# Small Signal Schottky Diode, Single, 30 V, 200 mA, 800 mV, 600 mA, 150 °C

![Product image](https://novapart.co/image/farnell:3514401RL/)

**URL**: https://novapart.co/products/BAT5402LRHE6327XTSA1/small-signal-schottky-diode-single-30-v-200-ma-800
**SKU**: BAT5402LRHE6327XTSA1
**Manufacturer**: INFINEON
**Price**: €0.0760
**Stock**: 1000+
**Lead Time**: 92 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | BAT54 Series |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | TSLP-2-7 |
| Diode Configuration | Single |
| Forward Voltage Max | 800mV |
| Forward Surge Current | 600mA |
| Reverse Recovery Time | 5ns |
| Average Forward Current | 200mA |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3514401RL/)

## **BAT24-02LS** 

## **Single silicon RF Schottky diode** 

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## **Product description** 

This Infineon RF Schottky diode is a silicon low barrier N-type device with an integrated guard ring on-chip for over-voltage protection. Its low barrier height, small forward voltage and low junction capacitance make BAT24-02LS a suitable choice for mixer and detector functions in applications which frequencies are as high as 24 GHz. 

## **Feature list** 

- Low inductance _L_ S = 0.2 nH (typical) 

- Low capacitance _C_ = 0.2 pF (typical) at voltage _V_ R = 0 V and frequency _f_ = 1 MHz 

- TSSLP-2-1 package (0.62 mm x 0.32 mm x 0.31 mm) with a 0201 foot print 

- Pb-free, RoHS compliant and halogen free 

## **Product validation** 

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22. 

## **Potential applications** 

For mixers and detectors in: 

- Radar systems and modules 

## **Device information** 

|**Table 1**<br>**Part information**|||||
|---|---|---|---|---|
|**Product name / Ordering code**|**Package**|**Pin configuration**|**Marking**|**Pieces / Reel**|
|BAT24-02LS / BAT2402LSE6327XTSA1|TSSLP-2-1|Single, leadless|S|15 k|



_**Attention** :_ _**ESD (Electrostatic discharge) sensitive device, observe handling precautions!**_ 

Please read the Important Notice and Warnings at the end of this document 

Datasheet **www.infineon.com** 

v2.0 2018-06-28 

**BAT24-02LS Single silicon RF Schottky diode** 

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## **Table of contents** 

## **Table of contents** 

||**Product description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|---|---|
||**Feature list**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Product validation**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Potential applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Device information**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Table of contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2|
|**1**|**Absolute maximum ratings**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2|
|**2**|**Electrical performance in test fixture**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
|2.1|Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
|2.2|Characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3|
|**3**|**Package information TSSLP-2-1**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|**4**|**Thermal characteristics**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8|
|**5**|**References**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
||**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
||**Disclaimer**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|



## **1 Absolute maximum ratings** 

**Table 2 Absolute maximum ratings at TA= 25°C, unless otherwise specified** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Unit**|**Note or test condition**|
|---|---|---|---|---|---|
|||**Min.**|**Max.**|||
|Diode reverse voltage|_V_R|–|4|V||
|Forward current|_I_F|–|110|mA||
|Total power dissipation|_P_TOT|–|100|mW|_T_S≤ 82°C**_1)_**|
|Junction temperature|_T_J|–|150|°C||
|Operating temperature|_T_OP|–|150|||
|Storage temperature|_T_STG|–|150|||



_**Attention** :_ _**Stresses above the maximum values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Exceeding only one of these values may cause irreversible damage to the component.**_ 

> 1 _T_ S is the soldering point temperature. 

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## **Electrical performance in test fixture** 

## **2 Electrical performance in test fixture** 

## **2.1 Electrical characteristics** 

## **Table 3 Electrical characteristics at** _**T**_ **A = 25°C, unless otherwise specified** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note or test condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Breakdown voltage|_V_BR|4|–|–|V|_I_R= 10 μA|
|Reverse current|_I_R|–|–|5|μA|_V_R= 1 V|
|Forward voltage|_V_R|0.16|0.25|0.32|V|_I_F= 1 mA|
|||0.25|0.35|0.41||_I_F= 10 mA|
|Diferential forward resistance|_R_F|–|8|10|Ω|_I_F= 10 mA / 50 mA**_1)_**|
|Capacitance|_C_|–|0.2|0.23|pF|_V_R= 0 V,_f_= 1 MHz|
|Inductance|_L_S|0.15|0.2|0.25|nH|**_2)_**|



## **2.2 Characteristic curves** 

At _T_ A = 25 °C, unless otherwise specified 

**==> picture [357 x 278] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.24<br>0.22<br>0.2<br>0.18<br>0.16<br>0.14<br>0.12<br>0 0.5 1 1.5 2 2.5 3 3.5 4<br>V  [V]<br>R<br>C [pF]<br>**----- End of picture text -----**<br>


**Figure 1 Capacitance** _**C**_ **vs. reverse voltage** _**V**_ **R at frequency** _**f**_ **= 1 MHz** 

> 1 _VF_ 50 mA − _VF_ 10 mA _R_ = _F_ 50 mA −10 mA 

> 2 Parameter is not subject to production test, min/max values are specified by design. 

