# Schottky Rectifier, 60 V, 1 A, Dual Series, SOT-223, 4 Pins, 650 mV

![Product image](https://novapart.co/image/farnell:2575117RL/)

**URL**: https://novapart.co/products/BAT160S,115/schottky-rectifier-60-v-1-a-dual-series-sot-223-4
**SKU**: BAT160S,115
**Manufacturer**: NEXPERIA
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.7050
**Stock**: 10+
**Lead Time**: 373 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:60V; Forward Current If(AV):1A; Diode Configuration:Dual Series; Diode Case Style:SOT-223; No. of Pins:4Pins; Forward Voltage VF Max:650mV; Forwar

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Product Range | BAT160 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOT-223 |
| Diode Configuration | Dual Series |
| Forward Voltage Max | 650mV |
| Forward Surge Current | 10A |
| Average Forward Current | 1A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 60V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2575117RL/)

## _**DISCRETE SEMICONDUCTORS**_ 

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DATA SHEET<br>**----- End of picture text -----**<br>


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halfpage<br>M3D087<br>**----- End of picture text -----**<br>


## **BAT160 series** Schottky barrier double diodes 

Product data sheet 1999 Sep 20 Supersedes data of 1999 Mar 26 

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**NXP Semiconductors** 

**Product data sheet** 

## **Schottky barrier double diodes** 

## **BAT160 series** 

## **FEATURES** 

## **PINNING** 

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BAT160<br>PIN 4<br>A C S<br>1 k1 a1 a1 1 3<br>2 n.c. n.c. n.c.<br>3 k2 a2 k2<br>2 n.c. MGL171<br>4 a1, a2 k1, k2 k1, a2<br>Fig.2 BAT160A diode<br>configuration (symbol).<br>age 4<br>4<br>1 3<br>2 n.c. MGL172<br>Fig.3 BAT160C diode<br>1 2 3 configuration (symbol).<br>Top view MSB002 - 1<br>4<br>Fig.1 Simplified outline<br>(SOT223) and pin  1 3<br>configuration.<br>2 n.c. MGL173<br>Fig.4 BAT160S diode<br>configuration (symbol).<br>**----- End of picture text -----**<br>


- Low switching losses 

- Capability of absorbing very high surge current 

- Fast recovery time 

- Guard ring protected 

- Plastic SMD package. 

## **APPLICATIONS** 

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• Low power switched-mode power<br>supplies<br>• Rectification age 4<br>• Polarity protection.<br>DESCRIPTION<br>Planar Schottky barrier double diodes<br>encapsulated in a SOT223 plastic<br>SMD package.<br>1 2 3<br>MARKING Top view MSB002 - 1<br>MARKING<br>TYPE NUMBER<br>CODE<br>BAT160A AT160A Fig.1 Simplified outline<br>BAT160C AT160C (SOT223) and pin<br>configuration.<br>BAT160S AT160S<br>**----- End of picture text -----**<br>


1999 Sep 20 

2 

NXP Semiconductors 

Product data sheet 

## Schottky barrier double diodes 

## BAT160 series 

## **LIMITING VALUES** 

In accordance with the Absolute Maximum Rating System (IEC 134). 

|**SYMBOL**|**PARAMETER**|**CONDITIONS**|**MIN.**|**MAX.**|**UNIT**|
|---|---|---|---|---|---|
|**Per diode**||||||
|VR|continuous reverse voltage||−|60|V|
|IF|continuous forward current||−|1|A|
|IFSM|non-repetitive peak forward current|tp= 8.3 ms; half sinewave;<br>JEDEC method|−|10|A|
|IRSM|non-repetitivepeak reverse current|tp= 100μs|−|0.5|A|
|Tstg|storage temperature||−65|+150|°C|
|Tj|junction temperature||−|150|°C|



## **ELECTRICAL CHARACTERISTICS** 

Tamb = 25 °C unless otherwise specified. 

|Tamb= 25°|C unless otherwise specified.||||
|---|---|---|---|---|
|**SYMBOL**|**PARAMETER**|**CONDITIONS**|**MAX.**|**UNIT**|
|**Per diode**|||||
|VF|forward voltage|see Fig.5<br>IF= 100 mA<br>IF= 1 A<br>IF= 2 A|400<br>650<br>850|mV<br>mV<br>mV|
|IR|reverse current|VR= 60 V; note 1; see Fig.6|350|μA|
|||VR= 60 V; Tj= 100°C; note 1;<br>see Fig.6|8|mA|
|Cd|diode capacitance|f = 1 MHz; VR= 4 V; see Fig7|60|pF|



