# Small Signal Schottky Diode, Single, 10 V, 3 A, 580 mV, 5 A, 150 °C

![Product image](https://novapart.co/image/farnell:1467544/)

**URL**: https://novapart.co/products/BAT60JFILM/small-signal-schottky-diode-single-10-v-3-a-580-mv
**SKU**: BAT60JFILM
**Manufacturer**: STMICROELECTRONICS
**Price**: €0.0400
**Stock**: 1000+
**Lead Time**: 127 days (indicative)

## Description

Diode Configuration:Single; Repetitive Reverse Voltage Vrrm Max:10V; Forward Current If(AV):3A; Forward Voltage VF Max:580mV; Forward Surge Current Ifsm Max:5A; Operating Temperature Max:15

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | BAT60 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-323 |
| Diode Configuration | Single |
| Forward Voltage Max | 580mV |
| Forward Surge Current | 5A |
| Reverse Recovery Time | - |
| Average Forward Current | 3A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 10V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1467544/)

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## **BAT60J** 

## SMALL SIGNAL SCHOTTKY DIODE 

## **FEATURES AND BENEFITS** 

- I VERY SMALL CONDUCTION LOSSES 

- I NEGLIGIBLE SWITCHING LOSSES 

- I LOW FORWARD VOLTAGE DROP 

- I EXTREMELY FAST SWITCHING 

- I SURFACE MOUNTED DEVICE 

## **DESCRIPTION** 

Schottky barrier diode encapsulated in a SOD-323 small SMD package. 

This device is intended for use in portable equipments. It is suited for DC to DC converters, step-up conversion and power management. 

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A 60 K<br>SOD-323<br>**----- End of picture text -----**<br>


## **ABSOLUTE RATINGS** (limiting values) 

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Symbol Parameter Value Unit<br>VRRM Repetitive peak reverse voltage 10 V<br>IF Peak forward current δ = 0.11 3 A<br>IFSM Surge non repetitive forward current tp=10ms 5 A<br>Ptot Power Dissipation Ta=25°C 310 mW<br>Tstg Storage temperature range - 65 to +150 °C<br>Tj Maximum operating junction temperature * 150 °C<br>TL Maximum temperature for soldering during 10s 260 °C<br>**----- End of picture text -----**<br>


- : dPtot < 1 thermal runaway condition for a diode on its own heatsink dTj Rth(j − a) 

## **THERMAL RESISTANCE** 

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Symbol Parameter Value Unit<br>Rth (j-a) Junction to ambient (*) 400 °C/W<br>**----- End of picture text -----**<br>


(*) Mounted on epoxy board with recommended pad layout. 

January 2003 - Ed: 6A 

1/5 

## **BAT60J** 

## **STATIC ELECTRICAL CHARACTERISTICS** 

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Symbol Tests Conditions Tests conditions Min. Typ. Max. Unit<br>VF * Forward voltage drop Tj = 25°C IF = 10 mA 0.28 0.32 V<br>IF = 100 mA 0.35 0.40<br>IF = 1 A 0.53 0.58<br>IR ** Reverse leakage current Tj = 25°C VR = 5 V 1 3 µA<br>Tj = 25°C VR = 8 V 1.3 4<br>Tj = 25°C VR = 10 V 2 6<br>Tj = 25°C VR = 12 V 2.5 7.5<br>Tj = 80°C VR = 8 V 73 150<br>**----- End of picture text -----**<br>


Pulse test: * tp = 380µs, δ < 2% 

** tp = 5ms, δ < 2% 

To evaluate the conduction losses the following equation: P = 0.38 x IF(AV) + 0.17 IF2(RMS) 

2/5 

**BAT60J** 

**Fig. 1:** Average forward power dissipation versus average forward current. 

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PF(av)(W)<br>0.35<br>δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5<br>0.30<br>0.25 δ = 1<br>0.20<br>0.15<br>0.10 T<br>0.05<br>IF(av) (A) δ [=tp/T] tp<br>0.00<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7<br>**----- End of picture text -----**<br>


**Fig. 2-2:** Average forward current versus ambient temperature (δ = 0.5). 

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IF(av)(A)<br>0.60<br>0.55<br>0.50<br>0.45<br>0.40<br>0.35<br>0.30<br>0.25<br>0.20<br>T<br>0.15<br>0.10<br>0.05 δ [=tp/T] tp Tamb(°C)<br>0.00<br>0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Fig. 4:** Relative variation of thermal impedance junction to ambient versus pulse duration (Epoxy printed circuit board FR4 with recommended pad layout). 

