|---|---|
||||Corrected Operating Temperature voltage to read||
||1.1|30 Aug 2016|VCC 1.8 V-3.6 V rather than 1.7 V-3.6V
Corrected minor formatting issues and typo|Raj Khatri|
||||Changed the SIO_02pin # (OTA mode table) to 23 vs. 21||
||||Added missing BT SIG info||
||1.2|02 Sept 2016|Updated Declaration of Conformity
Added text to Note 1 of Pin Definition Notes|Jonathan Kaye/
Raj Khatri|
||||Fixed error in Note 13 of Pin Definition Notes||
||1.3|14 Sept 2016|Updated BT SIG section|Jonathan Kaye|
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
2
© Copyright 2016 Laird. All Rights Reserved
**BL652** Datasheet
|CONTENTS|CONTENTS|
|---|---|
|1|Overview and Key Features .................................................................................................................................4|
|2|Specification .........................................................................................................................................................5|
|
2.1|Specification Summary ........................................................................................................................................5|
|3|Hardware Specifications ......................................................................................................................................9|
||Block Diagram and Pin-out .....................................................................................................................9
3.1|
||Pin Definitions ...................................................................................................................................... 10
3.2|
||Electrical Specifications ........................................................................................................................ 15
3.3|
|4|Power Consumption ......................................................................................................................................... 19|
|5|Functional Description ...................................................................................................................................... 34|
||Power Management (includes Brown-out and Power on Reset) ........................................................ 34
5.1|
||Clocks and Timers ................................................................................................................................ 35
5.2|
||Memory for_smart_BASIC Application Code .......................................................................................... 35
5.3|
||Radio Frequency (RF) ........................................................................................................................... 35
5.4|
||NFC ....................................................................................................................................................... 35
5.5|
||UART Interface ..................................................................................................................................... 36
5.6|
||SPI Bus .................................................................................................................................................. 37
5.7|
||I2C Interface ......................................................................................................................................... 37
5.8|
||General Purpose I/O, ADC, PWM and FREQ ........................................................................................ 38
5.9|
||nRESET pin ........................................................................................................................................... 39
5.10|
||nAutoRUN pin ...................................................................................................................................... 39
5.11|
||vSP Command Mode ............................................................................................................................ 39
5.12|
||Two-wire Interface JTAG ...................................................................................................................... 40
5.13|
||BL652 Wakeup ..................................................................................................................................... 42
5.14|
||Low Power Modes ............................................................................................................................... 42
5.15|
||Temperature Sensor ............................................................................................................................ 42
5.16|
||Random Number Generator ................................................................................................................ 42
5.17|
||AES Encryption/Decryption .................................................................................................................. 42
5.18|
||Optional External Serial (SPI) Flash ...................................................................................................... 43
5.19|
||Optional External 32.768 kHz crystal ................................................................................................... 43
5.20|
||BL652-SA On-board Chip Antenna Characteristics .............................................................................. 45
5.21|
|6|Hardware Integration Suggestions ................................................................................................................... 46|
|7|Mechanical Details ............................................................................................................................................ 51|
|8|Application Note for Surface Mount Modules .................................................................................................. 53|
||Introduction ......................................................................................................................................... 53
8.1|
||Shipping ............................................................................................................................................... 53
8.2|
||Reflow Parameters ............................................................................................................................... 56
8.3|
|9|FCC and IC Regulatory Statements ................................................................................................................... 58|
|10|Japan (MIC) Regulatory ..................................................................................................................................... 62|
|11|CE Regulatory .................................................................................................................................................... 63|
|12|EU Declarations of Conformity ......................................................................................................................... 64|
|13|Ordering Information ........................................................................................................................................ 65|
|14|Bluetooth SIG Qualification .............................................................................................................................. 65|
|15|Additional Assistance ........................................................................................................................................ 67|
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
3
© Copyright 2016 Laird. All Rights Reserved
**BL652** Datasheet
## 1 OVERVIEW AND KEY FEATURES
Every BL652 Series module is designed to enable OEMs to add single-mode Bluetooth Low Energy (BLE) v4.2 to small, portable, power-conscious devices. The BL652 modules are supported with Laird’s _smart_ BASIC, an eventdriven programming language that enables OEMs to make their BLE product development quicker and simpler, significantly reducing time to market. _smart_ BASIC enables customers to develop a complete embedded application inside the compact BL652 hardware, connecting to a wide array of external sensors via its I2C, SPI, UART, ADC or GPIO interfaces. The BL652 also provides flexibility in the OEM’s application development choice with full support for using Nordic’s SDK and firmware tools.
Based on the world-leading Nordic Semiconductor nRF52832 chipset, the BL652 modules provide ultra-low power consumption with outstanding wireless range via 4 dBm of transmit power. A broad range of BLE profiles including Temperature and Heart Rate are available, and _smart_ BASIC provides the ideal mechanism to support any BLE profile development of your choice. This document should be read in conjunction with the _smart_ BASIC user manual.
**Note:** BL652 hardware is functionally capable as the nRF52832 chipset used in the module design. Not all features are currently exposed within Laird’s _smart_ BASIC firmware implementation.
## **Features and Benefits**
- Bluetooth v4.2 - Single mode
- NFC-A Listen mode compliant
- External or internal antennas
- _smart_ BASIC programming language or Nordic SDK
- Compact footprint
- Programmable Tx power +4 dBm to -20 dBm
- Tx whisper mode (-40 dBm)
- Rx sensitivity: -96 dBm
- Ultra-low power consumption
- Tx: 5.3 mA peak (at 0 dBm, DCDC on) – See _Power Consumption_ section Note 1
- Rx: 5.4 mA peak (DCDC on) – See _Power Consumption_ section Note 1
- Standby Doze: 1.2 uA typical
- Deep Sleep: 0.4 uA – See _Power Consumption_ section Note 4
- UART, GPIO, ADC, PWM, FREQ output, timers, I2C, and SPI interfaces
- Fast time-to-market
- FCC, CE, IC, and Japan certified; Full Bluetooth Declaration ID
- Other regulatory certifications on request (all certifications are in process)
- No external components required
- Industrial temperature range (-40 to + 85)
## **Application Areas**
- Medical devices
- Wellness devices
- iOS “appcessories”
- Fitness sensors
- Location awareness
- Home automation
**Note** : Figures on this page are gathered from the nRF52 datasheet provided by Nordic.
Embedded Wireless Solutions Support Center: 4 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth © Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
**BL652** Datasheet
## 2 SPECIFICATION
## **Specification Summary**
_**Table 1: BL652 Specifications**_
|**Categories**
**Wireless**
~~Po~~|**Categories**
**Wireless**
~~Po~~|**Feature**|**Implementation**
V4.2 – Single mode|
|---|---|---|---|
||**Specification**|Bluetooth®|Concurrent master and slave|
||||Diffie-Hellman basedpairing|
|||Frequency|2.402 - 2.480 GHz|
|||Maximum Transmit Power Setting|+4 dBm
Conducted BL652-SA
+4 dBm
Conducted BL652-SC|
|||Minimum Transmit Power Setting|-20 dBm (in 4 dB steps) with_smart_BASIC command
-16 dBm,-12 dBm,- 8 dBm,- 4 dBm,0 dBm|
|||Tx Whisper Mode 1
Transmit Power|-40 dBm (min.) with_smart_BASIC command|
|||Receive Sensitivity (0.1% BER)|-96 dBm typical|
|||Link Budget|100 dB(@ 1 Mbps)|
|||Range|Upto 100 meters in free space|
|||Tx Whisper Modes|Range reduction feature with Tx Whisper modes via
_smart_BASIC command|
|||Range
(Tx Whisper Mode 1)|<~100 cm|
|||Raw Data Rates|1 Mbps(over-the-air)|
||**NFC**|NFC-A Listen mode compliant|Based on NFC forum specification|
||||
13.56 MHz|
||||
Date rate 106 kbps|
||||
NFC-A tag|
||||– Can only be a target/tag; cannot be an|
||||initiator|
||||**Modes of Operation:**|
||||
Disable|
||||
Sense|
||||
Activated|
||||**Use Cases:**|
||||
Touch-to-Pair with NFC|
||||
NFC enabled Out-of-Band Pairing|
|||System Wake-On-Field function|ProximityDetection|
||**Host Interface**|Total|32 x Multifunction I/O lines|
||**and Peripherals**||Tx, Rx, CTS, RTS|
|||UART|DCD, RI, DTR, DSR (See Note 1)
Default 115200,n,8,1|
||||From 1,200bps to 1Mbps|
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
5 © Copyright 2016 Laird. All Rights Reserved
**BL652** Datasheet
|**Categories**
~~a~~|**Categories**
~~a~~|**Feature**
~~a~~|**Implementation**
Up to 32, with configurable:|
|---|---|---|---|
||||I/O direction,|
|||GPIO|O/P drive strength (standard 0.5 mA or high 3mA/5|
||||mA),|
||||Pull-up /pull-down|
||||Eight 8/10/12-bit channels|
||||0.6 V internal reference|
||||Configurable 4, 2, 1, 1/2, 1/3, 1/4, 1/5 1/6(default)|
|||ADC|pre-scaling|
||||Configurable acquisition time 3uS, 5uS,|
||||10uS(default), 15uS, 20uS, 40uS.|
||||One-shot mode|
||||PWM outputs on 12 GPIO output pins.|
|||PWM output|PWM output duty cycle: 0%-100%
PWM output frequency: Up to 500kHz|
||||(SeeNote 7)|
||||FREQ outputs on 2 GPIO output pins.|
|||FREQ output|FREQ output frequency: 0 MHz-4MHz (50% duty|
||||cycle)|
|||I2C|One I2C interface(upto 400 kbps) (SeeNote 2)|
|||SPI|One SPI Master interface (up to 4 Mbps)
(SeeNote 3)|
||**Optional**
_External to the_|External 32.768kHz crystal|For customer use, connect +/-20ppm accuracy
crystal for more accurateprotocol timing.|
||_BL652 module_|External SPI serial flash|For customer use e.g. data-logging|
||**Profiles**||Laird’s_smar_tBASIC firmware supports the|
|||Services supported|following::|
|||(SeeNote 4)|
Central Mode|
||||
Peripheral Mode|
||||
Custom Series|
|||Nordic SDK v3x0|Any exposed within the related Nordic softdevice
(application development to be done byOEM)|
||**FW upgrade**|_smart_BASIC runtime engine FW
upgrade(See Note 4)|Via JTAG or UART|
||**Programmability**|_smart_BASIC|On-boardprogramminglanguage similar to BASIC.|
||||Via UART|
|||_smart_BASIC application download|Via Over-the-Air (ifSIO_02pin is pulled high|
||||externally)|
|||Nordic SDK|Via JTAG|
||**Control Protocols**|Any|User defined via_smart_BASIC|
Embedded Wireless Solutions Support Center: 6 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth © Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
**BL652** Datasheet
|**Categories**
**Operating Modes**
~~a ~~|**Categories**
**Operating Modes**
~~a ~~|**Feature**
Self-contained Run mode
~~ae~~|**Implementation**
Selected by nAutoRun pin status: LOW (0V).
Then runs $autorun$ (_smart_BASIC application
~~ee~~|
|---|---|---|---|
||||script)if it exists.|
||||HIGH (VCC).|
|||Interactive/Development mode|Then runs via at+run (and_file name_of_smart_BASIC|
||||application script).|
||**Supply Voltage**|Supply (VCC)|1.8- 3.6 V – Internal DCDC converter or LDO
(SeeNote 5)|
||**Power**|Active Modes Peak Current (for|Advertising mode
7.5 mA peak Tx (with DCDC)|
||**Consumption**|maximum Tx power +4 dBm)||
||(See Note 5)|– Radio only|Connecting mode
5.4 mA peak Tx (with DCDC)|
|||Active Modes Peak Current (for|Advertising mode
2.7 mA peak Tx (with DCDC)|
|||Tx Whisper mode2 power -40
dBm) – Radio only|Connecting mode
5.4 mA peak Tx (with DCDC)|
|||Active Modes Average Current|Depends on many factors, see_Power Consumption._|
|||Ultra Low Power Modes|Standby Doze
Deep Sleep
1.2 uA typical (Note 6)
400 nA (Note 6)|
||**Antenna Options**|Internal|Ceramic chip monopole antenna – on-board
**BL652-SA variant**|
||||Dipole antenna (with IPEX connector)|
||||Dipole PCB antenna (with IPEX connector)|
|||External|Connection via IPEX MH4 –**BL652-SC variant**|
||||See the Antenna Information sections forFCC and|
||||IC,MIC, andCE.|
||**Physical**||14 mm x 10 mm x 2.1 (TBC) mm|
|||Dimensions|Pad Pitch: 0.75 mm|
||||Pad Type: Plated half-moon edge pads (easy to|
||||hand solder)|
|||Weight|<1 gram|
||**Environmental**|Operating|-40 ˚C to +85 ˚C (VCC 1.8V-3.6V)|
|||Storage|-40 ˚C to +85 ˚C|
||**Miscellaneous**|Lead Free|Lead-free and RoHS compliant|
|||Warranty|Five-year Limited Lifetime|
||**Development**
**Tools**|Development Kit|Development kit (DVK-BL652-xx) and free software
tools|
||**Approvals**|Bluetooth®|Full Bluetooth SIG Declaration ID|
|||FCC / IC / CE / MIC|All BL652 Series|
## **Module Specification Notes:**
**Note 1** DSR, DTR, RI, and DCD can be implemented in the _smart_ BASIC application.
© Copyright 2016 Laird. All Rights Reserved
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**BL652** Datasheet
## **Module Specification Notes:**
- **Note 2** With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL _**must**_ be connected externally as per I2C standard.
- **Note 3** SPI interface (master) consists of SPI MOSI, SPI MISO, and SPI CLK. SPI CS is created by using any spare SIO pin within the _smart_ BASIC application script allowing multi-dropping.
- **Note 4** The BL652 module comes loaded with _smart_ BASIC runtime engine firmware but does not come loaded with any _smart_ BASIC application script (as that is dependent on customer-end application or use). Laird provides many sample _smart_ BASIC application scripts covering the services listed. Additional BLE services are being added every quarter.
- **Note 5** Use of the internal DCDC convertor or LDO is decided by the underlying BLE stack.
- **Note 6** These figures are measured on the BL652-Sx-xx.