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## **Electrical performance in test fixture** 

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**----- Start of picture text -----**<br>
0.24<br>0.22<br>0.2<br>0.18<br>0.16<br>0.14<br>0.12<br>-50 -25 0 25 50 75 100<br>TA [°C]<br>C [pF]<br>**----- End of picture text -----**<br>


**Figure 2 Capacitance** _**C**_ **vs. ambient temperature** _**T**_ **A at frequency** _**f**_ **= 1 MHz and reverse voltage** _**V**_ **R = 0 V** 

**==> picture [357 x 278] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [3]<br>10 [2]<br>10 [1]<br>10 [0]<br>10 [-1]<br>10 [-2]<br>10 [-3]<br>0 0.2 0.4 0.6 0.8 1 1.2<br>VF [V]<br> [mA]<br>IF<br>**----- End of picture text -----**<br>


**Figure 3** 

**Forward current** _**I**_ **F vs. forward voltage** _**V**_ **F** 

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## **Electrical performance in test fixture** 

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**----- Start of picture text -----**<br>
0.45<br>0.4<br>10 mA<br>0.35<br>0.3<br>1 mA<br>0.25<br>0.2<br>100 µA<br>0.15<br>0.1<br>-50 -25 0 25 50 75 100<br>TA [°C]<br> [V]<br>F<br>V<br>**----- End of picture text -----**<br>


**Figure 4 Forward voltage** _**V**_ **F vs. ambient temperature** _**T**_ **A at different forward currents** 

**==> picture [357 x 278] intentionally omitted <==**

**Figure 5 Differential forward resistance** _**R**_ **F vs. ambient temperature** _**T**_ **A between forward currents** _**I**_ **F = 10 mA and 50 mA** 

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**BAT24-02LS Single silicon RF Schottky diode** 

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## **Electrical performance in test fixture** 

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**----- Start of picture text -----**<br>
10 [1]<br>10 [0]<br>10 [-1]<br>0 0.5 1 1.5 2 2.5 3 3.5 4<br>V  [V]<br>R<br> [µA]<br>R<br> I<br>**----- End of picture text -----**<br>


**Figure 6 Reverse current** _**I**_ **R vs. reverse voltage** _**V**_ **R** 

**==> picture [357 x 278] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [2]<br>10 [1]<br>10 [0]<br>10 [-1]<br>10 [-2]<br>10 [-3]<br>-50 -25 0 25 50 75 100<br>TA [°C]<br> [µA]<br>IR<br>**----- End of picture text -----**<br>


**Figure 7** 

**Reverse current** _**I**_ **R vs. ambient temperature** _**T**_ **A at reverse voltage** _**V**_ **R = 1 V** 

_Note: The curves shown in this chapter have been generated using typical devices but shall not be understood as a guarantee that all devices have identical characteristic curves._ 

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## **Package information TSSLP-2-1** 

## **3 Package information TSSLP-2-1** 

**Figure 8 Package outline** 

## **Figure 9 Foot print** 

**Figure 10 Marking layout example** 

## **Figure 11** 

**==> picture [239 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
4<br>PIN 1 2 0.35<br>INDEX MARKING<br>\ {<br>4-8 lin —<br>0.43<br>ALL DIMENSIONS ARE IN UNITS MM<br>THE DRAWING IS IN COMPLIANCE WITH ISO 128 & PROJECTION METHOD 1 [  a e ]<br>Tape information<br>8<br>0.73<br>**----- End of picture text -----**<br>


_Note: See our_ _**Recommendations for Printed Circuit Board Assembly of TSLP/TSSLP/TSNP Packages** ._ 

_The marking layout is an example. For the real marking code refer to the device information on the first page. The number of characters shown in the layout example is not necessarily the real one. The marking layout can consist of less characters._ 

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## **Thermal characteristics** 

## **4 Thermal characteristics** 

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**----- Start of picture text -----**<br>
Table 4 Thermal resistance<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Parameter Sym Values Unit Note or test condition<br>bol<br>Min. Typ. Max.<br>Thermal resistance R thJS – 675 – K/W T S = 82 °C  [1)]<br>(junction - soldering point)<br>120<br>100<br>80<br>60<br>40<br>20<br>0<br>0 20 40 60 80 100 120 140 160<br>T  [°C]<br>S<br> [mA]<br>F<br>I<br>**----- End of picture text -----**<br>


**Figure 12 Permissible forward current** _**I**_ **F in DC operation** 

1 

For _R_ thJS in other conditions refer to the curves in this chapter. 

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## **Thermal characteristics** 

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**Figure 13 Thermal resistance** _**R**_ **thJS in pulse operation** 

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**Figure 14 Permissible forward current ratio** _**I**_ **Fmax/** _**I**_ **DC in pulse operation** 

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## **References** 

## **5 References** 

|[1]|Infineon AG -**_Recommendations for Printed Circuit Board Assembly of Infineon TSLP/TSSLP/TSNP_**<br>**_Packages_**|
|---|---|



## **Revision history** 

|**Document**<br>**version**|**Date of**<br>**release**|**Description of changes**|
|---|---|---|
|2.0|2018-09-07|•<br>New layout of datasheet<br>•<br>Typical values and curves updated to the values of the production<br>(No product or process change behind)|



Datasheet 

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## **Trademarks** 

All referenced product or service names and trademarks are the property of their respective owners. 

**Edition 2018-06-28 IMPORTANT NOTICE Published by** The information given in this document shall in no event be regarded as a guarantee of conditions or **Infineon Technologies AG** characteristics (“Beschaffenheitsgarantie”) . **81726 Munich, Germany** With respect to any examples, hints or any typical values stated herein and/or any information regarding the **© 2018 Infineon Technologies AG** application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of **All Rights Reserved.** any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

**Do you have a question about any aspect of this document?** In addition, any information given in this document is **Email: erratum@infineon.com** subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning **Document reference** customer’s products and any use of the product of **IFX-obw1529670163684** Infineon Technologies in customer’s applications. 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 



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