# Small Signal Schottky Diode, Single, 30 V, 300 mA, 310 mV, 4 A, 85 °C

![Product image](https://novapart.co/image/farnell:2454717/)

**URL**: https://novapart.co/products/BAT30F4/small-signal-schottky-diode-single-30-v-300-ma-310
**SKU**: BAT30F4
**Manufacturer**: STMICROELECTRONICS
**Price**: €0.0480
**Stock**: 1000+
**Lead Time**: 132 days (indicative)

## Description

Diode Configuration:Single; Repetitive Reverse Voltage Vrrm Max:30V; Forward Current If(AV):300mA; Forward Voltage VF Max:310mV; Forward Surge Current Ifsm Max:4A; Operating Temperatu

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | BAT30 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | 0201 |
| Diode Configuration | Single |
| Forward Voltage Max | 310mV |
| Forward Surge Current | 4A |
| Reverse Recovery Time | - |
| Average Forward Current | 300mA |
| Operating Temperature Max | 85°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2454717/)

**BAT30F4** 

Datasheet 

30 V signal Schottky diode 

## **Features** 

**==> picture [498 x 263] intentionally omitted <==**

**----- Start of picture text -----**<br>
A K<br>• Very low conduction losses<br>• Negligible switching losses<br>• 0201 package<br>• Low capacitance diode<br>• ECOPACK [®] 2 and RoHS compliant<br>0201 Applications<br>A A • Reverse polarity protection<br>• Fingerprint module<br>• Camera module<br>• Bluetooth wireless earbud<br>4 • Biometric computer card<br>a B || B Description<br>Top Bottom Marking<br>The BAT30F4 uses 30 V Schottky barrier diodes in a 0201 package. This device is<br>intended to be used in smartphones, and is especially suited for rail to rail protection<br>where its low forward voltage drop will help designers to get an efficient protection of<br>their ICs.<br>**----- End of picture text -----**<br>


## **Product status link** ~~=~~ 

**Product status link** BAT30F4 

**Product summary** ~~=~~ **VRRM** 30 V **Tj (max)** 85 °C **IF** 300 mA 

**DS10126** - **Rev 7** - **September 2018** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**BAT30F4 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage||30|V|
|IF|Continuous forward current||300|mA|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|4|A|
|PD(1)|Power dissipation||200|mW|
|Tstg|Storage temperature range||-55 to + 150|°C|
|TOP|Operating junction temperature range||-40 to +85|°C|
|Tj|Maximum junction temperature in DC forward mode||150|°C|
|TL|Maximum soldering temperature during 10 s||260|°C|



_1. On epoxy printed circuit board with minimum recommended footprint_ 

**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Value (Typ.)**|**Unit**|
|---|---|---|---|
|Rth(j-a)|Junction to ambient(1)|450|°C/W|



_1. On epoxy printed circuit board with minimum recommended footprint_ 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= 10 V|-|2.2|6.0|µA|
|||Tj= 85 °C||-||300||
|||Tj= 25 °C|VR= 30 V|-|18|||
|||Tj= 85 °C||-||1600||
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 5 mA|-||0.285|V|
|||Tj= 85 °C||-||0.205||
|||Tj= 25 °C|IF= 10 mA|-|0.27|0.31||
|||Tj= 85 °C||-||0.24||
|||Tj= 25 °C|IF= 100 mA|-|0.39|0.44||
|||Tj= 85 °C||-||0.40||
|||Tj= 25 °C|IF= 300 mA|-|0.55|0.625||
|||Tj= 85 °C||-||0.64||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

**DS10126** - **Rev 7** 

**page 2/12** 

**BAT30F4 Characteristics** 

## **Table 4. Dynamic characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|C|Diode capacitance|VR= 1 V, F = 1 MHz|-|10|14|pF|



**DS10126** - **Rev 7** 

**page 3/12** 

**BAT30F4 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 1. Reverse leakage current versus reverse applied Figure 2. Forward voltage drop versus forward current voltage (typical values) (typical values)** 

**==> picture [472 x 143] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.E+03IR(µA) 1.E+00 IF(A)<br>Tj = 85°C<br>T j = 85°C<br>1.E+02 1.E-01<br>1.E+01 1.E-02 Tj = 25°C<br>Tj = 25°C<br>1.E+00 1.E-03<br>VF(V)<br>VR(V)<br>1.E-01 1.E-04<br>0 5 10 15 20 25 30 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55<br>**----- End of picture text -----**<br>


**==> picture [513 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3. Relative variation of reverse leakage current Figure 4. Junction capacitance versus reverse applied<br>versus junction temperature voltage (typical values)<br>IR[Tj] / IR[Tj = 25 °C] C(pF)<br>1.E+02 10<br>VR = VRRM F = 1 MHz<br>V OSC = 30 mV RMS<br>Tj = 25°C<br>1.E+01<br>1.E+00<br>1.E-01<br>Tj(°C) VR(V)<br>1.E-02 1<br>-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 1 10 100<br>**----- End of picture text -----**<br>


**DS10126** - **Rev 7** 

**page 4/12** 

**BAT30F4 Characteristics (curves)** 

**==> picture [283 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Continuous forward current versus ambient temperature<br>IF(mA)<br>350<br>300<br>250<br>200<br>150<br>100<br>50<br>T amb (°C)<br>0<br>0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**DS10126** - **Rev 7** 

**page 5/12** 

**BAT30F4 Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **2.1 0201 package information** 

**Figure 6. 0201 package outline** 

**==> picture [142 x 225] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>E<br>Top<br>A<br>Side<br>fD D1<br>fE<br>E1<br>b<br>Bottom<br>**----- End of picture text -----**<br>


