BAV199DW-7-F

**BAV199DW** —— **QUAD SURFACE MOUNT LOW LEAKAGE DIODE** 

## **Features** 

- Surface Mount Package Ideally Suited for Automated Insertion 

- Very Low Leakage Current 

- **Totally Lead-Free & Fully RoHS Compliant  (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

## **Mechanical Data** 

- Case: SOT363 

- Case Material:  Molded Plastic.  UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminals: Finish - Matte Tin Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 

- Polarity: See Diagram 

- Weight: 0.008 grams (Approximate) 

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SOT363<br>**----- End of picture text -----**<br>


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AC1 C2 A2<br>A1 C1 AC2<br>Top View<br>Top View<br>Internal Schematic<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|(Note 4)|(Note 4)|||||
|---|---|---|---|---|---|---|
|**Part Number**||**Compliance**||**Case**||**Packaging**|
|BAV199DW-7-F||Standard||SOT363||3000/Tape & Reel|



Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant . 

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

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K52 = Product Type Marking Code<br>K52 YM<br>YM = Date Code Marking<br>Y = Year (ex: C = 2015)<br>M = Month (ex: 9 = September)<br>YM K52<br>**----- End of picture text -----**<br>


|Date Code Key<br>**Year**<br>**2006**<br>**2007**<br>**2008**<br>**…**<br>**2015**<br>**2016**<br>**2017**<br>**2018**<br>**2019**<br>**2020**<br>**Code**<br>T<br>U<br>V<br>…<br>C<br>D<br>E<br>F<br>G<br>H<br>**Month**<br>**Jan**<br>**Feb**<br>**Mar**<br>**Apr**<br>**May**<br>**Jun**<br>**Jul**<br>**Aug**<br>**Sep**<br>**Oct**<br>**Nov**<br>**Dec**<br>**Code**<br>1<br>2<br>3<br>4<br>5<br>6<br>7<br>8<br>9<br>O<br>N<br>D<br>~~a~~<br>~~ee~~<br>~~ee~~|
|---|



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BAV199DW Document number: DS30417 Rev. 10 - 2 

January 2016 © Diodes Incorporated 

**BAV199DW** 

**Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|
|||||
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC BlockingVoltage|VRRM<br>VRWM<br>VR|85|V|
|RMSReverseVoltage|VR(RMS)|60|V|
|Forward Continuous Current  (Note 5)<br>Single Diode<br>Double Diode|R(RMS)<br>IFM|160<br>140|mA|
|RepetitivePeak Forward Current (Note 5)|IFRM|500|mA|
|Non-Repetitive Peak Forward Surge Current<br>@ t = 1.0s<br>@ t = 1.0ms<br>@ t= 1.0s|IFSM|4.0<br>1.0<br>0.5|A|



## **Thermal Characteristics** 

|**Thermal Characteristics**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Power Dissipation(Note 5)|PD|200|mW|
|Thermal Resistance Junction to Ambient Air(Note 5)|RJA|625|C/W|
|Operatingand Storage Temperature Range|TJ, TSTG<br>-65 to +150|-65 to +150|C|



## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics**(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**<br>**Max**|**Unit**<br>**Test Condition**|
|ReverseBreakdown Voltage (Note 6)|V(BR)R|85|<br>|V<br>IR= 100A|
|Forward Voltage|(BR)R<br>VF||<br>0.90<br>1.0<br>1.1<br>1.25|V<br>IF= 1.0mA<br>IF= 10mA<br>IF= 50mA<br>IF= 150mA|
|Leakage Current (Note 6)|IR||<br>5.0<br>80|nA<br>VR= 75V<br>VR= 75V,TJ= +150C|
|Total Capacitance|CT||1.5<br>|pF<br>VR=0,f = 1.0MHz|
|Reverse Recovery Time|tRR||<br>3.0|s<br>IF= IR= 10mA,<br>IRR= 0.1 x IR,RL= 100|



Notes: 5. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com. 6. Short duration pulse test used to minimize self-heating effect. 

