![BDQQ00201210R33MPA — Power Inductor (SMD), 330 nH, 5.5 A, Shielded, 6.6 A, DQQ Series, 0805 [2012 Metric]](/media/3/2/B/76CF1C57D0E70B23.webp)
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BDQQ00201210R33MPA
Power Inductor (SMD), 330 nH, 5.5 A, Shielded, 6.6 A, DQQ Series, 0805 [2012 Metric]
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: PULSE ELECTRONICS
- Product type: SMD Power Inductors
- SVHC: No SVHC (04-Feb-2026)
- Inductance: 330nH
- Product Range: DQQ Series
- Product Width: 1.2mm
- Product Height: 1mm
- Product Length: 2mm
- DC Resistance Max: 0.016ohm
- RMS Current (Irms): 5.5A
- Inductance Tolerance: ± 20%
- Inductor Construction: Shielded
- Inductor Case / Package: 0805 [2012 Metric]
- Saturation Current (Isat): 6.6A
| Delivery and price | |
|---|---|
| Units per pack | 1500 |
| Price | 0.054 € |
| Current stock | 1000+ |
| Lead time | 30 days |
Datasheet
## RoHS & Halogen Free & REACH Compliance. ## **SPECIFICATION FOR APPROVAL** **Customer** `：` **Customer P/N:** **Drawing No** `：` **2024/06/13** **Quantity** `：` **X Pcs. Date : Pulse P/N** `：` **BDQQ00201210 series** **==> picture [219 x 186] intentionally omitted <==** **----- Start of picture text -----**<br> SPECIFICATION<br>ACCEPTED BY:<br>COMPONENT<br>ENGINEER<br>ELECTRICAL<br>ENGINEER<br>MECHANICAL<br>ENGINEER<br>APPROVED<br>REJECTED<br>**----- End of picture text -----**<br> **Pingzhen** No.270, Nanfeng Rd., Pingzhen Dist., Taoyuan City 324019, Taiwan TEL ： +886-2-6621-6900 FAX ： +886-3-419-2199 **Vietnam Dongguan** No 143 - 145, Road No 10, VSIP Hai No. 78, Puxing Rd., Yuliangwei Administration Area, Qingxi Town, Dongguan City, Phong, Lap Le Commune, Thuy Nguyen Guangdong,China Dist, Haiphong City, Vietnam Tel ： 84-316 255 688 TEL `：` +86-769-8773-0251~3 Fax ： 84-316 255 689 FAX `：` +86-769-8773-0232 Drawn by Checked by Approved by **Chang.Yuwen Tom.Chen Jacky.Chung** ## hee **BDQQ00201210 Series Specification** ~~_|~~ **1 Scope:** This specification applies to Molding power inductors ## **2 Part Numbering:** ~~_|~~ ## ~~_|~~ **3 Rating:** － Operating Temperature: 40℃ ~125℃(Including self-temperature rise) **==> picture [75 x 18] intentionally omitted <==** **----- Start of picture text -----**<br> _| 4 Marking:<br>**----- End of picture text -----**<br> **==> picture [182 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> 5 Standard Testing Condition<br>_|<br>**----- End of picture text -----**<br> |**Standard Testing Condition**<br>~~_|~~|**Standard Testing Condition**|| |---|---|---| ||Unless otherwise specified|Incase ofdoubt| |Temperature|OrdinaryTemperature(15 to 35℃)|20 to 30℃| |Humidity|OrdinaryHumidity(25 to 85%RH)|50 to 80 %RH| ## **BDQQ00201210 Series Specification** **==> picture [487 x 281] intentionally omitted <==** **----- Start of picture text -----**<br> _| 6 Configuration and Dimensions:<br>Dimensions in mm<br>TYPE 201210<br>_— ~~ S<br>A 2.0±0.2<br>B 1.2±0.2<br>C 1.0 Max.<br>D 0.7 Typ<br>ee. =<br>a,<br>Net Weight (grms)<br>Size Code Net Weight (grms)<br>201210 ≒ 0.0171<br>__| 7 Electrical Characteristics:<br>**----- End of picture text -----**<br> |**Part No.**|**Inductance**|**Tolerance**|**Test Freq.**|**Irms(A)**|**Isat(A)**|**RDC(mΩ)**| |---|---|---|---|---|---|---| ||**(uH)**|**(±%)**||**Max.(Typ)**|**Max.(Typ)**|**Max.(Typ)**| |BDQQ00201210R24MPA|0.24|20|2MHz,1V|5.3(5.8)|6.6(7.3)|14(11.5)| |BDQQ00201210R33MPA|0.33|20|2MHz,1V|5.0(5.5)|6.0(6.6)|16(13.0)| |BDQQ00201210R47MPA|0.47|20|2MHz,1V|4.5(5.0)|5.3(5.8)|20(16.5)| ## **NOTE:** 1.Operating temperature range －４０℃ ~ １２５℃(Including self - temperature rise) 2.Isat for Inductance drop 30% from its value without current. 