- Deep Sleep current for BL652-Sx-xx ~400nA (typical)
- Standby Doze current for BL652-xx-A1 1.2uA (typical)
- **Note 7** PWM output signal has a frequency and duty cycle property. PWM output is generated using dedicated hardware in the chipset. There is a trade-off between PWM output frequency and resolution.
For example:
- PWM output frequency of 500 kHz (2 uS) results in resolution of 1:2.
- PWM output frequency of 100 kHz (10 uS) results in resolution of 1:10.
- PWM output frequency of 10 kHz (100 uS) results in resolution of 1:100.
- PWM output frequency of 1 kHz (1000 uS) results in resolution of 1:1000.
Refer to the _smart_ BASIC user guide for details. It’s available from the Laird BL652 product page.
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Embedded Wireless Solutions Support Center: 8 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
© Copyright 2016 Laird. All Rights Reserved
**BL652** Datasheet
## 3 HARDWARE SPECIFICATIONS
## **Block Diagram and Pin-out**
_**Figure 1: BL652 Block diagram**_
_**Figure 2: Functional HW and SW block diagram for BL652 series BLE smartBASIC module**_
Embedded Wireless Solutions Support Center: 9 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth © Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
**BL652** Datasheet
_**Figure 3: BL652-Sx module pin-out (top view)**_
## **Pin Definitions**
_**Table 2: Pin definitions**_
|**Pin**
**#**|**Pin Name**|**Default**
**Function**|**Alternate**
**Function**|**In/**
**Out**|**Pull**
**Up/**
**Down**|**nRF52832**
**QFN Pin**|**nRF52832**
**QFN Name**|**Comment**|
|---|---|---|---|---|---|---|---|---|
|1|GND|-|-|-|-|-|-|-|
|||||||||**Laird Devkit:**SPI EEPROM.|
|||||||||SPI_Eeprom_MISO, Input.|
|2|SIO_24/
SPI_MISO|SIO_24|SPI_MISO|IN|PULL-
UP|29|PO.24|SPIOPEN() in_smart_BASIC selects
SPI function; MOSI and CLK are|
|||||||||outputs when in SPI master mode.|
|||||||||**Laird Devkit:**SPI EEPROM.|
|||||||||SPI_Eeprom_MOSI, Output|
|3|SIO_23/
SPI_MOSI|SIO_23|SPI_MOSI|IN|PULL-
UP|28|PO.23|SPIOPEN() in_smart_BASIC selects|
|||||||||SPI function, MOSI and CLK are|
|||||||||outputs in SPI master.|
||||||PULL-|||**Laird Devkit:**SPI EEPROM.|
|4|SIO_22|SIO_22||IN|UP|27|PO.22|SPI_Eeprom_CS, Input|
||||||PULL-||||
|5|SWDIO|SWDIO|-|-||26|SWDIO|-|
||||||UP||||
Embedded Wireless Solutions Support Center: 10 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth © Copyright 2016 Laird. All Rights Reserved
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**BL652** Datasheet
|**Pin**
**#**|**Pin Name**|**Default**
**Function**|**Alternate**
**Function**|**In/**
**Out**|**Pull**
**Up/**
**Down**|**nRF52832**
**QFN Pin**|**nRF52832**
**QFN Name**|**Comment**|
|---|---|---|---|---|---|---|---|---|
||||||PULL-||||
|6|SWDCLK|SWDCLK|-|-||25|SWDCLK|-|
||||||DOWN||||
|7|nRESET|nRESET|-|IN|PULL-
UP|24|PO.21/
nRESET|System Reset (Active Low)|
|||||||||**Laird Devkit:**Optional External|
|||||||||serial SPI flash for data logging|
|||||||||purpose.|
|8|SIO_20/
SFLASH_MOSI|SIO_20|SFLASH_MOSI|IN|PULL-
UP|23|PO.20|High level API in_smart_BASIC can|
|||||||||be used for fast access using|
|||||||||open/close/read/write API|
|||||||||functions.|
||||||PULL-||||
|9|SIO_18|SIO_18|-|IN|UP|21|PO.18|-|
|10|SIO_16/
SFLASH_CLK|SIO_16|SFLASH_CLK|IN|PULL-
UP|19|PO.16|**Laird Devkit:**Optional External
serial SPI flash for data logging|
|11|SIO_14/
SFLASH_MISO|SIO_14|SFLASH_MISO|IN|PULL-
UP|17|PO.14|purpose.
High level API in_smart_BASIC can|
|12|SIO_12/
SFLASH_CS|SIO_12|SFLASH_CS|IN|PULL-
UP|15|PO.12|be used for fast access using
open/close/read/write API
functions.|
|13|SIO_11|SIO_11|-|IN|PULL-
UP|14|PO.11|**Laird Devkit:**BUTTON1|
|14|NFC2/
SIO_10|NFC2|SIO_10|IN|-|12|PO.10/NFC2|-|
|15|NFC1/
SIO_09|NFC1|SIO_09|IN|-|11|PO.09/NFC1|-|
|16|GND|-|-|-|-|-|-|-|
|17|SIO_08/
UART_RX|SIO_08|UART_RX|IN|PULL-
UP|10|PO.08||
|18|SIO_07/
UART_CTS|SIO_07|UART_CTS|IN|PULL-
DOWN|9|PO.07|UARTCLOSE() selects DIO
functionality|
|19
20|SIO_06/
UART_TX
SIO_05/
UART_RTS/|SIO_06
SIO_05|UART_TX
UART_RTS/
AIN3|OUT
OUT|Set
High in
FW
Set Low
in FW|8
7|PO.06
PO.05/AIN3|UARTOPEN() selects UART
COMMS behaviour|
||AIN3||||||||
|21|SIO_04/
AIN2|SIO_04|AIN2|IN|PULL-
UP|6|PO.04/AIN2|Internal pull-down|
|22|SIO_03/
AIN1|SIO_03|AIN1|IN|PULL-
UP|5|PO.03/AIN1|**Laird Devkit:**Temp Sens Analog
or Arduino Analog|
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11
© Copyright 2016 Laird. All Rights Reserved
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**BL652** Datasheet
|**Pin**
**#**|**Pin Name**|**Default**
**Function**|**Alternate**
**Function**|**In/**
**Out**|**Pull**
**Up/**
**Down**|**nRF52832**
**QFN Pin**|**nRF52832**
**QFN Name**|**Comment**|
|---|---|---|---|---|---|---|---|---|
|23|SIO_02/
AIN0|SIO_02|AIN0|IN|PULL-
DOWN|4|PO.02/AIN0|Internal pull-down|
|24|SIO_01/
XL2|SIO_01|XL2|IN|PULL-
UP|3|PO.01/XL2|**Laird Devkit:**Optional 32.768kHz
crystal pad XL2|
|25|SIO_00/
XL1|SIO_00|XL1|IN|PULL-
UP|2|PO.00/XL1|**Laird Devkit:**Optional 32.768kHz
crystal pad XL1|
|26|VDD_nRF|-|-|-|-|-|-|1.7V to 3.6V|
|27|GND|-|-|-|-|-|-|-|
|-|SIO_13/
nAutoRUN|nAutoRUN|SIO_13|IN|PULL-
DOWN|16|PO.13|**Laird Devkit:**FTDI USB_DTR via
jumper on J12pin1-2.|
|29|SIO_15|SIO_15|-|IN|PULL-
UP|18|PO.15|**Laird Devkit:**BUTTON2|
|30|SIO_17|SIO_17|-|IN|PULL-
UP|20|PO.17|**Laird Devkit:**LED1|
|31|SIO_19|SIO_19|-|IN|PULL-
UP|22|PO.19|**Laird Devkit:**LED2|
|32|SIO_31/
AIN7|SIO_31|AIN7|IN|PULL-
UP|43|PO.31/AIN7|-|
|33|SIO_30/
AIN6|SIO_30|AIN6|IN|PULL-
UP|42|PO.30/AIN6|-|
|34|SIO_29/
AIN5|SIO_29|AIN5|IN|PULL-
UP|41|PO.29/AIN5|-|
|35|SIO_28/
AIN4|SIO_28|AIN4|IN|PULL-
UP|40|PO.28/AIN4|-|
|36|SIO_27/
I2C_SCL|SIO_27|I2C_SCL|IN|PULL-
UP|39|PO.27|**Laird Devkit:**I2C RTC chip. I2C
clock line.|
|37|SIO_26/
I2C_SDA|SIO_26|I2C_SDA|IN|PULL-
UP|38|PO.26|**Laird Devkit:**I2C RTC chip. I2C
data line.|
|||||||||**Laird Devkit:**SPI EEPROM.|
|||||||||SPI_Eeprom_CLK, Output|
|38|SIO_25/
SPI_CLK|SIO_25|SPI_CLK|IN|PULL-
UP|37|PO.25|SPIOPEN() in_smart_BASIC selects|
|||||||||SPI function, MOSI and CLK are|
|||||||||outputs when in SPI master mode.|
|39|GND|-|-|-|-|-|-|-|
## **Pin Definition Notes:**
**Note 1** SIO = Signal Input or Output. Secondary function is selectable in _smart_ BASIC application.
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## **Pin Definition Notes:**
- **Note 2** DIO = Digital Input or Output.
I/O voltage level tracks VCC.
- **Note 3** AIN = Analog Input
- **Note 4** DIO or AIN functionality is selected using the GpioSetFunc() function in _smart_ BASIC.
- **Note 5** AIN configuration selected using GpioSetFunc() function.
- **Note 6** I2C, UART, SPI controlled by xxxOPEN() functions in _smart_ BASIC.
- **Note 7** SIO_5 to SIO_8 are DIO by default when $autorun$ app runs on power-up.
- **Note 8** JTAG (two-wire SWD interface), pin 5 (SWDIO) and pin 6 (SWDCLK).
- JTAG is NOT required for customer use. Upgrading _smart_ BASIC runtime engine firmware or loading the _smart_ BASIC applications is done using the UART interface.
- **Note 9** Pull the nRESET pin (pin 7) low for minimum 100 milliseconds to reset the BL652.
- **Note 10** SPI CS is created by using any spare SIO pin within their _smart_ BASIC application script allowing multidropping.
- **Note 11** The SIO_02 pin must be pulled high externally to enable an OTA (over-the-air) _smart_ BASIC application download. Refer to the latest firmware release documentation for details.
- **Note 12** Ensure that SIO_02 (pin 23) and AutoRUN (pin 28) are _**not both high**_ (externally), in that state, the UART is bridged to Virtual Serial Port service; the BL652 module does not respond to AT commands and cannot load _smart_ BASIC application scripts.
- **Note 13** The _smartBASIC_ runtime engine has DIO (Default Function) INPUT pins, which are set PULL-UP by default. This avoids floating inputs (which can cause current consumption to drive with time in low power modes (such as StandbyDoze). You can disable the PULL-UP through your _smart_ BASIC application.
All of the SIO pins (with a default function of DIO) are inputs (apart from SIO_05 and SIO_06, which are outputs):
- SIO_06 (alternative function UART_TX) is an output, set High (in the firmware).
- SIO_05 (alternative function UART_RTS) is an output, set Low (in the firmware).
- SIO_08 (alternative function UART_RX) is an input, set with internal pull-up (in the firmware).
- SIO_07 (alternative function UART_CTS) is an input, set with internal pull-down (in the firmware).
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**BL652** Datasheet
## **Pin Definition Notes:**
- SIO_02 is an input set with internal pull-down (in the firmware). It is used for OTA downloading of _smart_ BASIC applications. Refer to the latest firmware release documentation for details.
- **Note 14** Not required for BL652 module normal operation. If you fit an external serial (SPI) flash for data logging purposes, then that external serial (SPI) flash must connect to BL652 module pins SIO_12 (SFLASH_CS), SIO_14 (SFLASH_MISO), SIO_16 (SFLASH_CLK), and SIO_20 (SFLASH_MOSI); in that case, a high level API in _smart_ BASIC can be used for fast access using open/close/read/write API functions.
By default, these are GPIO pins. Only when in their FlashOpen() _smart_ BASIC app are these lines dedicated to SPI and for talking to the off-board flash.
If you decide to use an external serial (SPI) flash with BL652-SX-xx, then **ONLY** the manufacturer part numbers below **MUST** be used:
- 4 Mbit Macronix MX25R4035F
- http://www.macronix.com/Lists/DataSheet/Attachments/3288/MX25R4035F,%20Wide%20Ran ge,%204Mb,%20v1.2.pdf
- 8 Mbit Macronix MX25R8035F
- http://www.macronix.com/Lists/DataSheet/Attachments/3532/MX25R8035F,%20Wide%20Ran ge,%208Mb,%20v1.2.pdf
_smart_ BASIC does not provide access to any external serial (SPI) flash other than these part numbers.
- **Note 15** Not required for BL652 module normal operation. The on-chip 32.768kHz RC oscillator provides the standard accuracy of ±250 ppm, with calibration required every 8seconds (default) to stay within ±250 ppm.
BL652 also allows as an option to connect an external higher accuracy (±20 ppm) 32.768 kHz crystal to the BL652-SX-xx pins SIO_01/XL2 (pin 24) and SIO_00/XL1 (pin 25). This provides higher accuracy protocol timing and helps with radio power consumption in the system standby doze/deep sleep modes by reducing the time that the Rx window must be open.
The BL652 module is delivered with the integrated _smart_ BASIC runtime engine firmware loaded (but no onboard _smart_ BASIC application script). Therefore it boots into AT command mode by default.
At reset, all SIO lines are configured as the defaults shown above.
SIO lines can be configured through the _smart_ BASIC application script to be either inputs or outputs with pull-ups or pull-downs. When an alternative SIO function is selected (such as I2C or SPI), the firmware does not allow the setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up resistors on I2C SDA and I2C SCL _**must**_ be connected externally as per I2C standard.
UART_RX, UART_TX, and UART_CTS are 3.3 V level logic (if VCC is 3.3 V; such as SIO pin I/O levels track VCC). For example, when Rx and Tx are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, handshaking pins CTS and RTS at 0V are treated as assertions.
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Pin 28 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BL652-xx) it is connected so that the state is driven by the host’s DTR output line. The nAutoRUN pin must be externally held high or low to select between the following two BL652 operating modes:
- Self-contained Run mode (nAutoRUN pin held at 0V –this is the default (internal pull-down enabled))
- Interactive/Development mode (nAutoRUN pin held at VCC)
The _smart_ BASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a _smart_ BASIC application script named **$autorun$** , then the _smart_ BASIC runtime engine firmware executes the application script automatically; hence the name S _elf-contained Run Mode_ .
