# Heat Sink, For Ball Grid Array, Push-Pin, 7 °C/W, BGA, 49 mm, 20 mm, 49 mm
**URL**: https://novapart.co/products/BGA-PP-035/heat-sink-for-ball-grid-array-push-pin-7-c-w-bga
**SKU**: BGA-PP-035
**Manufacturer**: ABL HEATSINKS
**Category**: Cooling & Thermal Management || Heat Sinks || Natural Convection Heat Sinks
**Price**: €3.5900
**Stock**: 10+
**Lead Time**: 58 days (indicative)
## Description
Thermal Resistance:7°C/W; Packages Cooled:BGA; External Width - Metric:49mm; External Height - Metric:20mm; External Length - Metric:49mm; External Diameter - Metric:-; Heat Sink Material
## Specifications
| Parameter | Value |
|---|---|
| Product Range | - |
| Packages Cooled | BGA |
| Heat Sink Material | Aluminium |
| Thermal Resistance | 7°C/W |
| External Width - Metric | 49mm |
| External Height - Metric | 20mm |
| External Length - Metric | 49mm |
| External Width - Imperial | 1.93" |
| External Diameter - Metric | - |
| External Height - Imperial | 0.79" |
| External Length - Imperial | 1.93" |
| External Diameter - Imperial | - |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2084422/)
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**All ABL's BGA heatsinks are supplied with thermal tape**
|Length
|“
Height[Fu|*
“
F
”
a||
|---|---|---|
||**All ABL's BGA heatsinks are supplied with thermal tape**||
|**Model**
**Width**
**Length**
**Height**
**Pad Size**
**Anodised**
**Finish **
**Pin Length**
**°C/W**
**°C/W**
**[mm]**
**[mm]**
**[mm]**
**[mm]**
**[mm]**
**Natural**
**Forced**
**2M/s**
BGA-PP-010
40.8
40.8
15.0
20x20
Natural
14.0
11.00
5.50
BGA-PP-015
49
49
10.0
30x30
Natural
14.0
10.50
4.20
BGA-PP-020
49
49
15.0
30x30
Natural
14.0
9.00
4.00
BGA-PP-025
49
49
15.0
30x30
Natural
16.4
9.00
4.00
BGA-PP-030
49
49
35.0
30x30
Natural
14.0
7.00
3.80
*BGA-PP-035
49
49
20.0
30x30
Black
16.4
7.00
3.70
BGA-PP-040
49
49
35.0
30x30
Black
14.0
6.50
3.50|||
## **Thermally Conductive Aluminium Foil**
All ABL's BGA heatsinks are supplied with “enn re thermal tape. ——_——_——— AcrylicAcrylic AdhesiveAdhesive Clear Liner With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment Colour - White to MPU, chip set and other plastic Backing Type / Thickness Mm Aluminium Foil / 0.10 encapsulated components. Adhesive Type / Thickness Mm Arylic 0.075 (on clear liner side) It consists of an aluminium foil backing Total Thickness mm 0,27 coated, on both sides, with a very high Adhesion Kg/25mm 1,5 temperature resistance acrylic adhesive. Due Thermal Conductivity W/m-K 0,95 to its high heat performance and adhesive properties this tape can also be use to attach Thermal Resistance °C-in[2] /W 0,2 components to a vertical heatsink and to Holding Power@23°C Hour >72 metal enclosure surfaces. Holding Power @ 130°C Hour >2
## Links
- [View this product on Novapart](https://novapart.co/products/BGA-PP-035/heat-sink-for-ball-grid-array-push-pin-7-c-w-bga)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/abl-heatsinks/bga-pp-035/heat-sink-bga-push-pin-7-c-w/dp/2084422)
---
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