# Small Signal Schottky Diode, Dual Common Cathode, 40 V, 200 mA, 1 V, 600 mA, 150 °C

![Product image](https://novapart.co/image/farnell:4574518RL/)

**URL**: https://novapart.co/products/BAS40-05/small-signal-schottky-diode-dual-common-cathode-40
**SKU**: BAS40-05
**Manufacturer**: DIOTEC SEMICONDUCTOR
**Price**: €0.0150
**Stock**: 500+
**Lead Time**: 50 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | 2,2',6,6'-tetrabromo-4,4'-isopropylidenediphenol (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Forward Voltage Max | 1V |
| Forward Surge Current | 600mA |
| Reverse Recovery Time | 5ns |
| Average Forward Current | 200mA |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4574518RL/)

BAS40, BAS40-04, BAS40-05, BAS40-06 

**BAS40, BAS40-04, BAS40-05, BAS40-06 SMD Small Signal Schottky Diodes SMD Kleinsignal-Schottky-Dioden** 

**IFAV = 200 mA VRRM = 40 V VF1mA < 0.38 V IFSM = 600 mA Tjmax = 150°C trr < 5 ns** 

Version 2024-03-15 

## **SOT-23** 

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TO-236<br>3<br>1<br>2<br>**----- End of picture text -----**<br>


**SPICE** Model & **STEP** File[1] ) 

**Marking Code** See below 'XX' | Siehe unten 'XX' **HS Code** 85411000 

## **Typical Applications** 

**Typische Anwendungen** Signalverarbeitung, Schnelles Schalten, Verpolschutz Suffix -C: Standardausführung[1] ) Kein Suffix: Industriequalität[1] ) Suffix -Q: AEC-Q101 konform[1] ) Suffix -AQ: AEC-Q101 qualifiziert[1] ) 

Signal processing, High-speed switching, Polarity protection Suffix -C: Commercial grade[1] ) No suffix: Industrial grade[1] ) Suffix -Q: AEC-Q101 compliant[1] ) Suffix -AQ: AEC-Q101 qualified[1] ) 

## **Besonderheiten** 

## **Features** 

Very high switching speed Extrem schnelles Schalten Low junction capacitance Niedrige Sperrschicht-Kapazität Low leakage current Niedriger Sperrstrom Compliant to RoHS (w/o exemp.), Konform zu RoHS (ohne Ausn.), **Pb** PB REACH, Conflict Minerals[1] ) REACH, Konfliktmineralien[1] ) **Mechanical Data[1] ) Mechanische Daten[1] )** Taped and reeled 3000 / 7“ Gegurtet auf Rolle Weight approx. 0.01 g Gewicht ca. Solder & assembly conditions 260°C/10s Löt- und Einbaubedingungen MSL = 1 

**BAS40/** -Q **/-AQ** Single BAS40-04/-Q/ **-AQ** Series '43' Diode '44' Connection BAS40-05/-Q Common BAS40-06/-C Common '45' Cathode '46' Anode 

|Power dissipation − Verlustleistung2)<br>Commercial (-C)<br>Industrial (<br>) / AEC-Q101 (-Q/<br>⌞⌟<br>**-AQ**)|Ptot<br>~~c=~~|200 mW3)<br>310 mW3)<br>~~c=~~|
|---|---|---|
|Max. average forward current – Dauergrenzstrom<br>DC|IFAV<br>~~—~~|200 mA4)<br>~~—~~|
|Repetitive peak forward current – Periodischer Spitzenstrom|IFRM<br>~~—~~|300 mA4)<br>~~—~~|
|Non repetitive peak forward surge current – Stoßstrom-Grenzwert<br>tp≤ 1 s|IFSM<br>~~Pf~~|600 mA<br>~~Pf~~|
|Repetitive peak reverse voltage – Periodische Spitzensperrspannung|VRRM<br>~~Pf~~|40 V<br>~~Pf~~|
|Reverse voltage – Sperrspannung<br>DC|VR<br>~~Pf~~|40 V<br>~~Pf~~|
|Junction temperature – Sperrschichttemperatur<br>Storage temperature – Lagerungstemperatur<br>Commercial (-C)<br>Industrial (<br>) / AEC-Q101 (-Q/<br>⌞⌟<br>**-AQ**)|Tj<br>~~——~~|-55...+125°C<br>-55...+150°C<br>~~——~~|
||TS<br>~~|~~|-55…+150°C<br>~~|~~|