**Table 5. 0201 package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.28|0.30|0.32|0.0110|0.0118|0.0126|
|b|0.125|0.14|0.155|0.0049|0.0055|0.0061|
|D|0.57|0.60|0.63|0.0224|0.0236|0.0248|
|D1||0.35|||0.0138||
|E|0.27|0.30|0.33|0.0106|0.0118|0.0130|
|E1|0.175|0.19|0.205|0.0069|0.0075|0.0081|
|fD|0.040|0.055|0.070|0.0015|0.0021|0.0027|
|fE|0.040|0.055|0.070|0.0015|0.0021|0.0027|



**DS10126** - **Rev 7** 

**page 6/12** 

**BAT30F4 0201 package information** 

**==> picture [513 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Footprint in mm (inches) Figure 8. Marking<br>0.656<br>0.243 (0.0258) 0.243<br>(0.0096) (0.0096)<br>0.300 Pin1 Pin2<br>(0.0118)<br>0.170<br>(0.0067)<br>4<br>**----- End of picture text -----**<br>


_Note: The marking codes can be rotated by 90° or 180° to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose._ 

**Figure 9. Tape and reel specification** 

**==> picture [444 x 238] intentionally omitted <==**

**----- Start of picture text -----**<br>
Bar indicates Pin 1<br>Ø 1.5 ± 0.1<br>2.0 ± 0.05 4.0 ± 0.1<br>0.22<br>4 4 4 4 4 4 4<br>0.36 ± 0.03 0.38 ± 0.03<br>2.0 ± 0.05<br>User direction of unreeling<br>All dimensions in mm<br>1.75 ± 0.1<br>0.68 ± 0.03<br>3.5 ± 0.05<br>8.0 + 0.03 - 0.01<br>**----- End of picture text -----**<br>


**DS10126** - **Rev 7** 

**page 7/12** 

**BAT30F4** 

**Recommendation on PCB assembly** 

**3 Recommendation on PCB assembly** 

## **3.1 Stencil opening design** 

1. General recommendation on stencil opening design 

   - a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). 

## **Figure 10. Stencil opening recommendation** 

**==> picture [98 x 60] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>T<br>W<br>**----- End of picture text -----**<br>


- b. General design rule 

   - Stencil thickness (T) = 75 ~ 125 μm 

W ◦ T[≥1.5] 

      - L ×  W 

      - ◦ ≥0.66 2T L + W 

1. Reference design 

   - a. Stencil opening thickness: 80 µm 

   - b. Other dimensions: see below figure. 

## **Figure 11. Recommended stencil window position, stencil opening thickness: 80 μm** 

**==> picture [319 x 245] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.656<br>(0.0258)<br>0.643<br>0.230 (0.0253)<br>(0.0091) 0.183<br>(0.0072)<br>0.170<br>0.007 0.007 (0.0067) 0.243<br>(0.00027) (0.00027) (0.0096)<br>mm<br>(inches)<br>Footprint Stencil window<br>0.008<br>(0.0003)<br>0.300 0.285<br>(0.0118) (0.0112)<br>0.008<br>(0.0003)<br>**----- End of picture text -----**<br>


**DS10126** - **Rev 7** 

**page 8/12** 

**BAT30F4 Solder paste** 

## **3.2 Solder paste** 

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 

2. “No clean” solder paste is recommended. 

3. Offers a high tack force to resist component displacement during PCB movement. 

4. Use solder paste with fine particles: Type 4 (powder particle size 20-48 μm per IPC J STD-005). 

## **3.3 Placement** 

1. Manual positioning is not recommended. 

2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ±0.05 mm is recommended. 

4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 

5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 

## **3.4 PCB design preference** 

1. To control the solder paste amount, the closed via is recommended instead of open vias. 

2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. 

## **3.5 Reflow profile** 

## **Figure 12. ST ECOPACK[®] recommended soldering reflow profile for PCB mounting** 

**==> picture [289 x 163] intentionally omitted <==**

**----- Start of picture text -----**<br>
240-245 °C<br>Temperature (°C)<br>250 -2 °C/s<br>2 - 3 °C/s<br>200 60 sec<br>(90 max) -3 °C/s<br>150<br>-6 °C/s<br>100<br>0.9 °C/s<br>50<br>Time (s)<br>0 30 60 90 120 150 180 210 240 270 300<br>**----- End of picture text -----**<br>


_Note: Minimize air convection currents in the reflow oven to avoid component movement._ 

**DS10126** - **Rev 7** 

**page 9/12** 

**BAT30F4 Ordering information** 

## **4 Ordering information** 

## **Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|BAT30F4|4(1)|Flat CSPS|0.116 mg|15000|Tape and reel|



_1. The marking codes can be rotated by 90° or 180° to differentiate assembly location_ 

**DS10126** - **Rev 7** 

**page 10/12** 

**BAT30F4** 

## **Revision history** 

## **Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|13-May-2014|1|First issue|
|24-Nov-2014|2|Updated Table 2.|
|13-Apr-2015|3|Updated Features and Description.|
|11-Feb-2016|4|Updated Table 3 and Figure 4.|
|26-Feb-2016|5|Updated Table 2. Added Table 3, Table 5 and Figure 7.|
|05-Jun-2018|6|UpdatedTable 3. Static electrical characteristics,Table 5. 0201 package mechanical dataand<br>Table 6. Ordering information.|
|24-Sep-2018|7|UpdatedTable 3. Static electrical characteristics.|



**DS10126** - **Rev 7** 

**page 11/12** 

**BAT30F4** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2018 STMicroelectronics – All rights reserved 

**DS10126** - **Rev 7** 

**page 12/12** 



## Links

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- [Supplier page](https://es.farnell.com/stmicroelectronics/bat30f4/diode-schottky-30v-0201-flipchip/dp/2454717)
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