BDCC00252012R47MCG

Power Inductor (SMD), 470 nH, 6.7 A, Shielded, 7.4 A, DCC Series, 1008 [2520 Metric]

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Manufacturer: PULSE ELECTRONICS
Product type: SMD Power Inductors
SVHC: No SVHC (04-Feb-2026)
Inductance: 470nH
Product Range: DCC Series
Product Width: 2mm
Product Height: 1.2mm
Product Length: 2.5mm
DC Resistance Max: 0.0135ohm
RMS Current (Irms): 6.7A
Inductance Tolerance: ± 20%
Inductor Construction: Shielded
Inductor Case / Package: 1008 [2520 Metric]
Saturation Current (Isat): 7.4A

Delivery and price
Units per pack	1500
Price	0.046 €
Current stock	1000+
Lead time	30 days

Datasheet

## RoHS & Halogen Free & REACH Compliance. 

## **SPECIFICATION  FOR  APPROVAL** 

**Customer** `：` 

**Customer P/N:** 

**Drawing No** `：` 

**2024/06/13** 

**Quantity** `：` **X Pcs.      Date : Pulse  P/N** `：` **BDCC00252012R47MCG** 

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SPECIFICATION<br>ACCEPTED BY:<br>COMPONENT<br>ENGINEER<br>ELECTRICAL<br>ENGINEER<br>MECHANICAL<br>ENGINEER<br>APPROVED<br>REJECTED<br>**----- End of picture text -----**<br>


**Pingzhen** No.270, Nanfeng Rd., Pingzhen Dist., Taoyuan City 324019, Taiwan TEL ： +886-2-6621-6900 FAX ： +886-3-419-2199 

**Vietnam Dongguan** No 143 - 145, Road No 10, VSIP Hai No. 78, Puxing Rd., Yuliangwei Administration Area, Qingxi Town, Dongguan City, Phong, Lap Le Commune, Thuy Nguyen Guangdong,China Dist, Haiphong City, Vietnam Tel ： 84-316 255 688 TEL `：` +86-769-8773-0251~3 Fax ： 84-316 255 689 FAX `：` +86-769-8773-0232 Drawn by Checked by Approved by **Chang.Yuwen Tom.Chen Jacky.Chung** 

## **BDCC00252012 Series Specification** 

**1 Scope:** This specification applies to Molding power inductors ~~_|~~ 

## **2 Part Numbering:** 

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－ Operating Temperature: 40℃ ~125℃(Including self-temperature rise) 

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## **5 Standard Testing Condition** 

||Unless otherwise specified|Incase ofdoubt|
|---|---|---|
|Temperature|OrdinaryTemperature(15 to 35℃)|20 to 30℃|
|Humidity|OrdinaryHumidity(25 to 85%RH)|50 to 80 %RH|



## **BDCC00252012 Series Specification** 

## ~~_|~~ **6 Configuration and Dimensions:** 

|Dimensions in mm|Dimensions in mm|
|---|---|
|TYPE|252012|
|A|2.5±0.2|
|B<br>C<br>D|2.0±0.2<br>1.2 Max.<br>0.6±0.3|
|Net Weight (grms)|Net Weight (grms)|
|Size Code|Net Weight (grms)|
|252012|≒0.0365|



## ~~__||~~ **7 Electrical Characteristics:** 

|**Part No.**|**Inductance**|**Tolerance**|**Test Freq.**|**Irms(A)**|**Isat(A)**|**RDC(mΩ)**|
|---|---|---|---|---|---|---|
||**(uH)**|**(±%)**||**Max.(Typ)**|**Max.(Typ)**|**Max.(Typ)**|
|BDCC00252012R47MCG|0.47|20|2MHz,1V|6.0(6.7)|6.7(7.4)|13.5(11)|



## **NOTE:** 

1.Operating temperature range －４０℃ ~ １２５℃(Including self - temperature rise) 

- 2.Isat for Inductance drop 30% from its value without current. 

- 3.Irms for a 40℃ temperature rise from 25℃ ambient. 

- 4.All test data is referenced to 25℃ ambient 

- 5.Absolute maximum voltage 20VDC 

6. Rated current: Isat or Irms, whichever is smaller 

## [ne **BDCC00252012 Series Specification** 

## **8 BDCC00252012Series** ~~_ |~~ **8.1 Construction:** 

## **8.2 Material List:** 

|**ITEM**|**PART**|**DESCRIPTION**|
|---|---|---|
|**1**|**Core**|**Metal Powder**|
|**2**|**Wire**|**Copper wire**|
|**3**|**Terminal**|**Cu**|
|**4**||**Ni**|
|**5**||**Sn**|