## **Electrical Specifications**
## **3.3.1 Absolute Maximum Ratings**
Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below; exceeding these values causes permanent damage.
||**_Table 3: Maximum current ratings_**||||
|---|---|---|---|---|
|**Parameter**
Voltage at VDD_nRFpin
~~a~~||**Min**
-0.3|**Max**
+3.9(Note 1)|**Unit**
V|
||Voltage at GNDpin||0|V|
||Voltage at SIOpin(at VDD_nRF≤3.6V)|-0.3|VDD_nRF +0.3|V|
||Voltage at SIOpin(at VDD_nRF≥3.6V)|-0.3|3.9|V|
||NFC antennapin current(NFC1/2)|-|80|mA|
||Radio RF input level|-|10|dBm|
||**Environmental**||||
||Storage temperature|-40|+85|ºC|
||MSL(Moisture SensitivityLevel)|-|3|-|
||ESD (as per EN301-489)||||
||Conductive||4|KV|
||Air Coupling||8|KV|
||Flash Memory (Endurance) (Note 2)|-|10000|Write/erase cycles|
||Flash Memory (Retention)|-|10years at 40°C|-|
## **Maximum Ratings Notes:**
**Note 1** The absolute maximum rating for VCC pin (max) is 3.9V for the BL652-Sx-xx.
**Note 2** Wear levelling is used in file system.
## **3.3.2 Recommended Operating Parameters**
_**Table 4: Power supply operating parameters**_ **Parameter Min Typ Max Unit** ~~eees es es~~ VDD_nRF (independent of DCDC) **[1]** 1.8 3.3 3.6 V Embedded Wireless Solutions Support Center: 15 Americas: +1-800-492-2320 http://ews-support.lairdtech.com Europe: +44-1628-858-940 www.lairdtech.com/bluetooth Hong Kong: +852 2923 0610
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**BL652** Datasheet
|**Parameter**
**Min**
**Typ**
**Max**
**Unit**
VCC Maximum ripple or noise**2**
-
-
10
mV
~~es~~
~~esee~~|**Parameter**
**Min**
**Typ**
**Max**
**Unit**
VCC Maximum ripple or noise**2**
-
-
10
mV
~~es~~
~~esee~~|**Parameter**
**Min**
**Typ**
**Max**
**Unit**
VCC Maximum ripple or noise**2**
-
-
10
mV
~~es~~
~~esee~~|**Parameter**
**Min**
**Typ**
**Max**
**Unit**
VCC Maximum ripple or noise**2**
-
-
10
mV
~~es~~
~~esee~~|
|---|---|---|---|
|VCC rise time (0 to 1.7V)**3**|-
-|60|mS|
|Operating Temperature Range|-40
-|+85|ºC|
## **Recommended Operating Parameters Notes:**
- **Note 1** 4.7 uF internal to module on VCC. In _smart_ BASIC runtime engine firmware, use of the internal DCDC convertor or LDO is decided by the underlying BLE stack.
- **Note 2** This is the maximum VCC ripple or noise (at any frequency) that does not disturb the radio.
- **Note 3** The on-board power-on reset circuitry may not function properly for rise times outside the noted interval.
|**_Table 5: Signal levels for interface, SIO_**|||||
|---|---|---|---|---|
|**Parameter**
**Min**
**Typ**
**Max**
**Unit**
VIHInput high voltage
0.7 VDD_nRF
VDD_nRF
V
~~ee~~
~~es~~|||||
|VILInput low voltage|VSS||0.3 x VDD_nRF|V|
|VOHOutput high voltage|||||
|(std. drive, 0.5mA) (Note 1)|VDD_nRF -0.4||VDD_nRF|V|
|(high-drive, 3mA) (Note 1)|VDD_nRF -0.4||VDD_nRF|V|
|(high-drive, 5mA) (Note 2)|VDD_nRF -0.4||VDD_nRF||
|VOLOutput low voltage|||||
|(std. drive, 0.5mA) (Note 1)|VSS||VSS+0.4|V|
|(high-drive, 3mA) (Note 1)|VSS||VSS+0.4|V|
|(high-drive, 5mA) (Note 2)|VSS||VSS+0.4||
|VOLCurrent at VSS+0.4V,Output set low|||||
|(std. drive, 0.5mA) (Note 1)|1|2|4|mA|
|(high-drive, 3mA) (Note 1)|3|-|-|mA|
|(high-drive, 5mA) (Note 2)|6|10|15|mA|
|VOLCurrent at VDD_nRF -0.4, Output set low|||||
|(std. drive, 0.5mA) (Note 1)|1|2|4|mA|
|(high-drive, 3mA) (Note 1)|3|-|-|mA|
|(high-drive, 5mA) (Note 2)|6|9|14|mA|
|Pull upresistance|11|13|16|kΩ|
|Pull down resistance|11|13|16|kΩ|
|Pad capacitance||3||pF|
|Pad capacitance at NFC pads||4||pF|
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**BL652** Datasheet
## **Signal Levels Notes:**
**Note 1** For VDD_nRF≥1.7V. The _smart_ BASIC firmware supports high drive (3 mA, as well as standard drive).
**Note 2** For VDD_nRF≥2.7V. The _smart_ BASIC firmware supports high drive (5 mA (since VDD_nRF≥2.7V), as well as standard drive).
_**Table 6: SIO pin alternative function AIN (ADC) specification**_
|**Parameter**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|
|ADC Internal reference voltage|-1.5%|0.6 V|+1.5%|%|
|ADC pin input||4, 2, 1, 1/2,||scaling|
|internal selectable scaling||1/3, 1/4, 1/5
1/6|||
|ADC input pin (AIN) voltage maximum without|||||
|damaging ADC w.r.t1|||||
|VCC Prescaling|||||
|0V-VDD_nRF 4, 2, 1, ½, 1/3, ¼, 1/5, 1/6||VDD+0.3||V|
|Configurable via smartBASIC|8bit|10bit mode|12bit mode||
|Resolution|mode|||bits|
|Configurable via smartBASIC2|||||
|Acquisition Time, source resistance ≤10kΩ||3||uS|
|Acquisition Time, source resistance ≤40kΩ||5||uS|
|Acquisition Time, source resistance ≤100kΩ||10||uS|
|Acquisition Time, source resistance ≤200kΩ||15||uS|
|Acquisition Time, source resistance ≤400kΩ||20||uS|
|Acquisition Time, source resistance ≤800kΩ||40||uS|
|Conversion Time3||<2||uS|
|ADC input impedance (during operation)3|||||
|Input Resistance||>1||MOhm|
|Sample and hold capacitance at maximum gain||2.5||pF|
## **Recommended Operating Parameters Notes:**
- **Note 1**[Stay within internal 0.6 V reference voltage with given pre-scaling on AIN pin and do not violate ADC ] maximum input voltage (for damage) for a given VCC, e.g. If VCC is 3.6V, you can only expose AIN pin to VDD+0.3 V. Default pre-scaling is 1/6 which configurable via smartBASIC.
- **Note 2** smartBASIC runtime engine firmware allows configurable resolution (8-bit, 10-bit or 12-bit mode) and acquisition time. The sampling frequency is limited by the sum of sampling time and acquisition time. The maximum sampling time is 2us. For acquisition time of 3us the total conversion time is therefore 5us, which makes maximum sampling frequency of 1/5us = 200kHz. Similarly, if acquisition time of 40us chosen, then the conversion time is 42us and the maximum sampling frequency is 1/42us = 23.8kHz
**Note 3** ADC input impedance is estimated mean impedance of the ADC (AIN) pins.
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**BL652** Datasheet
## **3.3.3 nAutoRUN Pin and Operating Modes**
Operating modes (refer to the _smart_ BASIC guide for details):
- Self-contained mode
- Interactive/Development mode
|**_Table 7: nAutoRUN pin_**
**Signal Name**
nAutoRUN /(SIO_13)
~~a~~|**_Table 7: nAutoRUN pin_**
**Signal Name**
nAutoRUN /(SIO_13)
~~a~~|**Pin #**
28
~~ee ~~|**I/O**
I
~~ee~~|**Comments**
Input with active low logic. Internal pull down (default).|
|---|---|---|---|---|
|||||Operating mode selected by nAutoRun pin status:|
|||||
If Low (0V), runs $autorun$ if it exists|
|||||
If High(VCC),runs via at+run(and file name of application)|
Pin 28 (nAutoRUN) is an input, with active low logic. In the development board (DVK-BL652-xx) it is connected so that the state is driven by the host’s DTR output line. nAutoRUN pin needs to be externally held high or low to select between the two BL652 operating modes:
- Self-contained Run mode (nAutoRUN pin held at 0V).
- Interactive/Development mode (nAutoRUN pin held at VCC).
_smart_ BASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low AND if there is a _smart_ BASIC application named $autorun$, the _smart_ BASIC runtime engine executes the application automatically; hence the name _self-contained run mode_ .
## **3.3.4 OTA (Over-the-Air)** _**smart**_ **BASIC Application Download**
Refer to latest firmware release documentation (firmware release notes and _smart_ BASIC user guide) for details.
_**Table 8: OTA mode**_
|**_Table 8: OTA mode_**|**_Table 8: OTA mode_**||||
|---|---|---|---|---|
|**Signal Name**
SIO_02
~~a~~||**Pin #**
23
~~a~~|**I/O**
I
~~ee~~|**Comments**
Internal pull down (default).|
|||||OTA mode selected by externally pulling-up SIO_02 pin:|
|||||**High (VCC),**then OTA_smart_ BASIC application download is possible.|
The OTA _smart_ BASIC application download feature can be useful for production because it allows the module to be soldered into an end product without pre-configuration; the application can then be downloaded over-the-air once the product has been pre-tested.
**Note:** It is the _smart_ BASIC application that is downloaded over-the-air and NOT the firmware. Since this is principally designed for use in production with multiple programming stations in a locality, the transmit power is limited (to lower Tx power). See the _**smart**_ **BASIC user guide** for more details.
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**BL652** Datasheet
## 4 POWER CONSUMPTION
Data taken at VCC_nRF of 3.0 V with internal (to chipset) LDO ON or with internal (to chipset) DCDC ON (see Note 1) and 25 º C.
## **Power Consumption**
## 4.1 **Power Consumption** _**Table 9: Power consumption**_ **Parameter Min Typ Max Unit** ~~aee ee~~
|**_Table 9: Power consumption_**
**Parameter**
**Active mode ‘peak’ current**(Note 1)
~~aee ee~~|**Min**
~~aee ee~~
~~ee ee ee~~|**Typ**
With DCDC [with LDO]
~~aee ee~~
~~ee ee ee~~|**Max**
~~aee ee~~|**Unit**
~~aee ee~~|
|---|---|---|---|---|
|**(Advertising or Connection)**|||||
|Tx only run peak current @ Txpwr = +4 dBm||7.5 [16.6]||mA|
|Tx only run peak current @ Txpwr = 0 dBm||5.3 [11.6]||mA|
|Tx only run peak current @ Txpwr = -4 dBm||4.2 [9.3]||mA|
|Tx only run peak current @ Txpwr = -8 dBm||3.8 [8.4]||mA|
|Tx only run peak current @ Txpwr = -12 dBm||3.5 [7.7]||mA|
|Tx only run peak current @ Txpwr = -16 dBm||3.3 [7.3]||mA|
|Tx only run peak current @ Txpwr = -20 dBm||3.2 [7.0]||mA|
|**Tx Whisper mode 1**(Note 2)|||||
|Tx only run peak current @ Txpwr = -40 dBm||2.7 [5.9]||mA|
|**Active Mode**|||||
|Rx only ‘peak’ current (Note 2)||5.4 [11.7]||mA|
|**Ultra Low Power Mode 1**(Note 2)||1.2||uA|
|Standby Doze, no RAM retention|||||
|**Ultra Low Power Mode 2**(Note 3)||400||nA|
|Deep Sleep (no RAM retention)|||||
|**Active Mode Average current**(Note 4)|||||
|**Advertising Average** **Current draw**|||||
|**Max**, with advertising interval (min) 20 mS||~511||uA|
|**Min**, with advertising interval (max) 10240 mS||~3.2||uA|
|**Connection** **Average** **Current draw**|||||
|**Max,**with connection interval (min) 7.5 mS||~513||uA|
|**Min**, with connection interval (max) 4000 mS||~2.9||uA|
## **Power Consumption Notes:**
- **Note 1** This is for Peak Radio Current only, but there is additional current due to the MCU, refer to Table 12 and Table 15 for the peak and "Average Advert/connection (burst) current" consumption profile (with DCDC on) during advertising and connection versus TX power. In _smart_ BASIC runtime engine firmware, use of the internal DCDC convertor or LDO is decided by the underlying BLE stack.
- **Note 2** BL652-Sx-xx: Standby Doze is 1.2uA typical. Standby Doze is entered automatically (when a _waitevent_ statement is encountered within a _smart_ BASIC application script). In Standby Doze, all peripherals
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**BL652** Datasheet
that are enabled stay on and may re-awaken the chip. Depending on active peripherals, current consumption ranges from ~1.2 µA to 270 uA (when UART is ON). See individual peripherals current consumption data in the Peripheral Block Current Consumption section. _smart_ BASIC runtime engine firmware has added new functionality to detect GPIO change with no current consumption cost, it is possible to close the UART and get to the 1.2uA current consumption regime and still be able to detect for incoming data and be woken up so that the UART can be re-opened at expense of losing that first character.
- **Note 3** In Deep Sleep, everything is disabled and the only wake-up sources (including NFC to wakeup) are reset and changes on SIO or NFC pins on which sense is enabled. The current consumption seen is ~400 nA typical in BL652-Sx-xx.
- _smart_ BASIC runtime engine firmware requires a hardware reset to come out of deep sleep.
- _smart_ BASIC runtime engine firmware also allows coming out from Deep Sleep to Standby Doze through GPIO signal through the reset vector. Deep Sleep mode is entered with a command in _smart_ BASIC application script.
- **Note 4** Data taken with a transmit power of 4 dBm and all peripherals off (UART OFF after radio event), slave latency of 0 (in a connection). Average current consumption depends on a number of factors (including Tx power, VCC, accuracy of 32MHz and 32.768 kHz). With these factors fixed, the largest variable is the advertising or connection interval set.