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300 1<br>Note 5<br>250 [| Ave V_( mv)@ 150°C a eesaes<br>OR LEE<br>200 0.1<br>nounnense a [Of] 74<br>NS<br>VAS A ny Ae<br>of<br>LK<br>150 EfSf<br>fffn |<br>100 0.01 LLLA [f/f] ef ee<br>ee eee<br>50 tfFF— FEIfF FF ine vet rn @ 5<br>fff fm)<br>0 0.001 LLL |<br>0 25 50 75 100 125 150 0.5 0.6 0.7 Lf 0.8 0.9 1.0 svsmoeee 1.1 1.2 1.3 |<br>TA, AMBIENT TEMPERATURE  ( 癈 oC ) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Fig. 1  Power Derating Curve, Total Package Fig. 2  Typical Forward Characteristics, Per Element<br>F<br>, INSTANTANEOUS FORWARD CURRENT (A)<br>I<br>, POWER DISSIPATION (mW)<br>P<br>D<br>**----- End of picture text -----**<br>


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BAV199DW Document number: DS30417 Rev. 10 - 2 

January 2016 © Diodes Incorporated 

**BAV199DW** 

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1,000 2<br>f =1MHz<br>1.8<br>=== === P| | | | tf<br>1.6<br>100<br>Sone 1.4 eee<br>70 70 [o] 癈 C<br>1.2<br>10 PLE 1<br>== ===L 0.8 ACEP<br>0.6<br>SSEEEEEESRE EE Eo<br>1 se eee 2525 癈 [o] C  0.4 PNETeee<br>0.2<br>———————— pit tt tttt<br>0.1 Ce 0 Ft tt... fy<br>0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>Fig.  3 Typical Reverse Characteristics, Per Element Fig. 4  Typical Junction Capacitance, Per ElementFig. 4 Typical Total Capacitance<br>300<br>Device mounted on an<br>FR4 printed-circuit board<br>Sao<br>250 se<br>200 i es<br>ee<br>150 —FELL<br>NCCE<br>100 TNE,<br>—LPPERELELL,<br>50 nn<br>ee ee<br>0 EEL INTE<br>0 50 100 150 200<br>TA, AMBIENT TEMPERATURE (°C)<br>Fig. 4  Current Derating Curve, Per ElementFig. 5<br>, LEAKAGE CURRENT (pA)<br>IR<br>, FORWARD CURRENT (mA)<br>IF<br>, TOTAL CAPACITANCE (pF)<br>T<br>CT<br>, JUNCTION CAPACITANCE (pF)<br>C<br>**----- End of picture text -----**<br>


## **Package Outline Dimensions** 

Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version. 

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SOT363<br>Dim  Min  Max  Typ<br>E ld! E1 =a A1  0.00 0.10 0.05<br>A2  0.90 1.00 1.00<br>| | ee b  ee 0.10 0.30 0.25<br>c  0.10 0.22  0.11<br>Cope a D  1.80 2.20 2.15<br>F SL b I E  2.00 2.20 2.10<br>a E1  1.1 ee 5 1. ee 35 1. ee 30<br>e  0.650 BSC<br>D F  0.40 0.45 0.425<br>L  0.25 0.40 0.30<br>rtf [tf] ee“TTT a 8°<br>A2 All Dimensions in mm<br>c a<br>fi A1 e <a, L =<br>**----- End of picture text -----**<br>


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BAV199DW Document number: DS30417 Rev. 10 - 2 

January 2016 © Diodes Incorporated 

**BAV199DW** 

## **Suggested Pad Layout** 

Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version. 

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C<br>Value<br>Dimensions<br>(in mm)<br>C  0.650<br>G  1.300<br>Y1 G X  0.420<br>Y  0.600<br>= = Y1  2.500<br>Y<br>ugar X<br>**----- End of picture text -----**<br>


## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference.  Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

- B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2016, Diodes Incorporated 

**www.diodes.com** 

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BAV199DW Document number: DS30417 Rev. 10 - 2 

January 2016 © Diodes Incorporated 

**www.diodes.com**