## **BDCC00252012 Series S ecification p** 

||**9**|**Reliability  Of  Molding power inductors**|**Reliability  Of  Molding power inductors**|**Reliability  Of  Molding power inductors**|**Reliability  Of  Molding power inductors**|||
|---|---|---|---|---|---|---|---|
|**1-1.Mechanical Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-1-1 Flexure Strength<br>The forces applied on the right<br>Test device shall be soldered on the substrate<br>conditions must not damage<br>Substrate Dimension: 100x40x1.6mm<br>the terminal electrode and the Deflection: 2.0mm<br>metal body<br>Keeping Time: 30sec<br>**Test Method**<br>~~esa~~||||||||
|1-1-2 Vibration<br>Appearance:No damage  (for<br>Test device shall be soldered on the substrate<br>microscope of CASTOR MZ-45 20X) Oscillation Frequency: 10 to 55 to 10Hz for 1min<br>Inductance change shall be<br>Amplitude: 1.5mm<br>within ±20%<br>Time: 2hrs for each axis(X,Y & Z),total 6hrs<br>1-1-3 Resistance to Soldering Heat Appearance: No damage<br>Pre-heating: 150℃, 1min<br>More than 75% of the terminal. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>electrode should be covered<br>Solder Temperature: 260±5℃<br>with solder.<br>Immersion Time: 10±1sec<br>Inductance:  within ±20% of<br>initial value<br>~~a~~||||||||
||1-1-4|Solder ability|The electrodes shall be at||The electrodes shall be at|The electrodes shall be at|Pre-heating: 150℃, 1min|
||||least 95% covered with new||||Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)|
||||solder coating||||Solder Temperature: 245±5℃|
||||||||Immersion Time: 4±1sec|
||1-1-5|Terminal Strength Test|No split termination||||Test device shall be soldered on the substrate,|
||||Chip|||F|then apply a force in the direction of the arrow.<br>Force : 5N<br>Keeping Time: 10±1sec|
|||||||||
||||MountingPad|||||
||**1-2.Environmental Performance**|||||||
||**No**|**Item**|**Specification**||||**Test Method**|
||1-2-1|Temperature Cycle|Appearance: No damage||||One cycle:|
||||Inductance:within±20% of||||Step<br>Temperature (℃)<br>Time(min)|
||||initial value||||1<br>-40±3<br>30|
||||||||2<br>25±2<br>3|
||||||||3<br>125±3<br>30|
||||||||4<br>25±2<br>3|
||||||||Total: 100cycles|
||||||||Measured after exposure in the room condition for 24hrs|
||1-2-2|Humidity Resistance|||||Temperature: 60±2℃|
||||||||Relative Humidity: 90 ~ 95% / Time: 1000hrs|
||||||||Measured after exposure in the room condition for 24hrs|
||1-2-3|High|||||Temperature: 125±3℃|
|||Temperature Resistance|||||Relative Humidity: 0% / Time: 1000hrs|
||||||||Measured after exposure in the room condition for 24hrs|
||1-2-4|Low|||||Temperature: -40±3℃|
|||Temperature Resistance|||||Relative Humidity: 0% / Time: 1000hrs|
||||||||Measured after exposure in the room condition for 24hrs|



## **BDCC00252012 Series S ecification p** 

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Reflow Profile<br>217°C Ramp down rate 6°C/s max<br>ae Eee<br>100<br>50<br>0<br>0 50 100 150<br>Time (sec<br>Te<br>**----- End of picture text -----**<br>


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Refer to J-STD-020F<br>**----- End of picture text -----**<br>


Note: 

1. Tp<260℃ 

2. Time [25℃ to peak temperature] < 8 minutes 

3. Reflow soldering must not be performed more than 3 times. 

4.[For superior solder joint connectivity results, soldering under standard nitrogen] atmosphere is recommended. 

## **BDCC00252012 Series Specification** 

## ~~__|~~ **10 Packaging:** 

**10.1 Packaging -Cover Tape** 

The force for tearing off cover tape is 10 to 100 grams in the arrow direction. 

## **10.2 Packaging Quantity** 

|TYPE|PCS/REEL|
|---|---|
|252012|3000|



## **10.3 Reel Dimensions** 

|TYPE|A|B|C|D|
|---|---|---|---|---|
|252012|178|60|12|1.5|



## **BDCC00252012 Series Specification** 

## **10 Packaging: 10.4 Tape Dimensions in mm** 

|TYPE|A|B|T|W|P|F|K|
|---|---|---|---|---|---|---|---|
|252012|2.30|2.80|0.22|8|4|3.5|1.35|



## **11 Recommended Land Pattern:** 

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Dimensions in mm<br>TYPE A B C<br>252012 1.3 2.8 2.2<br> _—_—<br>**----- End of picture text -----**<br>


## **12 Note:** 

1. The storage period is within 12 months. Products should be stored in the warehouse on the following condition: (Temperature: 5~40℃; Humidity: 20%~75%RH). Solderability should be checked if the period is exceeded. 

2. Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. 

3. Do not knock nor drop. 

4. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose,under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from  such agreement. 

5. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950) 

## **BDCC00252012 Series Specification** 

**13 Graph:** ~~__|~~

Updated at June 10, 2026

Pulse Electronics, a YAGEO company, is a global leader in the design and manufacturing of passive electronic components. With a legacy of innovation dating back to 1956, the company provides essential technology for the communications, computing, industrial, transportation, and IoT sectors. Pulse is recognized worldwide for delivering high-performance solutions that power advanced applications, ranging from 5G networks and electric vehicles to data centers and smart grids. The company's extensive product portfolio is heavily anchored in power and networking magnetics. This includes a comprehensive range of power inductors engineered for exceptional efficiency and reliability in demanding environments. To address complex electromagnetic compatibility challenges, Pulse also manufactures highly effective EMC and RFI suppression solutions, such as common mode chokes and filters, alongside specialized toroidal and RF inductors designed to ensure clean power delivery and optimal signal integrity. Beyond traditional magnetics, Pulse excels in the development of advanced wireless and power conversion components. Their connectivity solutions feature a wide array of high-performance RF antennas and single-band chip antennas tailored for modern connected devices. Furthermore, to support sophisticated power architectures, Pulse provides a broad spectrum of transformers—encompassing PCB-mounted designs, current sensing transformers, and precise pulse transformers—equipping engineers with robust, industry-proven components for power isolation and measurement.

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