Advertising Interval range:
- 20 milliseconds to 10240 milliseconds in multiples of 0.625 milliseconds for the following Advert type: ADV_IND and ADV_DIRECT_IND
- 100 milliseconds to 10240 milliseconds in multiples of 0.625 milliseconds for the following Advert types: ADV_SCAN_IND and ADV_NONCONN_IND
For advertising timeout, if the advert type is ADV_DIRECT_IND, then the timeout is limited to 1.28 seconds (1280 milliseconds).
For an advertising event:
- The minimum average current consumption is when the advertising interval is large 10240 mS (although this may cause long discover times (for the advertising event) by scanners
- The maximum average current consumption is when the advertising interval is small 20 mS
Other factors that are also related to average current consumption include the advertising payload bytes in each advertising packet and whether it’s continuously advertising or periodically advertising.
Connection Interval range:
- 7.5 milliseconds to 4000 milliseconds in multiples of 1.25 milliseconds.
For a connection event:
- The minimum average current consumption is when the connection interval is large 4000 milliseconds
- The maximum average current consumption is with the shortest connection interval of 7.5 ms; no slave latency.
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**BL652** Datasheet
Other factors that are also related to average current consumption include:
- Whether transmitting six packets per connection interval with each packet containing 20 bytes (which is the maximum for each packet)
- An inaccurate 32.768 kHz master clock accuracy would increase the average current consumption.
## **Measured Current Waveforms during Advertising and Connection**
The following figures illustrate current waveforms observed as the BL652 module performs advertising and connection functionality.
**==> picture [402 x 260] intentionally omitted <==**
**----- Start of picture text -----**
TX power – 4 dBm 29 byte payload
Advert duration ~4.377 ms Advertising interval – 20 ms
TX: 8.8 mA
TX: <8.8 mA TX: <8.8 mA
3 | RX: 6 mA | i RX: 6 mA ||| RX: 6 mA
‘
:|
: eei H }t | |)
» | b fit
Hl | | || | | bP
H | | || | | | | | | |
annt | | Tira rf a| ia
F1-A-I1 i]‘|| \VIfly\{| VyA —}aUtTAi rr AMoo |Wnhe | WyTAT| \ | ,LI\WWyh | | oeLIS\ J +| \
—>—_————= : J ily yy \f Le
3.701865 3.702365 3.702865 3.703365 3.703865 3.704365 3.704865 3.705365 3.705865
«<< { > >
[&] [Measurements] (~ Average current for BLE Advert Ranges... AUTO
**----- End of picture text -----**
_**Figure 4: Typical peak current consumption profile (with DCDC ON) during advertising in slave mode @ TX PWR +4 dBm. UART is OFF**_
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**BL652** Datasheet
**==> picture [375 x 271] intentionally omitted <==**
**----- Start of picture text -----**
TX power – 4 dBm 29 byte payload
Interval – 7.5 ms Advertising interval – 20 ms
TX: 8.55 mA
‘ ||a :
: | | :
'‘ RX: 6 mA | :
:
::: ih LyWt\!"| | :
4] | b :
an| | | | ry)1 fl:fr
‘7| | f| NYmSof}| PW1UyWey :
HLTA‘||}| Li /\| \ im||Tl A rl j h || |PP \|_|3
| a i A I iV. . f\ i | | ot
| {i }° / \/ { j i \f —_ ! | 3
: \/ — osHn ee eed —~ Ss ~— ~ | (os
1 y ‘. y oa
5.820417 5.820702 5.820987 5.821272 5.821556 5.821841 5.822126 5.822411 5.822695
&
<< < ' > >>
Stopped Markers& Measurements (~ Ranges...
Average current for BLE connection
g Marker 1 “occuTomon*t> Between Markers
**----- End of picture text -----**
_**Figure 5: Typical peak current consumption profile (with DCDC ON) during data connection event in slave mode @ TX PWR +4dBm UART is OFF**_
**Note:** In the above pictures, UART is OFF. Y-axis current (1.3 mA per square).
To make things easier the average current during the whole BLE event is shown in the plot above, and then the BLE event total charge consumption is found by multiplying the average current over the BLE event with the length of the event. This charge can then be used to extrapolate the average current for **different advertising intervals** , by dividing by the interval. Then the StandbyDoze (IDLE) current must be added to give the total average current. In this example we can calculate the average current to be:
The total charge of the BLE event:
BLE_charge **=** BLE_avg ***** BLE_length
The average current consumed by the BLE event for a specific interval:
BLE_avg **=** BLE_charge / (BLE_interval **+** perturbation)
The perturbation is given as a random number between 0 and 10 milliseconds added to the interval to prevent advertisers to periodically transmit at the exact same time. This averages to 5 milliseconds.
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Adding the IDLE current (StandbyDoze mode) to the inactive part of the interval:
TOT_avg **=** BLE_avg **+** IDLE ***** (BLE_interval **-** BLE_length) / BLE_interval
Performing the calculation with the numbers 25mS advertising internal and TX power for 4dBm for example:
BLE_charge = 4.377 ms ***** 2.91 mA = 12.74 uC
BLE_avg = 12.74 uC / 25 ms + 5 ms) = 509.78 uA
TOT_avg = 509.78 uA + 2 uA * (25 ms **-** 4.377 ms)/25 ms = 511.43 uA
Table 10 and Table 11 display the measured "Average Advert (Burst) current" (for a given TX power) which can be used to calculate the Total average current for any advertising interval.
Table 12 and Table 13 display the measured "Average Connection (Burst) current" (for a given TX power) which can be used to calculate the Total average current for any connection interval.
The following table (Table 10) shows the measured total average current consumption profile (with DCDC on) during advertising in slave mode versus TX power for a minimum advertising interval of 25 milliseconds. Note that UART is off.
_**Table 10: Measured total average current consumption profile – for a minimum advertising interval of 25 ms**_
|**TX**
**Power**
**(dBm)**|**Average**
**Advert**
**(Burst)**
**Current**
**(uA)**|**Average**
**Advert**
**(Burst)**
**Duration**
**(mS)**|**BLE**
**Advert**
**Charge**
**(uC)**|**BLE Advert**
**Interval**
**20 mS plus**
**5 mS**
**Perturbation**|**BLE**
**Advert**
**Average**
**(uA)**|**Max**
**Standby**
**Doze**
**Current**
**(uA)**|**BLE Advert**
**Interval**
**20 mS plus**
**5 mS**
**Pertubation**|**Total**
**Average**
**Current**
**(uA)**|
|---|---|---|---|---|---|---|---|---|
|4|2911.726|4.377|12744.625|25|509.785|2|25|511.435|
|0|2431.095|4.377|10640.903|25|425.636|2|25|427.286|
|-4|2163.884|4.377|9471.320|25|378.853|2|25|380.503|
|-8|2151.602|4.377|9417.562|25|376.702|2|25|378.352|
|-12|2086.596|4.377|9133.031|25|365.321|2|25|366.971|
|-16|2052.041|4.377|8981.783|25|359.271|2|25|360.921|
|-20|2029.615|4.377|8883.625|25|355.345|2|25|356.995|
|-40|1960.112|4.377|8579.410|25|343.177|2|25|344.826|
The following table (Table 11) shows the measured total average current consumption profile (with DCDC on) during advertising in slave mode versus TX power for a maximum advertising interval of 10240 milliseconds. Note that UART is off.
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_**Table 11: Measured total average current consumption profile – for a minimum advertising interval of 10240 ms**_
|**TX**
**Power**
**(dBm)**|**Average**
**Advert**
**(Burst)**
**Current**
**(uA)**|**Average**
**Advert**
**(Burst)**
**Duration**
**(mS)**|**BLE**
**Advert**
**Charge**
**(uC)**|**BLE Advert**
**Interval**
**10240 mS**
**plus 5 mS**
**Perturbation**|**BLE**
**Advert**
**Average**
**(uA)**|**Max**
**Standby**
**Doze**
**Current**
**(uA)**|**BLE Advert**
**Interval**
**10240 mS**
**plus 5 mS**
**Perturbation**|**Total**
**Average**
**Current**
**(uA)**|
|---|---|---|---|---|---|---|---|---|
|4|2911.726|4.377|12744.625|10245|1.244|2|10245|3.243|
|0|2431.095|4.377|10640.903|10245|1.039|2|10245|3.038|
|-4|2163.884|4.377|9471.320|10245|0.924|2|10245|2.924|
|-8|2151.602|4.377|9417.562|10245|0.919|2|10245|2.918|
|-12|2086.596|4.377|9133.031|10245|0.891|2|10245|2.891|
|-16|2052.041|4.377|8981.783|10245|0.877|2|10245|2.876|
|-20|2029.615|4.377|8883.625|10245|0.867|2|10245|2.866|
|-40|1960.112|4.377|8579.410|10245|0.837|2|10245|2.837|
Table 12 displays measured peak and "Average Advert (burst) current" consumption profile (with DCDC on) during advertising in slave mode versus TX power. Between Marker 1 and 2 is the average BLE advert current.
_**Table 12: Measured average advert (burst) current consumption profiles (with DCDC on) during advertising in slave mode vs TX power**_
TX power: 4 dBm 29 byte payload Advert 20 ms interval
Average BLE advert current burst (excluding advertising interval): 2.911 mA
Aside:
Peak TX current: 8.8 mA Peak RX current: 6 mA
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**BL652** Datasheet
TX power: 0 dBm 29 byte payload Advert 20 ms interval
Average BLE advert current burst (excluding advertising interval): 2.431 mA
Aside:
Peak TX current: 6 mA Peak RX current: 6 mA
TX power: -4 dBm 29 byte payload Advert 20 ms interval
Average BLE advert current burst (excluding advertising Interval): 2.163 mA
Aside: Peak TX current: 4.98 mA Peak RX current: 5.99 mA
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TX power: -8 dBm 29 byte payload Advert 20 ms interval
Average BLE advert current burst (excluding advertising Interval): 2.151 mA
Aside: Peak TX current: 4.59 mA Peak RX current: 5.98 mA
TX power: -12 dBm 29 byte payload Advert 20 ms interval
Average BLE advert current burst (excluding advertising Interval): 2.086 mA
Aside: Peak TX current: 4.34 mA Peak RX current: 5.99 mA
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TX power: -16 dBm 29 byte payload Advert 20 ms interval
Average BLE advert current burst (excluding advertising Interval): 2.052 mA
Aside: Peak TX current: 4.16 mA Peak RX current: 5.99 mA
TX power: -20 dBm 29 byte payload Advert 20 ms interval
Average BLE advert current burst (excluding advertising Interval): 2.029 mA
Aside:
Peak TX current: 4.03 mA Peak RX current: 5.99 mA
J,
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TX power: -40 dBm 29 byte payload Advert 20 ms interval
Average BLE advert current burst (excluding advertising Interval): 1.960 mA
Refer to table for worked out total BLE advert average current for given advertising interval.
Aside: Peak TX current: 3.6 mA Peak RX current: 6.01 mA
Table 13 and Table 14 has the measured "Average Connection (Burst) current" (for a given TX power) which can be used to calculate the Total average current for any connection interval.
_**Table 13: Measured Total average current consumption profile (with DCDC ON) during connection in slave mode versus TX POWER for minimum Connection interval of 7.5 mS. UART is OFF**_
|**TX**
**power**
**(dBm)**|**Average**
**Connection**
**(Burst)**
**Current (uA)**|**Average**
**Connection**
**(Burst)**
**Duration**
**(mS)**|**BLE**
**Connection**
**Charge**
**(uC)**|**BLE**
**Connection**
**Interval**
**(mS)**|**BLE**
**Connection**
**Average**
**(uA)**|**Max**
**Standby**
**Doze**
**Current**
**(uA)**|**BLE**
**Connection**
**Interval**
**7.5 ms**|**Total**
**Average**
**Current**
**(uA)**|
|---|---|---|---|---|---|---|---|---|
|4|1670.956|2.3|3843.199|7.5|512.427|2|7.5|513.813|
|0|1560.069|2.3|3588.159|7.5|478.421|2|7.5|479.808|
|-4|1513.156|2.3|3480.259|7.5|464.035|2|7.5|465.421|
|-8|1492.133|2.3|3431.906|7.5|457.587|2|7.5|458.974|
|-12|1488.407|2.3|3423.336|7.5|456.445|2|7.5|457.831|
|-16|1469.042|2.3|3378.797|7.5|450.506|2|7.5|451.893|
|-20|1454.618|2.3|3345.621|7.5|446.083|2|7.5|447.470|
|-40|1428.215|2.3|3284.895|7.5|437.986|2|7.5|439.373|
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**BL652** Datasheet
_**Table 14: Measured Total average current consumption profile (with DCDC ON) during connection in slave mode versus TX POWER for minimum Connection interval of 4000mS. UART is OFF**_
|**TX**
**power**
**(dBm)**|**Average**
**Connection**
**(Burst)**
**Current (uA)**|**Average**
**Connection**
**(Burst)**
**Duration**
**(mS)**|**BLE**
**Connection**
**Charge**
**(uC)**|**BLE**
**Connection**
**Interval**
**(mS)**|**BLE**
**Connection**
**Average**
**(uA)**|**Max**
**Standby**
**Doze**
**Current**
**(uA)**|**BLE**
**Connection**
**Interval**
**7.5 ms**|**Total**
**Average**
**Current**
**(uA)**|
|---|---|---|---|---|---|---|---|---|
|4|1670.956|2.3|3843.199|4000|0.961|2|4000|2.960|
|0|1560.069|2.3|3588.159|4000|0.897|2|4000|2.896|
|-4|1513.156|2.3|3480.259|4000|0.870|2|4000|2.869|
|-8|1492.133|2.3|3431.906|4000|0.858|2|4000|2.857|
|-12|1488.407|2.3|3423.336|4000|0.856|2|4000|2.855|
|-16|1469.042|2.3|3378.797|4000|0.845|2|4000|2.844|
|-20|1454.618|2.3|3345.621|4000|0.836|2|4000|2.835|
|-40|1428.215|2.3|3284.895|4000|0.821|2|4000|2.820|
Table 15 displays the typical peak and "Average Connection (Burst) current" consumption profile (with DCDC on) during a connection event in slave mode versus TX power. Between Marker 1 and 2 is the average BLE connection current.