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Zth(j-a)/Rth(j-a)<br>1E+0<br>δ = 0.5<br>δ = 0.2<br>δ = 0.1<br>1E-1<br>Single pulse<br>1E-2 T<br>t(s) δ [=tp/T] tp<br>1E-3<br>1E-4 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2<br>**----- End of picture text -----**<br>


**Fig. 2-1:** Peak forward current versus ambient temperature (δ = 0.11). 

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IF(A)<br>3.2<br>2.8<br>2.4<br>2.0<br>1.6<br>1.2<br>0.8 T<br>0.4<br>Tamb(°C)<br>δ [=tp/T] tp<br>0.0<br>0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Fig. 3:** Non repetitive surge peak forward current versus overload duration (maximum values). 

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IM(A)<br>3.0<br>2.5<br>Ta=25°C<br>2.0 Ta=50°C<br>Ta=75°C<br>1.5<br>1.0<br>IM<br>0.5<br>δ=0.5 t t(s)<br>0.0<br>1E-3 1E-2 1E-1 1E+0<br>**----- End of picture text -----**<br>


**Fig. 5:** Reverse leackage current versus reverse voltage applied (typical values). 

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IR(mA)<br>1E+1<br>Tj=150°C<br>1E+0<br>1E-1 Tj=80°C<br>1E-2<br>Tj=25°C<br>1E-3<br>VR(V)<br>1E-4<br>0 1 2 3 4 5 6 7 8 9 10<br>**----- End of picture text -----**<br>


3/5 

**BAT60J** 

**Fig. 6:** Reverse leackage current versus junction temperature (typical values). 

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IR[Tj] / IR[Tj=25°C]<br>1E+5<br>VR=8V<br>1E+4<br>1E+3<br>1E+2<br>1E+1<br>1E+0<br>Tj(°C)<br>1E-1<br>0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Fig. 8-1:** Forward voltage drop versus forward current (High level). 

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IFM(A)<br>1E+1<br>Tj=150°C<br>(Typical values)<br>1E+0 (Maximum values)Tj=25°C<br>Tj=80°C<br>(Typical values)<br>VFM(V)<br>1E-1<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8<br>**----- End of picture text -----**<br>


**Fig. 7:** Junction capacitance versus reverse voltage applied (typical values). 

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C(pF)<br>100<br>F=1MHz<br>Tj=25°C<br>VR(V)<br>10<br>1 10<br>**----- End of picture text -----**<br>


**Fig. 8-2:** Forward voltage drop versus forward current (Low level). 

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IFM(A)<br>1.0<br>0.9<br>0.8 Tj=150°C<br>(Typical values)<br>0.7<br>Tj=25°C<br>0.6 Tj=80°C (Maximum values)<br>0.5 (Typical values)<br>0.4<br>0.3<br>0.2<br>0.1 VFM(V)<br>0.0<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8<br>**----- End of picture text -----**<br>


**Fig. 9:** Thermal resistance junction to ambient versus copper surface (epoxy printed circuit board FR4, copper thickness: 35µm). 

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Rth(j-a) (°C/W)<br>600<br>IF=0.75A<br>550<br>500<br>450<br>400<br>350<br>300<br>250<br>200<br>150 S(Cu) (mm²)<br>100<br>0 10 20 30 40 50 60 70 80 90 100<br>**----- End of picture text -----**<br>


4/5 

**BAT60J** 

## **PACKAGE MECHANICAL DATA** 

SOD-323 

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DIMENSIONS<br>H A1 REF. Millimeters Inches<br>b Min. Max. Min. Max.<br>A 1.17 0.046<br>E<br>A1 0 0.1 0 0.004<br>b 0.25 0.44 0.01 0.017<br>D A c 0.1 0.25 0.004 0.01<br>D 1.52 1.8 0.06 0.071<br>c Q1 E 1.11 1.45 0.044 0.057<br>H 2.3 2.7 0.09 0.106<br>L 0.1 0.46 0.004 0.02<br>L<br>Q1 0.1 0.41 0.004 0.016<br>**----- End of picture text -----**<br>


## **MARKING** 

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Type Marking Package Weight Base qty Delivery mode<br>BAT60JFILM 60 SOD-323 0.005 g. 3000 Tape & reel<br>**----- End of picture text -----**<br>


> I Epoxy meets UL94V-0 

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 

STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 

The ST logo is a registered trademark of STMicroelectronics 

- © 2003 STMicroelectronics - Printed in Italy - All rights reserved. 

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5/5 

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