3.Irms for a 40℃ temperature rise from 25℃ ambient. 4.All test data is referenced to 25℃ ambient - 5.Absolute maximum voltage 20VDC 6. Rated current: Isat or Irms, whichever is smaller ## **BDQQ00201210 Series Specification** ## **8 BDQQ00201210Series** ~~_|~~ **8.1 Construction:** ## **8.2 Material List:** |**ITEM**|**PART**|**DESCRIPTION**| |---|---|---| |**1**|**Core**|**Metal Powder**| |**2**|**Wire**|**Copper wire**| |**3**|**Terminal**|**Cu**| |**4**||**Ni**| |**5**||**Sn**| ## **BDQQ00201210 Series S ecification p** |**1-1.Mechanical Performance**<br>~~es~~|**1.Mechanical Performance**<br>|**1.Mechanical Performance**<br>|||| |---|---|---|---|---|---| |**No**<br>~~es~~|**Item**<br>||**Specification**<br>|**Test Method**<br>|| |1-1-1 <br>~~esa~~|Flexure Strength<br>~~a~~||The forces applied on the right<br>conditions must not damage<br>the terminal electrode and the <br>metal body<br>~~a~~|Test device shall be soldered on the substrate<br>Substrate Dimension: 100x40x1.6mm<br> Deflection: 2.0mm<br>Keeping Time: 30sec<br>~~a~~|| |1-1-2 <br>~~a~~|Vibration<br>~~a~~||Appearance:No damage (for<br>microscope of CASTOR MZ-45 20X) <br>Inductance change shall be<br>within ±20%<br>~~a~~|Test device shall be soldered on the substrate<br> Oscillation Frequency: 10 to 55 to 10Hz for 1min<br>Amplitude: 1.5mm<br>Time: 2hrs for each axis(X,Y & Z),total 6hrs<br>~~a~~|| |1-1-3 <br>~~a~~|Resistance to Soldering Heat <br>~~a~~||Appearance: No damage<br>More than 75% of the terminal. <br>electrode should be covered<br>with solder.<br>Inductance: within ±20% of<br>initial value<br>~~a~~|Pre-heating: 150℃, 1min<br> Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>Solder Temperature: 260±5℃<br>Immersion Time: 10±1sec<br>~~a~~|| |1-1-4|Solder ability||The electrodes shall be at<br>least 95% covered with new<br>solder coating|Pre-heating: 150℃, 1min<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>Solder Temperature: 245±5℃<br>Immersion Time: 4±1sec|| |1-1-5|Terminal Strength Test||No split termination<br>MountingPad<br>F<br>Chip|Test device shall be soldered on the substrate,<br>then apply a force in the direction of the arrow.<br>Force : 5N<br>Keeping Time: 10±1sec|Test device shall be soldered on the substrate,<br>then apply a force in the direction of the arrow.<br>Force : 5N<br>Keeping Time: 10±1sec| |||**2.Environmental Performance**|||| |**No**|**Item**|**Specification**|**Test Method**|**Test Method**|**Test Method**| |---|---|---|---|---|---| |1-2-1|Temperature Cycle|Appearance: No damage<br>Inductance:within±20% of<br>initial value|One cycle:||| ||||Step|Temperature (℃)|Time(min)| ||||1|-40±3|30| ||||2|25±2|3| ||||3|125±3|30| ||||4|25±2|3| ||||Total: 100cycles<br>Measured after exposure in the room condition for 24hrs||| |1-2-2|Humidity Resistance||Temperature: 60±2℃<br>Relative Humidity: 90 ~ 95% / Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs||| |1-2-3|High<br>Temperature Resistance||Temperature: 125±3℃<br>Relative Humidity: 0% / Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs||| |1-2-4|Low<br>Temperature Resistance||Temperature: -40±3℃<br>Relative Humidity: 0% / Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs||| ## **BDQQ00201210 Series S ecification p** **==> picture [75 x 11] intentionally omitted <==** **----- Start of picture text -----**<br> Reflow Profile<br>**----- End of picture text -----**<br> **==> picture [200 x 104] intentionally omitted <==** **----- Start of picture text -----**<br> 50 100 150<br>Time (sec<br>Te<br>**----- End of picture text -----**<br> **==> picture [97 x 9] intentionally omitted <==** **----- Start of picture text -----**<br> Refer to J-STD-020F<br>**----- End of picture text -----**<br> Note: 1. Tp<260℃ 2. Time [25℃ to peak temperature] < 8 minutes 3. Reflow soldering must not be performed more than 3 times. 