_**Table 15: Average connection current consumption profiles during a connection event in slave mode**_
TX power: 4 dBm 29 byte payload Connection 7.5 ms interval
Average BLE connection burst current (excluding connection Interval): 1.67 mA
Aside: Peak RX current: 5.95mA Peak TX current: 8.55mA
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TX power: 0 dBm Connection
29 byte payload (2.3 ms) 7.5 ms interval
Average BLE connection burst current (excluding connection Interval): 1.56 mA
Aside: Peak RX current: 5.92 mA Peak TX current: 5.96 mA
TX power: -4 dBm 29 byte payload (2.3 ms) Connection 7.5 ms interval
Average BLE connection burst current (excluding connection Interval): 1.513 mA
Aside: Peak RX current: 5.94 mA Peak TX current: 4.95 mA
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TX power: -8 dBm 29 byte payload (2.3 ms) Connection 7.5 ms interval
Average BLE connection burst current (excluding connection Interval): 1.492 mA
Aside: Peak RX current: 5.92 mA Peak TX current: 4.58 mA
TX power: -12 dBm 29 byte payload (2.3 ms) Connection 7.5 ms interval
Average BLE connection burst current (excluding connection Interval): 1.488 mA
Aside: Peak RX current: 5.93 mA Peak TX current: 4.30 mA
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**BL652** Datasheet
TX power: -16 dBm 29 byte payload (2.3 ms) Average BLE connection burst current Connection 7.5 ms interval (excluding connection Interval): g7 g 1.469 mA Aside: Peak RX current: 5.94 mA Peak TX current: 4.17 mA —————_1 —_ - = ~ ‘tTt=, = ee 6375996 6376274 6.376552 6376829 6377107 6377385 6377662 6377340 6378218 6378495 _ ee Tange |ao cu] CS | & [EQ Marker 1 Measurements Between Markers Marker 2 Time 6.375941 s Min Avg MaxA= 2.301 ms RMSFreq = 434.561Peak toHz Peak Charge / Charge / 6.378242 5 FI-A-I 3.192 A 2.932 YA 469042 mA 5.9) 2 mA 4mA Energy44 pA Energy4 UC 5.878 YA 278ys/ > Offset O's Points: 2048 (Auto) ~ Period: O's Trigger Scope Run Button ~ Mode: Auto > Slope: & Leve TX power: -20 dBm 29 byte payload (2.3 ms) Average BLE connection burst current Connection 7.5 ms interval (excluding connection Interval):
Average BLE connection burst current (excluding connection Interval): 1.454 mA Aside: Peak RX current: 5.95 mA Peak TX current: 4.03 mA
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TX power: -40 dBm Connection
29 byte payload (2.3 ms) 7.5 ms interval
Average BLE connection burst current (excluding connection Interval): 1.428 mA
Aside: Peak RX current: 5.94 mA Peak TX current: 3.62 mA
## **Peripheral Block Current Consumption**
The values below are calculated for a typical operating voltage of 3V.
_**Table 16: UART power consumption**_
|**Parameter**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|
|UART Run current @ 115200 bps|-|55|-|uA|
|UART Run current @ 1200 bps|-|55|-|uA|
|Idle current for UART (no activity)|-|1|-|uA|
|UART Baud rate|1.2|-|1000|kbps|
## _**Table 17: power consumption**_
|**Parameter**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|
|SPI Master Run current @ 2 Mbps|-|50|-|uA|
|SPI Master Run current @ 8 Mbps|-|50|-|uA|
|SPI bit rate|0.125|-|8|Mbps|
## _**Table 18: I2C power consumption**_
|**Parameter**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|
|I2C Run current @ 100 kbps|-|50|-|uA|
|I2C Run current @ 400 kbps|-|50|-|uA|
|I2C Bit rate|100|-|400|kbps|
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_**Table 19: ADC power consumption**_ **Parameter Min Typ Max Unit** ~~e~~ ~~**e** e es~~ ADC current during conversion - 700 - uA
The above current consumption is for the given peripheral only and to operate that peripheral requires some other internal blocks which consume base current. This base current is consumed when the UART, SPI, I2C, or ADC is opened (operated).
For asynchronous interface like the UART (asynchronous as the other end can communicate at any time), the UART on the BL652 must be kept open (by a command in _smart_ BASIC application script), resulting in the base current consumption penalty.
For a synchronous interface like the I2C or SPI (since BL652 side is the master), the interface can be closed and opened (by a command in _smart_ BASIC application script) only when needed, resulting in current saving (no base current consumption penalty). There’s a similar argument for ADC (open ADC when needed).
## 5 FUNCTIONAL DESCRIPTION
The BL652 BLE (Bluetooth Low Energy) module is a self-contained product and requires only power and a user’s _smart_ BASIC application to implement full BLE functionality. The integrated, high performance antenna combined with the RF and base-band circuitry provides the BLE wireless link, and any of the SIO lines provide the OEM’s chosen interface connection to the sensors. The user’s _smart_ BASIC application binds the sensors to the BLE wireless functionality.
The variety of hardware interfaces and the _smart_ BASIC programming language allow the BL652 module to serve a wide range of wireless applications while reducing overall time to market and the learning curve for developing BLE products.
To provide the widest scope for integration, a variety of physical host interfaces/sensors are provided. The major BL652 series module functional blocks described below.
## **Power Management (includes Brown-out and Power on Reset)**
Power management features:
- System Standby Doze and Deep Sleep modes
- Open/Close Peripherals (UART, SPI, I2C, SIO’s, ADC, NFC). Peripherals consume current when open; each peripheral can be individually closed to save power consumption (with a command in a _smart_ BASIC application script)
- Use of the internal DCDC convertor or LDO is decided by the underlying BLE stack
- _smart_ BASIC command allows the VCC voltage to be read (through the internal ADC)
- Pin wake-up system from deep sleep (including from NFC pins)
Power supply features:
- Supervisor hardware to manage power during reset, brownout, or power fail.
-
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**BL652** Datasheet
## **Clocks and Timers**
## **5.2.1 Clocks**
The integrated high accuracy 32 MHz (±10 ppm) crystal oscillator helps with radio operation and reducing power consumption in the active modes.
The integrated on-chip 32.768 kHz RC oscillator (±250 ppm) provides protocol timing and helps with radio power consumption in the system StandByDoze and Deep Sleep modes by reducing the time that the RX window needs to be open.
To keep the on-chip 32.768 kHz RC oscillator within ±250 ppm (which is needed to run the BLE stack) accuracy, RC oscillator needs to be calibrated (which takes 16-17 mS) regularly. The default calibration interval is eight seconds which is enough to keep within ±250 ppm. The calibration interval ranges from 0.25 seconds to 31.75 seconds (in multiples of 0.25 seconds) and configurable via _smart_ BASIC command at+cfg210.
## **5.2.2 Timers**
In keeping with the event driven paradigm of _smart_ BASIC, the timer subsystem enables _smart_ BASIC applications to be written which allow future events to be generated based on timeouts.
- **Regular Timer** – There are eight built-in timers (regular timers) derived from a single RTC clock which are controlled solely by _smart_ BASIC functions. The resolution of the regular timer is 976 microseconds.
- **Tick Timer –** A 31-bit free running counter that increments every (1) millisecond. The resolution of this counter is 488 microseconds. Use the functions GetTickCount() and GetTickSince() to access this counter.
Refer to the _**smart**_ **BASIC User Guide** available from the Laird BL652 product page.
## **Memory for** _**smart**_ **BASIC Application Code**
You have up to 32 kbytes of data memory available for _smart_ BASIC application script.
## **Radio Frequency (RF)**
- 2402–2480 MHz Bluetooth Low Energy radio (one Mbps over the air data rate).
- Tx output power of +4 dBm programmable (via _smart_ BASIC command) to -20 dBm in steps of 4 dB.
- Tx Whisper mode1 -40 dBm (via _smart_ BASIC command).
- Receiver (with integrated channel filters) to achieve maximum sensitivity -96 dBm @ 1 Mbps BLE.
- RF conducted interface available in the following two ways:
- BL652-SA: RF connected to on-board antenna on BL652-SA
- BL652-SC: RF connected to on-board IPEX MH4 RF connector on BL652-SC
- Antenna options:
- Integrated monopole chip antenna on BL652-SA
-
- External dipole antenna connected with to IPEX MH4 RF connector on BL652-SC
## **NFC**
NFC-A Listen mode compliant:
- Based on NFC forum specification
- 13.56 MHz
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- Date rate 106 kbps
- NFC-A tag (can only be a target/tag; cannot be an initiator)
- Modes of Operation:
- Disable
- Sense
- Activated
## **5.5.1 Use Cases**
- Touch-to Pair with NFC
- Launch a smartphone app (on Android)
- NFC enabled Out-of-Band Pairing
- System Wake-On-Field function
- Proximity Detection
## **UART Interface**
The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial communication with built-in flow control support (UART_CTS, UART_RTS) in HW up to one Mbps baud. Parity checking and generation for the ninth data bit are supported.
UART_TX, UART_RX, UART_RTS, and UART_CTS form a conventional asynchronous serial data port with handshaking. The interface is designed to operate correctly when connected to other UART devices such as the 16550A. The signaling levels are nominal 0 V and 3.3 V (tracks VCC) and are inverted with respect to the signaling on an RS232 cable.
Two-way hardware flow control is implemented by UART_RTS and UART_CTS. UART_RTS is an output and UART_CTS is an input. Both are active low.
These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS, UART_RTS are all 3.3 V level logic (tracks VCC). For example, when RX and TX are idle they sit at 3.3 V. Conversely for handshaking pins CTS, RTS at 0 V is treated as an assertion.
The module communicates with the customer application using the following signals:
- Port/TxD of the application sends data to the module’s UART_RX signal line
- Port/RxD of the application receives data from the module’s UART_TX signal line
**==> picture [25 x 7] intentionally omitted <==**
**----- Start of picture text -----**
BL652
**----- End of picture text -----**
_**Figure 6: UART signals**_
**Note:** The BL652 serial module output is at 3.3V CMOS logic levels (tracks VCC). Level conversion must be added to interface with an RS-232 level compliant interface.
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Some serial implementations link CTS and RTS to remove the need for handshaking. We do not recommend linking CTS and RTS other than for testing and prototyping. If these pins are linked and the host sends data at the point that the BL652 deasserts its RTS signal, then there is significant risk that internal receive buffers will overflow, which could lead to an internal processor crash. This will drop the connection and may require a power cycle to reset the module. We recommend that the correct CTS/RTS handshaking protocol be adhered to for proper operation.
||**_Table 20: UART interface_**||||
|---|---|---|---|---|
|**Signal Name**
**Pin No**
**I/O**
**Comments**
SIO_06 / UART_Tx
17
O
SIO_06 (alternative function UART_Tx) is an output, set high
(in firmware).
~~a~~
~~ee ee~~
~~ee~~|||||
||SIO_08 / UART_Rx|14|I|SIO_08 (alternative function UART_Rx) is an input, set with internal
pull-up (in firmware).|
||SIO_05 / UART_RTS|18|O|SIO_05 (alternative function UART_RTS) is an output, set low
(in firmware).|
||SIO_07 / UART_CTS|16|I|SIO_07 (alternative function UART_CTS) is an input, set with internal
pull-down (in firmware).|
The UART interface is also used to load customer developed _smart_ BASIC application script.
## **SPI Bus**
The SPI interface is an alternate function on SIO pins, configurable by _smart_ BASIC.
The module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CS is implemented using any spare SIO digital output pins to allow for multi-dropping.
The SPI interface enables full duplex synchronous communication between devices. It supports a 3-wire (SPI_MOSI, SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from multiple slaves. Individual chip select signals are necessary for each of the slave devices attached to a bus, but control of these is left to the application through use of SIO signals. I/O data is double-buffered.
The SPI peripheral supports SPI mode 0, 1, 2, and 3.
_**Table 21: SPI interfaces**_
|**Signal Name**
SPI_MOSI
~~a~~|**Signal Name**
SPI_MOSI
~~a~~|**Pin No**
3
~~a~~|**I/O**
O
~~ee~~|**Comments**
This interface is an alternate function configurable by|
|---|---|---|---|---|
||SPI_MISO|2|I|_smart_BASIC. Default in the FW pin 3 and 38 are SIO inputs. SPIOPEN() in
_smart_BASIC selects SPI function and changes pin 3 and 38 to outputs (when in|
||SPI_CLK|38|O|master mode).|
||SPI_CS|4|I|SPI_CS is implemented using any spare SIO digital output pins to allow for
multi-dropping. On Laird devboard SIO_22 (pin4) used as SPI_CS.|
## **I2C Interface**
The I2C interface is an alternate function on SIO pins, configurable by _smart_ BASIC command.
The two-wire interface can interface a bi-directional wired-OR bus with two lines (SCL, SDA) and has master /slave topology. The interface is capable of clock stretching. Data rates of 100 kbps and 400 kbps are supported.
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An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR type bus consisting of two lines which normally sit at VCC. The BL652 module can only be configured as an I2C master with additional constraint that it be the only master on the bus. The SCL is the clock line which is always sourced by the master and SDA is a bi-directional data line which can be driven by any device on the bus.
**IMPORTANT:** It is essential to remember that pull-up resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module.
|**_Table 22: I2C interface_**
**Signal Name**
I2C_SDA
~~a ~~|**_Table 22: I2C interface_**
**Signal Name**
I2C_SDA
~~a ~~|**_Table 22: I2C interface_**
**Pin No**
37
~~ae~~|**I/O**
I/O
~~ee~~|**Comments**
This interface is an alternate function on each pin, configurable by|
|---|---|---|---|---|
||I2C_SCL|36|I/O|_smart_BASIC. I2COPEN() in_smart_BASIC selects I2C function.|
## **General Purpose I/O, ADC, PWM and FREQ**
## **5.9.1 GPIO**
The 19 SIO pins are configurable by _smart_ BASIC. They can be accessed individually. Each has the following user configured features:
- Input/output direction
- Output drive strength (standard drive 0.5 mA or high drive 5mA)
- Internal pull-up and pull-down resistors (13 K typical) or no pull-up/down
- Wake-up from high or low level triggers on all pins including NFC pins
## **5.9.2 ADC**
The ADC is an alternate function on SIO pins, configurable by _smart_ BASIC.
The BL652 provides access to 8-channel 8/10/12-bit successive approximation ADC in one-shot mode. This enables sampling up to 8 external signals through a front-end MUX. The ADC has configurable input and reference pre-scaling and sample resolution (8, 10, and 12 bit).