1 Please note the detailed information on our website or at the beginning of the data book Bitte beachten Sie die detaillierten Hinweise auf unserer Internetseite bzw. am Anfang des Datenbuches 

- 1 TA = 25°C and per diode, unless otherwise specified – TA = 25°C und pro Diode, wenn nicht anders angegeben 

- 2 Total power dissipation per device (single or both diodes loaded) Gesamtverlustleistung pro Bauteil (eine oder beide Dioden belastet) 

- 3 Mounted on PCB with 3 mm[2] copper pad per each terminal − Montage auf Leiterplatte mit 3 mm[2] Lötpad je Anschluss 

1 

© Diotec Semiconductor AG 

http://www.diotec.com/ 

BAS40, BAS40-04, BAS40-05, BAS40-06 

|**Characteristics**||**Kennwerte**|
|---|---|---|
|Forward voltage<br>Durchlass-Spannung<br>Tj= 25°C<br>IF= 1 mA<br>IF= 40 mA|VF|< 380 mV<br>< 1000 mV|
|Leakage current – Sperrstrom<br>Tj= 25°C<br>VR= 30 V|IR|< 200 nA1)|
|Breakdown voltage – Abbruch-Spannung<br>Tj= 25°C<br>IR= 10 µA|VBR|> 40 V1)|
|Junction capacitance – Sperrschichtkapazität<br>VR= 0 V, f = 1 MHz|CT|< 5 pF|
|Reverse recovery time – Sperrverzug<br>IF= 10 mA→ IR= 10 mA→ IR= 1 mA|trr|< 5 ns|
|Typical thermal resistance junction to ambient<br>Typischer Wärmewiderstand Sperrschicht – Umgebung<br>Commercial (-C)<br>Industrial (<br>) / AEC-Q101 (-Q/<br>⌞⌟<br>**-AQ**)|RthA|500 K/W2)<br>400 K/W2)|



Commercial grade (-C) **Dimensions – Maße [mm]** 

Industrial (⌞⌟)/ AEC-Q101 grade (-Q / -AQ) 

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120 104 1<br>[%] T  =  125°C j<br>100 REECE | [nA] BSSESSS) | [A]  S======<br>103 10-1<br>80 Nee eee T  =  75°Cj  ee a es ee ee ee ee<br>== ee<br>ATI ef] | tt | | | | | AZ<br>60 102 10-2<br>pj ff | tt | | Ly | |_|<br>A ee ee ee ee a ee ee ee, ee<br>40 10 T  =  25°C j 10-3 T  =  -40°CT   T  = 0°Cj j j =  25 °C<br>P20tot ry tT tT dT URE ST IR [_-—- + T  =  0°Cj — —- T  =  -40°C — j  + + IF i a a a oe T  =  125°CT  =  75 j j ° C<br>0 0 PTT TA 50 ET 100 TN 150 TT [°C] 1 5 6= VR 15 20  Sa 25 30 [V] 40 10-4 0.2 ATPs VF 0.4  |} 0.5 0.6 0.7 [V] 0.9<br>Power dissipation versus ambient temperature )Verlustleistung in Abh. von der Umgebungstemp. )1 1 Typical reverse characteristics Typische Kennlinien in Sperrrichtung  Typical forward characteristics Typische Kennlinien in Durchlassrichtung<br>**----- End of picture text -----**<br>


**Disclaimer:** See data book page 2 or ~~—~~ website **Haftungssauschluss:** Siehe Datenbuch Seite 2 oder Internet ~~——_~~ 

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4.0 P| | tT | dt tt<br>[pF] || tt | tT tt<br>3.0 P| | | | | TT<br>Ai | tT | tT fy<br>At ft tt tt |<br>2.0 pPX]| tT tt<br>| | | tt<br>1.0 | || | || ee| dt | |<br>P| | tt<br>CT P| |t t tf<br>0 Pt tt tt tT t<br>0 VR 10 20 [V] 30 40<br>Typical Junction Capacitance<br>Typische Sperrschichtkapazität<br>**----- End of picture text -----**<br>


> 1 Tested with pulses tp = 300 µs, duty cycle ≤ 2% − Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2% 2 Per device, mounted on PCB with 3 mm[2] copper pad per terminal − Pro Bauteil, Montage mit 3 mm[2] Lötpad je Anschluss 

2 

http://www.diotec.com/ 

© Diotec Semiconductor AG 



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