4.[For superior solder joint connectivity results, soldering under standard nitrogen] atmosphere is recommended. ## **BDQQ00201210 Series Specification** ## ~~__|~~ **10 Packaging:** **10.1 Packaging -Cover Tape** The force for tearing off cover tape is 10 to 100 grams in the arrow direction. ## **10.2 Packaging Quantity** **==> picture [136 x 34] intentionally omitted <==** **----- Start of picture text -----**<br> TYPE PCS/REEL<br>201210 3000<br>**----- End of picture text -----**<br> ## **10.3 Reel Dimensions** |TYPE|A|B|C|D| |---|---|---|---|---| |201210|178|60|12|1.5| ## **BDQQ00201210 Series Specification** ## **10 Packaging: 10.4 Tape Dimensions in mm** |TYPE|A|B|T|W|P|F|K| |---|---|---|---|---|---|---|---| |201210|1.50|2.30|0.22|8|4|3.5|1.10| ## **11 Recommended Land Pattern:** **==> picture [197 x 69] intentionally omitted <==** **----- Start of picture text -----**<br> Dimensions in mm<br>TYPE A B C<br>201210 0.5 2.1 1.3<br> _—_—<br>**----- End of picture text -----**<br> ## **12 Note:** 1. The storage period is within 12 months. Products should be stored in the warehouse on the following condition: (Temperature: 5~40℃; Humidity: 20%~75%RH). Solderability should be checked if the period is exceeded. 2. Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. 3. Do not knock nor drop. 4. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose,under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement. 5. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950) ## **BDQQ00201210 Series Specification** **==> picture [64 x 24] intentionally omitted <==** **----- Start of picture text -----**<br> 13 Graph:<br>_|<br>**----- End of picture text -----**<br>
Updated at June 10, 2026
Pulse Electronics, a YAGEO company, is a global leader in the design and manufacturing of passive electronic components. With a legacy of innovation dating back to 1956, the company provides essential technology for the communications, computing, industrial, transportation, and IoT sectors. Pulse is recognized worldwide for delivering high-performance solutions that power advanced applications, ranging from 5G networks and electric vehicles to data centers and smart grids. The company's extensive product portfolio is heavily anchored in power and networking magnetics. This includes a comprehensive range of power inductors engineered for exceptional efficiency and reliability in demanding environments. To address complex electromagnetic compatibility challenges, Pulse also manufactures highly effective EMC and RFI suppression solutions, such as common mode chokes and filters, alongside specialized toroidal and RF inductors designed to ensure clean power delivery and optimal signal integrity. Beyond traditional magnetics, Pulse excels in the development of advanced wireless and power conversion components. Their connectivity solutions feature a wide array of high-performance RF antennas and single-band chip antennas tailored for modern connected devices. Furthermore, to support sophisticated power architectures, Pulse provides a broad spectrum of transformers—encompassing PCB-mounted designs, current sensing transformers, and precise pulse transformers—equipping engineers with robust, industry-proven components for power isolation and measurement.
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