## _5.9.2.1 Analog Interface (ADC)_
_**Table 23: Analog interface**_
|**Signal Name**
AIN – Analog Input
~~a ~~|**Signal Name**
AIN – Analog Input
~~a ~~|**Pin No**
20
~~ae ~~|**I/O**
I
~~ae~~|**Comments**
This interface is an alternate function on each pin, configurable by|
|---|---|---|---|---|
||AIN – AnalogInput|21|I|_smart_BASIC. AIN configuration selected using GpioSetFunc()|
||AIN – Analog Input|22|I|function.|
||AIN – AnalogInput
AIN – Analog Input|23
32|I
I|Configurable 8, 10, 12 bit resolution.
Configurable voltage scaling 4, 2, 1/1, 1/3, 1/3, 1/4, 1/5,
1/6(default).|
||AIN – AnalogInput|33|I|Configurable acquisition time 3uS, 5uS, 10uS(default), 15uS, 20uS,|
||AIN – Analog Input|34|I|40uS.|
||AIN – AnalogInput|35|I|Full scale input range (VCC)|
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## **5.9.3 PWM Signal Output on up to 12 SIO Pins**
The PWM output is an alternate function on SIO pins, configurable by _smart_ BASIC.
The ability to output a PWM (Pulse Width Modulated) signal on ALL GPIO (SIO) output pins can be selected using GpioSetFunc() function.
The **PWM output** signal has a frequency and duty cycle property. Frequency is adjustable (up to 1MHz ) and the duty cycle can be set over a range from 0% to 100% (both configurable by _smart_ BASIC command).
## **5.9.4 FREQ Signal Output on up to 2 SIO Pins**
The FREQ output is an alternate function on SIO pins, configurable by _smart_ BASIC.
The ability to output a FREQ output signal on 2 GPIO (SIO) output pins can be selected using GpioSetFunc() function.
**Note:** The frequency driving each of the two SIO pins is the same but the duty cycle can be independently set for each pin.
**FREQ output** signal frequency can be set over a range of 0Hz to 4 MHz (with 50% mark-space ratio).
## **nRESET pin**
|**_Table 24: nRESET pin_**
**Signal Name**
~~ee ~~|**_Table 24: nRESET pin_**
**Signal Name**
~~ee ~~|**Pin No**
~~a~~|**I/O**
~~ee~~|**Comments**|
|---|---|---|---|---|
||nRESET|7|I|BL652 HW reset (active low). Pull the nRESET pin low for minimum
100mS in order for the BL652 to reset.|
## **nAutoRUN pin**
Refer to _nAutoRUN pin and Operating Modes_ regarding operating modes and the nAutoRUN pin.
- Self-contained Run mode
- Interactive/Development mode
## **vSP Command Mode**
This section discusses VSP Command mode through pulling SIO_2 high and nAutoRUN low. Read this section in conjunction with the _VSP Configuration_ chapter of the BL652 _smart_ BASIC Extensions Guide, found in the documentation tab of the **BL652 product page** .
Figure 7 shows the difference between VSP Bridge to UART mode and VSP Command mode and how SIO_02 and nAutoRUN must be configured to select between these two modes.
- **VSP Bridge to UART mode** takes data sent from phone or tablet (over BLE) and sends to BL652 to be sent out of the BL652 UART (therefore data not stored on BL652).
- **VSP Command mode** takes data sent from phone or tablet and sends to BL652 which will interpret as an AT command and response will be sent back. The OTA Android or iOS application can be used to download any _smart_ BASIC application script over the air to the BL652 because a _smart_ BASIC application is downloaded using AT commands.
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**BL652** Datasheet
_**Figure 7: Differences between VSP bridge to UART mode and VSP Command mode**_
_**Table 25: vSP modes**_
|**Mode**|**SIO_02**|**nAutoRUN**|
|---|---|---|
|VSP Bridge to UART Mode|High|High|
|VSP Command Mode|High|Low|
SIO_02 High (externally) selects the VSP service. When SIO_02 is High and nAutoRUN is Low (externally), this selects VSP Command mode. When SIO_12 is High and nAutoRUN is High (externally), this selects VSP Bridge to UART mode.
When SIO_02 on module is set HIGH (externally), VSP is enabled and auto-bridged to UART when connected. However, for VSP Command mode, auto-bridge to UART is not required. With SIO_02 set to High and nAutoRUN set to Low, the device enters VSP Command mode and you can then download the _smart_ BASIC application onto the module over the air from the phone (or tablet).
## **Two-wire Interface JTAG**
The BL652 Firmware hex file consists of four elements:
- _smart_ BASIC runtime engine
- Softdevice
- Master Bootloader
Laird BL652 _smart_ BASIC firmware (FW) image part numbers are referenced as w.x.y.z (ex. v28.x.y.z). The BL652 _smart_ BASIC runtime engine and Softdevice combined image can be upgraded by the customer over the UART interface.
You also have the option to use the two-wire (JTAG) interface, during production, to clone the file system of a Golden preconfigured BL652 to others using the Flash Cloning process. This is described in the app note Flash Cloning for the BL652. In this case the file system is also part of the .hex file.
|**Signal Name**|**Pin No**|**I/O**|**Comments**|
|---|---|---|---|
|SWDIO|5|I/O|Internal pull-up resistor|
|SWDCLK|6|I|Internalpull-down resistor|
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The Laird DVK-BL652 development board incorporates an on-board JTAG J-link programmer for this purpose. There is also the following JTAG connector which allows on-board JTAG J-link programmer signals to be routed off the development board. The only requirement is that you should use the following JTAG connector on the host PCB.
The JTAG connector MPN is as follows:
**Reference Part Description and MPN (Manufacturers Part Number)** ~~LC~~ JP1 FTSH-105 Header, 1.27mm, SMD, 10-way, FTSH-105-01-L-DV Samtech **Note:** Reference on the BL652 development board schematic (Figure 8) shows the DVK-BL652-xx development schematic wiring only for the JTAG connector and the BL652 module JTAG pins. U5 CON_SM_39 VCC_BLE GND 27 VCC_BLE ~~26~~ GND 2 ~~5~~ VDD_nRF 24 SIO_00/XL1 C9 23 SIO_01/XL2 ~~!~~ 0.1uF,16V 22 SIO_02/AIN0 21 SIO_03/AIN1 20 SIO_04/AIN2 ~~W~~ GND 19 SIO_05/UART_RTS/AIN3 18 SIO_06/UART_TX 17 SIO_07/UART_CTS SIO_08/UART_RX ~~a~~ SIO_18 SWDCLK_BLE SWDIO_BLE SWDCLK 2 2 J4PIN HEADER,2.54mm 1X3P J3 PIN HEADER,2.54mm 1X3P 2 2 SWDIO VCC_IO JP1 1 2 ~~3 4 5 6~~ SIO_18 ~~7 8~~ 9 ~~1~~ 0 nRESET_BLE NOPOP (PIN HEADER,1.27mm 2X5P) GND
## _**Figure 8: BL652 development board schematic**_
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**Note:** J3 and J4 (on the DVK-BL652-xx development board allows Laird on-board JTAG J-link programmer signals to be routed off the development board by fitting jumpers in the J3 pins (2-3) and J4 pins (2-3).
## **BL652 Wakeup**
## **5.14.1 Waking Up BL652 from Host**
Wake the BL652 from the host using wake-up pins (any SIO pin). Refer to the _smart_ BASIC user guide for details. You may configure the BL652’s wakeup pins via _smart_ BASIC to do any of the following:
- Wake up when signal is low
- Wake up when signal is high
- Wake up when signal changes
Refer to the _smart_ BASIC user guide for details. You can access this guide from the Laird BL652 product page.
## **Low Power Modes**
The BL652 has three power modes: Run, Standby Doze, and Deep Sleep.
The module is placed automatically in Standby Doze if there are no pending events (when WAITEVENT statement is encountered within a customer’s _smart_ BASIC script). The module wakes from Standby Doze via any interrupt (such as a received character on the UART Rx line). If the module receives a UART character from either the external UART or the radio, it wakes up.
Deep sleep is the lowest power mode. Once awakened, the system goes through a system reset.
## **Temperature Sensor**
The on-silicon temperature sensor has a temperature range greater than or equal to the operating temperature of the device. Resolution is 0.25 degrees.
To read temperature from on-silicon temperature sensor (in tenth of centigrade, so 23.4°C is output as 234):
- In command mode, use **ATI2024** or
- From running from a running _smart_ BASIC application script, use **SYSINFO(2024)**
## **Random Number Generator**
Exposed via an API in _smart_ BASIC (see _smart_ BASIC documentation available from the BL652 product page).
The **rand()** function from a running _smart_ BASIC application returns a value.
## **AES Encryption/Decryption**
Exposed via an API in _smart_ BASIC (see _smart_ BASIC documentation available from the BL652 product page). Function called **aesencrypt** and **aesdecrypt** .
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## **Optional External Serial (SPI) Flash**
This is not required for normal BL652 module opertion.
If you fit an optional external serial (SPI) flash (such as for data logging purpose) then that external serial (SPI) flash must connect to BL652 module pins SIO_12 (SFLASH_CS), SIO_14 (SFLASH_MISO), SIO_16 (SFLASH_CLK), and SIO_20 (SFLASH_MOSI); in that case a high level API in _smart_ BASIC can be used for fast access using open/close /read/write API functions.
**Note:** By default, these are GPIO pins. Only when in their FlashOpen() _smart_ BASIC app are these lines dedicated to SPI and for talking to the off-module board SPI flash.
If you decide to use external serial (SPI) flash with the BL652-SX-xx, then ONLY the manufacturer part numbers below MUST be used:
## **4-Mbit Macronix MX25R4035F**
http://www.macronix.com/Lists/DataSheet/Attachments/3288/MX25R4035F,%20Wide%20Range,%204Mb, %20v1.2.pdf
## **8-Mbit Macronix MX25R8035F**
- http://www.macronix.com/Lists/DataSheet/Attachments/3532/MX25R8035F,%20Wide%20Range,%208Mb, %20v1.2.pdf
For any external serial (SPI) flash other than these part numbers, _smart_ BASIC does not provide access.
## **Optional External 32.768 kHz crystal**
This is not required for normal BL652 module operation.
The BL652 uses the on-chip 32.76 kHz RC oscillator (LFCLK) by default (which has an accuracy of ±250 ppm) which requires regulator calibration (every eight seconds) to within ±250 ppm.
You can connect an optional external high accuracy (±20 ppm) 32.768 kHz crystal to the BL652-SX-xx pins, SIO_01/XL2 (pin 24) and SIO_00/XL1 (pin 25) to provide improved protocol timing and to help with radio power consumption in the system standby doze/deep sleep modes by reducing the time that the RX window needs to be open. Table 26 compares the current consumption difference between RC and crystal oscillator.
_**Table 26: Comparing current consumption difference between BL652 on-chip RC 32.76 kHz oscillator and optional external crystal (32.768kHz) based oscillator**_
||**BL652 On-chip 32.768 kHz RC Oscillator**|**Optional External Higher Accuracy (±20 ppm)**|
|---|---|---|
||**(±250 ppm) LFRC**|**32.768 kHz Crystal-based Oscillator XO**|
|**Current**|||
|**Consumption**
**of 32.768 kHz**|0.6 uA|0.25 uA|
|**Block**|||
|**Standby Doze**
**Current**|1.2 uA|1.2 uA|
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**BL652 On-chip 32.768 kHz RC Oscillator Optional External Higher Accuracy (±20 ppm) (±250 ppm) LFRC 32.768 kHz Crystal-based Oscillator XO** Calibration required regularly (default eight seconds interval) Calibration takes 16-17 ms; with DCDC used, the total charge of a calibration event is 7.4 uC. The average current consumed by the calibration depends on the calibration interval and can be calculated using the following formula: **CAL_charge/CAL_interval** The lowest calibration interval (0.25 seconds) provides an average current of (DCDC **Calibration** enabled): Not applicable **7.4uC / 0.25s = 29.6uA** To get the 250 ppm accuracy, the BLE stack specification states that a calibration interval of eight seconds is enough. This gives an average current of: **7.4uC / 8s = 0.93 uA** Added to the LFRC run current and Standby Doze (IDLE) base current shown above results in a total average current of:
**LFRC + CAL = 1.8 + 0.93 = 2.7uA**
|**Total**
2.7 uA||1.45 uA|
|---|---|---|
|||Lowest current consumption|
|**Summary**
Low current consumption
Accuracy 250 ppm|
|Needs external crystal
High accuracy (depends on the crystal, usually|
|||20ppm)|
|**_Table 27: Optional external 32.768 kHz crystal specification_**|||
|**Optional external 32.768kHz crystal**
**Min**
**Typ**
**Max**
Crystal Frequency
-
32.768 kHz
-
~~es~~
es|||
|Frequency tolerance requirement of BLE stack||-
-
±250 ppm|
|Load Capacitance||-
-
12.5 pF|
|Shunt Capacitance||-
-
2 pF|
|Equivalent series resistance||-
-
100 kOhm|
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**BL652** Datasheet
|**Optional external 32.768kHz crystal**|**Min**|**Typ**|**Max**|
|---|---|---|---|
|Drive level|-|-|1 uW|
|Input capacitance on XL1 and XL2 pads|-|4 pF|-|
|Run current for 32.768 kHz crystal based oscillator|-|0.25 uA|-|
|Startup time for 32.768 kHz crystal based oscillator|-|0.25 seconds|-|
|Peak to peak amplitude for external low swing clock input
signal must not be outside supply rails|200 mV|-|1000 mV|
Be sure to tune the load capacitors on the board design to optimize frequency accuracy (at room temperature) so it matches that of the same crystal standalone, Drive Level (so crystal operated within safe limits) oscillation margin (Rneg is at least 3 to 5 times ESR) over the operating temperature range.
## **BL652-SA On-board Chip Antenna Characteristics**
The BL652-SA on-board chip monopole antenna radiated performance depends on the host PCB layout.
The BL652 development board was used for BL652 development and antenna performance evaluation. To obtain similar performance, follow guidelines in section _PCB Layout on Host PCB for BL652-SA_ to allow the on-board antenna to radiate and reduce proximity effects due to nearby host PCB GND copper or metal covers.
BL652-SA on-board chip antenna datasheet: http://www.acxc.com.tw/product/at/at3216/AT3216-B2R7HAA_SR00-N198_2.pdf
|**Unit in dBi @2.44GHz**|**XY-plane**|**XY-plane**|**XZ-plane**|**XZ-plane**|**YZ-plane**|**YZ-plane**|**Efficiency**|
|---|---|---|---|---|---|---|---|
||**Peak**|**Avg**|**Peak**|**Avg**|**Peak**|**Avg**||
|AT3216-B2R7HAA|-5.1|-8.7|-1.3|-7.4|-5.1|-8.7|25.0%|
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**BL652** Datasheet
_**Table 28: BL652-SA on-board chip antenna performance (Antenna Gain, efficiency and S11 (whilst BL652-SA-xx module on DVKBL652-xx development board)**_
## 6 HARDWARE INTEGRATION SUGGESTIONS
## **Circuit**
The BL652 is easy to integrate, requiring no external components on your board apart from those which you require for development and in your end application.