## **Note** 

1. Pulse test: tp = 300 μs; δ = 0.02. 

## **THERMAL CHARACTERISTICS** 

|**SYMBOL**|**PARAMETER**|**CONDITIONS**|**VALUE**|**UNIT**|
|---|---|---|---|---|
|Rthj-a|thermal resistance fromjunction to ambient|note 1|100|K/W|



## **Note** 

1. Refer to SOT223 standard mounting conditions. 

1999 Sep 20 

3 

NXP Semiconductors 

Product data sheet 

## Schottky barrier double diodes 

## BAT160 series 

## **GRAPHICAL DATA** 

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MCD784<br>10 [4]<br>handbook, halfpage<br>IF<br>(mA)<br>10 [3]<br>10 [2]<br>(2)<br>(1) (3) (4)<br>10<br>1<br>0 0.2 0.4 0.6 0.8<br>VF (V)<br>(1) Tamb = 125 °C. (3) Tamb = 75 °C.<br>(2) Tamb = 100 °C. (4) Tamb = 25 °C.<br>Fig.5 Forward current as a function of forward<br>voltage; typical values.<br>**----- End of picture text -----**<br>


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MCD768<br>10 [5]<br>handbook, halfpage IR<br>( μ A)<br>10 [4]<br>(1)<br>10 [3]<br>(2)<br>(3)<br>10 [2]<br>10<br>(4)<br>1<br>10 [−] [1]<br>0 20 40 60<br>VR (V)<br>(1) Tamb = 125 °C. (3) Tamb = 75 °C.<br>(2) Tamb = 100 °C. (4) Tamb = 25 °C.<br>Fig.6 Reverse current as a function of reverse<br>voltage; typical values.<br>**----- End of picture text -----**<br>


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MCD766<br>10 [3]<br>handbook, halfpage<br>Cd<br>(pF)<br>10 [2]<br>10<br>0 20 40 60<br>VR (V)<br>f = 1 MHz; Tamb = 25 °C.<br>Fig.7 Diode capacitance as a function of reverse<br>voltage; typical values.<br>**----- End of picture text -----**<br>


1999 Sep 20 

4 

NXP Semiconductors 

Product data sheet 

## Schottky barrier double diodes 

## BAT160 series 

## **PACKAGE OUTLINE** 

**Plastic surface mounted package; collector pad for good heat transfer; 4 leads** 

## **SOT223** 

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D B E A X<br>c<br>y<br>HE v M A<br>b1<br>4<br>Q<br>A<br>A1<br>1 2 3 Lp<br>e1 bp w M B detail X<br>e<br>0 2 4 mm<br>scale<br>DIMENSIONS (mm are the original dimensions)<br>UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y<br>1.8 0.10 0.80 3.1 0.32 6.7 3.7 7.3 1.1 0.95<br>mm 4.6 2.3 0.2 0.1 0.1<br>1.5 0.01 0.60 2.9 0.22 6.3 3.3 6.7 0.7 0.85<br>OUTLINE  REFERENCES EUROPEAN<br>ISSUE DATE<br>VERSION  IEC  JEDEC  EIAJ PROJECTION<br>97-02-28<br> SOT223 SC-73<br>99-09-13<br>**----- End of picture text -----**<br>


1999 Sep 20 

5 

**NXP Semiconductors** 

**Product data sheet** 

## **Schottky barrier double diodes** 

## **BAT160 series** 

## **DATA SHEET STATUS** 

|**DATA SHEET STATUS**|||
|---|---|---|
|**DOCUMENT**<br>**STATUS**(1)|**PRODUCT**<br>**STATUS**(2)|**DEFINITION**|
|Objective data sheet|Development|This document contains data from the objective specification for product<br>development.|
|Preliminarydata sheet|Qualification|This document contains data from thepreliminaryspecification.|
|Product data sheet|Production|This document contains theproduct specification.|



## **Notes** 

1. Please consult the most recently issued document before initiating or completing a design. 

2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 

## **DISCLAIMERS** 

**General** ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. 

**Right to make changes** ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 

**Suitability for use** ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. 

⎯ **Applications** Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 

above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. 

**Terms and conditions of sale** ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. 

**No offer to sell or license** ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 

⎯ **Export control** This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 

**Quick reference data** ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 

⎯ **Limiting values** Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 

1999 Sep 20 

6 

## _**NXP Semiconductors**_ 

## **Customer notification** 

This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. 

## **Contact information** 

For additional information please visit: **http://www.nxp.com** For sales offices addresses send e-mail to: **salesaddresses@nxp.com** 

## © NXP B.V. 2009 

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. 

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. 

Printed in The Netherlands 

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Date of release: 1999 Sep 20 

115002/03/pp7 

Document order number: 9397 750 06097 



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