The following are suggestions for your design for the best performance and functionality.
## **Checklist (for Schematic):**
- **VCC pins**
- External power source should be within the operating range, rise time and noise/ripple specification of the BL652. Add decoupling capacitors for filtering the external source. Power-on reset circuitry within BL652 series module incorporates brown-out detector, thus simplifying your power supply design. Upon application of power, the internal power-on reset ensures that the module starts correctly.
- **VCC and coin-cell operation**
- With built-in DCDC (operating range 1.7V to 3.6V), reduces the peak current required from a coin-cell (CR2032), making it easier to use with coin-cell.
- **AIN (ADC) and SIO pin IO voltage levels**
- BL652 SIO voltage levels are at VCC. Ensure input voltage levels into SIO pins are at VCC also (if VCC source is a battery whose voltage will drop). Ensure ADC pin maximum input voltage for damage is not violated.
- **AIN (ADC) impedance and external voltage divider setup**
- If you need to measure with ADC a voltage higher than 3.6V, you can connect a high impedance voltage divider to lower the voltage to the ADC input pin.
- **JTAG**
- This is not required as _smart_ BASIC runtime engine firmware can be loaded using the UART. JTAG may be used if you intend to use Flash Cloning during production to load _smart_ BASIC scripts.
- **UART**
Required for loading your _smart_ BASIC application script during development (or for subsequent firmware
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**BL652** Datasheet
upgrades (except JTAG for FW upgrades and/or Flash Cloning of the _smart_ BASIC application script). Add connector to allow interfacing with UART via PC (UART–RS232 or UART-USB).
- **UART_RX and UART_CTS**
- SIO_8 (alternative function UART_RX) is an input, set with internal weak pull-up (in firmware). The pull-up prevents the module from going into deep sleep when UART_RX line is idling.
SIO_7 (alternative function UART_CTS) is an input, set with internal weak pull-down (in firmware). This pulldown ensures the default state of the UART_CTS will be asserted which means can send data out of the UART_TX line. Laird recommends that UART_CTS be connected.
- **nAutoRUN pin and operating mode selection**
nAutoRUN pin needs to be externally held high or low to select between the two BL652 operating modes at power-up:
- Self-contained Run mode (nAutoRUN pin held at 0V).
-
- Interactive / development mode (nAutoRUN pin held at VCC).
Make provision to allow operation in the required mode. Add jumper to allow nAutoRUN pin to be held high or low (BL652 has internal 13K pull-down by default) OR driven by host GPIO.
- **I2C**
It is essential to remember that pull-up resistors on both I2C_SCL and I2C_SDA lines are not provided in the BL652 module and MUST be provided external to the module as per I2C standard.
- **SPI**
Implement SPI chip select using any unused SIO pin within your _smart_ BASIC application script then SPI_CS is controlled from _smart_ BASIC application allowing multi-dropping.
- **SIO pin direction**
BL652 modules shipped from production with _smart_ BASIC runtime engine FW, all SIO pins (with default function of DIO) are mostly digital inputs (see Pin Definitions Table2). Remember to change the direction SIO pin (in your _smart_ BASIC application script) if that particular pin is wired to a device that expects to be driven by the BL652 SIO pin configured as an output. Also, these SIO pins have the internal pull-up or pull-down resistor-enabled by default in firmware (see Pin Definitions Table 2). This was done to avoid floating inputs, which can cause current consumption in low power modes (e.g. StandbyDoze) to drift with time. You can disable the PULL-UP or Pull-down through their _smart_ BASIC application.
**Note:** Internal pull-up, pull down will take current from VCC.
- **SIO_02 pin** and OTA _smart_ BASIC application download feature
SIO_02 is an input, set with internal pull-down (in FW). Refer to latest firmware release documentation on how SIO_02 is used for Over the Air _smart_ BASIC application download feature. SIO_02 pin has to be pulled high externally to enable the feature. Decide if this feature is required in production. When SIO_02 is high, ensure nAutoRun is NOT high at same time; otherwise you cannot load the _smart_ BASIC application script.
## **NFC antenna connector**
To make use of the Laird flexi-PCB NFC antenna, fit connector:
Description: FFC/FPC Connector, Right Angle, SMD/90d,Dual Contact,1.2mm Mated Height Manufacturer: Molex
Manufacturers Part number: 512810594
Add tuning capacitors of 300 pF on NGC1 pin to GND and 300 pF on NFC2 pins to GND if the PCB track length is similar as DVK-BL652 devboard.
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**BL652** Datasheet
- **nRESET pin (active low)**
Hardware reset. Wire out to push button or drive by host.
By default module is out of reset when power applied to VCC pins.
- **Optional External 32.768kHz crystal**
If the optional external 32.768kHz crystal is needed then use a crystal that meets specification.
- **Optional External serial SPI flash IC** If the optional external serial (SPI) flash is required, ensure that manufacturer part number tested by Laird are used.
## **PCB Layout on Host PCB - General**
## **Checklist (for PCB):**
- MUST locate BL652-Sx module close to the edge of PCB (mandatory for BL652-SA for on-board chip antenna to radiate properly).
- Use solid GND plane on inner layer (for best EMC and RF performance).
- All module GND pins MUST be connected to host PCB GND.
- Place GND vias close to module GND pads as possible.
- Unused PCB area on surface layer can flooded with copper but place GND vias regularly to connect copper flood to inner GND plane. If GND flood copper underside the module then connect with GND vias to inner GND plane.
- Route traces to avoid noise being picked up on VCC supply and AIN (analogue) and SIO (digital) traces.
- Ensure no exposed copper is on the underside of the module (refer to land pattern of BL652 development board).
## **PCB Layout on Host PCB for BL652-SA**
## **6.3.1 Antenna Keep-out on Host PCB**
The BL652-SA has an integrated chip antenna and its performance is sensitive to host PCB. It is critical to locate the BL652-SA on the edge of the host PCB (or corner) to allow the antenna to radiate properly. Refer to guidelines in section _**PCB land pattern and antenna keep-out area for BL652-SA**_ . Some of those guidelines repeated below.
- Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.
- For best antenna performance, place the BL652-SA module on the edge of the host PCB, preferably in the corner with the antenna facing the corner.
- The BL652 development board has the BL652-SA module on the edge of the board (not in the corner). The antenna keep-out area is defined by the BL652 development board which was used for module development and antenna performance evaluation is shown in Figure 9, where the antenna keep-out area is ~4.95mm wide, 25.65 mm long; with PCB dielectric (no copper) height 0.85 mm sitting under the BL652-SA antenna.
- The BL652-SA antenna is tuned when BL652-SA is sitting on development board (host PCB) with size of 120 mm x 93 mm.
- A different host PCB thickness dielectric will have small effect on antenna.
- The antenna-keep-out defined in the Host PCB Land Pattern and Antenna Keep-out for BL652-SA section.
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- Host PCB land pattern and antenna keep-out for the BL652 applies when the BL652-SA is placed in the corner of the host PCB. When BL652-SA cannot be placed as such, it must be placed on the edge of the host PCB and the antenna keep out must be observed. Figure 9 shows an example.
**==> picture [103 x 246] intentionally omitted <==**
**----- Start of picture text -----**
BL652-SA module
Antenna Keep-out
**----- End of picture text -----**
_**Figure 9: Antenna keep-out area (shown in red), corner of the BL652 development board for BL652-SA module.**_
## **Antenna Keep-out Notes:**
**Note 1** The BL652 module is placed on the edge of the host PCB.
- **Note 2** Copper cut-away on all layers in the _Antenna Keep-out_ area under BL652 on host PCB.
## **6.3.2 Antenna Keep-out and Proximity to Metal or Plastic**
## **Checklist (for metal /plastic enclosure):**
- Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40 mm top/bottom and 30 mm left or right.
- Metal close to the BL652-SA chip monopole antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. The amount of that degradation is entirely system dependent, meaning you will need to perform some testing with your host application.
- Any metal closer than 20 mm will begin to significantly degrade performance (S11, gain, radiation efficiency).
- It is best that you test the range with a mock-up (or actual prototype) of the product to assess effects of enclosure height (and materials, whether metal or plastic).
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## **External Antenna Integration with BL652-SC**
Please refer to the regulatory sections for FCC, IC, CE, and Japan for details of use of BL652-Sx with external antennas in each regulatory region.
The BL652 family has been designed to operate with the below external antennas (with a maximum gain of 2.0 dBi). The required antenna impedance is 50 ohms. See Table 29. External antennas improve radiation efficiency.
Table 29: External antennas for the BL652
|External Antenna
Part Number|Laird Part
Number|Mfg.|Type|Gain
(dBi)|Connector Type|BL652 Part
Number|
|---|---|---|---|---|---|---|
|FlexPIFA (001-0022)||LSR|PCB
Dipole|2.0|IPEX-4
(See Note 1)|BL652-SC|
|FlexNotch (001-0023)||LSR|PCB
Dipole|2.0|IPEX-4
(See Note 1)|BL652-SC|
|EDA-8709-2G4C1-B27-CY||Mag.Layers|Dipole|2.0|IPEX-4
(See Note 1)|BL652-SC|
|RFDPA870910EMAB302|0600-00057|Walsin|Dipole|2.0|IPEX-4
(See Note 1)|BL652-SC|
**Note 1:** Integral RF co-axial cable (1.13 mm OD) with length 100 ± 5 mm and IPEX-4 compatible connector. These antennas are available through Laird – please contact Sales for information.
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## 7 MECHANICAL DETAILS
## **BL652 Mechanical Details**
_**Figure 10: BL652 mechanical drawings**_
Development Kit Schematics can be found in the software downloads tab of the BL652 product page: http://www.lairdtech.com/Products/BL652-Series
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## **Host PCB Land Pattern and Antenna Keep-out for BL652-SA**
_**Figure 11: Land pattern and Keep-out for BL652-SA**_
All dimensions are in mm.
## **Host PCB Land Pattern and Antenna Keep-out for BL652-SANotes:**
- **Note 1** Ensure there is no copper in the antenna ‘keep out area’ on any layers of the host PCB. Also keep all mounting hardware or any metal clear of the area (Refer to 6.3.2) to reduce effects of proximity detuning the antenna and to help antenna radiate properly.
- **Note 2** For the best on-board antenna performance, the module BL652-SA MUST be placed on the edge of the host PCB and preferably in the corner with the antenna facing the corner. Above “Keep Out Area” is the module placed in corner of PCB. If BL652-SA is not placed in corner but on edge of host PCB, the antenna “Keep Out Area” is extended (see Note 4).
- **Note 3** BL652 development board has BL652-SA placed on the edge of the PCB board (and not in corner) for that the Antenna keep out area is extended down to the corner of the development board, see section _PCB Layout on Host PCB for BL652-SA_ , Figure 11. This was used for module development and antenna performance evaluation.
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**Note 4** Ensure that there is no exposed copper under the module on the host PCB.
- **Note 5** You may modify the PCB land pattern dimensions based on their experience and/or process capability.
## 8 APPLICATION NOTE FOR SURFACE MOUNT MODULES
## **Introduction**
Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the User Manual. This Application Note is considered a living document and will be updated as new information is presented.
The modules are designed to meet the needs of a number of commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes.
## **Shipping**
## **8.2.1 Tape and Reel Package Information**
**Note:** Ordering information for tape and reel packaging involves the addition of T/R to the end of the full module part number. For example, BL652-SA-0x becomes BL652-SA-0x-T/R.
_**Figure 12: Reel specifications**_
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_**Figure 13: Tape specifications**_
There are 1000 BL652 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (5000 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See Carton Contents for more information.
## **8.2.2 Carton Contents**
The following are the contents of the carton shipped for the BL652 modules.
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_**Figure 14: Carton contents for the BL652**_
## **8.2.3 Packaging Process**
_**Figure 15: BL652 packaging process**_
## **8.2.4 Labeling**
The following labels are located on the antistatic bag:
_**Figure 16: Antistatic bag labels**_
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The following package label is located on both sides of the master carton:
_**Figure 17: Master carton package label**_
The following is the packing slip label:
_**Figure 18: Packing slip label**_
## **Reflow Parameters**
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to _bake units_ on the card, see Table 30 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
**Note:** The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in in Table 30, the modules must be removed from the shipping tray.
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment 30°C/60%RH.
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_**Table 30: Recommended baking times and temperatures**_
|**MSL**||**125°C**|**90°C/≤ 5%RH**|**90°C/≤ 5%RH**|**40°C/≤ 5%RH**|**40°C/≤ 5%RH**|
|---|---|---|---|---|---|---|
||**Baking Temp.**||**Baking Temp.**||**Baking Temp.**||
||Saturated|Saturated
Floor Life Limit|Saturated|Saturated
Floor Life Limit|Saturated|Floor Life Limit|
||@|+ 72 hours|@|+ 72 hours|@|+ 72 hours @|
||30°C/85%|@ 30°C/60%|30°C/85%|@ 30°C/60%|30°C/85%|30°C/60%|
|3|9 hours|7 hours|33 hours|23 hours|13 days|9 days|
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
_**Figure 19: Recommended reflow temperature**_
Temperatures should not exceed the minimums or maximums presented in Table 31.
_**Table 31: Recommended maximum and minimum temperatures**_
|**Specification**|**Value**|**Unit**|
|---|---|---|
|Temperature Inc./Dec. Rate(max)|1~3|°C / Sec|
|Temperature Decrease rate(goal)|2-4|°C / Sec|
|Soak TempIncrease rate(goal)|.5 - 1|°C/Sec|
|Flux Soak Period(Min)|70|Sec|
|Flux Soak Period(Max)|120|Sec|
|Flux Soak Temp (Min)|150|°C|
|Flux Soak Temp (max)|190|°C|
|Time Above Liquidous(max)|70|Sec|
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|**Specification**
**Value**
**Unit**
Time Above Liquidous(min)
50
Sec
~~ee~~
~~ee~~|**Specification**
**Value**
**Unit**
Time Above Liquidous(min)
50
Sec
~~ee~~
~~ee~~|**Specification**
**Value**
**Unit**
Time Above Liquidous(min)
50
Sec
~~ee~~
~~ee~~|
|---|---|---|
|Time In Target Reflow Range(goal)|30|Sec|
|Time At Absolute Peak(max)|5|Sec|
|Liquidous Temperature(SAC305)|218|°C|
|Lower Target Reflow Temperature|240|°C|
|Upper Target Reflow Temperature|250|°C|
|Absolute Peak Temperature|260|°C|
## 9 FCC AND IC REGULATORY STATEMENTS
|**Model**
**US/FCC**
**Canada/IC**
BL652-SA
SQGBL652
3147A-BL652
~~Pf~~
~~ee~~
~~eel~~|
|---|
|BL652-SC
SQGBL652
3147A-BL652|
The BL652SA and BL652-SC hold full modular approvals. The OEM must follow the regulatory guidelines and warnings listed below to inherit the modular approval.
|**Part #**
BL652-SA-SA
~~a~~|**Part #**
BL652-SA-SA
~~a~~|**Form Factor**
Surface Mount
~~ee ~~|**Tx Outputs**
4 dBm
~~ee~~|**Antenna**
Ceramic|
|---|---|---|---|---|
||BL652-SC-SC|Surface Mount|4 dBm|IPEX MHF4|
*Last two slots "XX" in Part # are used for production firmware release changes. Can be values 01-99, aa-zz
## **Antenna Information**
The BL652 family has been designed to operate with the antennas listed below with a maximum gain of 2.21 dBi. The required antenna impedance is 50 ohms.
|External Antenna Part Number|Laird Part|Mfg.|Type|Gain|Connector|BL652 Part|
|---|---|---|---|---|---|---|
||Number|||(dBi)|Type|number|
|FlexPIFA|001-0022|LSR|PCB Dipole|2.0|IPEX-4|BL652-SC|
|FlexNotch|001-0023|LSR|PCB Dipole|2.0|IPEX-4|BL652-SC|
|EDA-8709-2G4C1-B27-CY||Mag.Layers|Dipole|2.0|IPEX-4|BL652-SC|
|RFDPA870910EMAB302|0600-00057|Walsin|Dipole|2.0|IPEX-4|BL652-SC|
**Note:** The OEM is free to choose another vendor’s antenna of like type and equal or lesser gain as an antenna appearing in the table and still maintain compliance. Reference FCC Part 15.204(c)(4) for further information on this topic.
To reduce potential radio interference to other users, the antenna type and gain should be chosen so that the equivalent isotropic radiated power (EIRP) is not more than that permitted for successful communication.
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## **Power Exposure Information**
Federal Communication Commission (FCC) Radiation Exposure Statement:
This EUT is in compliance with SAR for general population/uncontrolled exposure limits in ANSI/IEEE C95.1-1999 and had been tested in accordance with the measurement methods and procedures specified in OET Bulletin 65 Supplement C.
This transceiver must not be co-located or operating in conjunction with any other antenna, transmitter, or external amplifiers. Further testing / evaluation of the end product will be required if the OEM’s device violates any of these requirements.
The BL652 is fully approved for mobile and portable applications.
## **OEM Responsibilities**
**WARNING** : The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Laird Technology FCC identifier for this product.
Contains FCC ID: SQGBL652 IC: 3147A-BL652
If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on visible on outside of device:
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation
Label and text information should be in a size of type large enough to be readily legible, consistent with the dimensions of the equipment and the label. However, the type size for the text is not required to be larger than eight point.
**CAUTION** : The OEM should have their device which incorporates the BL652 tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators.
**CAUTION** : Any changes or modifications not expressly approved by Laird Technology could void the user’s authority to operate the equipment.
## **Federal Communication Commission Interference Statement**
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
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- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
**FCC Caution:** Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
## **IMPORTANT NOTE:**
## **FCC Radiation Exposure Statement:**
The product comply with the US portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
## **This device is intended only for OEM integrators under the following conditions:**
(1) The transmitter module may not be co-located with any other transmitter or antenna,
As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed
## **IMPORTANT NOTE**
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
## **End Product Labeling**
The final end product must be labeled in a visible area with the following: “Contains FCC ID: SQGBL652”.
## **Manual Information to the End User**
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
## **Industry Canada Statement**
This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause interference; and
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(2) This device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:
(1) l’appareil ne doit pas produire de brouillage;
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
## **Radiation Exposure Statement**
The product comply with the Canada portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available.
## **Déclaration d'exposition aux radiations:**
Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada établies pour un environnement non contrôlé. Le produit est sûr pour un fonctionnement tel que décrit dans ce manuel. La réduction aux expositions RF peut être augmentée si l'appareil peut être conservé aussi loin que possible du corps de l'utilisateur ou que le dispositif est réglé sur la puissance de sortie la plus faible si une telle fonction est disponible.
This device is intended only for OEM integrators under the following conditions:
(1) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 1 condition above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
## **Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:**
(1) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.
## **IMPORTANT NOTE:**
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
## **NOTE IMPORTANTE:**
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,
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l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
## **End Product Labeling**
The final end product must be labeled in a visible area with the following: “Contains IC: 3147A-BL652”.
## **Plaque signalétique du produit final**
Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 3147ABL652".
## **Manual Information to the End User**
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
## **Manuel d'information à l'utilisateur final**
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.
## 10 JAPAN (MIC) REGULATORY
The BL652 is approved for use in the Japanese market. The part numbers listed below hold WW type certification. Refer to **ARIB-STD-T66** for further guidance on OEM’s responsibilities.
|**Model**
BL652-SA
~~Po~~|**Model**
BL652-SA
~~Po~~|**Certificate Number**
201-160415|**Antenna**
Ceramic|
|---|---|---|---|
||BL652-SC|201-160416|IPEX MHF4|
## **Antenna Information**
The BL652 was tested with antennas listed below. The OEM can choose a different manufacturers antenna but must make sure it is of same type and that the gain is lesser than or equal to the antenna that is approved for use.
|External Antenna Part Number|Laird Part
Number|Mfg.|Type|Gain
(dBi)|Connector
Type|BL652 Part
Number|
|---|---|---|---|---|---|---|
|FlexPIFA|001-0022|LSR|PCB
Dipole|2.0|IPEX-4|BL652-SC|
|FlexNotch|001-0023|LSR|PCB
Dipole|2.0|IPEX-4|BL652-SC|
|EDA-8709-2G4C1-B27-CY||Mag.Layers|Dipole|2.0|IPEX-4|BL652-SC|
|RFDPA870910EMAB302|0600-00057|Walsin|Dipole|2.0|IPEX-4|BL652-SC|
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**BL652** Datasheet
## 11 CE REGULATORY
The BL652-SA/BL652-SC have been tested for compliance with relevant standards for the EU market. The BL652SC module was tested with a 2.21 dBi antenna. The OEM can operate the BL652-SC module with any other type of antenna but must ensure that the gain does not exceed 2.21 dBi to maintain the Laird approval.
The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device.
Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to. Test reports are available upon request.
## **Antenna Information**
The antennas listed below were tested for use with the BL652. For CE mark countries, the OEM is free to use any manufacturer’s antenna and type of antenna as long as the gain is less than or equal to the highest gain approved for use (2.21dBi ~~)~~ Contact a Laird representative for more information regarding adding antennas.
|External Antenna Part Number|Laird Part
Number|Mfg.|Type|Gain
(dBi)|Connector
Type|BL652 Part
number|
|---|---|---|---|---|---|---|
|FlexPIFA|001-0022|LSR|PCB
Dipole|2.0|IPEX-4|BL652-SC|
|FlexNotch|001-0023|LSR|PCB
Dipole|2.0|IPEX-4|BL652-SC|
|EDA-8709-2G4C1-B27-CY||Mag.Layers|Dipole|2.0|IPEX-4|BL652-SC|
|RFDPA870910EMAB302|0600-00057|Walsin|Dipole|2.0|IPEX-4|BL652-SC|
**Note:** The BL652 module internal BLE chipset IC pins are rated 4 kV (ESD HBM). ESD can find its way through the external JTAG connector (if used on the customers design), if discharge is applied directly. Customer should ensure adequate protection against ESD on their end product design (using the BL652 module) to meet relevant ESD standard (for CE, this is EN301-489).
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## 12 EU DECLARATIONS OF CONFORMITY
## **BL652-SA/BL652-SC**
|Manufacturer:|Laird|
|---|---|
|Products:|BL652-SA,BL652-SC|
||1999/5/EC – R&TTE|
|EU Directives:|2006/95/EC – Low Voltage directive (LVD)|
||2004/108/EC – Electromagnetic compatibility (EMC)|
|ConformityAssessment:|Annex IV|
**Reference standards used for presumption of conformity:**
|**Article Number**
**Requirement**
**Reference standard(s)**
~~P~~|**Article Number**
**Requirement**
**Reference standard(s)**
~~P~~|**Article Number**
**Requirement**
**Reference standard(s)**
~~P~~|**Article Number**
**Requirement**
**Reference standard(s)**
~~P~~|**Article Number**
**Requirement**
**Reference standard(s)**
~~P~~|
|---|---|---|---|---|
|||2006/95/EC|EN 60950-||
||3.1a|Low voltage equipment safety
2006/95/EC|1:2006+A11:2009+A1:2010+A12:2011+A2:2013
EN 50383:2010||
|||RF Exposure|EN 62311:2008||
||3.1b|2004/108/EC
Protection requirements with respect
to electromagnetic compatibility|EN 301 489-1 v1.9.2 (2011-09)
EN 301 489-17 v2.2.1 (2012-09)||
|||||Wide band|
||3.2|1999/5/EC
Means of the efficient use of the radio
frequency spectrum (ERM)|EN 300 328 v1.9.1 (2015-02)
EN 302 291-2 v1.1.1 (2005-07)
EN 302 291-1 v1.1.1 (2005-07|transmission
systems
Short range
devices
(SRD)|
## **Declaration:**
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose.
Laird Place of Issue: W66N220 Commerce Court, Cedarburg, WI 53012 USA tel: +1-262-375-4400 fax: +1-262-364-2649 Date of Issue: August 2016 Name of Authorized Person: Thomas T Smith, Director of EMC Compliance
Signature of Authorized Person:
Embedded Wireless Solutions Support Center: 64 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth © Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
**BL652** Datasheet
## 13 ORDERING INFORMATION
|**BL652-SA-0x**|Intelligent BTv4.2 Module featuring _smart_BASIC (internal antenna)|
|---|---|
|**BL652-SC-0x**|Intelligent BTv4.2 Module featuring_smart_BASIC (IPEX MHF4 connector)|
|**DVK-BL652-SA / SC-0x**|Development Kit for each BL652 series module above|
## **General Comments**
This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask.
## 14 BLUETOOTH SIG QUALIFICATION
## **Overview**
The BL652 module is listed on the Bluetooth SIG website as a qualified End Product.
|**Design**
**Name**|**Owner**|**Declaration**
**ID**|**QD ID**|**Link to listing on the SIG website**|
|---|---|---|---|---|
|BL652|Laird
Technologies|D031950|87158|https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=31950|
It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to registered as a member of the Bluetooth SIG – www.bluetooth.org
The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees
For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document:
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486
## **Qualification Steps When Referencing a Laird End Product Design**
To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm
In step 1, select the option, **Reference a Qualified Design** and enter 87158 in the End Product table entry. You can then select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit card, it will not be possible to proceed until the SIG invoice is paid.
Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC.
© Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: 65 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
**BL652** Datasheet
For further information, please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates
**Note** : If using the BL652 with Laird Firmware and _smart_ BASIC script, you can skip “Controller Subsystem”, “Host Subsystem”, and “Profile Subsystem”.
## **Qualification Steps When Deviating from a Laird End Product Design**
If you wish to deviate from the standard End Product design listed under D031950, the qualification process follows the Traditional Project route, creating a new design. When creating a new design, it is necessary to complete the full qualification listing process and also maintain a compliance folder for the new design.
The BL652 design under D031950 incorporates the following components:
|Listing reference
Design Name
31118
S132 link layer 3.0.0
eesee|Listing reference
Design Name
31118
S132 link layer 3.0.0
eesee|Core Spec Version
4.2
ee|
|---|---|---|
|30169
S132 nRF52 v3.0.0 Host Layer||4.2|
In the future, Nordic may list updated versions of these components and it is possible to use them in your new design. Please check with Nordic to make sure these software components are compatible with the nRF52 hardware (D029601).
If your design is based on un-modified BL652 hardware it is possible use the following process;
1. Reference the existing RF-PHY test report from the BL652 listing.
2. Combine the relevant Nordic Link Layer (LL) – check QDID with Nordic.
3. Combine in a Host Component (covering L2CAP, GAP, ATT, GATT, SM) - check QDID with Nordic.
4. Test any standard SIG profiles that are supported in the design (customs profiles are exempt).
**==> picture [95 x 215] intentionally omitted <==**
**----- Start of picture text -----**
End
Product
[|
Laird RF-PHY
Nordic LL
Host
Layers
Profiles
**----- End of picture text -----**
_**Figure 20: Scope of the qualification for an End Product Design**_
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: 66 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth © Copyright 2016 Laird. All Rights Reserved
**BL652** Datasheet
The first step is to generate a project on the TPG (Test Plan Generator) system. This determines which test cases apply to demonstrate compliance with the Bluetooth Test Specifications. If you are combining pre-tested and qualified components in your design and they are within their three-year listing period, you are not required to re-test those layers covered by these components.
If the design incorporates any standard SIG LE profiles (such as Heart Rate Profile), it is necessary to test these profiles using PTS or other tools where permitted; the results are added to the compliance folder.
You are required to upload your test declaration and test reports (where applicable) and then complete the final listing steps on the SIG website. Remember to purchase your Declaration ID before you start the qualification process, as it’s impossible to complete the listing without it.
## 15 ADDITIONAL ASSISTANCE
Please contact your local sales representative or our support team for further assistance:
Laird Technologies Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com Phone: Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: http://www.lairdtech.com/bluetooth
© Copyright 2016 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird Technologies™, corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party intellectual property right.
Embedded Wireless Solutions Support Center: 67 http://ews-support.lairdtech.com www.lairdtech.com/bluetooth © Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
## Links
- [View this product on Novapart](https://novapart.co/products/BL652-SA-01/bluetooth-smart-v42-nfc-module-2402-to-248ghz)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/laird-technologies/bl652-sa-01/ble-nfc-module-2-402-2-48ghz-96dbm/dp/2664536)
---
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